WO2020011045A1

WO2020011045A1 - Heat dissipation device

Info

Publication number: WO2020011045A1
Application number: PCT/CN2019/094206
Authority: WO
Inventors: 周爱兰; 杨洪亮; 张金川
Original assignee: 中兴通讯股份有限公司
Priority date: 2018-07-12
Filing date: 2019-07-01
Publication date: 2020-01-16
Also published as: EP3813501A4; JP3233006U; CN208850120U; EP3813501A1

Abstract

A heat dissipation device, the heat dissipation device comprising: a heat generation mechanism, a heat conduction mechanism, and a heat dissipation mechanism, the heat conduction mechanism comprising: a heat conduction layer and a filling layer; the heat generation mechanism is provided on the heat dissipation mechanism; the heat conduction mechanism is provided between the heat generation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat generation mechanism and with the heat dissipation mechanism; the filling layer is not in contact with the heat generation mechanism; and the filling layer transfers the heat of a heat conduction and temperate equalization layer to the heat dissipation mechanism.

Description

Heat sink

Technical field

The present disclosure relates to, but is not limited to, the field of heat dissipation technology.

Background technique

With the development of wireless communication technology from the second-generation mobile communication technology (2-Generation wireless telephone technology (2G) network to the fourth-generation mobile communication technology (the 4th generation mobile communication technology (4G) network, and the fifth In the 5th-Generation (5G) network, wireless communication technology requires faster transmission speed and greater output power; however, faster transmission speed and greater output power have significantly increased the heat consumption of outdoor communication base station systems ( For example, from 300W (Watt) to 1500W, the heat consumption per unit volume is increased from 20W / L (Watt / L) to 30W / L-40W / L), especially the heat consumption of high-power chips is more obvious.

In order to reliably and stably dissipate heat from a heating mechanism such as a high-power chip of an outdoor communication base station, the related art mainly adopts a heat-dissipating substrate between the chip and the heat-dissipating shell, thereby transferring the center temperature of the chip to the heat-dissipating. On the substrate, the heat is transferred to the heat dissipation casing through the uniform temperature heat dissipation substrate, so as to achieve the purpose of dissipating heat to the chip.

Summary of the invention

In view of this, according to a first aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, and a heat dissipation mechanism, and the heat conduction mechanism includes a heat conduction layer and a filling layer. Wherein, the heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism and the heat dissipation mechanism, respectively; The filling layer is not in contact with the heating mechanism; the filling layer transfers the heat of the thermally conductive layer to the heat dissipation mechanism.

According to a second aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a first heat transfer layer. The heat conduction mechanism includes a heat conduction layer and a filling layer. The heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism; the first heat transfer layer is disposed On the heat conducting mechanism, the heat of the heat generating mechanism is transmitted to the heat conducting mechanism; and the filling layer is not in contact with the heat generating mechanism.

Optionally, the filling layer may be provided between the heat conductive layer and the heat dissipation mechanism and / or between the heat conductive layer and the first heat transfer layer.

According to a third aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, a second heat transfer layer, and a floating mechanism. The heat transfer mechanism includes a heat transfer layer and a filling layer. Wherein the heat conduction mechanism is disposed between the heat generation mechanism and the heat dissipation mechanism; the second heat transmission layer is disposed between the heat generation mechanism and the heat conduction layer of the heat conduction mechanism, and The heat of the heating mechanism is transmitted to the heat conduction layer; the filling layer is disposed between the heat conduction layer and the heat dissipation mechanism, and transmits the heat of the heat conduction layer to the heat dissipation mechanism; the floating mechanism transmits The heat conduction layer is fixedly connected to the heat dissipation mechanism to adjust the interval between the heat conduction layer and the heat dissipation mechanism and / or the floating mechanism fixedly connects a substrate provided on the heat generation mechanism to the heat conduction layer. In order to reduce the interval between the heat generating mechanism and the thermally conductive layer.

Optionally, the filling layer and the second heat transfer layer are both thermal interface materials, especially elastic thermal interface materials, such as thermally conductive silica gel, thermally conductive glue, or phase interface materials.

Optionally, the heat-conducting layer is an isothermal heat-dissipating substrate such as an aluminum plate, a copper plate, a temperature equalizing plate, or a heat pipe-embedded aluminum plate. The thermally conductive layer has a function of uniformly conducting heat.

Optionally, the floating mechanism is a spring screw,

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, similar reference numerals may describe similar components in different views. Similar reference numerals with different letter suffixes may represent different examples of similar components. The drawings generally illustrate various embodiments discussed herein by way of example and not limitation.

FIG. 1 is a schematic structural diagram of a heat dissipation device according to an optional embodiment of the present disclosure;

2 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

3 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

4 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

5 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

6 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

7 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

8 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

9 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

10 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;

FIG. 11 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure.

