CN214155222U - Heat dissipation device for low-voltage cabinet circuit board - Google Patents
Heat dissipation device for low-voltage cabinet circuit board Download PDFInfo
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- CN214155222U CN214155222U CN202120135791.4U CN202120135791U CN214155222U CN 214155222 U CN214155222 U CN 214155222U CN 202120135791 U CN202120135791 U CN 202120135791U CN 214155222 U CN214155222 U CN 214155222U
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- heat
- heat dissipation
- fixedly connected
- heat conduction
- circuit board
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 91
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 6
- 230000002146 bilateral effect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a circuit board heat dissipation technical field just discloses a heat abstractor for low-voltage cabinet circuit board, comprising a base plate, two recesses, two have been seted up at the top of bottom plate the inboard bottom fixedly connected with dead lever of recess, two the equal sliding block in the outside of dead lever has connect the fixed block, two fixedly connected with heat-conducting plate between the fixed block, the first flexible heat conduction pad of bottom fixedly connected with of heat-conducting plate, the flexible heat conduction pad of top fixedly connected with second of bottom plate. The utility model discloses a, two recesses have been seted up through the top of bottom plate, and two inboard bottoms of recess difference fixed connection to the top of two dead levers, and the outside of two dead levers is sliding connection to the inside of two fixed blocks respectively, and one side that two fixed blocks are relative is fixed connection to the left and right sides of heat-conducting plate respectively to make the device possess the radiating effect good, advantage such as can both sides heat dissipation.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field specifically is a heat abstractor for low-voltage cabinet circuit board.
Background
The circuit board heat dissipation device is used for dissipating heat of a circuit board, is mainly attached to the outer side of the circuit board, dissipates heat generated by working of electronic elements on the circuit board, is widely used on various circuit boards, and has a good use effect.
Along with the development of the times, the integration degree of the existing circuit board is higher and higher, the requirement on the heat dissipation device is increased, the structure of the existing heat dissipation device is too simple, the heat dissipation efficiency is low, the existing heat dissipation device can only dissipate heat on a single side, and the heat dissipation requirement of the existing circuit board cannot be met, so that the heat dissipation device for the circuit board of the low-voltage cabinet is provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a heat abstractor for low-voltage cabinet circuit board possesses the radiating effect good, but advantages such as bilateral heat dissipation have solved present circuit board and have integrated the degree more and more high, lead to also increasing thereupon to heat abstractor's requirement, and current heat abstractor structure is too simple, and the radiating efficiency is low to can only unilateral heat dissipation, can't satisfy the problem of the heat dissipation demand of present circuit board.
(II) technical scheme
For realizing that above-mentioned radiating effect is good, can bilateral radiating purpose, the utility model provides a following technical scheme: a heat dissipation device for a circuit board of a low-voltage cabinet comprises a bottom plate, wherein two grooves are formed in the top of the bottom plate, fixing rods are fixedly connected to the bottoms of the inner sides of the two grooves, fixing blocks are connected to the outer sides of the two fixing rods in a sliding mode, a heat conduction plate is fixedly connected between the two fixing blocks, a first flexible heat conduction pad is fixedly connected to the bottom of the heat conduction plate, a second flexible heat conduction pad is fixedly connected to the top of the bottom plate, two heat conduction rods are fixedly connected to the top of the heat conduction plate, a heat dissipation block is fixedly installed at the top between the two heat conduction rods, heat dissipation lugs which are uniformly distributed are fixedly connected to the top of the heat dissipation block, a heat dissipation fan is fixedly connected to the top of the heat dissipation block, heat conduction copper pipes are fixedly connected to the left two sides of the heat dissipation block, and the other ends of the heat conduction copper pipes penetrate through and are fixedly connected to the inside of the bottom plate respectively, the other end of the heat conduction copper pipe extends to the top of the bottom plate, the other end of the heat conduction copper pipe is fixedly connected to the left side of the heat dissipation block, and the outer sides of the two heat conduction copper pipes are in contact with the bottom of the second flexible heat conduction pad.
Preferably, the heat conducting plate is an aluminum metal plate, and the heat dissipation block is an aluminum metal block.
Preferably, the front view cross section of the left side and the right side of the heat conduction copper pipe is arc-shaped, the outer sides of the two fixing rods are in threaded connection with nuts, and the bottoms of the two nuts are respectively contacted with the tops of the two fixing blocks.
