CN103687450A - Circuit board heat conduction optimization design structure for onboard aviation product - Google Patents
Circuit board heat conduction optimization design structure for onboard aviation product Download PDFInfo
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- CN103687450A CN103687450A CN201310683766.XA CN201310683766A CN103687450A CN 103687450 A CN103687450 A CN 103687450A CN 201310683766 A CN201310683766 A CN 201310683766A CN 103687450 A CN103687450 A CN 103687450A
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Abstract
The invention provides a circuit board heat conduction optimization design structure for an onboard aviation product. A heat-conductive board is arranged between a high-power highly-heat-radiating device and a PCB. The heat-conductive board is directly and additionally arranged on the PCB, so that the heat dissipation area is greatly increased; meanwhile, a soft silica gel heat-conductive fin is additionally arranged between the high-power highly-heat-radiating device and a heat-conductive aluminum plate so that an air gap can be eliminated, thermal contact resistance between the device and the heat-conductive aluminum plate can be reduced, and heat generated by the device can be rapidly conducted to the heat-conductive aluminum plate. A T-shaped structure of a heat-conductive and radiation heat exchange face is additionally arranged at the top of the heat-conductive aluminum plate. After the soft silica gel heat-conductive fin is additionally arranged on the upper end face of the T-shaped structure, the T-shaped structure is connected with a box body sealing cover into a whole, so that heat is effectively conducted to the surface of a box body, and the heat dissipation area is increased. A wedge-shaped pressing mechanism is adopted, so that the contact area between the heat-conductive aluminum plate and the box body is increased, heat conduction is effectively achieved, the temperature of the surface of an electronic device is rapidly lowered, and the service life of the product is prolonged.
Description
Technical field
The invention belongs to aeronautical product thermal design technical field, be specifically related to a kind of heat of the wiring board for airborne aeronautical product conduction optimal design structure.
Background technology
Along with the development of electronic product and the continuous enhancing of each subsystem integrated level, system power dissipation constantly increases, and box volume constantly reduces, and causes wiring board device heating to continue to increase, directly affect the usefulness of device, thereby cause the reduction of life of product, reliability.In addition, because airborne aeronautical product hot environment temperature General Requirements is at 70 ℃, and product casing internal temperature is far away higher than ambient temperature, and along with the accumulation of operating time constantly increases temperature, if can not fast product casing internal temperature be shed, will directly affect function and the performance of product.Current existing large power supply wiring board heat radiation mainly realizes in the following manner: the one, and nature cooling means, realizes the independent role of free convection and radiation heat transfer or the combination of two or more heat exchange forms is carried out cooling by blowing; The 2nd, direct liquid cooling method, electronic component is immersed in not to be affected in the liquid of system electrical operation, by conduction and convection, heat is directly passed to liquid, be applicable to electronic devices and components or parts that volumetric power density is higher, be also applicable to those and must under high ambient conditions, work and components and parts and the temperature gradient that is cooled between surface very little parts again; The 3rd, evaporating and cooling method, the heat that electronic component dissipates produces liquid boiling steam and emits heat, is applicable to components and parts or parts that volumetric power density is very high; The 4th, thermoelectric cooling method, the variation of potential energy while crossing semiconductor node by carrier flow and the energy that causes transmits, is applicable to not need exterior power and produces the Refrigeration Technique of negative thermal resistance; The 5th, hot pipe technique, owing to having adopted phase-change heat transfer, is therefore the heat-transfer device that a kind of heat transfer efficiency is very high, and when heat pipe is used, key is the thermal resistance reducing on the contact interface of two ends.Current airborne aeronautical product constantly requires miniaturization, lightweight, anti-high and low-temp, wet-heat resisting and high strength, this has just determined that cabinet is necessary for sealed machine box, the realizability of cooling, the direct liquid cools of natural wind, evaporating and cooling method, thermoelectric cooling method and hot pipe technique cooling means is poor maybe can not meet heat radiation needs, is therefore necessary to improve.