In order to enable those skilled in the art to clearly understand the technical solution of the present disclosure, the technical solution of the present disclosure will be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments and drawings are only for the convenience of the art. The explanation of the technical solution of the present disclosure by a technician does not constitute a limitation on the technical solution of the present disclosure, as long as it is within the scope of the idea of the present disclosure, any creative improvement should be included in the protection scope of the present disclosure.

It should be understood that “an embodiment of the present disclosure” or “the foregoing embodiment” mentioned throughout the specification means that a particular feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present disclosure. Therefore, "in the embodiments of the present disclosure" or "in the foregoing embodiments" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

As mentioned earlier, in order to reliably and stably dissipate heat from a heating mechanism such as a high-power chip of an outdoor communication base station, the related art mainly adopts a uniform heat-dissipating substrate between the chip and the heat-dissipating shell, thereby reducing the core temperature of the chip The heat is transferred to the heat-dissipating substrate, and the heat is transferred to the heat-dissipating shell through the heat-dissipating substrate, so as to achieve the purpose of dissipating heat to the chip. However, due to the processing and mounting tolerances of the chip and the uniform temperature heat dissipation substrate, there is a gap between the uniform temperature heat dissipation substrate and the chip, which results in a large thermal resistance between the chip and the uniform temperature heat dissipation substrate. In order to solve the above problems, related technologies A layer of interface material is set between the chip and the uniform temperature heat dissipation substrate, thereby reducing thermal resistance and improving heat transfer. However, the thickness of the interface material is relatively thick and the thermal conductivity of the interface material is small, resulting in low heat transfer efficiency, which makes the chip's heat dissipation effect worse.

Referring to FIG. 1, an optional embodiment of the present disclosure provides a heat dissipation device. The heat dissipation device includes: a heating mechanism 1, a heat conduction mechanism 2, and a heat dissipation mechanism 3. The heat conduction mechanism 2 includes a heat conduction layer 2a and a filling layer 2b. Among them, the heating mechanism 1 is disposed on the heat dissipation mechanism 3; the heat conduction mechanism 2 is disposed between the heat generation mechanism 1 and the heat dissipation mechanism 3, and the heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively.

In this embodiment, the heat conduction mechanism 2 is made of a material with good heat conduction performance. The heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively, and the heat generated by the heat generation mechanism 1 is quickly conducted to the heat dissipation mechanism 3 by the heat conduction mechanism 2. Thus, heat radiation to the heating mechanism 1 is achieved. It should be understood that the heating mechanism 1 may be a heating chip provided on the substrate 11, such as a high-power chip, CPU, GPU, etc. used for outdoor communication base stations, and the heating mechanism 1 may also be a battery, a motor, or other components that generate heat. , Or a mechanism to dissipate heat from other devices.

The filling layer 2 b is not in contact with the heat generating mechanism 1. The filling layer 2b transfers the heat of the thermally conductive layer 2a to the heat radiation mechanism 3.

Here, the thermally conductive layer 2a may be a thermally conductive layer 2a made of a thermally conductive material such as a copper plate, a vacuum chamber (VC) plate, an aluminum plate, a heat pipe embedded aluminum plate, or a heat pipe. The filling layer 2b is a thermally conductive material having elasticity such as a thermally conductive pad or the like. In other embodiments, the filling layer 2b may also be an amorphous thermally conductive material, such as thermal silica gel, thermally conductive adhesive, and the like.

It should be noted that, in FIG. 1, the case where the heat dissipation device includes one heat generating mechanism is taken as an example. It should be understood that in this embodiment, when the heat dissipation device includes multiple heat generating mechanisms, the heat dissipation device provided in this embodiment can also be applied. In addition, it should be noted that the heat generating mechanism 1 is provided on the heat radiating mechanism 3, and may be directly or indirectly provided on the heat radiating mechanism (in FIG. 1, the heat generating mechanism 1 is indirectly provided on the heat radiating mechanism).

When the heat radiating device includes a plurality of heating mechanisms, due to processing tolerances between the multiple heating mechanisms during processing, the thickness of the heating mechanisms is different, which results in a gap between the heating mechanism and the heat conduction mechanism, which increases the The heat generated by the heating mechanism is transferred to the thermal resistance on the heat conduction mechanism. In this embodiment, as shown in FIG. 1, the heat conduction mechanism is provided to include a heat conduction layer and a filling layer, and the filling layer is not in contact with the heat generation mechanism. In this way, after the heat generation mechanism is disposed on the heat radiation mechanism, the heat conduction is caused by the filling layer The gap between the layer and the heat dissipation mechanism is filled. Therefore, the elastic pressing effect of the filling layer can be used to tightly press the heat conductive layer together with the heat generating mechanism. Therefore, on the basis of compensating the processing and installation tolerances of the heating mechanism and the heat conduction mechanism, it is possible to improve the heat transfer efficiency and improve the heat radiation effect on the heating mechanism.

