CN107871723A - A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment - Google Patents
A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment Download PDFInfo
- Publication number
- CN107871723A CN107871723A CN201711065189.2A CN201711065189A CN107871723A CN 107871723 A CN107871723 A CN 107871723A CN 201711065189 A CN201711065189 A CN 201711065189A CN 107871723 A CN107871723 A CN 107871723A
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- China
- Prior art keywords
- heat
- substrate
- heat pipe
- electronic equipment
- semi
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
Method the present invention relates to a kind of heat sink of pre-buried heat pipe and its applied to electronic equipment, heat sink include substrate and are uniformly embedded in more heat pipes of substrate one side, and heat pipe is set with substrate-parallel, and heat-conducting medium is filled with heat pipe.Heat pipe is semi-cylindrical, and heat pipe is in the semi-cylindrical groove that substrate is correspondingly arranged, and the semi-cylindrical section of heat pipe is flushed with the side of substrate, and it has the advantages of simple in construction, cost is cheap, heat transfer efficiency is high, good heat dissipation effect；The method that heat sink is applied to electronic equipment has the advantages of technique is simple, realization is easy, radiating efficiency is high, solve the problems, such as that existing heat dissipation technology easily causes heat and concentrates on local space, heat caused by electronic device power device can rapidly and efficiently be spread out, ensure that the stability and reliability of electronic device works.
Description
Technical field
The present invention relates to a kind of thermal component, and in particular to a kind of heat sink of pre-buried heat pipe, and should by the heat sink
Method for electronic equipment.
Background technology
For electronic equipments such as Switching Power Supply, power circuits, power output during its work often only accounts for input power
A part, the power of loss are mainly manifested in caused by power device (heater members) on heat.Because electronic component needs in itself
Will within the scope of a suitable temperature could reliability service, temperature is too high not only to cause Parameters variation, and can reduce and make
Use the life-span.So this class of electronic devices wants steady operation and must just spread out heat caused by its power device, to protect
Its internal temperature is demonstrate,proved in the range of electronic component can be born.The main heat sink mode that electronic equipment uses at present, it is to allow work(
Rate device radiating surface directly contacts with radiator or chassis shell body, then is dissipated heat by natural cooling or air-cooled mode
Cloth is gone out.Although this radiating mode can realize basic radiating purpose, it also there are problems that storage is more in actual applications, it is main
Following aspect be present：Heat transfer efficiency is low, and radiating effect is poor, particularly power device is more, skewness, power consumption are larger
In the case of, it is easy to cause heat to concentrate on the local space of arrangement power device, and quickly can not spread out in time, influence
The stability and reliability of electronic device works.
The content of the invention
Method it is an object of the invention to provide a kind of heat sink of pre-buried heat pipe and its applied to electronic equipment, heat sink
With the advantages of simple in construction, cost is cheap, heat transfer efficiency is high, good heat dissipation effect；Heat sink is applied to the method for electronic equipment
With the advantages of technique is simple, realization is easy, radiating efficiency is high.
Its existing heat transfer efficiency of heat dissipation technology of the prior art is low, radiating effect is poor to solve, and easily causes heat
The problem of concentrating on local space, a kind of heat sink of pre-buried heat pipe provided by the invention, including substrate and uniformly it is embedded in base
More heat pipes of plate one side, the heat pipe are set with substrate-parallel, and heat-conducting medium is filled with heat pipe.
Further, a kind of heat sink of pre-buried heat pipe of the present invention, wherein, the heat pipe is semi-cylindrical, and heat pipe is in
In the semi-cylindrical groove that substrate is correspondingly arranged, and the semi-cylindrical section of heat pipe is set to be flushed with the side of substrate.
Further, a kind of heat sink of pre-buried heat pipe of the present invention, wherein, the substrate is provided with the side of embedded heat pipe
Heat-conducting piece, the heat-conducting piece are the insulating heat-conductive pad pasted or the heat conductive silica gel of coating.
