WO2020011045A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- WO2020011045A1 WO2020011045A1 PCT/CN2019/094206 CN2019094206W WO2020011045A1 WO 2020011045 A1 WO2020011045 A1 WO 2020011045A1 CN 2019094206 W CN2019094206 W CN 2019094206W WO 2020011045 A1 WO2020011045 A1 WO 2020011045A1
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- WIPO (PCT)
- Prior art keywords
- heat
- layer
- heat dissipation
- disposed
- thermally conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Definitions
- the present disclosure relates to, but is not limited to, the field of heat dissipation technology.
- wireless communication technology requires faster transmission speed and greater output power; however, faster transmission speed and greater output power have significantly increased the heat consumption of outdoor communication base station systems ( For example, from 300W (Watt) to 1500W, the heat consumption per unit volume is increased from 20W / L (Watt / L) to 30W / L-40W / L), especially the heat consumption of high-power chips is more obvious.
- the related art mainly adopts a heat-dissipating substrate between the chip and the heat-dissipating shell, thereby transferring the center temperature of the chip to the heat-dissipating.
- the heat is transferred to the heat dissipation casing through the uniform temperature heat dissipation substrate, so as to achieve the purpose of dissipating heat to the chip.
- a heat dissipation device includes a heating mechanism, a heat conduction mechanism, and a heat dissipation mechanism, and the heat conduction mechanism includes a heat conduction layer and a filling layer.
- the heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism and the heat dissipation mechanism, respectively;
- the filling layer is not in contact with the heating mechanism; the filling layer transfers the heat of the thermally conductive layer to the heat dissipation mechanism.
- a heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a first heat transfer layer.
- the heat conduction mechanism includes a heat conduction layer and a filling layer.
- the heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism; the first heat transfer layer is disposed On the heat conducting mechanism, the heat of the heat generating mechanism is transmitted to the heat conducting mechanism; and the filling layer is not in contact with the heat generating mechanism.
- the filling layer may be provided between the heat conductive layer and the heat dissipation mechanism and / or between the heat conductive layer and the first heat transfer layer.
- a heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, a second heat transfer layer, and a floating mechanism.
- the heat transfer mechanism includes a heat transfer layer and a filling layer.
- the heat conduction mechanism is disposed between the heat generation mechanism and the heat dissipation mechanism; the second heat transmission layer is disposed between the heat generation mechanism and the heat conduction layer of the heat conduction mechanism, and The heat of the heating mechanism is transmitted to the heat conduction layer; the filling layer is disposed between the heat conduction layer and the heat dissipation mechanism, and transmits the heat of the heat conduction layer to the heat dissipation mechanism; the floating mechanism transmits The heat conduction layer is fixedly connected to the heat dissipation mechanism to adjust the interval between the heat conduction layer and the heat dissipation mechanism and / or the floating mechanism fixedly connects a substrate provided on the heat generation mechanism to the heat conduction layer. In order to reduce the interval between the heat generating mechanism and the thermally conductive layer.
- the filling layer and the second heat transfer layer are both thermal interface materials, especially elastic thermal interface materials, such as thermally conductive silica gel, thermally conductive glue, or phase interface materials.
- the heat-conducting layer is an isothermal heat-dissipating substrate such as an aluminum plate, a copper plate, a temperature equalizing plate, or a heat pipe-embedded aluminum plate.
- the thermally conductive layer has a function of uniformly conducting heat.
- the floating mechanism is a spring screw
- FIG. 1 is a schematic structural diagram of a heat dissipation device according to an optional embodiment of the present disclosure
- FIG. 2 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure
- FIG. 3 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 4 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 5 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 6 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 7 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 8 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 9 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 10 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- FIG. 11 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
- an embodiment of the present disclosure or “the foregoing embodiment” mentioned throughout the specification means that a particular feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present disclosure. Therefore, “in the embodiments of the present disclosure” or “in the foregoing embodiments” appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
- the related art mainly adopts a uniform heat-dissipating substrate between the chip and the heat-dissipating shell, thereby reducing the core temperature of the chip
- the heat is transferred to the heat-dissipating substrate, and the heat is transferred to the heat-dissipating shell through the heat-dissipating substrate, so as to achieve the purpose of dissipating heat to the chip.
- a layer of interface material is set between the chip and the uniform temperature heat dissipation substrate, thereby reducing thermal resistance and improving heat transfer.
- the thickness of the interface material is relatively thick and the thermal conductivity of the interface material is small, resulting in low heat transfer efficiency, which makes the chip's heat dissipation effect worse.
- an optional embodiment of the present disclosure provides a heat dissipation device.
- the heat dissipation device includes: a heating mechanism 1, a heat conduction mechanism 2, and a heat dissipation mechanism 3.
- the heat conduction mechanism 2 includes a heat conduction layer 2a and a filling layer 2b.
- the heating mechanism 1 is disposed on the heat dissipation mechanism 3; the heat conduction mechanism 2 is disposed between the heat generation mechanism 1 and the heat dissipation mechanism 3, and the heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively.
- the heat conduction mechanism 2 is made of a material with good heat conduction performance.
- the heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively, and the heat generated by the heat generation mechanism 1 is quickly conducted to the heat dissipation mechanism 3 by the heat conduction mechanism 2.
- heat radiation to the heating mechanism 1 is achieved.
- the heating mechanism 1 may be a heating chip provided on the substrate 11, such as a high-power chip, CPU, GPU, etc. used for outdoor communication base stations, and the heating mechanism 1 may also be a battery, a motor, or other components that generate heat. , Or a mechanism to dissipate heat from other devices.
- the filling layer 2 b is not in contact with the heat generating mechanism 1.
- the filling layer 2b transfers the heat of the thermally conductive layer 2a to the heat radiation mechanism 3.
- the thermally conductive layer 2a may be a thermally conductive layer 2a made of a thermally conductive material such as a copper plate, a vacuum chamber (VC) plate, an aluminum plate, a heat pipe embedded aluminum plate, or a heat pipe.
- the filling layer 2b is a thermally conductive material having elasticity such as a thermally conductive pad or the like.
- the filling layer 2b may also be an amorphous thermally conductive material, such as thermal silica gel, thermally conductive adhesive, and the like.
- the case where the heat dissipation device includes one heat generating mechanism is taken as an example. It should be understood that in this embodiment, when the heat dissipation device includes multiple heat generating mechanisms, the heat dissipation device provided in this embodiment can also be applied.
- the heat generating mechanism 1 is provided on the heat radiating mechanism 3, and may be directly or indirectly provided on the heat radiating mechanism (in FIG. 1, the heat generating mechanism 1 is indirectly provided on the heat radiating mechanism).
- the heat radiating device includes a plurality of heating mechanisms, due to processing tolerances between the multiple heating mechanisms during processing, the thickness of the heating mechanisms is different, which results in a gap between the heating mechanism and the heat conduction mechanism, which increases the The heat generated by the heating mechanism is transferred to the thermal resistance on the heat conduction mechanism.
- the heat conduction mechanism is provided to include a heat conduction layer and a filling layer, and the filling layer is not in contact with the heat generation mechanism. In this way, after the heat generation mechanism is disposed on the heat radiation mechanism, the heat conduction is caused by the filling layer The gap between the layer and the heat dissipation mechanism is filled.
- the elastic pressing effect of the filling layer can be used to tightly press the heat conductive layer together with the heat generating mechanism. Therefore, on the basis of compensating the processing and installation tolerances of the heating mechanism and the heat conduction mechanism, it is possible to improve the heat transfer efficiency and improve the heat radiation effect on the heating mechanism.
- the heat-conducting layer is a heat-conducting layer made of a heat-conducting material with good thermal conductivity such as copper plate, VC plate, aluminum plate or heat pipe
- the thermal conductivity of the heat-conducting layer can reach 380W / mk (Watts / meter * Kelvin).
- the heat generated by the heat-generating mechanism is quickly transferred to the heat-dissipating mechanism, which reduces the thermal resistance between the heat-generating mechanism and the heat-dissipating mechanism, thereby improving the transmission efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.
- the surface of the heat dissipation mechanism 3 may be provided with a notch, the heat conduction mechanism 2 is disposed in the notch, and the filling layer 2b is a thermally conductive material having elasticity.
- the filling layer 2b can always provide the heat-conducting layer 2a with an elastic force directed toward the heat-generating mechanism 1, so that the heat-conducting layer 2a can be more closely pressed with the heat-generating mechanism 1.
- the heat transfer mechanism 2 by disposing the heat transfer mechanism 2 in the slot, the heat of the heat transfer mechanism 2 can also be transferred to the heat dissipation mechanism through the side wall of the slot, thereby further improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism.
- the surface of the heat dissipation mechanism 3 may not be provided with a notch.
- the heat conduction mechanism 2 is directly disposed on the surface of the heat dissipation mechanism 3, and the filling layer 2b can also play a role in pressing the heat conduction layer 2a and the heat generation mechanism 1. More closely.
- the heat dissipation device provided by the embodiment of the present disclosure directly contacts the heat conduction mechanism and the heat generation mechanism when dissipating the heat generation mechanism, but the filling layer in the heat conduction mechanism does not contact the heat generation mechanism. In this way, the heat generated by the heat generation mechanism is directly transmitted.
- the heat-conducting layer is provided so that the heat-conducting layer can quickly transfer the heat from the center of the heat-generating mechanism to the heat-radiating mechanism, improve the heat-conducting efficiency of the heat generated by the heat-generating mechanism, and enhance the heat-radiating effect on the heat-generating mechanism.
- the heat dissipation mechanism 3 may include a heat dissipation casing 3 a and a plurality of heat dissipation teeth 3 b.
- the plurality of heat dissipation teeth 3 b are disposed on the heat dissipation casing 3 a and are fixedly connected to the heat dissipation casing 3 a.
- a plurality of heat-dissipating teeth 3b are provided away from the heating mechanism 1 and the heat-conducting mechanism 2.
- the plurality of heat dissipating teeth and the heat dissipating case may be made of the same thermally conductive material; as shown in FIG. 1, the plurality of heat dissipating teeth and the heat dissipating case are disposed perpendicular to each other.
- the heat dissipation area improves the heat dissipation effect and enhances the cooling and heat dissipation effect of the heating mechanism.
- a plurality of heat dissipation teeth may be formed integrally with the heat dissipation housing.
- the heat conducting layer 2 a is disposed on the filling layer 2 b.
- the thermally conductive layer 2 a is in direct contact with the heat generating mechanism 1; the filling layer 2 b is disposed between the thermally conductive layer 2 a and the heat dissipation mechanism 3.
- the heating mechanism is directly contacted with the heat-conducting layer.
- the heat-conducting layer is tightly pressed onto the heating mechanism; at the same time, because the heat-conducting layer is a copper plate or a VC plate Made of thermally conductive materials such as aluminum, aluminum plates or heat pipes, and the thermal conductivity of the thermally conductive layer can reach 380 W / mk.
- the thermally conductive layer can quickly transfer the heat generated by the heating mechanism to the heat dissipation mechanism, reducing the heating mechanism and the The thermal resistance between the heat-dissipating mechanisms improves the transfer efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.
- the heat dissipation device may further include a substrate 11 and at least two fixed connecting members 14.
- the heat-generating mechanism 1 is provided between the substrate 11 and the heat-conducting mechanism 2.
- One end of the at least two fixed connecting members 14 is connected to the substrate 11, and the other end is connected to the heat dissipation mechanism 3.
- the fixing connection member 14 may be a screw or a bolt, which may be screwed into a threaded hole on the heat dissipation mechanism 3 (for example, the heat dissipation casing 3a) through a hole on the substrate 11.
- the substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for the electronic components and a carrier for the electrical connection of the electronic components.
- PCB printed circuit board
- the at least two fixed connectors 14 apply a force to the substrate 11 toward the heat generating mechanism 1, thereby clamping the heat generating mechanism 1 and the heat conducting mechanism 2 between the substrate 11 and the heat radiating mechanism 3.
- the fixing connection member 14 is a screw (which can be a common screw or a spring screw)
- a screw head (not shown in detail in the figure) can be used to apply force to the substrate 11.
- the filling layer 2b with elasticity can further be used to eliminate processing tolerances and installation tolerances of the heating mechanism 1, the substrate 11, and the thermally conductive layer 2a, etc., and reduce the gap between the thermally conductive layer and the heating layer, so that the thermally conductive layer and the heating layer are not used.