Summary of the invention
The technical problem that the present invention solves: a kind of heat of the wiring board for airborne aeronautical product conduction optimal design structure is provided, object is to reduce high heater members surface temperature, thereby reduce box house ambient temperature, improve Product environment adaptability, extend life of product.
The technical solution used in the present invention: the wiring board heat conduction optimal design structure for airborne aeronautical product is provided with heat-conducting plate between high-power high heater members and pcb board.
Wherein, described heat-conducting plate consists of insulating barrier, aluminum heat conducting plate and wedge shape hold-down mechanism, described aluminum heat conducting plate is arranged on pcb board upper end and is provided with the insulating barrier of isolation pcb board and aluminum heat conducting plate between the two, on described aluminum heat conducting plate, according to pcb board pad locations, reserve the circular hole that high-power high heater members is installed, the pin of described high-power high heater members is arranged on pcb board by circular hole, and described wedge shape hold-down mechanism is set directly at upper surface, aluminum heat conducting plate both sides to be played and casing locking and conduction of heat.
Further, between described high-power high heater members and aluminum heat conducting plate, be also provided with and can increase heat conducting soft silica gel conducting strip.
Wherein, described wedge shape hold-down mechanism by screw rod, upper wedge shape part, in wedge shape part and lower wedge shape part form, between described upper wedge shape part and lower wedge shape part, form vee, described middle wedge shape part is inverted triangle and includes in vee, and screw rod screws and is integrated with the lower wedge shape part that is fixed on aluminum heat conducting plate upper surface through upper wedge shape part, middle wedge shape part.
Further, the top of described aluminum heat conducting plate is T-shaped structure, and the upper surface of T-shaped structure installs additional after soft silica gel conducting strip and connects as one with box sealing lid.
Further, the position that described aluminum heat conducting plate upper surface does not arrange high-power high heater members is shaped with a plurality of " work " type radiator.
The present invention's advantage compared with prior art:
1, the present invention directly increases a heat-conducting plate on pcb board, has greatly increased area of dissipation, is a kind of heat dissipating method of mixing heat-exchange;
2, in the middle of high-power high heater members of the present invention and aluminum heat conducting plate, add soft silica gel conducting strip, to eliminate air gap, further reduce the contact heat resistance between device and aluminum heat conducting plate, the heat that device is produced passes to rapidly on aluminum heat conducting plate;
3, the present invention increases the T shape structure of a heat conduction and radiation heat transfer face at aluminum heat conducting plate top, and the upper surface of T-shaped structure connects as one with box sealing lid after installing soft silica gel conducting strip additional, effectively conduct heat to tank surface, increased area of dissipation;
4, the present invention tightens up and has carried out improving design the installation of pcb board, for making aluminum heat conducting plate and cabinet wall close contact, junction between aluminum heat conducting plate and cabinet wall is optimized, and adopt wedge shape hold-down mechanism, increase the contact area of aluminum heat conducting plate and casing, effectively realized hot conduction;
5, by using FLOTHERM heat to analyze simulation software, under 85 ℃ of conditions of box house high temperature, the heat conduction conduction device of optimal design is carried out to simulation analysis, utilize Finite Volume Method for Air to carry out fluid calculation, can obtain temperature field cloud charts, high-power high heater members surface temperature is the highest is no more than 87 ℃;
6, the design of aluminum heat conducting plate and optimization are controlled and are had reasonable improvement temperature rise, have improved the reliability of electronic equipment;
7, " work " type radiator designing on aluminum heat conducting plate, is conducive to thermal radiation, fast reducing electronic device surface temperature;
8, with respect to not installing aluminum heat conducting plate additional, not installing soft silica gel conducting strip or the inadequate heat exchange pattern of heat transfer area additional between aluminum heat conducting plate and high-power high heater members, greatly improve device ambient temperature, improved the useful life of electronic device.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is end view of the present invention;
Fig. 3 is aluminum heat conducting plate structural representation of the present invention;
Fig. 4 is that wedge shape of the present invention compresses mechanism structure schematic diagram;
Fig. 5 is wedge shape hold-down mechanism of the present invention structural representation while contacting with casing.