Since the heat-conducting layer is a heat-conducting layer made of a heat-conducting material with good thermal conductivity such as copper plate, VC plate, aluminum plate or heat pipe, the thermal conductivity of the heat-conducting layer can reach 380W / mk (Watts / meter * Kelvin). The heat generated by the heat-generating mechanism is quickly transferred to the heat-dissipating mechanism, which reduces the thermal resistance between the heat-generating mechanism and the heat-dissipating mechanism, thereby improving the transmission efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.

In this embodiment, referring to FIG. 1, the surface of the heat dissipation mechanism 3 may be provided with a notch, the heat conduction mechanism 2 is disposed in the notch, and the filling layer 2b is a thermally conductive material having elasticity. When the mechanisms 1 are pressed together, the filling layer 2b can always provide the heat-conducting layer 2a with an elastic force directed toward the heat-generating mechanism 1, so that the heat-conducting layer 2a can be more closely pressed with the heat-generating mechanism 1. In addition, by disposing the heat transfer mechanism 2 in the slot, the heat of the heat transfer mechanism 2 can also be transferred to the heat dissipation mechanism through the side wall of the slot, thereby further improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism. Of course, in this embodiment, the surface of the heat dissipation mechanism 3 may not be provided with a notch. At this time, the heat conduction mechanism 2 is directly disposed on the surface of the heat dissipation mechanism 3, and the filling layer 2b can also play a role in pressing the heat conduction layer 2a and the heat generation mechanism 1. More closely.

The heat dissipation device provided by the embodiment of the present disclosure directly contacts the heat conduction mechanism and the heat generation mechanism when dissipating the heat generation mechanism, but the filling layer in the heat conduction mechanism does not contact the heat generation mechanism. In this way, the heat generated by the heat generation mechanism is directly transmitted. The heat-conducting layer is provided so that the heat-conducting layer can quickly transfer the heat from the center of the heat-generating mechanism to the heat-radiating mechanism, improve the heat-conducting efficiency of the heat generated by the heat-generating mechanism, and enhance the heat-radiating effect on the heat-generating mechanism.

As shown in FIG. 1, in this embodiment, the heat dissipation mechanism 3 may include a heat dissipation casing 3 a and a plurality of heat dissipation teeth 3 b. The plurality of heat dissipation teeth 3 b are disposed on the heat dissipation casing 3 a and are fixedly connected to the heat dissipation casing 3 a. ; And a plurality of heat-dissipating teeth 3b are provided away from the heating mechanism 1 and the heat-conducting mechanism 2.

In this embodiment, the plurality of heat dissipating teeth and the heat dissipating case may be made of the same thermally conductive material; as shown in FIG. 1, the plurality of heat dissipating teeth and the heat dissipating case are disposed perpendicular to each other. The heat dissipation area improves the heat dissipation effect and enhances the cooling and heat dissipation effect of the heating mechanism. Alternatively, a plurality of heat dissipation teeth may be formed integrally with the heat dissipation housing.

Based on the foregoing embodiment, in an alternative embodiment of the present disclosure, referring to FIG. 2 (the case where the heat dissipation device includes a heat generating mechanism is taken as an example in FIG. 2), the heat conducting layer 2 a is disposed on the filling layer 2 b.

As shown in FIG. 2, in this embodiment, the thermally conductive layer 2 a is in direct contact with the heat generating mechanism 1; the filling layer 2 b is disposed between the thermally conductive layer 2 a and the heat dissipation mechanism 3.

In this embodiment, the heating mechanism is directly contacted with the heat-conducting layer. During the installation process, due to the elastic floating effect of the filling layer, the heat-conducting layer is tightly pressed onto the heating mechanism; at the same time, because the heat-conducting layer is a copper plate or a VC plate Made of thermally conductive materials such as aluminum, aluminum plates or heat pipes, and the thermal conductivity of the thermally conductive layer can reach 380 W / mk. Therefore, the thermally conductive layer can quickly transfer the heat generated by the heating mechanism to the heat dissipation mechanism, reducing the heating mechanism and the The thermal resistance between the heat-dissipating mechanisms improves the transfer efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.

In addition, as shown in FIG. 2, the heat dissipation device may further include a substrate 11 and at least two fixed connecting members 14. The heat-generating mechanism 1 is provided between the substrate 11 and the heat-conducting mechanism 2. One end of the at least two fixed connecting members 14 is connected to the substrate 11, and the other end is connected to the heat dissipation mechanism 3. In addition, the fixing connection member 14 may be a screw or a bolt, which may be screwed into a threaded hole on the heat dissipation mechanism 3 (for example, the heat dissipation casing 3a) through a hole on the substrate 11. The substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for the electronic components and a carrier for the electrical connection of the electronic components.