- the thermal interface material or a thin thermal interface material with a thickness of, for example, 0.1-0.15 mm improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. This effect is particularly prominent when there are two or more heating mechanisms 1 corresponding to the same substrate 11.
- the substrate 11 and the heating mechanism 1 may be fixedly connected to each other or formed integrally.
- the substrate and the fixed connection are shown in the drawings of the present disclosure, they are not essential. Additionally or alternatively, the effects of eliminating tolerances and reducing thermal resistance may be achieved by other methods such as the first fixed connection member 10, the second fixed connection member 13 or the second elastic connection member 12 described below.
- the filling layer 2b is disposed on the thermally conductive layer 2a.
- the thermally conductive layer 2a is provided between the filling layer 2b and the heat generating mechanism 1.
- a filling layer 2b is provided on the heat conductive layer 2a, and a case where two heat generating mechanisms are provided is taken as an example.
- the heat sink provided in this embodiment further includes a first heat transfer layer 4, The first heat transfer layer 4 is disposed on the heat transfer mechanism 2; the first heat transfer layer 4 transfers the heat of the heat generating mechanism 1 to the heat transfer mechanism 2.
- the heat-conducting mechanism 2 does not directly contact the heat-generating mechanism 1, but transfers heat through at least the first heat-transfer layer 4.
- the first heat transfer layer 4 is directly in contact with the heating mechanism 1.
- the first heat transfer layer 4 may be made of a material having good thermal conductivity, such as a copper sheet, a VC plate, and an aluminum plate. of.
- the material of the first heat transfer layer 4 may be the same as that of the heat transfer layer 2a.
- the first heat transfer layer 4 may also be made of a different material from the thermally conductive layer 2a, as long as the first heat transfer layer 4 is made of a material having good thermal conductivity, which is not particularly limited in this embodiment.
- the filling layer 2b is provided between the thermally conductive layer 2a and the first thermally conductive layer 4.
- the filling layer may also be disposed between the thermally conductive layer 2a and the heat dissipation mechanism 3; or, the filling layer may be disposed between the thermally conductive layer 2a and the first thermally conductive layer 4 and at the same time (another)
- the filling layer is provided between the heat-conducting layer 2 a and the heat dissipation mechanism 3.
- the first heat-transfer layer when the filling layer is disposed between the heat-conducting layer and the heat-dissipating mechanism, the first heat-transfer layer directly contacts the heat-conducting layer, and after the installation is completed, the first heat-transfer layer, The thermally conductive layer is tightly pressed against the heating mechanism by the filling layer.
- the first heat transfer layer quickly transfers the heat generated by the heating mechanism to the thermally conductive layer, which reduces the thermal resistance between the thermally conductive layer and the heating mechanism, improves the efficiency of heat transfer, and conducts heat.
- the layer can quickly transfer the heat generated by the heat generating mechanism to the heat dissipation mechanism, reducing the thermal resistance between the heat generating mechanism and the heat dissipation mechanism, thereby improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism.
- the heat conductive layer 2 a is close to the first heat transfer layer 4.
- a groove 2c is provided on the surface; wherein the first heat transfer layer 4 is disposed in the groove 2c.
- the groove 2 c is disposed to face the heating mechanism 1, and the first heat transfer layer 4 is disposed in the groove 2 c; the filling layer 2 b is disposed between the heat conduction layer 2 a and the heat dissipation mechanism 3. .
- the filling layer may also be disposed in the groove 2 c and disposed between the first heat transfer layer 23 and the heat transfer layer 2 a.
- the first heat transfer layer is disposed in the groove, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.
- the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least two limiting posts. 5; at least two limiting posts 5 are disposed on the surface of the thermally conductive layer 2a close to the first heat transfer layer 4; the first heat transfer layer 4 is disposed between at least two limiting posts 5.
- the area between the opposite sides of the two limiting posts 5 is opposite to the heating mechanism 1, and the first heat transfer layer 4 is provided on the opposite side of the two limiting posts 5.
- a filling layer 2b is provided between the heat conducting layer 2a and the heat dissipation mechanism 3.
- the filling layer may also be provided in a region between the opposite sides of the two limiting posts 5 and between the first heat transfer layer 4 and the heat transfer layer 2a.
- a case where the filling layer 2 b is provided between the heat conductive layer 2 a and the heat dissipation mechanism 3 is taken as an example.
- the filling layer 2b may also be provided between the first heat transfer layer 4 and the thermally conductive layer 2a. At this time, the filling layer 2b is provided in a region between the opposite sides of the two limiting posts 5 and, The filling layer 2b is a thermally conductive material with a certain hardness and elasticity, such as a thermally conductive pad. After installation, the elasticity of the thermally conductive pad tightly presses the first heat transfer layer 4 on the heating mechanism 1.
- the first heat transfer layer is disposed in an area between the opposite sides of the two limiting posts, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.
- the heat dissipation device provided by an optional embodiment of the present disclosure further includes a second heat transfer layer 6, Wherein: the second heat transfer layer 6 is disposed on the first heat transfer layer 4; the second heat transfer layer 6 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.
- the second heat transfer layer 6 may be a thermal interface material with good thermal conductivity and somewhat soft fluidity, such as thermally conductive silicone grease, thermally conductive glue, and the like.
- the second heat transfer layer 6 may be an elastic thermal interface material, such as an elastic thermally conductive pad.
- the second heat transfer layer 6 is tightly pressed onto the heat generating mechanism 1 by the first heat transfer layer 4.
- the second heat transfer layer is a thermal interface material, especially some materials with very soft fluid properties such as thermally conductive silicone grease, thermally conductive glue, and the like. After the second heat transfer layer is disposed between the first heat transfer layer and the heat generating mechanism, the second heat transfer layer is tightly pressed onto the heat generating mechanism to reduce the thermal resistance between the heat generating mechanism and the first heat transfer layer. Therefore, the transmission efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism is improved.
- the second heat transfer layer 6 may also be directly disposed on and in contact with the heat transfer mechanism 2, that is, the first heat transfer layer 4 may not be provided.
- the filling layer 2b is an elastic thermal interface material such as a thermally conductive pad.
- the filling layer 2b is provided between the thermally conductive layer 2a and the heat radiation mechanism 3.
- the heat-conducting layer 2a may be in contact with the heat-generating mechanism 1 and the heat-radiating mechanism 3 through the thermal interface material serving as the second heat-transporting layer 6 and the filling layer 2b, respectively. Since the thermally conductive layer 2a has a function of uniform temperature, it may also be referred to as a thermally conductive uniform temperature layer or a uniform thermally conductive layer.
- the heat dissipation device provided in an optional embodiment of the present disclosure further includes an adhesive layer 7 and an adhesive layer 7
- the first heat transfer layer 4 is adhered to the heat generating mechanism 1, and the adhesive layer 7 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.
- the adhesive layer 7 may be a thermally conductive adhesive.
- the thermally conductive adhesive can be a single component, thermally conductive, room temperature curing silicone adhesive sealant.
- Thermally conductive adhesive has good resistance to cold and heat alternation, aging resistance and electrical insulation properties, and has good moisture resistance, shock resistance, corona resistance, leakage resistance and chemical resistance. It can be used continuously at -60 ° C to 280 ° C and maintains performance, and has good adhesion to most metal and non-metal materials.
- the first heat transfer layer is adhered to the heating mechanism through a thermally conductive adhesive.
- the first heat transfer layer can be prevented from falling due to vibration and the like while reducing heat generation.
- the thermal resistance between the mechanism and the first heat transfer layer improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism, and enhances the cooling and cooling effect on the heating mechanism.
- the heat dissipation device provided by an optional embodiment of the present disclosure further includes a heat transfer member 8, One end of 8 is connected to the first heat transfer layer 4, and the other end of the heat transfer member 8 is connected to the heat conduction mechanism 2.
- the heat transfer member 8 includes a heat pipe; as shown in FIG. 8, the heat pipe includes an evaporation side 8b and a condensation side 8a; the evaporation side 8b of the heat pipe is connected to the first heat transfer layer 4; and the condensation side 8a of the heat pipe is connected to a heat exchanger. Layer 2a is connected.
- the heat pipe is composed of a shell, a wick and an end cap.
- the inside of the shell is drawn to a negative pressure of 1.3 ⁇ 10 -1 Pa-10 to 4 Pa and filled with an appropriate amount of working liquid.
- the thermal phase change liquid can be selected according to the actual needs.
- the wick is made of a capillary material with multiple holes and is closely attached to the inner wall of the tube shell.
- the working liquid is filled with the wick and sealed.
- the working liquid in the heat pipe is evaporated on the heated side, and the condensed side is the condensed side of the working liquid in the heat pipe. When the evaporation side of the heat pipe is heated, the liquid in the suction core evaporates and vaporizes.
- the steam flows to the condensation side under a slight pressure difference and releases heat to condense into a liquid.
- the liquid flows along the suction core and relies on the siphoning force of the suction core. Evaporation side. In this way, heat is transferred from the evaporation side to the condensation side of the heat pipe.
- the evaporation side of the heat pipe is connected to the first heat transfer layer
- the connection method between the evaporation side of the heat pipe and the first heat transfer layer may be welding, bonding or other connection methods
- the condensing side of the heat pipe and heat conduction Layer connection the connection method of the condensation side of the heat pipe and the heat conduction layer can be welding, bonding or other connection methods.
- the heat on the evaporation side of the heat pipe can be quickly transferred to the condensation side of the heat pipe, and transferred to the heat conduction layer through the condensation side of the heat pipe, reducing the thermal resistance between the first heat transfer layer and the heat conduction layer, and increasing the heat generated by the heating mechanism.
- the transfer efficiency to the heat-dissipating mechanism enhances the cooling effect of the heat-generating mechanism.
- the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least one first elastic connecting member .
- each heating mechanism corresponds to two first elastic connecting members 9 as an example, in which one end of at least one first elastic connecting member is connected to the first heat transfer layer 4 and the other end of at least one first elastic connecting member. It is connected to the thermally conductive layer 2a; at least one first elastic connecting member provides elastic force to the first thermally conductive layer 4 in a direction close to the heat generating mechanism 1.
- the first elastic connecting member 9 is provided perpendicular to the surface where the heat conductive layer 2 a contacts the first heat transfer layer 4. After the installation is completed, the first elastic connecting member 9 provides the first heat transfer layer 4. The direction of the elastic force provided by the first elastic connecting member 9 to the first heat transfer layer 4 is directed to the heat generating mechanism 1. That is, in this embodiment, the first heat transfer layer 4 and the heat transfer layer are tightly pressed onto the heat generating mechanism 1 under the action of the first elastic connecting member 9.
- the filling layer 2 b is provided between the first heat transfer layer 4 and the heat conducting layer 2 a is taken as an example in FIG. 9. It should be understood that the filling layer 2 b may also be provided between the heat conducting layer 2 a and the heat dissipation mechanism. Between 3, the filling layer 2b may also be disposed between the first heat transfer layer 4 and the heat conducting layer 2a, and at the same time between the heat conducting layer 2a and the heat dissipation mechanism 3.
- the filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.
- the first elastic connecting member may be a spring screw. After the spring screw connects two objects, the spring screw can provide elastic force to the two objects connected by the spring screw between the two objects connected by the spring screw. In the method, the first elastic connecting member 9 provides the first heat transfer layer 4 with an elastic force directed toward the heat generating mechanism 1.
- the device further includes at least two first fixed connecting members, and the at least two first fixed connecting members fix the heat conducting layer 2 a on the heat dissipation mechanism 3.
- the first fixed connection member 10 may be an ordinary screw.
- the first fixed connection member 10 fixes the heat conducting layer 2 a on the heat dissipation mechanism 3 through a threaded hole provided in the heat dissipation mechanism 3.
- a first elastic connection is used to connect the first heat transfer layer to the heat transfer layer. After the installation is completed, the first heat transfer layer is tightly pressed onto the heating mechanism. In this way, the first elastic connection is provided.
- the elastic force reduces the gap between the first heat transfer layer and the heating mechanism, thereby reducing the thermal resistance between the heating mechanism and the first heat transfer layer, and improving the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. Enhance the cooling and cooling effect on the heating mechanism.
- the heating mechanism 1 is disposed on the substrate 11; the heat dissipation device further includes at least two second elastic connecting members; One end of the two elastic connecting members is connected to the heat conductive layer 2a, and the other ends of the at least two second elastic connecting members are connected to the substrate 11.