Preferably, the outer side of each fixing rod is sleeved with a spring, the bottom ends of the springs are respectively and fixedly connected to the bottom of the inner side of each groove, and the top ends of the springs are respectively and fixedly connected to the bottoms of the two fixing blocks.
Preferably, the equal fixedly connected with otic placode in the left and right sides of bottom plate, two the mounting hole has all been seted up to the inside of otic placode.
Preferably, the heat dissipation block is internally provided with through holes which are arranged equidistantly.
Preferably, the outer side of the heat dissipation bump is provided with a heat dissipation groove.
Preferably, the first flexible heat conduction pad and the second flexible heat conduction pad are made of silicone rubber pads.
(III) advantageous effects
Compared with the prior art, the utility model provides a heat abstractor for low-voltage cabinet circuit board possesses following beneficial effect:
1. the heat dissipation device for the circuit board of the low-voltage cabinet is characterized in that two grooves are formed in the top of a bottom plate, the bottoms of the inner sides of the two grooves are respectively fixedly connected to the tops of two fixing rods, the outer sides of the two fixing rods are respectively connected to the insides of two fixing blocks in a sliding manner, one opposite sides of the two fixing blocks are respectively fixedly connected to the left side and the right side of a heat conduction plate, the bottom of the heat conduction plate is fixedly connected to a first flexible heat conduction pad, the top of the bottom plate is fixedly connected to a second flexible heat conduction pad, the top of the heat conduction plate is fixedly connected to the bottoms of the two heat conduction rods, a heat dissipation block is fixedly installed at the top between the two heat conduction rods, the top of the heat dissipation block is fixedly connected to the bottom of a heat dissipation lug, the top of the heat dissipation block is fixedly connected to the bottom of a heat dissipation fan, the left side and the right side of the heat dissipation block are fixedly connected to the two ends of a heat conduction copper pipe, and the outer side of the copper pipe is fixedly connected to the inside of the bottom plate, when the heat conduction copper tube is used, the circuit board is placed between the first flexible heat conduction pad and the second flexible heat conduction pad, the fixing block is pressed downwards and fixed by rotating the nut, so that the first flexible heat conduction pad presses the circuit board, when the circuit board is electrified to work, an internal electronic element generates heat, the heat is transmitted to the heat conduction plate through the first flexible heat conduction pad, the heat conduction plate quickly transmits the heat to the radiating block through the heat conduction rod, then the radiating fan is started to be matched with the radiating convex block, the contact area between the radiating block and air is increased, the flow rate is accelerated, the radiating efficiency of the radiating block is higher, meanwhile, the heat at the bottom of the circuit board is transmitted to the heat conduction copper tube through the second flexible heat conduction pad and is finally transmitted to the radiating block, thereby completing double-sided heat radiation and accelerating the radiating efficiency, and the device has good radiating effect, but advantages such as bilateral heat dissipation have solved present circuit board and have integrated the degree more and more high, lead to also increasing thereupon to heat abstractor's requirement, and present heat abstractor structure is too simple, and the radiating efficiency is low to can only unilateral heat dissipation, can't satisfy the problem of the heat dissipation demand of present circuit board.
2. This a heat abstractor for low-voltage cabinet circuit board is aluminium to metal block through heat-conducting plate and radiating block, makes its heat-conduction efficiency higher for the radiating efficiency of device is better.
3. This a heat abstractor for low-voltage cabinet circuit board is the arc through the front view cross-section of the left and right sides of heat conduction copper pipe, when fixing the circuit board, curved heat conduction copper pipe can possess certain elasticity for the device is convenient for install the circuit board, and fixes spacingly to the fixed block through two nuts are convenient.
4. This a heat abstractor for low-voltage cabinet circuit board can carry out certain support to the fixed block through the spring, prevents that the heat-conducting plate from causing the damage to the too big pressure of circuit board.
5. This a heat abstractor for low-voltage cabinet circuit board is through two otic placodes that have the mounting hole for the device is easy to assemble.
6. This a heat abstractor for low-voltage cabinet circuit board can make radiator fan when operation through the through-hole, and the inside air of device can circulate to make the radiating effect of device better.
