CN107871723A - A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment - Google Patents

Abstract

The invention relates to a heat dissipation plate with pre-embedded heat pipes and a method for applying it to electronic equipment. The heat dissipation plate includes a base plate and a plurality of heat pipes uniformly buried on one side of the base plate. The heat pipes are arranged in parallel with the base plate and filled with a heat conducting medium. The heat pipe is semi-cylindrical, and the heat pipe is located in the semi-cylindrical groove corresponding to the substrate, and the semi-cylindrical cut surface of the heat pipe is flush with the side of the substrate, which has the advantages of simple structure, low cost, high heat transfer efficiency, and good heat dissipation effect Advantages: The method of heat dissipation plate applied to electronic equipment has the advantages of simple process, easy realization, and high heat dissipation efficiency, which solves the problem that the existing heat dissipation technology easily causes heat to be concentrated in a local space, and can quickly and efficiently heat generated by power devices of electronic equipment Distributed to ensure the stability and reliability of electronic equipment.

Description

A cooling plate with pre-embedded heat pipes and its application method in electronic equipment

technical field

The invention relates to a heat dissipation component, in particular to a heat dissipation plate with pre-embedded heat pipes and a method for applying the heat dissipation plate to electronic equipment.

Background technique

For electronic equipment such as switching power supplies and power circuits, the output power during operation often only accounts for a part of the input power, and the lost power is mainly reflected in the heat generated by power devices (heating devices). Because electronic components themselves need to operate reliably within a suitable temperature range, too high temperature will not only cause parameter changes, but also reduce service life. Therefore, if this kind of electronic equipment wants to work stably, it must dissipate the heat generated by its power devices to ensure that its internal temperature is within the range that the electronic components can bear. At present, the main heat dissipation method adopted by electronic equipment is to directly contact the heat dissipation surface of the power device with the heat sink or the chassis shell, and then dissipate the heat through natural cooling or air cooling. Although this heat dissipation method can achieve the basic purpose of heat dissipation, there are still many storage problems in practical applications, mainly in the following aspects: low heat transfer efficiency, poor heat dissipation effect, especially when there are many power devices, uneven distribution, In the case of high power consumption, it is easy to cause heat to concentrate in the local space where the power devices are arranged, and cannot be dissipated quickly and in time, which affects the stability and reliability of electronic equipment.

Contents of the invention

The purpose of the present invention is to provide a heat sink with pre-embedded heat pipes and a method for applying it to electronic equipment. The heat sink has the advantages of simple structure, low cost, high heat transfer efficiency, and good heat dissipation effect; the heat sink is applied to electronic equipment The method has the advantages of simple process, easy realization and high heat dissipation efficiency.

In order to solve the problem of low heat transfer efficiency and poor heat dissipation effect in the heat dissipation technology in the prior art, which may easily cause heat to be concentrated in a local space, the present invention provides a heat dissipation plate for embedded heat pipes, which includes a substrate and is evenly embedded in the A plurality of heat pipes on one side of the substrate, the heat pipes are arranged parallel to the substrate, and the heat pipes are filled with a heat-conducting medium.

Further, the present invention is a heat dissipation plate with pre-embedded heat pipes, wherein the heat pipes are semi-cylindrical, the heat pipes are located in the corresponding semi-cylindrical grooves of the substrate, and the semi-cylindrical section of the heat pipe is flush with the side of the substrate .

Further, the present invention is a heat dissipation plate with pre-embedded heat pipes, wherein the substrate is provided with a heat conduction element on the side where the heat pipe is embedded, and the heat conduction element is an insulating heat conduction pad pasted or coated heat conduction silica gel.

Furthermore, the present invention provides a heat dissipation plate with embedded heat pipes, wherein the substrate is made of aluminum.

The method for applying the above heat dissipation plate to electronic equipment provided by the present invention comprises the following steps:

1. According to the design, arrange the power devices of the electronic equipment, and make all the power devices flush;

2. According to the layout of power devices of electronic equipment, use aluminum to make the corresponding substrate, and set evenly distributed semi-cylindrical grooves on one side of the substrate;

3. Prepare the corresponding semi-cylindrical heat pipes according to the semi-cylindrical grooves on the substrate, and fix the semi-cylindrical heat pipes in the semi-cylindrical grooves of the substrate one by one, and make the semi-cylindrical cut surface of the heat pipe and the side of the substrate flush;

4. Set the substrate in the electronic equipment, and make the side of the substrate where the heat pipe is embedded be bonded to the power device of the electronic equipment;

Fifth, let the electronic equipment set up an air duct on the other side of the substrate relative to the power device.