- the at least two second elastic connecting members provide elastic force to the heat conductive layer 2a in a direction close to the heating mechanism 1.
- the filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.
- the second elastic connecting member 12 may be the same spring screw or other elastic connecting members as the first elastic connecting member.
- the second elastic connecting member 12 is disposed at both ends of the heat conductive layer 2a, and the second elastic connecting member 12 is provided perpendicular to the surface of the heat conductive layer 2a near the substrate 11, and the second elastic The connecting member 12 provides an elastic force to the heat-conducting layer 2 a perpendicular to the surface of the heat-generating mechanism 1 that is in contact with the heat-conducting layer 2 a.
- the heat-conducting layer 2 a is tightly pressed against the heat-generating mechanism 1 by the elastic force.
- the substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for electronic components and a carrier for the electrical connection of the electronic components; several electronic components are disposed on the PCB board. , And realize electrical connection with each other through printed circuits on the PCB.
- PCB printed circuit board
- the substrate 11 is fixedly connected to the heat dissipation mechanism 3, and the side on which the electronic components are disposed on the substrate 11 is directly opposite to the heat dissipation mechanism 3. That is, as shown in FIG. 10, the electronic components on the substrate 11 are disposed between the substrate 11 and the heat dissipation mechanism 3.
- the heating mechanism 1 is provided between the substrate 11 and the heat dissipation mechanism 3 and is connected to the substrate 11.
- the heating mechanism 1 may be a heating chip provided on the substrate 11.
- the heating mechanism 1 is an electronic component, and is arranged on the substrate 11 together with other electronic components, and is electrically connected to other electronic components through a printed circuit of the substrate 11. .
- the thermally conductive layer and the substrate are connected by a spring screw.
- the spring screw provides elastic force between the thermally conductive layer and the substrate, so that the thermally conductive layer is tightly pressed onto the heating mechanism, and the heating mechanism and the thermally conductive layer are reduced.
- the gap and thermal resistance improve the transfer efficiency of the heat generated by the heating mechanism to the heat dissipation mechanism, and enhance the cooling and cooling effect of the heating mechanism.
- the heat generating mechanism 1 is disposed on the substrate 11; It also includes at least two second fixed connecting members, and the at least two second fixed connecting members fixedly connect the heat conducting layer 2 a and the substrate 11.
- the second fixed connection member 13 may be the same ordinary screw as the first fixed connection member, and the second fixed connection member 13 fixes the heat conductive layer 2a on the substrate 11 through a screw hole.
- the second heat transfer layer may include some relatively soft fluid thermal interface materials, such as thermal interface materials such as thermally conductive silicone grease, thermally conductive glue, and the thickness of the thermal interface material is 0.10 mm-0.15 mm. Some softer thermal interface materials in this embodiment may be thermally conductive silicone grease, thermally conductive adhesive, etc.
- the material of the second heat transfer layer in this embodiment may be the same as the material of the filling layer, or it may be different, as long as it is It has good thermal conductivity and can have certain elasticity, which is not specifically limited in this embodiment.
- the filling layer is a thermal interface material, and its thickness is 0.30 mm-1.00 mm.
- the filling layer in FIG. 1 to FIG. 8 may include an elastic thermal interface material, and the filling layer in FIG. 9 to FIG. 11 may also be a thermally conductive adhesive with relatively soft fluidity.
- the heat-conducting layer may include or may be a temperature-conducting heat-conducting substrate, and the area of the temperature-conducting heat-conducting substrate is larger than the contact area of the heating mechanism and the heat-conducting mechanism.
- the temperature-conducting and heat-conducting substrate can be made of a thermally conductive material such as a copper plate, a VC plate, an aluminum plate, or a heat pipe.
- first elastic connecting member 9 and the second elastic connecting member 12 in the above embodiments, and the filling layer 2b in FIG. 1 to FIG. 8 and the like have a function of adjusting the interval between the layers by applying a clamping force. Role of the floating body.
- the interval between the thermally conductive layer 2a and the heat generating mechanism 1 and / or the thermally conductive layer 2a and the heat radiating layer 3 i.e., compression heat
- Interface material thickness to reduce thermal resistance. Since the thermally conductive layer 2a has a function of uniformly conducting heat, it can quickly extract heat from the heat generating mechanism, and quickly and fully transfer it to the heat dissipating mechanism after performing the uniformly conducting heat.
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Abstract
A heat dissipation device, the heat dissipation device comprising: a heat generation mechanism, a heat conduction mechanism, and a heat dissipation mechanism, the heat conduction mechanism comprising: a heat conduction layer and a filling layer; the heat generation mechanism is provided on the heat dissipation mechanism; the heat conduction mechanism is provided between the heat generation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat generation mechanism and with the heat dissipation mechanism; the filling layer is not in contact with the heat generation mechanism; and the filling layer transfers the heat of a heat conduction and temperate equalization layer to the heat dissipation mechanism.
Description
本公开涉及但不限于散热技术领域。The present disclosure relates to, but is not limited to, the field of heat dissipation technology.
随着无线通讯技术由第二代移动通讯技术(2-Generation wireless telephone technology,2G)网络发展到第四代移动通讯技术(the 4th Generation mobile communication technology,4G)网络,以及即将投入应用的第五代移动通讯技术(5th-Generation,5G)网络,无线通讯技术需要更快传输速度和更大输出功率;然而,更快的传输速度和更大的输出功率使得室外通讯基站系统热耗显著提升(例如,由300W(瓦特)提升到1500W,单位体积的热耗由20W/L(瓦特/升)提升到30W/L-40W/L),尤其是高功耗芯片的热耗提升更明显。With the development of wireless communication technology from the second-generation mobile communication technology (2-Generation wireless telephone technology (2G) network to the fourth-generation mobile communication technology (the 4th generation mobile communication technology (4G) network, and the fifth In the 5th-Generation (5G) network, wireless communication technology requires faster transmission speed and greater output power; however, faster transmission speed and greater output power have significantly increased the heat consumption of outdoor communication base station systems ( For example, from 300W (Watt) to 1500W, the heat consumption per unit volume is increased from 20W / L (Watt / L) to 30W / L-40W / L), especially the heat consumption of high-power chips is more obvious.
为了给诸如室外通讯基站的高功耗芯片等发热机构进行可靠稳定的散热,相关技术中主要采用在芯片与散热壳体之间设置均温散热基板,从而将芯片的中心温度传递至均温散热基板上,进而通过均温散热基板将热量传递至散热壳体上,达到对芯片散热的目的。In order to reliably and stably dissipate heat from a heating mechanism such as a high-power chip of an outdoor communication base station, the related art mainly adopts a heat-dissipating substrate between the chip and the heat-dissipating shell, thereby transferring the center temperature of the chip to the heat-dissipating. On the substrate, the heat is transferred to the heat dissipation casing through the uniform temperature heat dissipation substrate, so as to achieve the purpose of dissipating heat to the chip.
发明内容Summary of the invention
有鉴于此,根据本公开的第一方面,提供了一种散热装置,所述散热装置包括:发热机构、导热机构和散热机构,所述导热机构包括:导热层和填充层。其中,所述发热机构设置在所述散热机构上;所述导热机构设置在所述发热机构和所述散热机构之间,并且所述导热机构分别与所述发热机构和所述散热机构接触;所述填充层与所述发热机构不接触;所述填充层将所述导热层的热量传递至所述散热机构。In view of this, according to a first aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, and a heat dissipation mechanism, and the heat conduction mechanism includes a heat conduction layer and a filling layer. Wherein, the heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism and the heat dissipation mechanism, respectively; The filling layer is not in contact with the heating mechanism; the filling layer transfers the heat of the thermally conductive layer to the heat dissipation mechanism.
根据本公开的第二方面,提供了一种散热装置,所述散热装置包括:发热机构、导热机构、散热机构和第一传热层,所述导热机构包括:导热层和填充层;其中,所述发热机构设置在所述散热机构上;所述导热机构设置在所述发热机构和所述散热机构之间,并且所述导热机构与所述散热机构接触;所述第 一传热层设置在所述导热机构上,并将所述发热机构的热量传递至所述导热机构;并且所述填充层与所述发热机构不接触。According to a second aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a first heat transfer layer. The heat conduction mechanism includes a heat conduction layer and a filling layer. The heating mechanism is disposed on the heat dissipation mechanism; the heat conduction mechanism is disposed between the heat dissipation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism; the first heat transfer layer is disposed On the heat conducting mechanism, the heat of the heat generating mechanism is transmitted to the heat conducting mechanism; and the filling layer is not in contact with the heat generating mechanism.
可选地,所述填充层可设置在所述导热层与所述散热机构之间和/或设置在所述导热层与所述第一传热层之间。Optionally, the filling layer may be provided between the heat conductive layer and the heat dissipation mechanism and / or between the heat conductive layer and the first heat transfer layer.
根据本公开的第三方面,提供了一种散热装置,所述散热装置包括:发热机构、导热机构、散热机构、第二传热层和浮动机构,所述导热机构包括:导热层和填充层;其中,所述导热机构设置在所述发热机构与所述散热机构之间;所述第二传热层设置在所述发热机构与所述导热机构的所述导热层之间,并将所述发热机构的热量传递至所述导热层;所述填充层设置在所述导热层与所述散热机构之间,并将所述导热层的热量传递至所述散热机构;所述浮动机构将所述导热层与所述散热机构固定连接以调整所述导热层与所述散热机构之间的间隔和/或所述浮动机构将设置在所述发热机构上的基板与所述导热层固定连接以减小所述发热机构与所述导热层之间的间隔。According to a third aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, a second heat transfer layer, and a floating mechanism. The heat transfer mechanism includes a heat transfer layer and a filling layer. Wherein the heat conduction mechanism is disposed between the heat generation mechanism and the heat dissipation mechanism; the second heat transmission layer is disposed between the heat generation mechanism and the heat conduction layer of the heat conduction mechanism, and The heat of the heating mechanism is transmitted to the heat conduction layer; the filling layer is disposed between the heat conduction layer and the heat dissipation mechanism, and transmits the heat of the heat conduction layer to the heat dissipation mechanism; the floating mechanism transmits The heat conduction layer is fixedly connected to the heat dissipation mechanism to adjust the interval between the heat conduction layer and the heat dissipation mechanism and / or the floating mechanism fixedly connects a substrate provided on the heat generation mechanism to the heat conduction layer. In order to reduce the interval between the heat generating mechanism and the thermally conductive layer.
可选地,所述填充层和所述第二传热层均是热界面材料,特别是弹性热界面材料,如导热硅胶、导热胶或者相界面材料等。Optionally, the filling layer and the second heat transfer layer are both thermal interface materials, especially elastic thermal interface materials, such as thermally conductive silica gel, thermally conductive glue, or phase interface materials.
可选地,所述导热层是铝板、铜板、均温板或热管嵌铝板等均温散热基板。所述导热层具有导热均温的作用。Optionally, the heat-conducting layer is an isothermal heat-dissipating substrate such as an aluminum plate, a copper plate, a temperature equalizing plate, or a heat pipe-embedded aluminum plate. The thermally conductive layer has a function of uniformly conducting heat.
可选地,所述浮动机构为弹簧螺钉,Optionally, the floating mechanism is a spring screw,
在附图(其不一定是按比例绘制的)中,相似的附图标记可在不同的视图中描述相似的部件。具有不同字母后缀的相似附图标记可表示相似部件的不同示例。附图以示例而非限制的方式大体示出了本文中所讨论的各个实施例。In the drawings, which are not necessarily drawn to scale, similar reference numerals may describe similar components in different views. Similar reference numerals with different letter suffixes may represent different examples of similar components. The drawings generally illustrate various embodiments discussed herein by way of example and not limitation.
图1为本公开一种可选实施方式提供的散热装置的结构示意图;FIG. 1 is a schematic structural diagram of a heat dissipation device according to an optional embodiment of the present disclosure;
图2为本公开另一可选实施方式提供的散热装置的结构示意图;2 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图3为本公开另一可选实施方式提供的散热装置的结构示意图;3 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图4为本公开另一可选实施方式提供的散热装置的结构示意图;4 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图5为本公开另一可选实施方式提供的散热装置的结构示意图;5 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图6为本公开另一可选实施方式提供的散热装置的结构示意图;6 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图7为本公开另一可选实施方式提供的散热装置的结构示意图;7 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图8为本公开另一可选实施方式提供的散热装置的结构示意图;8 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图9为本公开另一可选实施方式提供的散热装置的结构示意图;9 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图10为本公开另一可选实施方式提供的散热装置的结构示意图;10 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure;
图11为本公开另一可选实施方式提供的散热装置的结构示意图。FIG. 11 is a schematic structural diagram of a heat dissipation device according to another optional embodiment of the present disclosure.