In addition, preferably, the at least two fixed connectors 14 apply a force to the substrate 11 toward the heat generating mechanism 1, thereby clamping the heat generating mechanism 1 and the heat conducting mechanism 2 between the substrate 11 and the heat radiating mechanism 3. When the fixing connection member 14 is a screw (which can be a common screw or a spring screw), by screwing the screw down, a screw head (not shown in detail in the figure) can be used to apply force to the substrate 11. In this way, the filling layer 2b with elasticity can further be used to eliminate processing tolerances and installation tolerances of the heating mechanism 1, the substrate 11, and the thermally conductive layer 2a, etc., and reduce the gap between the thermally conductive layer and the heating layer, so that the thermally conductive layer and the heating layer are not used. The thermal interface material or a thin thermal interface material with a thickness of, for example, 0.1-0.15 mm, improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. This effect is particularly prominent when there are two or more heating mechanisms 1 corresponding to the same substrate 11. It should be understood that the substrate 11 and the heating mechanism 1 may be fixedly connected to each other or formed integrally. In addition, although the substrate and the fixed connection are shown in the drawings of the present disclosure, they are not essential. Additionally or alternatively, the effects of eliminating tolerances and reducing thermal resistance may be achieved by other methods such as the first fixed connection member 10, the second fixed connection member 13 or the second elastic connection member 12 described below.

Referring to FIG. 3, in an optional embodiment of the present disclosure, the filling layer 2b is disposed on the thermally conductive layer 2a. In other words, the thermally conductive layer 2a is provided between the filling layer 2b and the heat generating mechanism 1.

As shown in FIG. 3, in FIG. 3, a filling layer 2b is provided on the heat conductive layer 2a, and a case where two heat generating mechanisms are provided is taken as an example. The heat sink provided in this embodiment further includes a first heat transfer layer 4, The first heat transfer layer 4 is disposed on the heat transfer mechanism 2; the first heat transfer layer 4 transfers the heat of the heat generating mechanism 1 to the heat transfer mechanism 2. In other words, in this embodiment, the heat-conducting mechanism 2 does not directly contact the heat-generating mechanism 1, but transfers heat through at least the first heat-transfer layer 4.

As shown in FIG. 3, in this embodiment, the first heat transfer layer 4 is directly in contact with the heating mechanism 1. The first heat transfer layer 4 may be made of a material having good thermal conductivity, such as a copper sheet, a VC plate, and an aluminum plate. of.

It should be noted that, in this embodiment, the material of the first heat transfer layer 4 may be the same as that of the heat transfer layer 2a. Of course, the first heat transfer layer 4 may also be made of a different material from the thermally conductive layer 2a, as long as the first heat transfer layer 4 is made of a material having good thermal conductivity, which is not particularly limited in this embodiment.

The filling layer 2b is provided between the thermally conductive layer 2a and the first thermally conductive layer 4.

Of course, in this embodiment, the filling layer may also be disposed between the thermally conductive layer 2a and the heat dissipation mechanism 3; or, the filling layer may be disposed between the thermally conductive layer 2a and the first thermally conductive layer 4 and at the same time (another) The filling layer is provided between the heat-conducting layer 2 a and the heat dissipation mechanism 3.

In this embodiment, when the filling layer is disposed between the heat-conducting layer and the heat-dissipating mechanism, the first heat-transfer layer directly contacts the heat-conducting layer, and after the installation is completed, the first heat-transfer layer, The thermally conductive layer is tightly pressed against the heating mechanism by the filling layer. The first heat transfer layer quickly transfers the heat generated by the heating mechanism to the thermally conductive layer, which reduces the thermal resistance between the thermally conductive layer and the heating mechanism, improves the efficiency of heat transfer, and conducts heat. The layer can quickly transfer the heat generated by the heat generating mechanism to the heat dissipation mechanism, reducing the thermal resistance between the heat generating mechanism and the heat dissipation mechanism, thereby improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism.

Based on the foregoing embodiment, referring to FIG. 4 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 4), in an optional embodiment of the present disclosure, the heat conductive layer 2 a is close to the first heat transfer layer 4. A groove 2c is provided on the surface; wherein the first heat transfer layer 4 is disposed in the groove 2c.

As shown in FIG. 4, in this embodiment, the groove 2 c is disposed to face the heating mechanism 1, and the first heat transfer layer 4 is disposed in the groove 2 c; the filling layer 2 b is disposed between the heat conduction layer 2 a and the heat dissipation mechanism 3. . Of course, the filling layer may also be disposed in the groove 2 c and disposed between the first heat transfer layer 23 and the heat transfer layer 2 a.

In this embodiment, the first heat transfer layer is disposed in the groove, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.

Based on the foregoing embodiment, referring to FIG. 5 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 5), the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least two limiting posts. 5; at least two limiting posts 5 are disposed on the surface of the thermally conductive layer 2a close to the first heat transfer layer 4; the first heat transfer layer 4 is disposed between at least two limiting posts 5.