7. This a heat abstractor for low-voltage cabinet circuit board has further increased the whole area of contact with the air of radiating block through the radiating groove for the radiating efficiency of device is higher.
8. This a heat abstractor for low-voltage cabinet circuit board, the material through first flexible heat conduction pad and second flexible heat conduction pad is the silica rubber pad, makes it possess when good heat conductivity, also possesses better elasticity to the protection circuit board surface does not receive the damage.
Drawings
FIG. 1 is a schematic sectional view of the structure of the present invention;
FIG. 2 is a schematic top view of the heat dissipation block of the present invention;
FIG. 3 is a front perspective view of the present invention;
fig. 4 is a front perspective view of the heat dissipation bump structure of the present invention.
In the figure: 1. a base plate; 2. a groove; 3. fixing the rod; 31. a spring; 32. a nut; 4. a heat conducting plate; 5. a first flexible thermal pad; 6. a second flexible thermally conductive pad; 7. a heat conducting rod; 8. a heat dissipating block; 81. a through hole; 9. a heat dissipating bump; 91. a heat sink; 10. a heat radiation fan; 11. a heat conducting copper pipe; 12. a fixed block; 13. an ear plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a heat dissipation device for a circuit board of a low voltage cabinet comprises a bottom plate 1, two grooves 2 are formed at the top of the bottom plate 1, fixing rods 3 are fixedly connected to the bottoms of the inner sides of the two grooves 2, fixing blocks 12 are respectively connected to the outer sides of the two fixing rods 3 in a sliding manner, a heat conduction plate 4 is fixedly connected between the two fixing blocks 12, a first flexible heat conduction pad 5 is fixedly connected to the bottom of the heat conduction plate 4, a second flexible heat conduction pad 6 is fixedly connected to the top of the bottom plate 1, two heat conduction rods 7 are fixedly connected to the top of the heat conduction plate 4, a heat dissipation block 8 is fixedly installed at the top between the two heat conduction rods 7, heat dissipation lugs 9 are uniformly distributed at the top of the heat dissipation block 8, a heat dissipation fan 10 is fixedly connected to the top of the heat dissipation block 8, and heat conduction copper tubes 11 are fixedly connected to the left sides of the heat dissipation block 8, the other end of the heat conduction copper pipe 11 penetrates through and is fixedly connected to the inside of the bottom plate 1, the other end of the heat conduction copper pipe 11 extends to the top of the bottom plate 1, the other end of the heat conduction copper pipe 11 is fixedly connected to the left side of the radiating block 8, the outer sides of the two heat conduction copper pipes 11 are in contact with the bottom of the second flexible heat conduction pad 6, two grooves 2 are formed in the top of the bottom plate 1, the bottoms of the inner sides of the two grooves 2 are fixedly connected to the tops of the two fixing rods 3 respectively, the outer sides of the two fixing rods 3 are slidably connected to the insides of the two fixing blocks 12 respectively, the opposite sides of the two fixing blocks 12 are fixedly connected to the left side and the right side of the heat conduction plate 4 respectively, the bottom of the heat conduction plate 4 is fixedly connected to the first flexible heat conduction pad 5, the top of the bottom plate 1 is fixedly connected to the second flexible heat conduction pad 6, and the top of the heat conduction plate 4 is fixedly connected to the bottoms of the two heat conduction rods 7, the top between the two heat conducting rods 7 is fixedly provided with a heat radiating block 8, the top of the heat radiating block 8 is fixedly connected to the bottom of a heat radiating bump 9, the top of the heat radiating block 8 is fixedly connected to the bottom of a heat radiating fan 10, the left side and the right side of the heat radiating block 8 are fixedly connected to the two ends of a heat conducting copper pipe 11, the outer side of the heat conducting copper pipe 11 is fixedly connected to the inside of the base plate 1, the outer side of the heat conducting copper pipe 11 is contacted with the bottom of a second flexible heat conducting pad 6, when the circuit board is used, a circuit board is firstly placed between the first flexible heat conducting pad 5 and the second flexible heat conducting pad 6, then the fixing block 12 is pressed downwards and fixed by rotating a nut 32, so that the first flexible heat conducting pad 5 presses the circuit board, when the circuit board is electrified and works, internal electronic elements generate heat, the heat is transferred to the heat conducting plate 4 through the first flexible heat conducting pad 5, the heat conducting plate 4 rapidly transfers the heat to the heat radiating block 8 through the heat conducting rods 7, then start radiator fan 10 cooperation heat dissipation lug 9, make the area of contact increase of radiating block 8 and air, the velocity of flow is accelerated, make the radiating efficiency of radiating block 8 higher, simultaneously through the flexible heat conduction pad 6 of second with the heat transfer of circuit board bottom to heat conduction copper pipe 11 on, and finally transmit to radiating block 8 on, thereby accomplish two-sided heat dissipation and accelerate radiating efficiency, thereby make the device possess the radiating effect good, advantages such as can bilateral heat dissipation, it is increasingly high to have solved present circuit board integration degree, lead to also increasing thereupon to heat abstractor's requirement, current heat abstractor structure is too simple, the radiating efficiency is low, and can only unilateral heat dissipation, can't satisfy the problem of the heat dissipation demand of present circuit board.