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述。The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure.
为使本领域技术人员能够清楚的理解本公开的技术方案,现结合附图及具体实施例对本公开的技术方案进行详细说明,应当理解,所述具体实施例及附图仅是为了便于本领域技术人员对本公开技术方案的理解进行的说明,并不构成对本公开技术方案的限定,只要在本公开的思想范围内,未作出任何创造性的改进都应该包括在本公开的保护范围内。In order to enable those skilled in the art to clearly understand the technical solution of the present disclosure, the technical solution of the present disclosure will be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments and drawings are only for the convenience of the art. The explanation of the technical solution of the present disclosure by a technician does not constitute a limitation on the technical solution of the present disclosure, as long as it is within the scope of the idea of the present disclosure, any creative improvement should be included in the protection scope of the present disclosure.
应理解,说明书通篇中提到的“本公开实施方式”或“前述实施方式”意味着与实施方式有关的特定特征、结构或特性包括在本公开的至少一个实施方式中。因此,在整个说明书各处出现的“本公开实施方式中”或“在前述实施方式中”未必一定指相同的实施方式。此外,这些特定的特征、结构或特性可以任意适合的方式结合在一个或多个实施方式中。It should be understood that “an embodiment of the present disclosure” or “the foregoing embodiment” mentioned throughout the specification means that a particular feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present disclosure. Therefore, "in the embodiments of the present disclosure" or "in the foregoing embodiments" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
如前面所述,为了给诸如室外通讯基站的高功耗芯片等发热机构进行可靠稳定的散热,相关技术中主要采用在芯片与散热壳体之间设置均温散热基板,从而将芯片的中心温度传递至均温散热基板上,进而通过均温散热基板将热量传递至散热壳体上,达到对芯片散热的目的。然而,由于芯片和均温散热基板均存在加工和安装公差,均温散热基板和芯片之间存在间隙,导致芯片与均温散热基板之间存在较大的热阻,为了解决上述问题,相关技术中在芯片与均温散热基板之间设置一层界面材料,从而减小热阻并提高热传递。但是,界面材料的厚度较厚且界面材料的导热系数很小,导致传热效率不高,使得芯片的散热效果较差。As mentioned earlier, in order to reliably and stably dissipate heat from a heating mechanism such as a high-power chip of an outdoor communication base station, the related art mainly adopts a uniform heat-dissipating substrate between the chip and the heat-dissipating shell, thereby reducing the core temperature of the chip The heat is transferred to the heat-dissipating substrate, and the heat is transferred to the heat-dissipating shell through the heat-dissipating substrate, so as to achieve the purpose of dissipating heat to the chip. However, due to the processing and mounting tolerances of the chip and the uniform temperature heat dissipation substrate, there is a gap between the uniform temperature heat dissipation substrate and the chip, which results in a large thermal resistance between the chip and the uniform temperature heat dissipation substrate. In order to solve the above problems, related technologies A layer of interface material is set between the chip and the uniform temperature heat dissipation substrate, thereby reducing thermal resistance and improving heat transfer. However, the thickness of the interface material is relatively thick and the thermal conductivity of the interface material is small, resulting in low heat transfer efficiency, which makes the chip's heat dissipation effect worse.
参照图1所示,本公开的一种可选实施方式提供了一种散热装置,散热装置包括:发热机构1、导热机构2和散热机构3,导热机构2包括:导热层2a 和填充层2b;其中,发热机构1设置在散热机构3上;导热机构2设置在发热机构1和散热机构3之间,并且导热机构2分别与发热机构1和散热机构3接触。Referring to FIG. 1, an optional embodiment of the present disclosure provides a heat dissipation device. The heat dissipation device includes: a heating mechanism 1, a heat conduction mechanism 2, and a heat dissipation mechanism 3. The heat conduction mechanism 2 includes a heat conduction layer 2a and a filling layer 2b. Among them, the heating mechanism 1 is disposed on the heat dissipation mechanism 3; the heat conduction mechanism 2 is disposed between the heat generation mechanism 1 and the heat dissipation mechanism 3, and the heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively.
在本实施方式中,导热机构2采用具有良好导热性能的材料制成,导热机构2分别与发热机构1和散热机构3接触,发热机构1产生的热量被导热机构2快速传导至散热机构3上,从而实现给发热机构1的散热。应当理解的是,发热机构1可以是设置在基板11上的发热芯片,例如用于室外通讯基站的高功耗芯片、CPU、GPU等,发热机构1也可以是电池、电机等产生热量的元件,或是用于为其他装置散热的机构。In this embodiment, the heat conduction mechanism 2 is made of a material with good heat conduction performance. The heat conduction mechanism 2 is in contact with the heat generation mechanism 1 and the heat dissipation mechanism 3, respectively, and the heat generated by the heat generation mechanism 1 is quickly conducted to the heat dissipation mechanism 3 by the heat conduction mechanism 2. Thus, heat radiation to the heating mechanism 1 is achieved. It should be understood that the heating mechanism 1 may be a heating chip provided on the substrate 11, such as a high-power chip, CPU, GPU, etc. used for outdoor communication base stations, and the heating mechanism 1 may also be a battery, a motor, or other components that generate heat. , Or a mechanism to dissipate heat from other devices.
此外,填充层2b与发热机构1不接触。填充层2b将导热层2a的热量传递至散热机构3。The filling layer 2 b is not in contact with the heat generating mechanism 1. The filling layer 2b transfers the heat of the thermally conductive layer 2a to the heat radiation mechanism 3.
这里导热层2a可以是铜板、真空腔均温(Vapor Chamber,VC)板、铝板、热管嵌铝板或热管等导热性能良好的导热材料制成的导热层2a。填充层2b是具有弹性的导热材料比如导热衬垫等。在其他一些实施方式中,填充层也2b可以是不定型的导热材料,如热硅胶、导热胶等。Here, the thermally conductive layer 2a may be a thermally conductive layer 2a made of a thermally conductive material such as a copper plate, a vacuum chamber (VC) plate, an aluminum plate, a heat pipe embedded aluminum plate, or a heat pipe. The filling layer 2b is a thermally conductive material having elasticity such as a thermally conductive pad or the like. In other embodiments, the filling layer 2b may also be an amorphous thermally conductive material, such as thermal silica gel, thermally conductive adhesive, and the like.
需要说明的是,图1中以散热装置包括一个发热机构的情况作为示例,应当理解的是,本实施方式中,散热装置包括多个发热机构时,本实施方式提供的散热装置同样能够适用。另外,需要说明的是,发热机构1设置在散热机构3上,可以是直接或间接设置在散热机构上(图1中为发热机构1间接设置在散热机构上)。It should be noted that, in FIG. 1, the case where the heat dissipation device includes one heat generating mechanism is taken as an example. It should be understood that in this embodiment, when the heat dissipation device includes multiple heat generating mechanisms, the heat dissipation device provided in this embodiment can also be applied. In addition, it should be noted that the heat generating mechanism 1 is provided on the heat radiating mechanism 3, and may be directly or indirectly provided on the heat radiating mechanism (in FIG. 1, the heat generating mechanism 1 is indirectly provided on the heat radiating mechanism).
在散热装置包括多个发热机构时,由于多个发热机构在加工时,相互之间存在加工公差,导致发热机构的厚度存在差异,从而导致发热机构与导热机构之间存在间隙,增大了将发热机构产生的热量传递至导热机构上的热阻。在本实施方式中,如图1所示,将导热机构设置成包括导热层和填充层,并且填充层与发热机构不接触;如此,在发热机构设置在散热机构上后,由于填充层将导热层与散热机构之间的间隙填充,因此,能够利用填充层的弹性压紧作用使得导热层被紧紧的与发热机构压合在一起。从而,能够在弥补发热机构和导热机构的加工和安装公差的基础上,提高传热效率,提升对发热机构的散热效果。When the heat radiating device includes a plurality of heating mechanisms, due to processing tolerances between the multiple heating mechanisms during processing, the thickness of the heating mechanisms is different, which results in a gap between the heating mechanism and the heat conduction mechanism, which increases the The heat generated by the heating mechanism is transferred to the thermal resistance on the heat conduction mechanism. In this embodiment, as shown in FIG. 1, the heat conduction mechanism is provided to include a heat conduction layer and a filling layer, and the filling layer is not in contact with the heat generation mechanism. In this way, after the heat generation mechanism is disposed on the heat radiation mechanism, the heat conduction is caused by the filling layer The gap between the layer and the heat dissipation mechanism is filled. Therefore, the elastic pressing effect of the filling layer can be used to tightly press the heat conductive layer together with the heat generating mechanism. Therefore, on the basis of compensating the processing and installation tolerances of the heating mechanism and the heat conduction mechanism, it is possible to improve the heat transfer efficiency and improve the heat radiation effect on the heating mechanism.
由于导热层采用的是铜板、VC板、铝板或热管等导热性能良好的导热材料制成的导热层,导热层的导热系数能够达到380W/mk(瓦特/米*开尔文),因 此,导热层能够迅速将发热机构产生的热量传递至散热机构,减小了发热机构与散热机构之间的热阻,从而提高了将发热机构产生的热量传递至散热机构的传递效率。Since the heat-conducting layer is a heat-conducting layer made of a heat-conducting material with good thermal conductivity such as copper plate, VC plate, aluminum plate or heat pipe, the thermal conductivity of the heat-conducting layer can reach 380W / mk (Watts / meter * Kelvin). The heat generated by the heat-generating mechanism is quickly transferred to the heat-dissipating mechanism, which reduces the thermal resistance between the heat-generating mechanism and the heat-dissipating mechanism, thereby improving the transmission efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.
在本实施方式中,参照图1所示,散热机构3的表面可以设置有槽口,导热机构2设置在槽口内,并且填充层2b是具有弹性的导热材料,如此,在导热层2a与发热机构1压合在一起时,填充层2b能始终对导热层2a提供指向发热机构1的弹力,使得导热层2a能与发热机构1压合的更加紧密。此外,通过将导热机构2设置在槽口内,导热机构2的热量可还能够经槽口的侧壁传递至散热机构,进一步提高了将发热机构产生的热量传递至散热机构的传递效率。当然,本实施方式中,散热机构3的表面也可以不设置槽口,此时,导热机构2直接设置在散热机构3的表面,填充层2b同样能起到使导热层2a与发热机构1压合的更加紧密的作用。In this embodiment, referring to FIG. 1, the surface of the heat dissipation mechanism 3 may be provided with a notch, the heat conduction mechanism 2 is disposed in the notch, and the filling layer 2b is a thermally conductive material having elasticity. When the mechanisms 1 are pressed together, the filling layer 2b can always provide the heat-conducting layer 2a with an elastic force directed toward the heat-generating mechanism 1, so that the heat-conducting layer 2a can be more closely pressed with the heat-generating mechanism 1. In addition, by disposing the heat transfer mechanism 2 in the slot, the heat of the heat transfer mechanism 2 can also be transferred to the heat dissipation mechanism through the side wall of the slot, thereby further improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism. Of course, in this embodiment, the surface of the heat dissipation mechanism 3 may not be provided with a notch. At this time, the heat conduction mechanism 2 is directly disposed on the surface of the heat dissipation mechanism 3, and the filling layer 2b can also play a role in pressing the heat conduction layer 2a and the heat generation mechanism 1. More closely.
本公开的实施方式所提供的散热装置,在对发热机构进行散热时,直接将导热机构与发热机构接触,但导热机构中的填充层不与发热机构接触,如此,发热机构产生的热量直接传递给导热层,从而导热层能够快速将发热机构中心的热量传递给散热机构,提高对发热机构产生的热量的导热效率,提升对发热机构的散热效果。The heat dissipation device provided by the embodiment of the present disclosure directly contacts the heat conduction mechanism and the heat generation mechanism when dissipating the heat generation mechanism, but the filling layer in the heat conduction mechanism does not contact the heat generation mechanism. In this way, the heat generated by the heat generation mechanism is directly transmitted. The heat-conducting layer is provided so that the heat-conducting layer can quickly transfer the heat from the center of the heat-generating mechanism to the heat-radiating mechanism, improve the heat-conducting efficiency of the heat generated by the heat-generating mechanism, and enhance the heat-radiating effect on the heat-generating mechanism.