Further, in the method of applying the above-mentioned heat dissipation plate to electronic equipment in the present invention, in the above step 4, a step of installing a heat-conducting member between the substrate and the power device is also performed; wherein the heat-conducting member is an insulating heat-conducting pad or heat-conducting silica gel.

Compared with the prior art, a heat dissipation plate with pre-embedded heat pipes and its use method of the present invention have the following advantages: the present invention allows the heat pipes to be arranged parallel to the substrate by arranging a substrate and a plurality of heat pipes evenly buried on one side of the substrate, and Fill the heat pipe with a heat transfer medium. Thus, a heat dissipation plate with embedded heat pipes is formed with simple structure, low cost, high heat transfer efficiency and good heat dissipation effect. In practical applications, the heat dissipation plate is arranged in the electronic equipment, so that all power devices (heating devices) of the electronic equipment are in contact with the side of the heat dissipation plate where the heat pipe is disposed. Because the thermal resistance of the heat pipe is much smaller than the thermal resistance of the substrate, when the electronic equipment is in operation, when the heat generated by the power device is transferred to the contact surface of the heat sink, it will be conducted to the remote end of the heat pipe first through the heat pipe, and then dissipated through the substrate. This structure not only improves the heat transfer speed and heat dissipation efficiency, but also effectively utilizes the space where the power device is not arranged, which solves the problem that the existing heat dissipation technology easily causes heat to be concentrated in the local space where the power device is located, and ensures the timeliness and reliability of heat dissipation. Reliability, enhanced cooling effect. The method for applying the heat dissipation plate of the pre-embedded heat pipe to the electronic equipment provided by the invention has the advantages of simple process, easy realization and high heat dissipation efficiency.

Below in conjunction with the specific implementation shown in the accompanying drawings, a heat dissipation plate for embedded heat pipes and its use method of the present invention will be further described in detail:

Description of drawings

Fig. 1 is the three-dimensional view of the radiator plate of a kind of pre-embedded heat pipe of the present invention;

Fig. 2 is a top view of a heat dissipation plate of a pre-embedded heat pipe of the present invention;

Fig. 3 is A-A direction view among Fig. 2;

Fig. 4 is a schematic diagram of the heat dissipation state of a heat dissipation plate of a pre-embedded heat pipe in the present invention;

Fig. 5 is a B-B arrow view in Fig. 4 .

Detailed ways

First of all, it needs to be explained that the orientation words such as up, down, front, back, left, and right in the present invention are only described according to the accompanying drawings, so as to facilitate understanding, and are not intended to limit the technical solution and scope of protection of the present invention. .

As shown in Figures 1 to 5, a specific embodiment of a radiator plate with embedded heat pipes in the present invention includes a substrate 1 and a plurality of heat pipes 2 evenly buried on one side of the substrate 1, so that the heat pipes 2 are arranged in parallel with the substrate 1, and Fill the heat pipe 2 with a heat conducting medium. Through the above structural arrangement, a heat dissipation plate with pre-embedded heat pipes with simple structure, low cost, high heat transfer efficiency and good heat dissipation effect is formed. In practical applications, the heat dissipation plate is arranged in the electronic equipment, so that all power devices 3 of the electronic equipment are in contact with the side of the heat dissipation plate where the heat pipe 2 is disposed. Because the thermal resistance of the heat pipe 2 is much smaller than the thermal resistance of the substrate 1, when the electronic equipment is in operation, when the heat generated by the power device 3 is transferred to the contact surface of the heat sink, it will be transmitted to the far end of the heat pipe 2 first through the heat pipe 2, and then through the substrate 1. Spread the heat out. This method not only improves the heat transfer speed and heat dissipation efficiency, but also effectively utilizes the space where the power device 3 is not arranged, which solves the problem that the existing heat dissipation technology easily causes heat to be concentrated in the local space where the power device is located, and ensures the timeliness of heat dissipation and reliability, enhanced heat dissipation.