As shown in FIG. 5, in the present embodiment, the area between the opposite sides of the two limiting posts 5 is opposite to the heating mechanism 1, and the first heat transfer layer 4 is provided on the opposite side of the two limiting posts 5. In a region between them; a filling layer 2b is provided between the heat conducting layer 2a and the heat dissipation mechanism 3. Of course, the filling layer may also be provided in a region between the opposite sides of the two limiting posts 5 and between the first heat transfer layer 4 and the heat transfer layer 2a. In FIG. 5, a case where the filling layer 2 b is provided between the heat conductive layer 2 a and the heat dissipation mechanism 3 is taken as an example. It should be noted that the filling layer 2b may also be provided between the first heat transfer layer 4 and the thermally conductive layer 2a. At this time, the filling layer 2b is provided in a region between the opposite sides of the two limiting posts 5 and, The filling layer 2b is a thermally conductive material with a certain hardness and elasticity, such as a thermally conductive pad. After installation, the elasticity of the thermally conductive pad tightly presses the first heat transfer layer 4 on the heating mechanism 1.

In this embodiment, the first heat transfer layer is disposed in an area between the opposite sides of the two limiting posts, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.

Based on the foregoing embodiment, referring to FIG. 6 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 6), the heat dissipation device provided by an optional embodiment of the present disclosure further includes a second heat transfer layer 6, Wherein: the second heat transfer layer 6 is disposed on the first heat transfer layer 4; the second heat transfer layer 6 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.

In this embodiment, the second heat transfer layer 6 may be a thermal interface material with good thermal conductivity and somewhat soft fluidity, such as thermally conductive silicone grease, thermally conductive glue, and the like. In other embodiments, the second heat transfer layer 6 may be an elastic thermal interface material, such as an elastic thermally conductive pad.

After the installation is completed, the second heat transfer layer 6 is tightly pressed onto the heat generating mechanism 1 by the first heat transfer layer 4.

In this embodiment, the second heat transfer layer is a thermal interface material, especially some materials with very soft fluid properties such as thermally conductive silicone grease, thermally conductive glue, and the like. After the second heat transfer layer is disposed between the first heat transfer layer and the heat generating mechanism, the second heat transfer layer is tightly pressed onto the heat generating mechanism to reduce the thermal resistance between the heat generating mechanism and the first heat transfer layer. Therefore, the transmission efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism is improved.

It should be understood that the second heat transfer layer 6 may also be directly disposed on and in contact with the heat transfer mechanism 2, that is, the first heat transfer layer 4 may not be provided. In addition, the filling layer 2b is an elastic thermal interface material such as a thermally conductive pad. In this case, the filling layer 2b is provided between the thermally conductive layer 2a and the heat radiation mechanism 3. In other words, the heat-conducting layer 2a may be in contact with the heat-generating mechanism 1 and the heat-radiating mechanism 3 through the thermal interface material serving as the second heat-transporting layer 6 and the filling layer 2b, respectively. Since the thermally conductive layer 2a has a function of uniform temperature, it may also be referred to as a thermally conductive uniform temperature layer or a uniform thermally conductive layer.

Based on the foregoing embodiment, referring to FIG. 7 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 7), the heat dissipation device provided in an optional embodiment of the present disclosure further includes an adhesive layer 7 and an adhesive layer 7 The first heat transfer layer 4 is adhered to the heat generating mechanism 1, and the adhesive layer 7 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.

In this embodiment, the adhesive layer 7 may be a thermally conductive adhesive. The thermally conductive adhesive can be a single component, thermally conductive, room temperature curing silicone adhesive sealant. Thermally conductive adhesive has good resistance to cold and heat alternation, aging resistance and electrical insulation properties, and has good moisture resistance, shock resistance, corona resistance, leakage resistance and chemical resistance. It can be used continuously at -60 ° C to 280 ° C and maintains performance, and has good adhesion to most metal and non-metal materials.

As shown in FIG. 7, in this embodiment, the first heat transfer layer is adhered to the heating mechanism through a thermally conductive adhesive. In this way, the first heat transfer layer can be prevented from falling due to vibration and the like while reducing heat generation. The thermal resistance between the mechanism and the first heat transfer layer improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism, and enhances the cooling and cooling effect on the heating mechanism.

Based on the foregoing embodiment, referring to FIG. 8 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 8), the heat dissipation device provided by an optional embodiment of the present disclosure further includes a heat transfer member 8, One end of 8 is connected to the first heat transfer layer 4, and the other end of the heat transfer member 8 is connected to the heat conduction mechanism 2.

In this embodiment, the heat transfer member 8 includes a heat pipe; as shown in FIG. 8, the heat pipe includes an evaporation side 8b and a condensation side 8a; the evaporation side 8b of the heat pipe is connected to the first heat transfer layer 4; and the condensation side 8a of the heat pipe is connected to a heat exchanger. Layer 2a is connected.