参照图1所示,本实施方式中,散热机构3可以包括散热壳体3a和多个散热齿3b;其中,多个散热齿3b设置在散热壳体3a上,并与散热壳体3a固定连接;并且多个散热齿3b远离发热机构1和导热机构2设置。As shown in FIG. 1, in this embodiment, the heat dissipation mechanism 3 may include a heat dissipation casing 3 a and a plurality of heat dissipation teeth 3 b. The plurality of heat dissipation teeth 3 b are disposed on the heat dissipation casing 3 a and are fixedly connected to the heat dissipation casing 3 a. ; And a plurality of heat-dissipating teeth 3b are provided away from the heating mechanism 1 and the heat-conducting mechanism 2.
本实施方式中,多个散热齿和散热壳体可以采用相同的导热材料制成;如图1所示,多个散热齿与散热壳体相互垂直设置,如此,多个散热齿能够增加散热机构的散热面积,提升散热效果,增强对发热机构的降温散热效果。可选地,多个散热齿可与散热壳体一体形成。In this embodiment, the plurality of heat dissipating teeth and the heat dissipating case may be made of the same thermally conductive material; as shown in FIG. 1, the plurality of heat dissipating teeth and the heat dissipating case are disposed perpendicular to each other. The heat dissipation area improves the heat dissipation effect and enhances the cooling and heat dissipation effect of the heating mechanism. Alternatively, a plurality of heat dissipation teeth may be formed integrally with the heat dissipation housing.
基于前述实施方式,本公开的一种可选实施方式中,参照图2所示(图2中以散热装置包括一个发热机构的情况作为示例),导热层2a设置在填充层2b上。Based on the foregoing embodiment, in an alternative embodiment of the present disclosure, referring to FIG. 2 (the case where the heat dissipation device includes a heat generating mechanism is taken as an example in FIG. 2), the heat conducting layer 2 a is disposed on the filling layer 2 b.
如图2所示,在本实施方式中,导热层2a是与发热机构1直接接触的;填充层2b设置在导热层2a与散热机构3之间。As shown in FIG. 2, in this embodiment, the thermally conductive layer 2 a is in direct contact with the heat generating mechanism 1; the filling layer 2 b is disposed between the thermally conductive layer 2 a and the heat dissipation mechanism 3.
本实施方式中,将发热机构直接与导热层接触,在安装过程中,由于填充 层的弹性浮动作用,使得导热层紧密压合在发热机构上;同时,由于导热层采用的是铜板、VC板、铝板或热管等导热性能良好的导热材料制成的,且导热层的导热系数能够达到380W/mk,因此,导热层能够迅速将发热机构产生的热量传递至散热机构,减小了发热机构与散热机构之间的热阻,从而提高了将发热机构产生的热量传递至散热机构的传递效率。In this embodiment, the heating mechanism is directly contacted with the heat-conducting layer. During the installation process, due to the elastic floating effect of the filling layer, the heat-conducting layer is tightly pressed onto the heating mechanism; at the same time, because the heat-conducting layer is a copper plate or a VC plate Made of thermally conductive materials such as aluminum, aluminum plates or heat pipes, and the thermal conductivity of the thermally conductive layer can reach 380 W / mk. Therefore, the thermally conductive layer can quickly transfer the heat generated by the heating mechanism to the heat dissipation mechanism, reducing the heating mechanism and the The thermal resistance between the heat-dissipating mechanisms improves the transfer efficiency of transferring the heat generated by the heat-generating mechanism to the heat-dissipating mechanism.
此外,如图2所示,散热装置还可包括基板11和至少两个固定连接件14。发热机构1设置在基板11与导热机构2之间。该至少两个固定连接件14的一端与基板11连接,另一端与散热机构3连接。另外,固定连接件14可以是螺钉或螺栓,其可穿过基板11上的穿孔拧入散热机构3(例如,散热壳体3a)上的螺纹孔中。基板11可以是印制电路板(Printed Circuit Board,PCB)板,PCB板是电子元器件的支撑体和电子元器件电气连接的载体。In addition, as shown in FIG. 2, the heat dissipation device may further include a substrate 11 and at least two fixed connecting members 14. The heat-generating mechanism 1 is provided between the substrate 11 and the heat-conducting mechanism 2. One end of the at least two fixed connecting members 14 is connected to the substrate 11, and the other end is connected to the heat dissipation mechanism 3. In addition, the fixing connection member 14 may be a screw or a bolt, which may be screwed into a threaded hole on the heat dissipation mechanism 3 (for example, the heat dissipation casing 3a) through a hole on the substrate 11. The substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for the electronic components and a carrier for the electrical connection of the electronic components.
此外,优选地,该至少两个固定连接件14向基板11施加朝向发热机构1的力,从而将发热机构1和导热机构2夹紧在基板11与散热机构3之间。当固定连接件14是螺钉(可以是普通螺钉或弹簧螺钉)时,通过向下拧入螺钉,即可利用螺钉的螺头(图中未详细示出)对基板11施加力。这样,可进一步利用具有弹性的填充层2b消除发热机构1、基板11、导热层2a等的加工公差和安装公差,减小导热层与发热层之间间隙,使导热层与发热层之间不用热界面材料或者用很薄比如0.1-0.15mm厚度的热界面材料,提高将发热机构产生的热量传递至散热机构的传递效率。当与同一基板11对应的发热机构1为两个以上时,该效果尤为突出。应当理解的是,基板11与发热机构1可以是彼此固定连接或是一体形成的。此外,尽管在本公开的各附图中示出了基板和固定连接件,但它们并不是必不可少的。附加地或者作为替代,可以通过下文所描述的第一固定连接件10、第二固定连接件13或第二弹性连接件12等其他方式来实现消除公差、减小热阻的作用。In addition, preferably, the at least two fixed connectors 14 apply a force to the substrate 11 toward the heat generating mechanism 1, thereby clamping the heat generating mechanism 1 and the heat conducting mechanism 2 between the substrate 11 and the heat radiating mechanism 3. When the fixing connection member 14 is a screw (which can be a common screw or a spring screw), by screwing the screw down, a screw head (not shown in detail in the figure) can be used to apply force to the substrate 11. In this way, the filling layer 2b with elasticity can further be used to eliminate processing tolerances and installation tolerances of the heating mechanism 1, the substrate 11, and the thermally conductive layer 2a, etc., and reduce the gap between the thermally conductive layer and the heating layer, so that the thermally conductive layer and the heating layer are not used. The thermal interface material or a thin thermal interface material with a thickness of, for example, 0.1-0.15 mm, improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. This effect is particularly prominent when there are two or more heating mechanisms 1 corresponding to the same substrate 11. It should be understood that the substrate 11 and the heating mechanism 1 may be fixedly connected to each other or formed integrally. In addition, although the substrate and the fixed connection are shown in the drawings of the present disclosure, they are not essential. Additionally or alternatively, the effects of eliminating tolerances and reducing thermal resistance may be achieved by other methods such as the first fixed connection member 10, the second fixed connection member 13 or the second elastic connection member 12 described below.
参照图3所示,本公开的一种可选实施方式中,填充层2b设置在导热层2a上。换句话说,导热层2a设置在填充层2b与发热机构1之间。Referring to FIG. 3, in an optional embodiment of the present disclosure, the filling layer 2b is disposed on the thermally conductive layer 2a. In other words, the thermally conductive layer 2a is provided between the filling layer 2b and the heat generating mechanism 1.
如图3所示,图3中以填充层2b设置在导热层2a上,并且以设置有两个发热机构的情况作为示例,本实施方式中提供的散热装置还包括第一传热层4,第一传热层4设置在导热机构2上;第一传热层4将发热机构1的热量传递至导热机构2。换句话说,在本实施方式中,导热机构2不直接与发热机构1接 触,而是至少通过第一传热层4来传递热量。As shown in FIG. 3, in FIG. 3, a filling layer 2b is provided on the heat conductive layer 2a, and a case where two heat generating mechanisms are provided is taken as an example. The heat sink provided in this embodiment further includes a first heat transfer layer 4, The first heat transfer layer 4 is disposed on the heat transfer mechanism 2; the first heat transfer layer 4 transfers the heat of the heat generating mechanism 1 to the heat transfer mechanism 2. In other words, in this embodiment, the heat-conducting mechanism 2 does not directly contact the heat-generating mechanism 1, but transfers heat through at least the first heat-transfer layer 4.
如图3所示,在本实施方式中,第一传热层4直接与发热机构1接触;第一传热层4可以是由铜片、VC板、铝板等具有良好导热性能的材料制成的。As shown in FIG. 3, in this embodiment, the first heat transfer layer 4 is directly in contact with the heating mechanism 1. The first heat transfer layer 4 may be made of a material having good thermal conductivity, such as a copper sheet, a VC plate, and an aluminum plate. of.
需要说明的是,在本实施方式中,第一传热层4的材料可以和导热层2a采用相同的材料。当然,第一传热层4也可以和导热层2a采用不同的材料,只要第一传热层4是采用具有良好导热性能的材料制成的即可,本实施例中不做特别限定。It should be noted that, in this embodiment, the material of the first heat transfer layer 4 may be the same as that of the heat transfer layer 2a. Of course, the first heat transfer layer 4 may also be made of a different material from the thermally conductive layer 2a, as long as the first heat transfer layer 4 is made of a material having good thermal conductivity, which is not particularly limited in this embodiment.
填充层2b设置在导热层2a与第一传热层4之间。The filling layer 2b is provided between the thermally conductive layer 2a and the first thermally conductive layer 4.
当然,在本实施方式中,填充层也可以设置在导热层2a与散热机构3之间;或者,填充层可以设置在导热层2a与第一传热层4之间,并且同时(另一)填充层设置在导热层2a与散热机构3之间。Of course, in this embodiment, the filling layer may also be disposed between the thermally conductive layer 2a and the heat dissipation mechanism 3; or, the filling layer may be disposed between the thermally conductive layer 2a and the first thermally conductive layer 4 and at the same time (another) The filling layer is provided between the heat-conducting layer 2 a and the heat dissipation mechanism 3.
在本实施方式中,当填充层设置在导热层与散热机构之间时,第一传热层直接与导热层接触,并且安装完成后,在填充层弹性的作用下,第一传热层、导热层被填充层紧密压合在发热机构上,第一传热层将发热机构产生的热量迅速传递至导热层,减小了导热层与发热机构之间的热阻,提高热传递效率,导热层能够迅速将发热机构产生的热量传递至散热机构,减小了发热机构与散热机构之间的热阻,从而提高了将发热机构产生的热量传递至散热机构的传递效率。In this embodiment, when the filling layer is disposed between the heat-conducting layer and the heat-dissipating mechanism, the first heat-transfer layer directly contacts the heat-conducting layer, and after the installation is completed, the first heat-transfer layer, The thermally conductive layer is tightly pressed against the heating mechanism by the filling layer. The first heat transfer layer quickly transfers the heat generated by the heating mechanism to the thermally conductive layer, which reduces the thermal resistance between the thermally conductive layer and the heating mechanism, improves the efficiency of heat transfer, and conducts heat. The layer can quickly transfer the heat generated by the heat generating mechanism to the heat dissipation mechanism, reducing the thermal resistance between the heat generating mechanism and the heat dissipation mechanism, thereby improving the transfer efficiency of transferring the heat generated by the heat generating mechanism to the heat dissipation mechanism.
基于前述实施方式,参照图4所示(图4中以散热机构包括两个发热机构的情况作为示例),本公开的一种可选实施方式中,导热层2a靠近第一传热层4的面上设置有凹槽2c;其中,第一传热层4设置在凹槽2c内。Based on the foregoing embodiment, referring to FIG. 4 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 4), in an optional embodiment of the present disclosure, the heat conductive layer 2 a is close to the first heat transfer layer 4. A groove 2c is provided on the surface; wherein the first heat transfer layer 4 is disposed in the groove 2c.
如图4所示,本实施方式中,凹槽2c是与发热机构1正对设置,第一传热层4设置在凹槽2c内;填充层2b设置在导热层2a与散热机构3之间。当然,填充层也可以设置在凹槽2c内,并设置在第一传热层23与导热层2a之间。As shown in FIG. 4, in this embodiment, the groove 2 c is disposed to face the heating mechanism 1, and the first heat transfer layer 4 is disposed in the groove 2 c; the filling layer 2 b is disposed between the heat conduction layer 2 a and the heat dissipation mechanism 3. . Of course, the filling layer may also be disposed in the groove 2 c and disposed between the first heat transfer layer 23 and the heat transfer layer 2 a.