Further, a kind of heat sink of pre-buried heat pipe of the present invention, wherein, the substrate is made using aluminium.
The method provided by the invention that above-mentioned heat sink is applied to electronic equipment, comprises the following steps：
First, according to design, the power device of arranging electronic equipment, and flush all power devices；
2nd, the power device according to electronic equipment is laid out, using aluminium make corresponding to substrate, and opened in the side of substrate
If equally distributed semi-cylindrical groove；
3rd, according to the semi-cylindrical groove on substrate, corresponding semi-cylindrical heat pipe is prepared, and by semi-cylindrical heat pipe one by one
It is corresponding to be fixed in the semi-cylindrical groove of substrate, and the semi-cylindrical section of heat pipe is flushed with the side of substrate；
4th, substrate is arranged in electronic equipment, and substrate is buried the side of heat pipe and the power device of electronic equipment
Fitting；
5th, allow electronic equipment that air channel is set relative to the opposite side of power device in substrate.
Further, above-mentioned heat sink is applied to the method for electronic equipment by the present invention, in above-mentioned steps four, also carries out
The step of heat-conducting piece is set between substrate and power device；Wherein, heat-conducting piece is insulating heat-conductive pad or heat conductive silica gel.
The heat sink and its application method of a kind of pre-buried heat pipe of the present invention compared with prior art, have advantages below：This
Invention allows heat pipe to be set with substrate-parallel by setting substrate and be uniformly embedded in more heat pipes of substrate one side, and in heat
Heat-conducting medium is filled in pipe.Thus just constitute it is a kind of it is simple in construction, cost is cheap, heat transfer efficiency is high, good heat dissipation effect it is pre-
Bury the heat sink of heat pipe.In actual applications, heat sink is arranged in electronic equipment, allows all power devices of electronic equipment
(heater members) set a side contacts of heat pipe with heat sink.Because the thermal resistance of heat pipe is much smaller than the thermal resistance of substrate, electronic equipment
During work, when heat transfer caused by power device is to heat sink contact surface, understand preferentially by hot pipe conducting to heat pipe distal end, then
Heat is spread out by substrate.This structure not only increases heat transfer rate and radiating efficiency, and is effectively utilized not
The space of power device is arranged, existing heat dissipation technology is solved and easily causes asking for local space where heat concentrates on power device
Topic, ensure that the promptness and reliability of radiating, enhances radiating effect.Heat sink provided by the invention by pre-buried heat pipe should
Method for electronic equipment has the advantages of technique is simple, realization is easy, radiating efficiency is high.
Shown embodiment is to the present invention a kind of heat sink and its application method of pre-buried heat pipe below in conjunction with the accompanying drawings
It is described in further detail：
Brief description of the drawings
Fig. 1 is a kind of stereogram of the heat sink of pre-buried heat pipe of the present invention；
Fig. 2 is a kind of top view of the heat sink of pre-buried heat pipe of the present invention；
Fig. 3 is the A-A direction views in Fig. 2；
Fig. 4 is a kind of radiating state schematic diagram of the heat sink of pre-buried heat pipe of the present invention；
Fig. 5 is the B-B direction view in Fig. 4.
Embodiment
Firstly the need of explanation, the noun of locality such as heretofore described upper and lower, front, rear, left and right simply enters with reference to the accompanying drawings
Capable description, in order to understand, not to technical scheme and be claimed scope progress limitation.