In this embodiment, the heat pipe is composed of a shell, a wick and an end cap. The inside of the shell is drawn to a negative pressure of 1.3 × 10 ^-1 Pa-10 to ⁴ Pa and filled with an appropriate amount of working liquid. The thermal phase change liquid can be selected according to the actual needs. The wick is made of a capillary material with multiple holes and is closely attached to the inner wall of the tube shell. The working liquid is filled with the wick and sealed. The working liquid in the heat pipe is evaporated on the heated side, and the condensed side is the condensed side of the working liquid in the heat pipe. When the evaporation side of the heat pipe is heated, the liquid in the suction core evaporates and vaporizes. The steam flows to the condensation side under a slight pressure difference and releases heat to condense into a liquid. The liquid flows along the suction core and relies on the siphoning force of the suction core. Evaporation side. In this way, heat is transferred from the evaporation side to the condensation side of the heat pipe.

In this embodiment, the evaporation side of the heat pipe is connected to the first heat transfer layer, and the connection method between the evaporation side of the heat pipe and the first heat transfer layer may be welding, bonding or other connection methods, and the condensing side of the heat pipe and heat conduction Layer connection, the connection method of the condensation side of the heat pipe and the heat conduction layer can be welding, bonding or other connection methods. The heat on the evaporation side of the heat pipe can be quickly transferred to the condensation side of the heat pipe, and transferred to the heat conduction layer through the condensation side of the heat pipe, reducing the thermal resistance between the first heat transfer layer and the heat conduction layer, and increasing the heat generated by the heating mechanism. The transfer efficiency to the heat-dissipating mechanism enhances the cooling effect of the heat-generating mechanism.

Based on the foregoing embodiment, referring to FIG. 9 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 9), the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least one first elastic connecting member . In FIG. 9, each heating mechanism corresponds to two first elastic connecting members 9 as an example, in which one end of at least one first elastic connecting member is connected to the first heat transfer layer 4 and the other end of at least one first elastic connecting member. It is connected to the thermally conductive layer 2a; at least one first elastic connecting member provides elastic force to the first thermally conductive layer 4 in a direction close to the heat generating mechanism 1.

As shown in FIG. 9, the first elastic connecting member 9 is provided perpendicular to the surface where the heat conductive layer 2 a contacts the first heat transfer layer 4. After the installation is completed, the first elastic connecting member 9 provides the first heat transfer layer 4. The direction of the elastic force provided by the first elastic connecting member 9 to the first heat transfer layer 4 is directed to the heat generating mechanism 1. That is, in this embodiment, the first heat transfer layer 4 and the heat transfer layer are tightly pressed onto the heat generating mechanism 1 under the action of the first elastic connecting member 9.

As shown in FIG. 9, the case where the filling layer 2 b is provided between the first heat transfer layer 4 and the heat conducting layer 2 a is taken as an example in FIG. 9. It should be understood that the filling layer 2 b may also be provided between the heat conducting layer 2 a and the heat dissipation mechanism. Between 3, the filling layer 2b may also be disposed between the first heat transfer layer 4 and the heat conducting layer 2a, and at the same time between the heat conducting layer 2a and the heat dissipation mechanism 3. The filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.

In this embodiment, the first elastic connecting member may be a spring screw. After the spring screw connects two objects, the spring screw can provide elastic force to the two objects connected by the spring screw between the two objects connected by the spring screw. In the method, the first elastic connecting member 9 provides the first heat transfer layer 4 with an elastic force directed toward the heat generating mechanism 1.

In this embodiment, as shown in FIG. 9, the device further includes at least two first fixed connecting members, and the at least two first fixed connecting members fix the heat conducting layer 2 a on the heat dissipation mechanism 3.

In this embodiment, the first fixed connection member 10 may be an ordinary screw. The first fixed connection member 10 fixes the heat conducting layer 2 a on the heat dissipation mechanism 3 through a threaded hole provided in the heat dissipation mechanism 3.

In this embodiment, a first elastic connection is used to connect the first heat transfer layer to the heat transfer layer. After the installation is completed, the first heat transfer layer is tightly pressed onto the heating mechanism. In this way, the first elastic connection is provided. The elastic force reduces the gap between the first heat transfer layer and the heating mechanism, thereby reducing the thermal resistance between the heating mechanism and the first heat transfer layer, and improving the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. Enhance the cooling and cooling effect on the heating mechanism.

Based on the foregoing embodiment and referring to FIG. 10, in an optional embodiment of the present disclosure, the heating mechanism 1 is disposed on the substrate 11; the heat dissipation device further includes at least two second elastic connecting members; One end of the two elastic connecting members is connected to the heat conductive layer 2a, and the other ends of the at least two second elastic connecting members are connected to the substrate 11. The at least two second elastic connecting members provide elastic force to the heat conductive layer 2a in a direction close to the heating mechanism 1. The filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.

In this embodiment, the second elastic connecting member 12 may be the same spring screw or other elastic connecting members as the first elastic connecting member.