在本实施方式中,将第一传热层设置在凹槽内,有效避免因震动等原因造成第一传热层松动脱落,提高散热的稳定性。In this embodiment, the first heat transfer layer is disposed in the groove, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.
基于前述实施方式,参照图5所示(图5中以散热机构包括两个发热机构的情况作为示例),本公开的一种可选实施方式中提供的散热装置还包括至少两个限位立柱5;至少两个限位立柱5设置在导热层2a靠近第一传热层4的面上; 第一传热层4设置在至少两个限位立柱5之间。Based on the foregoing embodiment, referring to FIG. 5 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 5), the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least two limiting posts. 5; at least two limiting posts 5 are disposed on the surface of the thermally conductive layer 2a close to the first heat transfer layer 4; the first heat transfer layer 4 is disposed between at least two limiting posts 5.
如图5所示,本实施方式中,两个限位立柱5的相对侧之间的区域与发热机构1正对设置,第一传热层4设置在两个限位立柱5的相对侧之间的区域内;填充层2b设置在导热层2a与散热机构3之间。当然,填充层也可以设置在两个限位立柱5的相对侧之间的区域内,并设置在第一传热层4与导热层2a之间。图5中以填充层2b设置在导热层2a和散热机构3之间的情况作为示例。需要说明的是,填充层2b也可以设置在第一传热层4与导热层2a之间,此时,填充层2b设置在两个限位立柱5的相对侧之间的区域内,并且,填充层2b是具有一定的硬度和弹性的导热材料比如导热衬垫,安装后,导热衬垫的弹性将第一传热层4紧密压合在发热机构1上。As shown in FIG. 5, in the present embodiment, the area between the opposite sides of the two limiting posts 5 is opposite to the heating mechanism 1, and the first heat transfer layer 4 is provided on the opposite side of the two limiting posts 5. In a region between them; a filling layer 2b is provided between the heat conducting layer 2a and the heat dissipation mechanism 3. Of course, the filling layer may also be provided in a region between the opposite sides of the two limiting posts 5 and between the first heat transfer layer 4 and the heat transfer layer 2a. In FIG. 5, a case where the filling layer 2 b is provided between the heat conductive layer 2 a and the heat dissipation mechanism 3 is taken as an example. It should be noted that the filling layer 2b may also be provided between the first heat transfer layer 4 and the thermally conductive layer 2a. At this time, the filling layer 2b is provided in a region between the opposite sides of the two limiting posts 5 and, The filling layer 2b is a thermally conductive material with a certain hardness and elasticity, such as a thermally conductive pad. After installation, the elasticity of the thermally conductive pad tightly presses the first heat transfer layer 4 on the heating mechanism 1.
在本实施方式中,将第一传热层设置在两个限位立柱的相对侧之间的区域内,有效避免因震动等原因造成第一传热层松动脱落,提高散热的稳定性。In this embodiment, the first heat transfer layer is disposed in an area between the opposite sides of the two limiting posts, which effectively prevents the first heat transfer layer from loosening and falling due to vibration and other reasons, and improves the stability of heat dissipation.
基于前述实施方式,参照图6所示(图6中以散热机构包括两个发热机构的情况作为示例),本公开的一种可选实施方式提供的散热装置还包括第二传热层6,其中:第二传热层6设置在第一传热层4上;第二传热层6将发热机构1的热量传递至第一传热层4。Based on the foregoing embodiment, referring to FIG. 6 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 6), the heat dissipation device provided by an optional embodiment of the present disclosure further includes a second heat transfer layer 6, Wherein: the second heat transfer layer 6 is disposed on the first heat transfer layer 4; the second heat transfer layer 6 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.
本实施方式中,第二传热层6可以是具有良好导热性能有些流动性较软的热界面材料,例如导热硅脂、导热胶等。在其他实施方式中,第二传热层6可以是具有弹性的热界面材料,如弹性导热衬垫。In this embodiment, the second heat transfer layer 6 may be a thermal interface material with good thermal conductivity and somewhat soft fluidity, such as thermally conductive silicone grease, thermally conductive glue, and the like. In other embodiments, the second heat transfer layer 6 may be an elastic thermal interface material, such as an elastic thermally conductive pad.
在安装完成后,第二传热层6被第一传热层4紧密压合在发热机构1上。After the installation is completed, the second heat transfer layer 6 is tightly pressed onto the heat generating mechanism 1 by the first heat transfer layer 4.
在本实施方式中,第二传热层是热界面材料,尤其是有些流动性非常软的材料比如导热硅脂、导热胶等。在将第二传热层设置在第一传热层与发热机构之间后,第二传热层被紧密压合在发热机构上,减小发热机构与第一传热层之间的热阻,从而提高了将发热机构产生的热量传递至散热机构的传递效率。In this embodiment, the second heat transfer layer is a thermal interface material, especially some materials with very soft fluid properties such as thermally conductive silicone grease, thermally conductive glue, and the like. After the second heat transfer layer is disposed between the first heat transfer layer and the heat generating mechanism, the second heat transfer layer is tightly pressed onto the heat generating mechanism to reduce the thermal resistance between the heat generating mechanism and the first heat transfer layer. Therefore, the transmission efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism is improved.
应当理解的是,第二传热层6也可以直接设置在导热机构2上并与导热机构接触,即,可以不设置第一传热层4。另外,填充层2b是具有弹性的热界面材料比如导热衬垫。在这种情况下,填充层2b设置在导热层2a与散热机构3之间。换言之,导热层2a可分别通过作为第二传热层6和填充层2b的热界面材料与发热机构1和散热机构3接触。由于导热层2a具有均温的作用,故也可称为导热均温层或均温导热层。It should be understood that the second heat transfer layer 6 may also be directly disposed on and in contact with the heat transfer mechanism 2, that is, the first heat transfer layer 4 may not be provided. In addition, the filling layer 2b is an elastic thermal interface material such as a thermally conductive pad. In this case, the filling layer 2b is provided between the thermally conductive layer 2a and the heat radiation mechanism 3. In other words, the heat-conducting layer 2a may be in contact with the heat-generating mechanism 1 and the heat-radiating mechanism 3 through the thermal interface material serving as the second heat-transporting layer 6 and the filling layer 2b, respectively. Since the thermally conductive layer 2a has a function of uniform temperature, it may also be referred to as a thermally conductive uniform temperature layer or a uniform thermally conductive layer.
基于前述实施方式,参照图7所示(图7中以散热机构包括两个发热机构的情况作为示例),本公开的一种可选实施方式中提供的散热装置还包括粘贴层7,粘贴层7将第一传热层4粘接在发热机构1上,并且,粘贴层7将发热机构1的热量传递至第一传热层4。Based on the foregoing embodiment, referring to FIG. 7 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 7), the heat dissipation device provided in an optional embodiment of the present disclosure further includes an adhesive layer 7 and an adhesive layer 7 The first heat transfer layer 4 is adhered to the heat generating mechanism 1, and the adhesive layer 7 transfers the heat of the heat generating mechanism 1 to the first heat transfer layer 4.
本实施方式中,粘贴层7可以是导热胶。导热胶可以是单组份、导热型、室温固化有机硅粘接密封胶。导热胶具有良好的抗冷热交变性能、耐老化性能和电绝缘性能,并具有良好的防潮、抗震、耐电晕、抗漏电性能和耐化学介质性能。可持续使用在-60℃~280℃且保持性能,并且对大多数金属和非金属材料具有良好的粘接性。In this embodiment, the adhesive layer 7 may be a thermally conductive adhesive. The thermally conductive adhesive can be a single component, thermally conductive, room temperature curing silicone adhesive sealant. Thermally conductive adhesive has good resistance to cold and heat alternation, aging resistance and electrical insulation properties, and has good moisture resistance, shock resistance, corona resistance, leakage resistance and chemical resistance. It can be used continuously at -60 ° C to 280 ° C and maintains performance, and has good adhesion to most metal and non-metal materials.
如图7所示,在本实施方式中,第一传热层是通过导热胶粘接在发热机构上,如此,能够在避免第一传热层因震动等原因掉落的同时,减小发热机构与第一传热层之间的热阻,提高将发热机构产生的热量传递至散热机构的传递效率,增强对发热机构的降温散热效果。As shown in FIG. 7, in this embodiment, the first heat transfer layer is adhered to the heating mechanism through a thermally conductive adhesive. In this way, the first heat transfer layer can be prevented from falling due to vibration and the like while reducing heat generation. The thermal resistance between the mechanism and the first heat transfer layer improves the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism, and enhances the cooling and cooling effect on the heating mechanism.
基于前述实施方式,参照图8所示(图8中以散热机构包括两个发热机构的情况作为示例),本公开一种可选实施方式提供的散热装置还包括传热件8,传热件8的一端与第一传热层4连接,传热件8的另一端与导热机构2连接。Based on the foregoing embodiment, referring to FIG. 8 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 8), the heat dissipation device provided by an optional embodiment of the present disclosure further includes a heat transfer member 8, One end of 8 is connected to the first heat transfer layer 4, and the other end of the heat transfer member 8 is connected to the heat conduction mechanism 2.
在本实施方式中,传热件8包括热管;如图8所示,热管包括蒸发侧8b和冷凝侧8a;热管的蒸发侧8b与第一传热层4连接;热管的冷凝侧8a与导热层2a连接。In this embodiment, the heat transfer member 8 includes a heat pipe; as shown in FIG. 8, the heat pipe includes an evaporation side 8b and a condensation side 8a; the evaporation side 8b of the heat pipe is connected to the first heat transfer layer 4; and the condensation side 8a of the heat pipe is connected to a heat exchanger. Layer 2a is connected.
在本实施方式中,热管是由管壳、吸液芯和端盖组成,将管壳内抽成1.3×10
-1Pa-10
-4Pa的负压后充入适量的工作液体,工作液体可以根据实际需要选择热相变液体,吸液芯采用具有多空的毛细材料制成,并且紧贴在管壳的内壁,工作液体将吸液芯充满后加以密封。热管内的工作液体受热后被蒸发的一侧为蒸发侧,热管内工作液体受冷后冷凝的一侧为冷凝侧。当热管的蒸发侧受热时吸液芯中的液体蒸发汽化,蒸汽在微小的压差下流向冷凝侧放出热量凝结成液体,液体沿着吸液芯,依靠吸液芯的虹吸力的作用流回蒸发侧。如此循环,热量由热管的蒸发侧传至冷凝侧。
In this embodiment, the heat pipe is composed of a shell, a wick and an end cap. The inside of the shell is drawn to a negative pressure of 1.3 × 10 -1 Pa-10 to 4 Pa and filled with an appropriate amount of working liquid. The thermal phase change liquid can be selected according to the actual needs. The wick is made of a capillary material with multiple holes and is closely attached to the inner wall of the tube shell. The working liquid is filled with the wick and sealed. The working liquid in the heat pipe is evaporated on the heated side, and the condensed side is the condensed side of the working liquid in the heat pipe. When the evaporation side of the heat pipe is heated, the liquid in the suction core evaporates and vaporizes. The steam flows to the condensation side under a slight pressure difference and releases heat to condense into a liquid. The liquid flows along the suction core and relies on the siphoning force of the suction core. Evaporation side. In this way, heat is transferred from the evaporation side to the condensation side of the heat pipe.
本实施方式中,将热管的蒸发侧与第一传热层连接,热管的蒸发侧与第一传热层的连接方式可以是焊接、粘接或其他连接方式连接,将热管的冷凝侧与导热层连接,热管的冷凝侧与导热层的连接方式可以是焊接、粘接或其他连接 方式连接。热管的蒸发侧的热量能够快速传递至热管的冷凝侧,并通过热管的冷凝侧传递至导热层,减小了第一传热层与导热层之间的热阻,提高将发热机构产生的热量传递至散热机构的传递效率,增强对发热机构的降温散热效果。In this embodiment, the evaporation side of the heat pipe is connected to the first heat transfer layer, and the connection method between the evaporation side of the heat pipe and the first heat transfer layer may be welding, bonding or other connection methods, and the condensing side of the heat pipe and heat conduction Layer connection, the connection method of the condensation side of the heat pipe and the heat conduction layer can be welding, bonding or other connection methods. The heat on the evaporation side of the heat pipe can be quickly transferred to the condensation side of the heat pipe, and transferred to the heat conduction layer through the condensation side of the heat pipe, reducing the thermal resistance between the first heat transfer layer and the heat conduction layer, and increasing the heat generated by the heating mechanism. The transfer efficiency to the heat-dissipating mechanism enhances the cooling effect of the heat-generating mechanism.