The embodiment of the heat sink of a kind of pre-buried heat pipe of the invention as shown in Figures 1 to 5, including substrate 1 and
Even more heat pipes 2 for being embedded in the one side of substrate 1, allow heat pipe 2 to be arranged in parallel with substrate 1, and fill heat conduction in heat pipe 2 and be situated between
Matter.By above structure setting just constitute it is a kind of it is simple in construction, cost is cheap, heat transfer efficiency is high, good heat dissipation effect it is pre-buried
The heat sink of heat pipe.In actual applications, heat sink is arranged in electronic equipment, allows all power devices 3 of electronic equipment
One side contacts of heat pipe 2 are set with heat sink.Because the thermal resistance of heat pipe 2 is much smaller than the thermal resistance of substrate 1, during electronic device works,
When heat transfer caused by power device 3 is to heat sink contact surface, preferentially it can be conducted by heat pipe 2 to the distal end of heat pipe 2, then lead to
Substrate 1 is crossed to spread out heat.This mode not only increases heat transfer rate and radiating efficiency, and is effectively utilized non-cloth
The space of power device 3 is put, solves the problems, such as that existing heat dissipation technology easily causes heat and concentrates on local space where power device,
The promptness and reliability of radiating are ensure that, enhances radiating effect.
As prioritization scheme, present embodiment allows heat pipe 2 to use semi-cylindrical, and heat pipe 2 is placed in into substrate 1 correspondingly sets
In the semi-cylindrical groove put, and the semi-cylindrical section of heat pipe 2 is set to be flushed with the side of substrate 1.This structure setting is using
When, the compactness of heat sink and power device 3 can be improved, contacts both more abundant, ensure that heat transfer efficiency.To make all dissipate
Hot plate is reliably bonded with all power devices 3, and present embodiment also allows substrate 1 to be provided with the side of embedded heat pipe 2 and led
Warmware, the set-up mode of heat-conducting piece can both use leads with 3 corresponding position of power device part stickup insulating heat-conductive pad or coating
Hot silica gel, it can also use and paste insulating heat-conductive pad or coated with thermally conductive silica gel comprehensively.This structure setting can be avoided effectively because of processing
The problem of error causes Partial Power device 3 to contact unreal and then influence heat transfer with heat sink, further increase radiating effect.Need
It is noted that in actual applications, the present invention generally allows substrate 1 to be made using aluminium, its have handling ease, light weight,
The characteristics of heat-transfer effect is good.
Present invention also offers a kind of method that heat sink by above-mentioned pre-buried heat pipe is applied to electronic equipment, specifically include
Following steps：
First, according to design, the power device 3 of arranging electronic equipment, and flush all power devices 3.
2nd, the power device according to electronic equipment is laid out, using aluminium make corresponding to substrate 1, and in the side of substrate 1
Open up equally distributed semi-cylindrical groove.
3rd, according to the semi-cylindrical groove on substrate 1, corresponding semi-cylindrical heat pipe 2 is prepared, and by semi-cylindrical heat pipe 2
One-to-one corresponding is fixed in the semi-cylindrical groove of substrate 1, and the semi-cylindrical section of heat pipe 2 is flushed with the side of substrate 1.
4th, substrate 1 is arranged in electronic equipment, and substrate 1 is buried the side of heat pipe 2 and the power device of electronic equipment
Part is bonded.
5th, allow electronic equipment that air channel is set relative to the opposite side of power device in substrate 1.
In above-mentioned steps four, the step of also having carried out setting heat-conducting piece between substrate 1 and power device.Heat-conducting piece can
Using diversified forms such as insulating heat-conductive pad or heat conductive silica gels.
Heat sink provided by the invention by pre-buried heat pipe is applied to the method for electronic equipment, has that technique is simple, realizes
Easily, the advantages of radiating efficiency is high, heat caused by the power device of electronic equipment can rapidly and efficiently be spread out, ensured
The stability and reliability of electronic device works.
Above example is only the description carried out to the preferred embodiment of the present invention, and model not is claimed to the present invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, technology of this area engineers and technicians according to the present invention
The various forms of deformations that scheme is made, it all should fall into the protection domain of claims of the present invention determination.
Claims (6)
1. a kind of heat sink of pre-buried heat pipe, it is characterised in that including substrate (1) and be uniformly embedded in substrate (1) one side
More heat pipes (2), the heat pipe (2) are be arranged in parallel with substrate (1), and heat-conducting medium is filled with heat pipe (2).
