CN112492862B - High-power printed circuit board - Google Patents
High-power printed circuit board Download PDFInfo
- Publication number
- CN112492862B CN112492862B CN202110008449.2A CN202110008449A CN112492862B CN 112492862 B CN112492862 B CN 112492862B CN 202110008449 A CN202110008449 A CN 202110008449A CN 112492862 B CN112492862 B CN 112492862B
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- Prior art keywords
- heat dissipation
- cold plate
- area
- heat
- dissipation cold
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The invention discloses a high-power printed circuit board, which comprises a heat dissipation cold plate; the heat dissipation cold plate comprises heat dissipation cylindrical teeth, heat dissipation ribs and a heat pipe; the heat dissipation ribs are arranged on two sides of the heat dissipation cold plate; wherein, the heat dissipation ribs are horizontally arranged; the heat dissipation cylindrical teeth are arranged in the middle of the heat dissipation cold plate. The beneficial effects are as follows: the heat dissipation structure has multiple heat dissipation structures, ensures that the chip can be fully dissipated, and enables the circuit board to be maintained at the temperature of a normal use state, thereby avoiding the damage of the chip caused by the overlarge heat generated by the chip, effectively ensuring the normal work of the chip, ensuring the timely processing of signals, and effectively avoiding the delay of the signals.
Description
Technical Field
The invention relates to the technical field of military high-power-consumption circuit heat dissipation, in particular to a high-power printed circuit board.
Background
With the continuous development of chip technology, the method is applied to chips in high-density operations such as radar, communication, sonar, information countermeasure, image processing and recognition, CAE simulation and the like, the requirements on integration level, signal processing operation speed and accuracy are higher and higher, and more dense information processing chips are arranged on a corresponding processing board to accelerate the information processing speed.
The problem that the information processing chip on the mainboard generates a large amount of heat in the operation process, the temperature of the core of the chip reaches 100 degrees or even higher in a short time, so that the performance of the chip is reduced, the chip stops working (crashes), even the chip is burned out, so that the chip cannot work, information delay is caused, and unpredictable loss is caused.
Disclosure of Invention
The invention aims to solve the problem of high power consumption and high density of a printed circuit board, and provides a heat dissipation mode different from the past similar board cards, so as to solve the problem of heat dissipation of an SD9892 board card.
The invention is realized by the following technical scheme:
a high-power printed circuit board comprises a heat dissipation cold plate and an SD9892 board card;
the heat dissipation cold plate is used for dissipating heat of the SD9892 board card, and the SD9892 board card is divided into a middle heating area, a left heating area and a right heating area; the left heating area and the right heating area are respectively provided with two 17W power chips, and the middle heating area is provided with a 9W power chip, an 8W power chip and a 6W power chip;
the heat dissipation cold plate is divided into a middle area, a left area and a right area corresponding to the middle heating area, the left heating area and the right heating area, grooves matched with 17W chips are formed in the right area and the left area of the back of the heat dissipation cold plate respectively, grooves matched with the 9W chips, the 8W chips and the 6W chips are formed in the middle area of the back of the heat dissipation cold plate, and holes are formed in the heat dissipation cold plate;
the front surface of the heat dissipation cold plate is of a groove structure, and the front surface of the heat dissipation cold plate is provided with heat dissipation cylindrical teeth, heat dissipation ribs, a heat pipe, two air inlets and an air outlet; the heat dissipation cylindrical teeth are arranged in the middle area of the front face of the heat dissipation cold plate, the air outlet is arranged at the upper end of the middle area, and the heat pipe is embedded into the hole of the heat dissipation cold plate; all be provided with on the positive left side region of heat dissipation cold plate and the right side region heat dissipation rib, all be provided with on the positive left side region of heat dissipation cold plate and the regional lateral wall in right side the air intake.
