CN101039565A

CN101039565A - Heat abstractor

Info

Publication number: CN101039565A
Application number: CN 200610034544
Authority: CN
Inventors: 杨平安; 周世文; 陈俊吉
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-03-17
Filing date: 2006-03-17
Publication date: 2007-09-19

Abstract

A cooling device includes a substrate, a radiator set up on the substrate, and a heat pipe buried in the substrate. The said heat pipe is mainly of S-shaped, including three parallel spacing placed straight sections and a bending section connecting the three straight sections together, and the said two S-shaped heat pipes are buried parallelly in the same direction in the substrate. These heat pipes bend continuously, apparently having a longer length than the common linear-shaped or U-shaped heat pipes, buried in the same area of the substrate, so it has a much more bigger contact area with the substrate. In addition, the straight sections of these heat pipes are uniformly disposed on a direction perpendicular to the extending direction of the cooling fins in the substrate, which will allow the intensive heat on the contact position of the substrate and the electronic components to uniformly distribute throughout the whole substrate, so that the cooling efficiency of the cooling device is maximized.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that is used to distribute the heat that electronic component produces especially.

[background technology]

Along with the continuous development of electronic technology, such as the speed of service of electronic components such as central processing unit and overall performance in continuous lifting.Yet its caloric value also increases thereupon on the one hand, and its volume is more and more littler on the other hand, and it is also just more concentrated to generate heat, and makes the simple heat abstractor of metal solid heat transfer that uses can't satisfy its radiating requirements.

For this reason, industry begins to use in heat abstractor heat pipe to come heat conduction.Heat pipe commonly used mainly by the vacuum tubular shell of sealing, be arranged on the capillary structure (as powder sintered thing, groove structure, screen net structure etc.) on the inner walls and the housing of packing in an amount of hydraulic fluid (as water, alcohol, fluorine Lyons, acetone etc.) form.Heat pipe is after being subjected to the thermal evaporation heat absorption by the hydraulic fluid evaporation part, be transferred to the condensation part and carry out the condensation heat release, by capillary structure condensed liquid hydraulic fluid being sucked the evaporation part again circulates, to reach the heat transfer purpose, it has advantages such as heat transfer is fast, heat transfer distances is long, thereby is used widely.

China's utility model patent has disclosed a kind of heat abstractor that has heat pipe No. 02248248.2, and it comprises several heat pipes that folder is established between a heat transfer plate that contacts with thermal source, the radiating fin of being located at the some equidistant arrangements on the heat transfer plate and heat transfer plate and the radiating fin.This heat transfer plate end face central region and parallel several the relative tanks that is provided with of above-mentioned some radiating fins with the heat transfer plate junction, and tank common combination that should correspondence forms a through hole, plugs above-mentioned heat pipe in this through hole.Because Heat Transfer of Heat Pipe on Heat Pipe speed is very fast, can very fast being diffused on the heat transfer plate with the heat of thermal source, and then promote radiating efficiency to improve.But the heat pipe of this heat abstractor substantially all concentrates on the central region of heat transfer plate, and heat pipe configuration direction is single and little with bottom surface and radiator contact area, so fail heat fully is spread in whole heat transfer plate, makes that the radiating efficiency of this heat abstractor is not high.

[summary of the invention]

The present invention aims to provide a kind of heat abstractor with higher radiating efficiency.

The technical solution used in the present invention is as follows:

A kind of heat abstractor comprises that a substrate and is arranged at the radiator on the substrate, is embedded with two S shape heat pipes on the described substrate cocurrent and parallel.

This technical scheme compared with prior art has following advantage: this heat abstractor is buried two S shape heat pipes underground at substrate, these heat pipes bend continuously, the length that heat pipes such as linear obviously commonly used or U-shaped are embedded in it on the substrate of same area is longer, so the contact area of itself and substrate is also bigger.

A kind of heat abstractor comprises a substrate, is arranged at the radiator on the substrate and is embedded in heat pipe on the described substrate that described heat pipe is S-shaped substantially, and it comprises flat segments that three parallel interval are arranged and two bending sections that this three flat segments is linked together.

This technical scheme compared with prior art has following advantage: the radiating fin of above-mentioned radiator can be arranged on the substrate perpendicular to heat pipe three mutual parallel flat segments, thereby the heat that substrate and electronic component contact position is intensive is evenly distributed on the whole base plate, makes the radiating efficiency maximization of heat abstractor.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of the heat abstractor in a preferred embodiment of the invention.

Fig. 2 is the three-dimensional combination figure of heat abstractor shown in Figure 1.

[embodiment]

Fig. 1 and Fig. 2 show the heat abstractor in a preferred embodiment of the invention, this heat abstractor is used to distribute the heat that heat-generating electronic elements such as central processing unit (figure does not show) produce, and it comprises that mainly a substrate 10, two is embedded in the radiator 30 that heat pipe 20 and in this substrate 10 is installed in substrate 10 end faces.

This substrate 10 adopts the good materials of heat conductivility such as copper, aluminium to make, and it is roughly rectangular.The bottom surface of substrate 10 is used for and the heat-generating electronic elements thermo-contact, and to absorb the heat that heat-generating electronic elements produces, end face offers two grooves 12 that cooperate with above-mentioned heat pipe 20, and this two groove 12 is all roughly S-shaped, and cocurrent and parallel is arranged.