Embodiment
Below in conjunction with accompanying drawing 1-5, a kind of embodiment of the present invention is described.
Wiring board heat conduction optimal design structure for airborne aeronautical product is provided with heat-conducting plate 3 between high-power high heater members 1 and pcb board 2.Described heat-conducting plate 3 consists of insulating barrier 4, aluminum heat conducting plate 5 and wedge shape hold-down mechanism 7, concrete, described wedge shape hold-down mechanism 7 by screw rod 12, upper wedge shape part 13, in wedge shape part 14 and lower wedge shape part 15 form, between described upper wedge shape part 13 and lower wedge shape part 15, form vee, described middle wedge shape part 14 is inverted triangle and includes in vee, and screw rod 12 screws and is integrated with the lower wedge shape part 15 that is fixed on aluminum heat conducting plate 5 upper surfaces through upper wedge shape part 13, middle wedge shape part 14.Described aluminum heat conducting plate 5 is arranged on pcb board 2 upper ends and is provided with the insulating barrier 4 of conductivity between isolation pcb board 2 and aluminum heat conducting plate 5 between the two, on described aluminum heat conducting plate 5, according to pcb board 2 pad locations, reserve the circular hole 8 that high-power high heater members 1 is installed, the pin of described high-power high heater members 1 is arranged on pcb board 2 by circular hole 8, and described wedge shape hold-down mechanism 7 is set directly at aluminum heat conducting plate 5 upper surfaces, both sides to be played and casing 9 locking and conduction of heat.Between described high-power high heater members 1 and aluminum heat conducting plate 5, be also provided with and can increase heat conducting soft silica gel conducting strip 6.The top 10 of described aluminum heat conducting plate 5 is T-shaped structure, and the upper surface 11 of T-shaped structure installs rear same casing 9 seal covers of soft silica gel conducting strip 6 additional and connects as one.The position that described aluminum heat conducting plate 5 upper surfaces do not arrange high-power high heater members 1 is shaped with a plurality of " work " type radiator.
Lower mask body is done to elaborate to each parts: in order to improve, the realizability of cooling, the direct liquid cools of current natural wind, evaporating and cooling method, thermoelectric cooling method and hot pipe technique cooling means is poor maybe can not meet this situation of heat radiation needs, has proposed to add the method for heat-conducting plate 3 in the middle of high-power high heater members 1 and pcb board 2.
One, the composition of heat-conducting plate 3 and installation
Heat-conducting plate 3 is mainly comprised of insulating barrier 4, aluminum heat conducting plate 5 and wedge shape hold-down mechanism 7 three parts, and insulating barrier 4, for isolating pcb board 2 with the conductivity between aluminum heat conducting plate 5, is installed between aluminum heat conducting plate 5 and pcb board 2.Aluminum heat conducting plate 5 is mainly used in the heat of the high heater members 1 of conduction and high power, aluminum heat conducting plate 5 is direct and insulating barrier 4 laminatings simultaneously, and according to pcb board 2 pad locations, reserve the circular hole 8 of installing device, device pin is installed on pcb board 2 by this circular hole 8, between high-power high heater members 1 and aluminum heat conducting plate 5, add soft silica gel conducting strip 6, increase heat conduction; Wedge shape hold-down mechanism 7 is directly installed on aluminum heat conducting plate 5 both sides, plays and casing locking and conduction of heat.The top 10 of aluminum heat conducting plate 5 is T-shaped structure, and the upper surface 11 of T-shaped structure installs rear same casing 9 seal covers of soft silica gel conducting strip 6 additional and connects as one, and has increased area of dissipation.