Furthermore, the number of the heat dissipation cylindrical teeth is N, wherein N is more than or equal to 10, and the heat dissipation cylindrical teeth are uniformly arranged in the middle area of the front surface of the heat dissipation cold plate; the radius range of the heat dissipation cylindrical teeth is 1 mm-5 mm.
Further, the heat dissipation ribs are horizontally arranged in the right area and the left area of the front face of the heat dissipation cold plate; wherein, the heat dissipation rib is bar structure, and the segmentation design.
Further, the heat pipe is arranged right above the SD9892 board card chip, and the heat pipe is perpendicular to the heat dissipation ribs; wherein the heat pipe is filled with heat-conducting liquid.
Furthermore, an air duct sealing gasket is arranged on the air inlet.
Further, the device also comprises a cover plate;
the front surface of the heat dissipation cold plate is matched with the cover plate.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the high-power printed circuit board has various heat dissipation structures, so that the chip can be sufficiently dissipated, the temperature of the SD9892 board card can be always maintained at the temperature in a normal use state, the damage of the chip caused by excessive heat generated by the chip is avoided, the normal work of the chip is effectively ensured, the working time of the chip is ensured, the working efficiency of the chip is greatly improved, and the cost is effectively reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic of the present invention;
FIG. 2 is a schematic structural diagram of the cover plate of the present invention;
FIG. 3 is a schematic view of a heat sink plate according to the present invention;
FIG. 4 is a schematic diagram of the SD9892 board chip power structure of the present invention;
FIG. 5 is a cross-sectional view of the present invention shown in FIGS. 1B-B.
Reference numbers and corresponding part names in the drawings:
1-heat dissipation cold plate; 11-heat dissipation cylindrical teeth; 12-heat dissipation ribs; 13-a heat pipe; 14-air inlet; 15-air outlet; 16-duct gasket;
2-cover plate;
3-SD 9892 board card;
100-groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Referring to fig. 1 and 4, a high power printed circuit board includes a heat sink cold plate 1 and an SD9892 board card 3;
the heat dissipation cold plate 1 is used for dissipating heat of the SD9892 board card 3, and the SD9892 board card 3 is divided into a middle heating area, a left heating area and a right heating area; the left heating area and the right heating area are respectively provided with two 17W power chips, and the middle heating area is provided with a 9W power chip, an 8W power chip and a 6W power chip;
the heat dissipation cold plate 1 is divided into a middle area, a left area and a right area corresponding to the middle heating area, the left heating area and the right heating area, the right area and the left area of the back of the heat dissipation cold plate 1 are respectively provided with grooves matched with 17W chips, the middle area of the back of the heat dissipation cold plate 1 is provided with grooves matched with the 9W chips, the 8W chips and the 6W chips, and the heat dissipation cold plate 1 is further provided with holes;
the front surface of the heat dissipation cold plate 1 is of a groove structure, and the front surface of the heat dissipation cold plate 1 is provided with heat dissipation cylindrical teeth 11, heat dissipation ribs 12, a heat pipe 13, two air inlets 14 and an air outlet 15; the heat dissipation cylindrical teeth 11 are arranged in the middle area of the front face of the heat dissipation cold plate 1, the air outlet 15 is arranged at the upper end of the middle area, and the heat pipe 13 is embedded into the hole of the heat dissipation cold plate 1; the heat dissipation cold plate 1 is characterized in that the heat dissipation ribs 12 are arranged on the left side area and the right side area of the front face of the heat dissipation cold plate 1, and the air inlets 14 are arranged on the side walls of the left side area and the right side area of the front face of the heat dissipation cold plate 1.
Further, a straight line formed by the two air inlets 14 is parallel to the long side of the heat dissipation cold plate 1, and is perpendicular to the short side of the heat dissipation cold plate 1.
Further, the reason for setting up two air intakes is in order to ensure the entering of wind to the inflow of wind has been ensured, thereby enables the chip and carries out abundant cooling, when guaranteeing wind at the middle part of heat dissipation cold drawing 1, the wind of two air intakes forms the impact, leads to the wind speed to reduce, the effectual radiating effect who improves heat dissipation cylinder tooth 11.