As an optimized solution, in this specific embodiment, the heat pipe 2 adopts a semi-cylindrical shape, and the heat pipe 2 is placed in the corresponding semi-cylindrical groove of the substrate 1, and the semi-cylindrical cut surface of the heat pipe 2 is flush with the side of the substrate 1. When this structure is set in use, the bonding degree between the radiator plate and the power device 3 can be improved, so that the contact between the two is more sufficient, and the heat transfer efficiency is ensured. In order to ensure that all heat sinks and all power devices 3 are reliably bonded, this specific embodiment also allows the substrate 1 to be provided with a heat conduction element on the side where the heat pipe 2 is buried. Partially stick an insulating heat conduction pad or coat heat conduction silica gel at the position, or use a full paste insulation heat conduction pad or coat heat conduction silica gel. This structural setting can effectively avoid the problem of inaccurate contact between some power devices 3 and the heat dissipation plate due to processing errors, thereby affecting heat transfer, and further improves the heat dissipation effect. It should be noted that, in practical applications, the present invention usually makes the substrate 1 made of aluminum, which has the characteristics of easy processing, light weight and good heat transfer effect.

The present invention also provides a method for applying the heat dissipation plate of the above-mentioned pre-embedded heat pipe to electronic equipment, which specifically includes the following steps:

1. According to the design, arrange the power devices 3 of the electronic equipment, and make all the power devices 3 flush.

2. According to the layout of the power devices of the electronic equipment, the corresponding substrate 1 is made of aluminum material, and evenly distributed semi-cylindrical slots are provided on one side of the substrate 1 .

3. According to the semi-cylindrical groove on the substrate 1, prepare the corresponding semi-cylindrical heat pipe 2, and fix the semi-cylindrical heat pipe 2 in the semi-cylindrical groove of the substrate 1 one by one, and make the semi-cylindrical shape of the heat pipe 2 The cut surface is flush with the side of the substrate 1 .

4. Install the substrate 1 in the electronic equipment, and attach the side of the substrate 1 where the heat pipe 2 is embedded to the power device of the electronic equipment.

Fifth, let the electronic equipment set up an air duct on the other side of the substrate 1 relative to the power device.

In the fourth step above, a step of arranging a heat conducting member between the substrate 1 and the power device is also performed. The heat conduction element can adopt various forms such as insulating heat conduction pad or heat conduction silica gel.

The method of applying the heat dissipation plate of the embedded heat pipe to the electronic equipment provided by the present invention has the advantages of simple process, easy realization, and high heat dissipation efficiency, and can quickly and efficiently dissipate the heat generated by the power device of the electronic equipment, ensuring that the electronic equipment Work stability and reliability.

The above examples are only descriptions of preferred implementations of the present invention, and are not intended to limit the scope of protection claimed by the present invention. All forms of deformation should fall within the scope of protection defined by the claims of the present invention.

Claims (6)

1. A heat sink with pre-embedded heat pipes, characterized in that it comprises a substrate (1) and a plurality of heat pipes (2) evenly embedded in one side of the substrate (1), and the heat pipes (2) are parallel to the substrate (1) Set, the heat pipe (2) is filled with a heat conduction medium. 2. A heat sink with pre-embedded heat pipes according to claim 1, characterized in that the heat pipes (2) are semi-cylindrical, and the heat pipes (2) are located in the corresponding semi-cylindrical grooves of the substrate (1) , and make the semi-cylindrical cut surface of the heat pipe (2) flush with the side surface of the substrate (1). 3. A heat sink with pre-embedded heat pipes according to claim 2, characterized in that, the substrate (1) is provided with a heat conduction member on the side where the heat pipe (2) is embedded, and the heat conduction member is an insulating material pasted Thermal pad or coated thermal silicone. 4. The heat dissipation plate with pre-embedded heat pipes according to claim 3, characterized in that, the substrate (1) is made of aluminum. 5. A method for applying the cooling plate according to claim 4 to electronic equipment, comprising the following steps: 1. According to the design, arrange the power devices of the electronic equipment, and make all the power devices flush; 2. According to the layout of the power devices of the electronic equipment, the corresponding substrate (1) is made of aluminum material, and evenly distributed semi-cylindrical grooves are provided on one side of the substrate (1); 3. Prepare the corresponding semi-cylindrical heat pipes (2) according to the semi-cylindrical grooves on the substrate (1), and fix the semi-cylindrical heat pipes (2) one by one in the semi-cylindrical grooves of the substrate (1), And make the semi-cylindrical section of the heat pipe (2) flush with the side of the substrate (1); 4. Installing the substrate (1) in the electronic equipment, and bonding the side of the substrate (1) where the heat pipe (2) is embedded with the power device of the electronic equipment; 5. Allow the electronic equipment to set an air duct on the other side of the substrate (1) relative to the power device. 6. The method for applying a cooling plate to an electronic device according to claim 1, characterized in that, in the above-mentioned step 4, a step of setting a heat conduction member between the substrate (1) and the power device is also performed; wherein the heat conduction The parts are insulating thermal pad or thermal silicone.