Two, aluminum heat conducting plate 5 designs
Aluminium is the typical material for radiator or heat diffuser, because it has high heat conductance, and light weight and the feature that is easy to processing, the aluminum heat conducting plate 5 designing in the technical program adopts aluminums; For guaranteeing good pyroconductivity, aluminum heat conducting plate 5 is optimized to design.Aluminum heat conducting plate 5 tops are with box cover close contact, expanded area of dissipation, on aluminum heat conducting plate 5, do not have the vacant place of high-power high heater members 1 to make " work " type radiator, strengthened thermal radiation, by emulation can determine that the rib of " work " type radiator is high, rib is long, rib is thick, fin number, fin shape, thereby it is minimum to reach the thermal resistance of heat conduction, heat radiation.
Three, the mounting design of aluminum heat conducting plate 5 and high-power high heater members 1
Aluminum heat conducting plate 5 is mainly used in the heat of the high heater members 1 of conduction and high power, aluminum heat conducting plate 5 is direct and insulating barrier 4 laminatings simultaneously, high-power high heater members 1 pin is through aluminum heat conducting plate 5 and pcb board 2 welding, between aluminum heat conducting plate 5 and high-power high heater members 1, fill soft silica gel conducting strip 6, this soft silica gel conducting strip 6 can be filled any irregular space at linkage interface place, and the thermal resistance that can effectively reduce interface, the parameters such as the thickness of soft silica gel conducting strip 6, hardness, thermal conductivity coefficient can be selected as required.
Four, the structure of wedge shape hold-down mechanism 7 and installation
The effect that installation tightens up is also considered in the design of aluminum heat conducting plate 5, and the installation between aluminum heat conducting plate 5 and casing 9 tightens up by wedge shape hold-down mechanism 7, has not only played fixing and locking effect, has also played conduction of heat simultaneously.Wedge shape hold-down mechanism 7 by screw rod 12, upper wedge shape part 13, in wedge shape part 14 and lower wedge shape part 15 form, between upper wedge shape part 13 and lower wedge shape part 15, form vee, middle wedge shape part 14 is inverted triangle and includes in vee, and screw rod 12 screws and is integrated with the lower wedge shape part 15 that is fixed on aluminum heat conducting plate 5 upper surfaces through upper wedge shape part 13, middle wedge shape part 14.By rotating screw bolt 12, make 13 extruding downwards of upper wedge shape, thereby make to move and withstand cabinet wall on middle wedge shape part 14, realize two heat loss through conduction approach: heater element one heat-conducting plate/wedge shape hold-down mechanism one cabinet wall.
Practicality:
1, this structure is applicable to the heat conduction to the high-power high heater members 1 on wiring board;
2, the heat exchange pattern designing in this method is easy to realize, and has reduced pcb board 2 is carried out to heat conduction, thermal-radiating designing requirement;
3, use this structure with respect to using red copper template heat abstractor, saved cost, and aluminium sheet hardness is moderate, be easy to processing.
Above-described embodiment, is preferred embodiment of the present invention, is not used for limiting the scope of the present invention, and the equivalence of being done with content described in the claims in the present invention therefore all changes, within all should being included in the claims in the present invention scope.
Claims (6)
1. for the wiring board heat conduction optimal design structure of airborne aeronautical product, it is characterized in that: between high-power high heater members (1) and pcb board (2), be provided with heat-conducting plate (3).
2. the heat of the wiring board for airborne aeronautical product according to claim 1 is conducted optimal design structure, it is characterized in that: described heat-conducting plate (3) is by insulating barrier (4), aluminum heat conducting plate (5) and wedge shape hold-down mechanism (7) form, described aluminum heat conducting plate (5) is arranged on pcb board (2) upper end and is provided with the insulating barrier (4) of conductivity between isolation pcb board (2) and aluminum heat conducting plate (5) between the two, the upper circular hole (8) that high-power high heater members (1) is installed that reserves according to pcb board (2) pad locations of described aluminum heat conducting plate (5), the pin of described high-power high heater members (1) is arranged on pcb board (2) by circular hole (8), described wedge shape hold-down mechanism (7) is set directly at aluminum heat conducting plate (5) upper surface, both sides to be played and casing (9) locking and conduction of heat.