Each groove 12 includes one first straight straight flute section 122, one second straight flute section 123, one the 3rd straight flute section 124 and the crooked one first bent ditch section 126 and the second bent ditch section 128.First and second crooked ditch section 126,128 is extended at these first straight flute section, 122 two ends oppositely bending, and this first and second crooked ditch section 126,128 free ends oppositely bend respectively and extend to form second and third straight flute section 123,124, thereby form generally'S '-shaped groove 12.This first, second and third straight flute section 122,123,124 is parallel with substrate 10 1 lateral margins, and second and third straight flute section 123,124 is positioned at the first straight flute section, 122 both sides, and the distance of the first straight flute section, 122 to second straight flute sections 123 is greater than the distance to the 3rd straight flute section 124.The second bent ditch section 128 of this groove 12 is positioned at the first crooked ditch section, 126 inboards of another groove 12, thereby forms this two grooves, 12 cocurrent and parallels configuration.

This heat pipe 20 bends to roughly S-shaped, with being embedded in the above-mentioned groove 12 in the substrate 10 that groove 12 shapes are complementary, this heat pipe 20 comprises one first flat segments 22 that parallel interval is arranged, one second flat segments 23, one the 3rd flat segments 24 and with this first flat segments 22, second flat segments 23, one first bending section 26 that the 3rd flat segments 24 links together and one second bending section 28, the first ditch section 122 of groove 12 on these first flat segments, 22 counterpart substrates 10 wherein, this is second years old, three flat segments 23, second of 24 respective grooves 12, three straight flute sections 123,124, this is first years old, two bending sections 26, first of 28 difference respective grooves 12, two bent ditch sections 126,128, and the distance of these first flat segments, 22 to second flat segments 23 is greater than the distance of first flat segments, 22 to the 3rd flat segments 24.Its end face was roughly concordant with substrate 10 surfaces when this heat pipe 20 was arranged in the groove 12.

This radiator 30 is arranged in parallel at a certain distance by some radiating fins 32 and is combined to form, these radiating fins 32 extend perpendicular to first, second and third

flat segments

22,23,24 that is embedded in the substrate 10, and the relative up and down two edges of each radiating fin 32 bend in the same way and are extended with flanging, and all flangings of radiating fin 32 form and the upper surface of substrate 10 and the planes that contact with the exposed surface of heat pipe 20.

From said structure as can be known, this heat abstractor is buried two S shape heat pipes 20 underground at substrate 10, these heat pipes 20 bend continuously, and the length that heat pipes such as linear obviously commonly used or U-shaped are embedded in it on the substrate of same area is longer, so the contact area of itself and substrate is also bigger.In addition, first, second and third

flat segments

22,23,24 of these heat pipes 20 evenly is embedded on the substrate 10 perpendicular to the direction that radiating fin 32 extends, thereby the heat that substrate 10 and electronic component contact position is intensive is evenly distributed on the whole base plate 10, makes the radiating efficiency maximization of heat abstractor.

Claims

1. a heat abstractor comprises that a substrate and is arranged at the radiator on the substrate, is characterized in that: be embedded with two S shape heat pipes on the described substrate cocurrent and parallel.

2. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe comprises two bending sections that flat segments that three parallel interval are arranged and two links together this three flat segments.

3. heat abstractor as claimed in claim 2 is characterized in that: the top of described substrate is concaved with the groove that cooperates with described heat pipe.

4. heat abstractor as claimed in claim 3 is characterized in that: described heat pipe flat segments is arranged on the substrate parallel with substrate one lateral margin, and the neutral straight section to the distance of a flat segments greater than distance to another flat segments.

5. heat abstractor as claimed in claim 4 is characterized in that: the direction that described heat pipe flat segments is extended perpendicular to radiating fin.

6. heat abstractor as claimed in claim 5 is characterized in that: the bending section of a described heat pipe is positioned at the bending section inboard of another heat pipe.

7. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe end face flushes with substrate top surface, and described radiator is to contact with the heat pipe end face by its bottom surface.

8. heat abstractor as claimed in claim 1 is characterized in that: described radiator comprises the radiating fin that some equidistant parallels are arranged.

9. heat abstractor, comprise a substrate, be arranged at the radiator on the substrate and be embedded in heat pipe on the described substrate, it is characterized in that: described heat pipe is S-shaped substantially, and it comprises flat segments that three parallel interval are arranged and two bending sections that this three flat segments is linked together.

10. heat abstractor as claimed in claim 9 is characterized in that: the top of described substrate is concaved with the groove that cooperates with described heat pipe.

11. heat abstractor as claimed in claim 10 is characterized in that: be embedded with two S shape heat pipes in the described substrate cocurrent and parallel.

12. heat abstractor as claimed in claim 11 is characterized in that: described heat pipe flat segments is arranged on the substrate parallel with substrate one lateral margin, and the neutral straight section to the distance of a flat segments greater than distance to another flat segments.

13. heat abstractor as claimed in claim 12 is characterized in that: the direction that described heat pipe flat segments is extended perpendicular to radiating fin.

14. heat abstractor as claimed in claim 13 is characterized in that: the bending section of a described heat pipe is positioned at the bend inboard of another heat pipe.

15. heat abstractor as claimed in claim 9 is characterized in that: described heat pipe end face flushes with the substrate top, and described radiator is to contact with the heat pipe end face by its bottom surface.

16. heat abstractor as claimed in claim 9 is characterized in that: described radiator comprises the radiating fin that some equidistant parallels are arranged.