Further, the heat-conducting plate 4 is an aluminum metal plate, the radiating block 8 is an aluminum metal block, and the heat-conducting plate 4 and the radiating block 8 are made of aluminum to the metal block, so that the heat conduction efficiency is higher, and the radiating efficiency of the device is better.
Further, the front-view cross section of the left and right sides of the heat conduction copper pipe 11 is arc-shaped, two the equal threaded connection in outside of dead lever 3 has a nut 32, two the bottom of nut 32 contacts with the top of two fixed blocks 12 respectively, and the front-view cross section through the left and right sides of the heat conduction copper pipe 11 is arc-shaped, when fixing the circuit board, the arc-shaped heat conduction copper pipe 11 can have certain elasticity, so that the device is convenient for installing the circuit board, and the fixed blocks 12 are fixed and limited conveniently through two nuts 32.
Further, two the outside cover of dead lever 3 is equipped with spring 31, two the bottom of spring 31 is fixed connection respectively to the inboard bottom of two recesses 2, two the top of spring 31 is fixed connection respectively to the bottom of two fixed blocks 12, can carry out certain support to fixed block 12 through spring 31, prevents that heat-conducting plate 4 from causing the damage to the too big pressure of circuit board.
Further, the equal fixedly connected with otic placode 13 of the left and right sides of bottom plate 1, two the mounting hole has all been seted up to the inside of otic placode 13, through two otic placodes 13 that have the mounting hole for the device is easy to assemble.
Furthermore, through holes 81 are formed in the heat dissipation block 8 and are arranged equidistantly, and air in the heat dissipation fan 10 can circulate when the heat dissipation fan operates through the through holes 81, so that the heat dissipation effect of the heat dissipation fan is better.
Furthermore, the heat dissipation groove 91 is formed in the outer side of the heat dissipation bump 9, and the contact area between the whole heat dissipation block 8 and the air is further increased through the heat dissipation groove 91, so that the heat dissipation efficiency of the device is higher.
Furthermore, the first flexible heat conduction pad 5 and the second flexible heat conduction pad 6 are made of silicone rubber pads, and the first flexible heat conduction pad 5 and the second flexible heat conduction pad 6 are made of silicone rubber pads, so that the circuit board has good heat conductivity and good elasticity, and the surface of the circuit board is protected from being damaged.
The utility model discloses the model of radiator fan 10 that uses can be G1238, and it is provided with the control switch rather than supporting, and control switch's mounted position can select according to the in-service use needs.