3. the heat of the wiring board for airborne aeronautical product conduction optimal design structure according to claim 2, is characterized in that: between described high-power high heater members (1) and aluminum heat conducting plate (5), be also provided with and can increase heat conducting soft silica gel conducting strip (6).
4. the heat of the wiring board for airborne aeronautical product according to claim 2 is conducted optimal design structure, it is characterized in that: described wedge shape hold-down mechanism (7) is by screw rod (12), upper wedge shape part (13), middle wedge shape part (14) and lower wedge shape part (15) form, between described upper wedge shape part (13) and lower wedge shape part (15), form vee, described middle wedge shape part (14) is inverted triangle and includes in vee, screw rod (12) is through upper wedge shape part (13), middle wedge shape part (14) screws and is integrated with the lower wedge shape part (15) that is fixed on aluminum heat conducting plate (5) upper surface.
5. according to the heat of the wiring board for the airborne aeronautical product conduction optimal design structure described in claim 1,2,3 or 4, it is characterized in that: the top (10) of described aluminum heat conducting plate (5) is T-shaped structure, and the upper surface of T-shaped structure (11) install same casing (9) seal cover after soft silica gel conducting strip (6) additional and connect as one.
6. according to the heat of the wiring board for the airborne aeronautical product conduction optimal design structure described in claim 2,3 or 4, it is characterized in that: the position that described aluminum heat conducting plate (5) upper surface does not arrange high-power high heater members (1) is shaped with a plurality of " work " type radiator.
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| CN201310683766.XA CN103687450B (en) | 2013-12-13 | 2013-12-13 | Wiring board heat transfer for aeronautical product optimizes module |
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| CN201310683766.XA CN103687450B (en) | 2013-12-13 | 2013-12-13 | Wiring board heat transfer for aeronautical product optimizes module |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270921A (en) * | 2014-09-26 | 2015-01-07 | 中国南方电网有限责任公司电网技术研究中心 | Miniaturization high-protection-level microprocessor protecting device |
| CN107949236A (en) * | 2017-10-27 | 2018-04-20 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
| CN108055812A (en) * | 2017-12-27 | 2018-05-18 | 陕西航空电气有限责任公司 | A kind of cooling system of on-board power device |
| CN109948290A (en) * | 2019-04-01 | 2019-06-28 | 山东浪潮云信息技术有限公司 | A kind of laboratory power supply optimizing thermal solution method based on Flotherm |
| CN111740298A (en) * | 2020-06-22 | 2020-10-02 | 中国科学院长春光学精密机械与物理研究所 | Aviation laser |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
| CN113301762A (en) * | 2020-05-22 | 2021-08-24 | 西安黄河机电有限公司 | Heat abstractor and phased array radar structure |
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| US7495915B2 (en) * | 2006-11-29 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation system |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270921A (en) * | 2014-09-26 | 2015-01-07 | 中国南方电网有限责任公司电网技术研究中心 | Miniaturization high-protection-level microprocessor protecting device |
| CN107949236A (en) * | 2017-10-27 | 2018-04-20 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
| CN108055812A (en) * | 2017-12-27 | 2018-05-18 | 陕西航空电气有限责任公司 | A kind of cooling system of on-board power device |
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| CN109948290A (en) * | 2019-04-01 | 2019-06-28 | 山东浪潮云信息技术有限公司 | A kind of laboratory power supply optimizing thermal solution method based on Flotherm |
| CN113301762A (en) * | 2020-05-22 | 2021-08-24 | 西安黄河机电有限公司 | Heat abstractor and phased array radar structure |
| CN113301762B (en) * | 2020-05-22 | 2023-02-28 | 西安黄河机电有限公司 | Heat abstractor and phased array radar structure |
| CN111740298A (en) * | 2020-06-22 | 2020-10-02 | 中国科学院长春光学精密机械与物理研究所 | Aviation laser |
| CN111740298B (en) * | 2020-06-22 | 2021-09-03 | 中国科学院长春光学精密机械与物理研究所 | Aviation laser |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN112492862B (en) * | 2021-01-05 | 2021-04-23 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
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