In this embodiment, as shown in FIG. 10, the second elastic connecting member 12 is disposed at both ends of the heat conductive layer 2a, and the second elastic connecting member 12 is provided perpendicular to the surface of the heat conductive layer 2a near the substrate 11, and the second elastic The connecting member 12 provides an elastic force to the heat-conducting layer 2 a perpendicular to the surface of the heat-generating mechanism 1 that is in contact with the heat-conducting layer 2 a. The heat-conducting layer 2 a is tightly pressed against the heat-generating mechanism 1 by the elastic force.

In this embodiment, the substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for electronic components and a carrier for the electrical connection of the electronic components; several electronic components are disposed on the PCB board. , And realize electrical connection with each other through printed circuits on the PCB.

As shown in FIG. 10, the substrate 11 is fixedly connected to the heat dissipation mechanism 3, and the side on which the electronic components are disposed on the substrate 11 is directly opposite to the heat dissipation mechanism 3. That is, as shown in FIG. 10, the electronic components on the substrate 11 are disposed between the substrate 11 and the heat dissipation mechanism 3.

The heating mechanism 1 is provided between the substrate 11 and the heat dissipation mechanism 3 and is connected to the substrate 11. Here, the heating mechanism 1 may be a heating chip provided on the substrate 11. The heating mechanism 1 is an electronic component, and is arranged on the substrate 11 together with other electronic components, and is electrically connected to other electronic components through a printed circuit of the substrate 11. .

In this embodiment, the thermally conductive layer and the substrate are connected by a spring screw. The spring screw provides elastic force between the thermally conductive layer and the substrate, so that the thermally conductive layer is tightly pressed onto the heating mechanism, and the heating mechanism and the thermally conductive layer are reduced. The gap and thermal resistance improve the transfer efficiency of the heat generated by the heating mechanism to the heat dissipation mechanism, and enhance the cooling and cooling effect of the heating mechanism.

Based on the foregoing embodiment, as shown in FIG. 11 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 11), in an optional embodiment of the present disclosure, the heat generating mechanism 1 is disposed on the substrate 11; It also includes at least two second fixed connecting members, and the at least two second fixed connecting members fixedly connect the heat conducting layer 2 a and the substrate 11.

In this embodiment, the second fixed connection member 13 may be the same ordinary screw as the first fixed connection member, and the second fixed connection member 13 fixes the heat conductive layer 2a on the substrate 11 through a screw hole.

The second heat transfer layer may include some relatively soft fluid thermal interface materials, such as thermal interface materials such as thermally conductive silicone grease, thermally conductive glue, and the thickness of the thermal interface material is 0.10 mm-0.15 mm. Some softer thermal interface materials in this embodiment may be thermally conductive silicone grease, thermally conductive adhesive, etc. Of course, the material of the second heat transfer layer in this embodiment may be the same as the material of the filling layer, or it may be different, as long as it is It has good thermal conductivity and can have certain elasticity, which is not specifically limited in this embodiment.

In various embodiments of the present disclosure, the filling layer is a thermal interface material, and its thickness is 0.30 mm-1.00 mm. The filling layer in FIG. 1 to FIG. 8 may include an elastic thermal interface material, and the filling layer in FIG. 9 to FIG. 11 may also be a thermally conductive adhesive with relatively soft fluidity.

The heat-conducting layer may include or may be a temperature-conducting heat-conducting substrate, and the area of the temperature-conducting heat-conducting substrate is larger than the contact area of the heating mechanism and the heat-conducting mechanism. The temperature-conducting and heat-conducting substrate can be made of a thermally conductive material such as a copper plate, a VC plate, an aluminum plate, or a heat pipe.

It should be understood that the first elastic connecting member 9 and the second elastic connecting member 12 in the above embodiments, and the filling layer 2b in FIG. 1 to FIG. 8 and the like have a function of adjusting the interval between the layers by applying a clamping force. Role of the floating body. In particular, in the case where a thermal interface material is used as an intermediate layer, through such a floating mechanism, the interval between the thermally conductive layer 2a and the heat generating mechanism 1 and / or the thermally conductive layer 2a and the heat radiating layer 3 (i.e., compression heat) can be reduced. Interface material thickness) to reduce thermal resistance. Since the thermally conductive layer 2a has a function of uniformly conducting heat, it can quickly extract heat from the heat generating mechanism, and quickly and fully transfer it to the heat dissipating mechanism after performing the uniformly conducting heat.

The above are only preferred embodiments of the present disclosure, and are not intended to limit the protection scope of the present disclosure.