The working principle is as follows: when the heat dissipation device for the circuit board of the low-voltage cabinet is used, firstly, the circuit board is placed between the first flexible heat conduction pad 5 and the second flexible heat conduction pad 6, then the fixed block 12 is pressed downwards and fixed by rotating the nut 32, so that the first flexible heat conduction pad 5 presses the circuit board, when the circuit board is electrified to work, an internal electronic element generates heat, the heat is transferred to the heat conduction plate 4 through the first flexible heat conduction pad 5, the heat is rapidly transferred to the heat dissipation block 8 through the heat conduction rod 7 by the heat conduction plate 4, then the heat dissipation fan 10 is started to be matched with the heat dissipation lug 9, so that the contact area between the heat dissipation block 8 and air is increased, the flow speed is accelerated, the heat dissipation efficiency of the heat dissipation block 8 is higher, meanwhile, the heat at the bottom of the circuit board is transferred to the heat conduction copper pipe 11 through the second flexible heat conduction pad 6 and is finally transferred to the heat dissipation block 8, and the heat dissipation efficiency is accelerated by double-sided heat dissipation, thereby make the device possess the radiating effect good, but advantages such as bilateral heat dissipation have solved present circuit board and have integrated the degree more and more high, lead to also increasing thereupon to heat abstractor's requirement, present heat abstractor structure is too simple, and the radiating efficiency is low to can only unilateral heat dissipation, can't satisfy the problem of the heat dissipation demand of present circuit board.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a heat abstractor for low-voltage cabinet circuit board, includes bottom plate (1), its characterized in that: the heat dissipation structure is characterized in that two grooves (2) are formed in the top of the bottom plate (1), fixing rods (3) are fixedly connected to the bottoms of the inner sides of the two grooves (2), fixing blocks (12) are connected to the outer sides of the two fixing rods (3) in a sliding mode, a heat conduction plate (4) is fixedly connected between the two fixing blocks (12), a first flexible heat conduction pad (5) is fixedly connected to the bottom of the heat conduction plate (4), a second flexible heat conduction pad (6) is fixedly connected to the top of the bottom plate (1), two heat conduction rods (7) are fixedly connected to the top of the heat conduction plate (4), a heat dissipation block (8) is fixedly mounted at the top between the two heat conduction rods (7), heat dissipation lugs (9) which are uniformly distributed are fixedly connected to the top of the heat dissipation block (8), a heat dissipation fan (10) is fixedly connected to the top of the heat dissipation block (8), and heat conduction copper pipes (11) are fixedly connected to the left sides of the heat dissipation block (8), the other end of heat conduction copper pipe (11) all runs through respectively and fixed connection to the inside of bottom plate (1), the other end of heat conduction copper pipe (11) extends to the top of bottom plate (1), the other end fixed connection of heat conduction copper pipe (11) is to the left side of radiating block (8), two the outside of heat conduction copper pipe (11) contacts with the bottom of the flexible heat conduction pad of second (6).
2. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: the heat conducting plate (4) is an aluminum metal plate, and the radiating block (8) is an aluminum metal block.
3. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: the front view cross-section of the left side and the right side of the heat conduction copper pipe (11) is arc-shaped, the outer sides of the two fixing rods (3) are in threaded connection with nuts (32), and the bottoms of the two nuts (32) are respectively in contact with the tops of the two fixing blocks (12).
4. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: the outer side of the two fixing rods (3) is sleeved with a spring (31), the bottom ends of the springs (31) are fixedly connected to the inner bottoms of the two grooves (2) respectively, and the top ends of the springs (31) are fixedly connected to the bottoms of the two fixing blocks (12) respectively.
5. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: the equal fixedly connected with otic placode (13) of the left and right sides of bottom plate (1), two the mounting hole has all been seted up to the inside of otic placode (13).
6. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: through holes (81) are formed in the heat dissipation block (8) and are arranged equidistantly.
7. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: and the outer side of the heat dissipation lug (9) is provided with a heat dissipation groove (91).
8. The heat dissipation device for the circuit board of the low-voltage cabinet according to claim 1, wherein: the first flexible heat conducting pad (5) and the second flexible heat conducting pad (6) are made of silicone rubber pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120135791.4U CN214155222U (en) | 2021-01-19 | 2021-01-19 | Heat dissipation device for low-voltage cabinet circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120135791.4U CN214155222U (en) | 2021-01-19 | 2021-01-19 | Heat dissipation device for low-voltage cabinet circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN214155222U true CN214155222U (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120135791.4U Active CN214155222U (en) | 2021-01-19 | 2021-01-19 | Heat dissipation device for low-voltage cabinet circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114190018A (en) * | 2021-11-25 | 2022-03-15 | 深圳市中芯微实业有限公司 | Integrated circuit chip with self-protection structure |
-
2021
- 2021-01-19 CN CN202120135791.4U patent/CN214155222U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114190018A (en) * | 2021-11-25 | 2022-03-15 | 深圳市中芯微实业有限公司 | Integrated circuit chip with self-protection structure |
| CN114190018B (en) * | 2021-11-25 | 2024-04-30 | 深圳市中芯微实业有限公司 | Integrated circuit chip with self-protection structure |
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