2. according to a kind of heat sink of pre-buried heat pipe described in claim 1, it is characterised in that the heat pipe (2) is semicolumn
Shape, heat pipe (2) are in the semi-cylindrical groove that substrate (1) is correspondingly arranged, and make semi-cylindrical section and the substrate of heat pipe (2)
(1) side flushes.
3. according to a kind of heat sink of pre-buried heat pipe described in claim 2, it is characterised in that the substrate (1) is in embedded heat
The side of pipe (2) is provided with heat-conducting piece, and the heat-conducting piece is the insulating heat-conductive pad pasted or the heat conductive silica gel of coating.
4. according to a kind of heat sink of pre-buried heat pipe described in claim 3, it is characterised in that the substrate (1) uses aluminium
Make.
A kind of 5. method that heat sink described in claim 4 is applied to electronic equipment, it is characterised in that comprise the following steps：
First, according to design, the power device of arranging electronic equipment, and flush all power devices；
2nd, the power device according to electronic equipment is laid out, using aluminium make corresponding to substrate (1), and in the side of substrate (1)
Open up equally distributed semi-cylindrical groove；
3rd, according to the semi-cylindrical groove on substrate (1), corresponding semi-cylindrical heat pipe (2) is prepared, and by semi-cylindrical heat pipe
(2) correspond and be fixed in the semi-cylindrical groove of substrate (1), and make the semi-cylindrical section of heat pipe (2) and the side of substrate (1)
Face flushes；
4th, substrate (1) is arranged in electronic equipment, and substrate (1) is buried the side of heat pipe (2) and the power of electronic equipment
Device is bonded；
5th, allow electronic equipment that air channel is set relative to the opposite side of power device in substrate (1).
6. according to the method that heat sink is applied to electronic equipment described in claim 1, it is characterised in that in above-mentioned steps four
In, also carry out substrate (1) sets heat-conducting piece between power device the step of；Wherein, heat-conducting piece be insulating heat-conductive pad or
Heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711065189.2A CN107871723A (en) | 2017-11-02 | 2017-11-02 | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711065189.2A CN107871723A (en) | 2017-11-02 | 2017-11-02 | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107871723A true CN107871723A (en) | 2018-04-03 |
Family
ID=61753334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711065189.2A Pending CN107871723A (en) | 2017-11-02 | 2017-11-02 | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107871723A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
| CN111526458A (en) * | 2020-04-26 | 2020-08-11 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN111538384A (en) * | 2020-04-26 | 2020-08-14 | 南京安元科技有限公司 | High-efficiency heat dissipation Internet of things host integrating safety data acquisition, analysis and early warning |
| CN113380281A (en) * | 2021-06-23 | 2021-09-10 | 刘永志 | Information storage device for urban and rural planning |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039565A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| CN201611996U (en) * | 2010-02-09 | 2010-10-20 | 王弘越 | Heat pipe radiator |
| CN204191077U (en) * | 2014-10-23 | 2015-03-04 | 安徽赛沃电气科技有限公司 | A kind of novel inverter bridge module heat-pipe radiator |
-
2017
- 2017-11-02 CN CN201711065189.2A patent/CN107871723A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039565A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| CN201611996U (en) * | 2010-02-09 | 2010-10-20 | 王弘越 | Heat pipe radiator |
| CN204191077U (en) * | 2014-10-23 | 2015-03-04 | 安徽赛沃电气科技有限公司 | A kind of novel inverter bridge module heat-pipe radiator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
| CN111526458A (en) * | 2020-04-26 | 2020-08-11 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN111538384A (en) * | 2020-04-26 | 2020-08-14 | 南京安元科技有限公司 | High-efficiency heat dissipation Internet of things host integrating safety data acquisition, analysis and early warning |
| CN113380281A (en) * | 2021-06-23 | 2021-09-10 | 刘永志 | Information storage device for urban and rural planning |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180403 |