Furthermore, the air inlet is arranged at the chip with the power of 17W, so that the chip with the highest power in the equipment can be cooled better.
The PCB board cooling device has the advantages that the PCB board chips are distributed and combined, the 17W chips are cooled in a mode of air inlet at two sides, and air flows out from the middle part, so that the high-power chips are effectively cooled, the chips can be sufficiently cooled, the temperature of the SD9892 board card 3 can be always maintained at the temperature in a normal use state, the damage of the chips caused by the overlarge heat generated by the chips is avoided, the normal work of the chips is effectively ensured, the working time of the chips is ensured, the working efficiency of the chips is greatly improved, and the cost is effectively reduced.
With reference to fig. 1, the number of the heat dissipation cylindrical teeth 11 is N, where N is greater than or equal to 10, and the heat dissipation cylindrical teeth 11 are uniformly disposed in the middle area of the front surface of the heat dissipation cold plate 1; the radius range of the heat dissipation cylindrical teeth 11 is 1 mm-5 mm.
It can be understood that the heat conducting ribs are milled into a long strip shape conventionally, the milling direction of the ribs can block the ventilation air channel longitudinally or transversely, and the air flow heat dissipation is seriously affected, so that after the heat dissipation cylindrical teeth 11 are adopted to mill the middle of the heat dissipation cold plate 1 into cylindrical teeth, the heat dissipation area is increased by the middle three chips needing heat dissipation, and a smooth heat dissipation air channel is formed. Secondly, can block the dust in the wind, the effectual momentum that reduces the dust of outside heat dissipation cylinder tooth 11 like this descends the dust on heat dissipation cold drawing 1, has effectually avoided adhering to the dust on the outer wall of middle part heat dissipation cylinder tooth 11 to influence the radiating efficiency of heat dissipation cylinder tooth 11, make the radiating effect of chip better.
With continued reference to fig. 1, in an alternative embodiment, the heat sink fins 12 are horizontally disposed on the right and left regions of the front surface of the heat sink cold plate 1; the heat dissipation ribs 12 are of a strip structure and are designed in a segmented manner.
It can be understood that the strip shape is adopted to enable the wind to flow more smoothly, and effectively reduce the resistance. The wind can effectively move linearly, and the generated heat can be taken away quickly. Thereby realizing the timely cooling of the chip.
With reference to fig. 1, the heat pipe 13 is disposed over the SD9892 board 3 chip, and the heat pipe 13 is perpendicular to the heat dissipation ribs 12; wherein the heat pipe 13 is filled with a heat conductive liquid.
It can be understood that, because the chip on the SD9892 board 3 is the key part for heating, and the chip is also the core of the whole SD9892 board 3, the heat pipe 13 needs to be added, so that heat transfer can be realized between a heat source and a radiating fin by a small temperature difference, and isothermal can be realized on the surface of a radiator substrate to improve the efficiency of the radiator, so as to ensure that the chip is not damaged due to overheating, effectively control the cost, thereby avoiding the occurrence of the condition that the chip cannot work due to damage in a fighting state, and leading the heat pipe 13 to rapidly conduct heat to a low-temperature region to play a role in temperature uniformity.
With continued reference to fig. 1, the air inlet 14 is provided with an air duct gasket 16.
It can be understood that, in order to prevent the air leakage of the air inlet, the cooling effect is not good, and the air duct sealing gasket 16 effectively ensures the air volume of the air inlet.
Please refer to fig. 2 and fig. 3, which also include a cover plate 2;
the front face of the heat dissipation cold plate 1 is matched with the cover plate 2.