基于前述实施方式,参照图9所示(图9中以散热机构包括两个发热机构的情况作为示例),本公开一种可选实施方式中提供的散热装置还包括至少一个第一弹性连接件。图9中以每个发热机构对应两个第一弹性连接件9作为示例,其中,至少一个第一弹性连接件的一端与第一传热层4连接,至少一个第一弹性连接件的另一端与导热层2a连接;至少一个第一弹性连接件沿靠近发热机构1的方向给第一传热层4提供弹力。Based on the foregoing embodiment, referring to FIG. 9 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 9), the heat dissipation device provided in an optional embodiment of the present disclosure further includes at least one first elastic connecting member . In FIG. 9, each heating mechanism corresponds to two first elastic connecting members 9 as an example, in which one end of at least one first elastic connecting member is connected to the first heat transfer layer 4 and the other end of at least one first elastic connecting member. It is connected to the thermally conductive layer 2a; at least one first elastic connecting member provides elastic force to the first thermally conductive layer 4 in a direction close to the heat generating mechanism 1.
如图9所示,第一弹性连接件9是垂直于导热层2a与第一传热层4接触的面设置的,在安装完成后,第一弹性连接件9给第一传热层4提供的弹力垂直于发热机构1的靠近导热层2a的面;并且,第一弹性连接件9给第一传热层4提供的弹力的方向是指向发热机构1的。也就是说,本实施方式中,第一传热层4和导热层在第一弹性连接件9的作用下,被紧密压合在发热机构1上。As shown in FIG. 9, the first elastic connecting member 9 is provided perpendicular to the surface where the heat conductive layer 2 a contacts the first heat transfer layer 4. After the installation is completed, the first elastic connecting member 9 provides the first heat transfer layer 4. The direction of the elastic force provided by the first elastic connecting member 9 to the first heat transfer layer 4 is directed to the heat generating mechanism 1. That is, in this embodiment, the first heat transfer layer 4 and the heat transfer layer are tightly pressed onto the heat generating mechanism 1 under the action of the first elastic connecting member 9.
如图9所示,在图9中以填充层2b设置在第一传热层4与导热层2a之间的情况作为示例,应当理解,填充层2b也可以是设置在导热层2a与散热机构3之间的,填充层2b还可以是设置在第一传热层4与导热层2a之间,并且同时设置在导热层2a与散热机构3之间。填充层2b为有些流动性较软的热界面材料,例如导热硅脂、导热胶等。As shown in FIG. 9, the case where the filling layer 2 b is provided between the first heat transfer layer 4 and the heat conducting layer 2 a is taken as an example in FIG. 9. It should be understood that the filling layer 2 b may also be provided between the heat conducting layer 2 a and the heat dissipation mechanism. Between 3, the filling layer 2b may also be disposed between the first heat transfer layer 4 and the heat conducting layer 2a, and at the same time between the heat conducting layer 2a and the heat dissipation mechanism 3. The filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.
本实施方式中,第一弹性连接件可以是弹簧螺钉,弹簧螺钉在将两个物体连接后,能够在弹簧螺钉连接的两个物体之间,给弹簧螺钉连接的两个物体提供弹力;本实施方式中,第一弹性连接件9给第一传热层4提供指向发热机构1的弹力。In this embodiment, the first elastic connecting member may be a spring screw. After the spring screw connects two objects, the spring screw can provide elastic force to the two objects connected by the spring screw between the two objects connected by the spring screw. In the method, the first elastic connecting member 9 provides the first heat transfer layer 4 with an elastic force directed toward the heat generating mechanism 1.
在本实施方式中,如图9所示,所述装置还包括至少两个第一固定连接件,至少两个第一固定连接件将导热层2a固定在散热机构3上。In this embodiment, as shown in FIG. 9, the device further includes at least two first fixed connecting members, and the at least two first fixed connecting members fix the heat conducting layer 2 a on the heat dissipation mechanism 3.
本实施方式中,第一固定连接件10可以是普通螺钉,第一固定连接件10通过设置在散热机构3上的螺纹孔将导热层2a固定在散热机构3上。In this embodiment, the first fixed connection member 10 may be an ordinary screw. The first fixed connection member 10 fixes the heat conducting layer 2 a on the heat dissipation mechanism 3 through a threaded hole provided in the heat dissipation mechanism 3.
在本实施方式中,采用第一弹性连接将第一传热层与导热层连接,在安装完成后,第一传热层被紧密压合在发热机构上,如此,通过第一弹性连接件提供的弹性力减小第一传热层与发热机构之间的间隙,从而减小发热机构与第一 传热层之间的热阻,提高将发热机构产生的热量传递至散热机构的传递效率,增强对发热机构的降温散热效果。In this embodiment, a first elastic connection is used to connect the first heat transfer layer to the heat transfer layer. After the installation is completed, the first heat transfer layer is tightly pressed onto the heating mechanism. In this way, the first elastic connection is provided. The elastic force reduces the gap between the first heat transfer layer and the heating mechanism, thereby reducing the thermal resistance between the heating mechanism and the first heat transfer layer, and improving the transfer efficiency of transferring the heat generated by the heating mechanism to the heat dissipation mechanism. Enhance the cooling and cooling effect on the heating mechanism.
基于前述实施方式,参照图10所示,本公开的一种可选实施方式中,发热机构1设置在基板11上;散热装置还包括至少两个第二弹性连接件;其中,至少两个第二弹性连接件的一端与导热层2a连接,至少两个第二弹性连接件的另一端与基板11连接;至少两个第二弹性连接件沿靠近发热机构1的方向给导热层2a提供弹力。填充层2b为有些流动性较软的热界面材料,例如导热硅脂、导热胶等。Based on the foregoing embodiment and referring to FIG. 10, in an optional embodiment of the present disclosure, the heating mechanism 1 is disposed on the substrate 11; the heat dissipation device further includes at least two second elastic connecting members; One end of the two elastic connecting members is connected to the heat conductive layer 2a, and the other ends of the at least two second elastic connecting members are connected to the substrate 11. The at least two second elastic connecting members provide elastic force to the heat conductive layer 2a in a direction close to the heating mechanism 1. The filling layer 2b is a soft fluid thermal interface material, such as thermally conductive silicone grease, thermally conductive glue, and the like.
本实施方式中,第二弹性连接件12可以是与第一弹性连接件相同的弹簧螺钉或者其他弹性连接件。In this embodiment, the second elastic connecting member 12 may be the same spring screw or other elastic connecting members as the first elastic connecting member.
本实施方式中,如图10所示,第二弹性连接件12是设置在导热层2a的两端的,并且,第二弹性连接件12垂直于导热层2a靠近基板11的面设置,第二弹性连接件12对导热层2a提供垂直于发热机构1与导热层2a接触的面的弹力,导热层2a被弹力紧密压合在发热机构1上。In this embodiment, as shown in FIG. 10, the second elastic connecting member 12 is disposed at both ends of the heat conductive layer 2a, and the second elastic connecting member 12 is provided perpendicular to the surface of the heat conductive layer 2a near the substrate 11, and the second elastic The connecting member 12 provides an elastic force to the heat-conducting layer 2 a perpendicular to the surface of the heat-generating mechanism 1 that is in contact with the heat-conducting layer 2 a. The heat-conducting layer 2 a is tightly pressed against the heat-generating mechanism 1 by the elastic force.
在本实施方式中,基板11可以是印制电路板(Printed Circuit Board,PCB)板,PCB板是电子元器件的支撑体和电子元器件电气连接的载体;若干电子元器件设置在PCB板上,并且通过PCB板上的印制电路实现相互电气连接。In this embodiment, the substrate 11 may be a printed circuit board (PCB) board, and the PCB board is a support for electronic components and a carrier for the electrical connection of the electronic components; several electronic components are disposed on the PCB board. , And realize electrical connection with each other through printed circuits on the PCB.
如图10所示,基板11与散热机构3固定连接,并且基板11上设置有电子元器件的一面与散热机构3正对设置。也就是说,如图10所示,基板11上的电子元器件是设置在基板11与散热机构3之间的。As shown in FIG. 10, the substrate 11 is fixedly connected to the heat dissipation mechanism 3, and the side on which the electronic components are disposed on the substrate 11 is directly opposite to the heat dissipation mechanism 3. That is, as shown in FIG. 10, the electronic components on the substrate 11 are disposed between the substrate 11 and the heat dissipation mechanism 3.
发热机构1设置在基板11与散热机构3之间,并与基板11连接。这里发热机构1可以是设置在基板11上的发热芯片,发热机构1作为电子元器件,与其他电子元器件一同设置在基板11上,并且通过基板11的印制电路与其他电子元器件电气连接。The heating mechanism 1 is provided between the substrate 11 and the heat dissipation mechanism 3 and is connected to the substrate 11. Here, the heating mechanism 1 may be a heating chip provided on the substrate 11. The heating mechanism 1 is an electronic component, and is arranged on the substrate 11 together with other electronic components, and is electrically connected to other electronic components through a printed circuit of the substrate 11. .
本实施方式中,在导热层与基板之间通过弹簧螺钉连接,弹簧螺钉在导热层与基板之间提供弹力,从而使得导热层紧密压合在发热机构上,减小发热机构与导热层之间的间隙和热阻,提高将发热机构产生的热量传递至散热机构的传递效率,增强对发热机构的降温散热效果。In this embodiment, the thermally conductive layer and the substrate are connected by a spring screw. The spring screw provides elastic force between the thermally conductive layer and the substrate, so that the thermally conductive layer is tightly pressed onto the heating mechanism, and the heating mechanism and the thermally conductive layer are reduced. The gap and thermal resistance improve the transfer efficiency of the heat generated by the heating mechanism to the heat dissipation mechanism, and enhance the cooling and cooling effect of the heating mechanism.
基于前述实施方式,如图11所示(图11中以散热机构包括两个发热机构的情况作为示例),本公开的一种可选实施方式中,发热机构1设置在基板11 上;散热装置还包括至少两个第二固定连接件,至少两个第二固定连接件将导热层2a与基板11固定连接。Based on the foregoing embodiment, as shown in FIG. 11 (the case where the heat dissipation mechanism includes two heat generating mechanisms is taken as an example in FIG. 11), in an optional embodiment of the present disclosure, the heat generating mechanism 1 is disposed on the substrate 11; It also includes at least two second fixed connecting members, and the at least two second fixed connecting members fixedly connect the heat conducting layer 2 a and the substrate 11.
本实施方式中,第二固定连接件13可以是与第一固定连接件相同的普通螺钉,第二固定连接件13通过螺纹孔将导热层2a固定在基板11上。In this embodiment, the second fixed connection member 13 may be the same ordinary screw as the first fixed connection member, and the second fixed connection member 13 fixes the heat conductive layer 2a on the substrate 11 through a screw hole.
第二传热层可包括有些流动性较软的热界面材料,例如导热硅脂、导热胶等热界面材料,热界面材料的厚度为0.10mm-0.15mm。本实施方式中有些流动性较软热界面材料可以是导热硅脂、导热胶等;当然,本实施方式中第二传热层的材料可以和填充层的材料一样,也可以不一样,只要是具有良好导热性能,且具有一定的弹性均可,本实施方式不做具体限定。The second heat transfer layer may include some relatively soft fluid thermal interface materials, such as thermal interface materials such as thermally conductive silicone grease, thermally conductive glue, and the thickness of the thermal interface material is 0.10 mm-0.15 mm. Some softer thermal interface materials in this embodiment may be thermally conductive silicone grease, thermally conductive adhesive, etc. Of course, the material of the second heat transfer layer in this embodiment may be the same as the material of the filling layer, or it may be different, as long as it is It has good thermal conductivity and can have certain elasticity, which is not specifically limited in this embodiment.
在本公开各个实施方式中,填充层为热界面材料,其厚度为0.30mm-1.00mm。图1-图8中填充层可包括弹性热界面材料,图9-图11中填充层也可以为有些流动性较软的导热胶。In various embodiments of the present disclosure, the filling layer is a thermal interface material, and its thickness is 0.30 mm-1.00 mm. The filling layer in FIG. 1 to FIG. 8 may include an elastic thermal interface material, and the filling layer in FIG. 9 to FIG. 11 may also be a thermally conductive adhesive with relatively soft fluidity.