Claims

A heat dissipation device includes a heating mechanism, a heat conduction mechanism, and a heat dissipation mechanism. The heat conduction mechanism includes: a heat conduction layer and a filling layer;

The heating mechanism is disposed on the heat dissipation mechanism;

The heat conduction mechanism is disposed between the heat generation mechanism and the heat radiation mechanism, and the heat conduction mechanism is in contact with the heat generation mechanism and the heat radiation mechanism, respectively;

The filling layer is not in contact with the heating mechanism; and the filling layer has elasticity, and the elastic floating effect tightly presses the heat conducting layer and the heating mechanism together;

The filling layer transfers the heat of the thermally conductive layer to the heat dissipation mechanism.
The device according to claim 1, wherein the thermally conductive layer is disposed between the filling layer and the heat generating mechanism.
The device according to claim 1 or 2, wherein:

The heating mechanism is disposed on a substrate;

The device further includes at least two second elastic connecting members;

One end of the at least two second elastic connecting members is connected to the heat conductive layer, and the other end of the at least two second elastic connecting members is connected to the substrate; and

The at least two second elastic connecting members provide elastic force to the heat conductive layer in a direction close to the heating mechanism.
The device according to claim 1 or 2, wherein:

The device further includes at least two first fixed connecting members that fix the heat conductive layer on the heat dissipation mechanism.
The device according to claim 1 or 2, wherein:

The heating mechanism is disposed on a substrate;

The device further includes at least two second fixed connections;

The at least two second fixed connecting members fixedly connect the heat conducting layer and the substrate.
A heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a first heat transfer layer. The heat conduction mechanism includes a heat conduction layer and a filling layer;

The heating mechanism is disposed on the heat dissipation mechanism;

The heat conduction mechanism is disposed between the heat generation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism;

The first heat transfer layer is disposed on the heat transfer mechanism, and transfers heat of the heat generation mechanism to the heat transfer mechanism; and

The filling layer is not in contact with the heating mechanism.
The apparatus according to claim 6, wherein:

A groove is provided on a surface of the heat conductive layer close to the first heat transfer layer; and

The first heat transfer layer is disposed in the groove.
The apparatus according to claim 6, wherein:

The device further includes at least two limiting posts;

The at least two limiting posts are disposed on a surface of the thermally conductive layer near the first thermally conductive layer; and

The first heat transfer layer is disposed between the at least two limiting posts.
The apparatus according to claim 6, wherein:

The device further includes a second heat transfer layer; and

The second heat transfer layer is disposed on the first heat transfer layer, and the second heat transfer layer transfers heat of the heating mechanism to the first heat transfer layer.
The device according to any one of claims 6-9, wherein:

The device further includes a heat transfer member disposed between the first heat transfer layer and the filling layer;

The heat transfer member includes a heat pipe;

An evaporation side of the heat pipe is connected to the first heat transfer layer; and

The condensation side of the heat pipe is connected to the thermally conductive layer.
The device according to any one of claims 6-10, wherein:

The device further includes at least one first elastic connecting member;

One end of the at least one first elastic connection member is connected to the first heat transfer layer, and the other end of the at least one first elastic connection member is connected to the heat conduction layer; and

The at least one first elastic connecting member provides elastic force to the first heat transfer layer in a direction close to the heat generating mechanism.
The device according to any one of claims 6 to 11, wherein:

The filling layer is disposed between the thermally conductive layer and the heat dissipation mechanism and / or between the thermally conductive layer and the first thermally conductive layer.
The device according to any one of claims 6 to 11, wherein:

The heating mechanism is disposed on a substrate;

The device further includes at least two second elastic connecting members;

One end of the at least two second elastic connecting members is connected to the heat conductive layer, and the other end of the at least two second elastic connecting members is connected to the substrate; and

The at least two second elastic connecting members provide elastic force to the heat conductive layer in a direction close to the heating mechanism.
The device according to any one of claims 6 to 11, wherein:

The device further includes at least two first fixed connecting members that fix the heat conductive layer on the heat dissipation mechanism.
The device according to any one of claims 6 to 11, wherein:

The heating mechanism is disposed on a substrate;

The device further includes at least two second fixed connections;

The at least two second fixed connecting members fixedly connect the heat conducting layer and the substrate.
The apparatus according to claim 9, wherein:

The filling layer and the second heat transfer layer are thermal interface materials.
A heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a floating mechanism. The heat conduction mechanism includes a heat conduction layer and a filling layer;

The heat conduction mechanism is disposed between the heat generation mechanism and the heat radiation mechanism;

The filling layer is disposed between the heat conduction layer and the heat dissipation mechanism, and transfers heat of the heat conduction layer to the heat dissipation mechanism;

The floating mechanism fixedly connects the thermally conductive layer and the heat dissipation mechanism or the floating mechanism fixedly connects a substrate provided on the heating mechanism with the thermally conductive layer to reduce the heating mechanism and the thermally conductive layer. Interval.
The heat sink according to claim 17, wherein the filling layer is a thermal interface material.
The heat dissipation device according to claim 17 or 18, wherein the thermally conductive layer is an isothermal substrate such as an aluminum plate, a copper plate, a vacuum chamber temperature equalizing plate, or a heat pipe embedded aluminum plate.
The heat sink according to any one of claims 17 to 18, wherein the floating mechanism is a spring screw.