It is understood that the number of the grooves 100 in fig. 3 is seven, and the seven correspond to four 17W power chips, one 9W power chip, one 8W power chip and one 6W power chip, respectively; have the existence of a lot of chips on the SD9892 integrated circuit board 3, so heat dissipation cold plate 1 need set up recess and SD9892 integrated circuit board 3 and match each other, can effectually protect the chip like this, avoids the extrusion to damage, can also effectual help chip carry out thermal transmission. The cover plate 2 serves to seal the heat sink cold plate 1 to ensure circulation of air therein.
Referring to fig. 5, fig. 5 is a schematic cross-sectional view of fig. 1 of the present structure, for illustrating a positional relationship of the present structure having a three-layer structure, in which the heat dissipation cold plate 1 is disposed on the SD9892 board card 3.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A high-power printed circuit board is characterized by comprising a heat dissipation cold plate (1) and an SD9892 board card (3);
the heat dissipation cold plate (1) is used for dissipating heat of the SD9892 board card (3), and the SD9892 board card (3) is divided into a middle heating area, a left heating area and a right heating area; the left heating area and the right heating area are respectively provided with two 17W power chips, and the middle heating area is provided with a 9W power chip, an 8W power chip and a 6W power chip;
the heat dissipation cold plate (1) is divided into a middle area, a left area and a right area corresponding to the middle heating area, the left heating area and the right heating area, grooves matched with 17W chips are formed in the right area and the left area of the back of the heat dissipation cold plate (1), grooves matched with the 9W chips, the 8W chips and the 6W chips are formed in the middle area of the back of the heat dissipation cold plate (1), and holes are formed in the heat dissipation cold plate (1);
the front surface of the heat dissipation cold plate (1) is of a groove structure, and the front surface of the heat dissipation cold plate (1) is provided with heat dissipation cylindrical teeth (11), heat dissipation ribs (12), a heat pipe (13), two air inlets (14) and an air outlet (15); the heat dissipation cylindrical teeth (11) are arranged in the middle area of the front face of the heat dissipation cold plate (1), the air outlet (15) is arranged at the upper end of the middle area, and the heat pipe (13) is embedded into the hole of the heat dissipation cold plate (1); the left area and the right area of the front face of the heat dissipation cold plate (1) are both provided with the heat dissipation ribs (12), and the side walls of the left area and the right area of the front face of the heat dissipation cold plate (1) are both provided with the air inlets (14);
the heat pipe (13) is arranged right above the chip of the SD9892 board card (3), and the heat pipe (13) is vertical to the heat dissipation ribs (12); wherein the heat pipe (13) is filled with heat-conducting liquid.
2. The high-power printed circuit board according to claim 1, wherein the number of the heat dissipation cylindrical teeth (11) is N, N is greater than or equal to 10, and the heat dissipation cylindrical teeth (11) are uniformly arranged in the middle area of the front surface of the heat dissipation cold plate (1); the radius range of the heat dissipation cylindrical teeth (11) is 1 mm-5 mm.
3. A high-power printed circuit board according to claim 1, characterized in that the heat dissipation ribs (12) are horizontally arranged in the right and left regions of the front face of the heat dissipation cold plate (1); the heat dissipation ribs (12) are of strip structures and are designed in a segmented mode.
4. High-power printed circuit board according to claim 1, characterized in that the air inlet opening (14) is provided with an air duct gasket (16).
5. A high power printed circuit board according to claim 1, characterized in that it further comprises a cover plate (2);
the front surface of the heat dissipation cold plate (1) is matched with the cover plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110008449.2A CN112492862B (en) | 2021-01-05 | 2021-01-05 | High-power printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110008449.2A CN112492862B (en) | 2021-01-05 | 2021-01-05 | High-power printed circuit board |
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| Publication Number | Publication Date |
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| CN112492862A CN112492862A (en) | 2021-03-12 |
| CN112492862B true CN112492862B (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110008449.2A Active CN112492862B (en) | 2021-01-05 | 2021-01-05 | High-power printed circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114373725A (en) * | 2021-12-13 | 2022-04-19 | 北京比特大陆科技有限公司 | Chip array and electronic equipment |
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