导热层可包括或可以是均温导热基板,均温导热基板的面积大于发热机构与导热机构的接触面积。均温导热基板可以采用铜板、VC板、铝板或热管等导热性能良好的导热材料制成。The heat-conducting layer may include or may be a temperature-conducting heat-conducting substrate, and the area of the temperature-conducting heat-conducting substrate is larger than the contact area of the heating mechanism and the heat-conducting mechanism. The temperature-conducting and heat-conducting substrate can be made of a thermally conductive material such as a copper plate, a VC plate, an aluminum plate, or a heat pipe.
应当理解的是,上述各实施方式中的第一弹性连接件9和第二弹性连接件12以及图1-图8中的填充层2b等具有通过施加夹紧力来浮动调整层之间的间隔的浮动机构的作用。特别地,在以热界面材料作为中间层的情况下,通过这样的浮动机构,可以减小导热层2a与发热机构1和/或导热层2a与散热层3之间的间隔(即,压缩热界面材料的厚度),降低热阻。由于导热层2a具有导热均温的作用,因此能够快速提取来自发热机构的热量,在进行导热均温后快速、充分地传递到散热机构上。It should be understood that the first elastic connecting member 9 and the second elastic connecting member 12 in the above embodiments, and the filling layer 2b in FIG. 1 to FIG. 8 and the like have a function of adjusting the interval between the layers by applying a clamping force. Role of the floating body. In particular, in the case where a thermal interface material is used as an intermediate layer, through such a floating mechanism, the interval between the thermally conductive layer 2a and the heat generating mechanism 1 and / or the thermally conductive layer 2a and the heat radiating layer 3 (i.e., compression heat) can be reduced. Interface material thickness) to reduce thermal resistance. Since the thermally conductive layer 2a has a function of uniformly conducting heat, it can quickly extract heat from the heat generating mechanism, and quickly and fully transfer it to the heat dissipating mechanism after performing the uniformly conducting heat.
以上,仅为本公开的较佳实施例而已,并非用于限定本公开的保护范围。The above are only preferred embodiments of the present disclosure, and are not intended to limit the protection scope of the present disclosure.
Claims (20)
- 一种散热装置,包括:发热机构、导热机构和散热机构,所述导热机构包括:导热层和填充层;其中,A heat dissipation device includes a heating mechanism, a heat conduction mechanism, and a heat dissipation mechanism. The heat conduction mechanism includes: a heat conduction layer and a filling layer;所述发热机构设置在所述散热机构上;The heating mechanism is disposed on the heat dissipation mechanism;所述导热机构设置在所述发热机构和所述散热机构之间,并且所述导热机构分别与所述发热机构和所述散热机构接触;The heat conduction mechanism is disposed between the heat generation mechanism and the heat radiation mechanism, and the heat conduction mechanism is in contact with the heat generation mechanism and the heat radiation mechanism, respectively;所述填充层与所述发热机构不接触;并且填充层具有弹性,弹性浮动作用将导热层与发热机构紧密压在一起;The filling layer is not in contact with the heating mechanism; and the filling layer has elasticity, and the elastic floating effect tightly presses the heat conducting layer and the heating mechanism together;所述填充层将所述导热层的热量传递至所述散热机构。The filling layer transfers the heat of the thermally conductive layer to the heat dissipation mechanism.
- 根据权利要求1所述的装置,其中,所述导热层设置在所述填充层与所述发热机构之间。The device according to claim 1, wherein the thermally conductive layer is disposed between the filling layer and the heat generating mechanism.
- 根据权利要求1或2所述的装置,其中,The device according to claim 1 or 2, wherein:所述发热机构设置在基板上;The heating mechanism is disposed on a substrate;所述装置还包括至少两个第二弹性连接件;The device further includes at least two second elastic connecting members;所述至少两个第二弹性连接件的一端与所述导热层连接,所述至少两个第二弹性连接件的另一端与所述基板连接;并且One end of the at least two second elastic connecting members is connected to the heat conductive layer, and the other end of the at least two second elastic connecting members is connected to the substrate; and所述至少两个第二弹性连接件沿靠近所述发热机构的方向给所述导热层提供弹力。The at least two second elastic connecting members provide elastic force to the heat conductive layer in a direction close to the heating mechanism.
- 根据权利要求1或2所述的装置,其中,The device according to claim 1 or 2, wherein:所述装置还包括至少两个第一固定连接件,所述至少两个第一固定连接件将所述导热层固定在所述散热机构上。The device further includes at least two first fixed connecting members that fix the heat conductive layer on the heat dissipation mechanism.
- 根据权利要求1或2所述的装置,其中,The device according to claim 1 or 2, wherein:所述发热机构设置在基板上;The heating mechanism is disposed on a substrate;所述装置还包括至少两个第二固定连接件;The device further includes at least two second fixed connections;所述至少两个第二固定连接件将所述导热层与所述基板固定连接。The at least two second fixed connecting members fixedly connect the heat conducting layer and the substrate.
- 一种散热装置,包括:发热机构、导热机构、散热机构和第一传热层, 所述导热机构包括:导热层和填充层;其中,A heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a first heat transfer layer. The heat conduction mechanism includes a heat conduction layer and a filling layer;所述发热机构设置在所述散热机构上;The heating mechanism is disposed on the heat dissipation mechanism;所述导热机构设置在所述发热机构和所述散热机构之间,并且所述导热机构与所述散热机构接触;The heat conduction mechanism is disposed between the heat generation mechanism and the heat dissipation mechanism, and the heat conduction mechanism is in contact with the heat dissipation mechanism;所述第一传热层设置在所述导热机构上,并将所述发热机构的热量传递至所述导热机构;并且The first heat transfer layer is disposed on the heat transfer mechanism, and transfers heat of the heat generation mechanism to the heat transfer mechanism; and所述填充层与所述发热机构不接触。The filling layer is not in contact with the heating mechanism.
- 根据权利要求6所述的装置,其中,The apparatus according to claim 6, wherein:所述导热层靠近所述第一传热层的面上设置有凹槽;并且A groove is provided on a surface of the heat conductive layer close to the first heat transfer layer; and所述第一传热层设置在所述凹槽内。The first heat transfer layer is disposed in the groove.
- 根据权利要求6所述的装置,其中,The apparatus according to claim 6, wherein:所述装置还包括至少两个限位立柱;The device further includes at least two limiting posts;所述至少两个限位立柱设置在所述导热层靠近所述第一传热层的面上;并且The at least two limiting posts are disposed on a surface of the thermally conductive layer near the first thermally conductive layer; and所述第一传热层设置在所述至少两个限位立柱之间。The first heat transfer layer is disposed between the at least two limiting posts.
- 根据权利要求6所述的装置,其中,The apparatus according to claim 6, wherein:所述装置还包括第二传热层;并且The device further includes a second heat transfer layer; and所述第二传热层设置在所述第一传热层上,所述第二传热层将所述发热机构的热量传递至所述第一传热层。The second heat transfer layer is disposed on the first heat transfer layer, and the second heat transfer layer transfers heat of the heating mechanism to the first heat transfer layer.
- 根据权利要求6-9中任一项所述的装置,其中,The device according to any one of claims 6-9, wherein:所述装置还包括传热件,所述传热件设置在所述第一传热层与所述填充层之间;The device further includes a heat transfer member disposed between the first heat transfer layer and the filling layer;所述传热件包括热管;The heat transfer member includes a heat pipe;所述热管的蒸发侧与所述第一传热层连接;并且An evaporation side of the heat pipe is connected to the first heat transfer layer; and所述热管的冷凝侧与所述导热层连接。The condensation side of the heat pipe is connected to the thermally conductive layer.
- 根据权利要求6-10中任一项所述的装置,其中,The device according to any one of claims 6-10, wherein:所述装置还包括至少一个第一弹性连接件;The device further includes at least one first elastic connecting member;所述至少一个第一弹性连接件的一端与所述第一传热层连接,所述至少一个第一弹性连接件的另一端与所述导热层连接;并且One end of the at least one first elastic connection member is connected to the first heat transfer layer, and the other end of the at least one first elastic connection member is connected to the heat conduction layer; and所述至少一个第一弹性连接件沿靠近所述发热机构的方向给所述第一传热层提供弹力。The at least one first elastic connecting member provides elastic force to the first heat transfer layer in a direction close to the heat generating mechanism.
- 根据权利要求6-11中任一项所述的装置,其中,The device according to any one of claims 6 to 11, wherein:所述填充层设置在所述导热层与所述散热机构之间和/或设置在所述导热层与所述第一传热层之间。The filling layer is disposed between the thermally conductive layer and the heat dissipation mechanism and / or between the thermally conductive layer and the first thermally conductive layer.
- 根据权利要求6-11中任一项所述的装置,其中,The device according to any one of claims 6 to 11, wherein:所述发热机构设置在基板上;The heating mechanism is disposed on a substrate;所述装置还包括至少两个第二弹性连接件;The device further includes at least two second elastic connecting members;所述至少两个第二弹性连接件的一端与所述导热层连接,所述至少两个第二弹性连接件的另一端与所述基板连接;并且One end of the at least two second elastic connecting members is connected to the heat conductive layer, and the other end of the at least two second elastic connecting members is connected to the substrate; and所述至少两个第二弹性连接件沿靠近所述发热机构的方向给所述导热层提供弹力。The at least two second elastic connecting members provide elastic force to the heat conductive layer in a direction close to the heating mechanism.
- 根据权利要求6-11中任一项所述的装置,其中,The device according to any one of claims 6 to 11, wherein:所述装置还包括至少两个第一固定连接件,所述至少两个第一固定连接件将所述导热层固定在所述散热机构上。The device further includes at least two first fixed connecting members that fix the heat conductive layer on the heat dissipation mechanism.
- 根据权利要求6-11中任一项所述的装置,其中,The device according to any one of claims 6 to 11, wherein:所述发热机构设置在基板上;The heating mechanism is disposed on a substrate;所述装置还包括至少两个第二固定连接件;The device further includes at least two second fixed connections;所述至少两个第二固定连接件将所述导热层与所述基板固定连接。The at least two second fixed connecting members fixedly connect the heat conducting layer and the substrate.
- 根据权利要求9所述的装置,其中,The apparatus according to claim 9, wherein:所述填充层和所述第二传热层是热界面材料。The filling layer and the second heat transfer layer are thermal interface materials.
- 一种散热装置,包括:发热机构、导热机构、散热机构、浮动机构,所述导热机构包括:导热层和填充层;其中,A heat dissipation device includes a heating mechanism, a heat conduction mechanism, a heat dissipation mechanism, and a floating mechanism. The heat conduction mechanism includes a heat conduction layer and a filling layer;所述导热机构设置在所述发热机构与所述散热机构之间;The heat conduction mechanism is disposed between the heat generation mechanism and the heat radiation mechanism;所述填充层设置在所述导热层与所述散热机构之间,并将所述导热层的热量传递至所述散热机构;The filling layer is disposed between the heat conduction layer and the heat dissipation mechanism, and transfers heat of the heat conduction layer to the heat dissipation mechanism;所述浮动机构将所述导热层与所述散热机构固定连接或所述浮动机构将设置在所述发热机构上的基板与所述导热层固定连接以减小所述发热机构与所述导热层之间的间隔。The floating mechanism fixedly connects the thermally conductive layer and the heat dissipation mechanism or the floating mechanism fixedly connects a substrate provided on the heating mechanism with the thermally conductive layer to reduce the heating mechanism and the thermally conductive layer. Interval.
- 根据权利要求17所述的散热装置,其中,所述填充层是热界面材料。The heat sink according to claim 17, wherein the filling layer is a thermal interface material.
- 根据权利要求17或18所述的散热装置,其中,所述导热层是铝板、铜板、真空腔均温板或热管嵌铝板等均温基板。The heat dissipation device according to claim 17 or 18, wherein the thermally conductive layer is an isothermal substrate such as an aluminum plate, a copper plate, a vacuum chamber temperature equalizing plate, or a heat pipe embedded aluminum plate.
- 根据权利要求17至18中任一项所述的散热装置,其中,所述浮动机构为弹簧螺钉。The heat sink according to any one of claims 17 to 18, wherein the floating mechanism is a spring screw.
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CN208850120U (en) | 2019-05-10 |
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EP3813501A1 (en) | 2021-04-28 |
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