CN219087630U - Heat abstractor, system and electronic equipment - Google Patents

Abstract

The utility model relates to a heat dissipating device, a system and electronic equipment, wherein the heat dissipating device comprises a fan and a heat dissipating structure, and the fan is provided with a first air inlet and a first air outlet; the radiating structure comprises a plurality of radiating fins which are arranged in an array, wherein each radiating fin comprises a radiating surface, and the vertical section of the radiating surface along the arrangement direction is in a wave shape; one side edge array of the plurality of radiating surfaces is communicated with the first air outlet, and the other side edge array of the plurality of radiating surfaces forms an air outlet structure. The radiating surfaces are made into the wave shape, so that the contact area between the radiating air flow and the radiating surfaces is enlarged on the premise that the flow speed of the radiating air flow is not influenced, the radiating rate of the radiating surfaces is improved, the radiating structure is formed by arranging a plurality of radiating surfaces in an array mode, the radiating rate of the whole radiating structure is improved by multiple times through the improvement of the radiating rate of the single radiating surface, meanwhile, the occupied space of the radiating structure is not enlarged, and the radiating efficiency of the electronic element is improved under the condition that the radiating space is limited.

Description

Heat abstractor, system and electronic equipment

Technical Field

The application relates to the field of electronic equipment, in particular to a heat dissipation device, a heat dissipation system and electronic equipment.

Background

With the rapid development of modern technology, the performance requirements of electronic equipment and electronic devices are higher and higher, especially the requirements on temperature change are more and more strict, and in many occasions, the temperature characteristics, heating power and the like of the system need to be mastered. In particular, in the field of electronic devices with space limitation such as thin clients, the requirement on the volume of the product is relatively high, the volume of the product is small, and the heat dissipation design space of the product is small, so that some changes and breakthroughs are needed to be made on the traditional heat dissipation design, and the heat dissipation requirement of the electronic device can be met.

Disclosure of Invention

In view of the above problems, the present application provides a heat dissipation device, a system, and an electronic device, which solve the problem of low heat dissipation efficiency of an electronic component under the condition of limited heat dissipation space.

In order to achieve the above object, in a first aspect, the present utility model provides a heat dissipating device, including a fan and a heat dissipating structure, the fan having a first air inlet and a first air outlet; the heat dissipation structure comprises a plurality of heat dissipation fins which are arranged in an array, each heat dissipation fin comprises a heat dissipation surface, and the vertical section of the heat dissipation surface along the arrangement direction is in a wave shape; the top edge of the radiating surface is provided with a first connecting surface extending outwards along the arrangement direction of the radiating surface; the first connecting surfaces of the adjacent radiating fins are connected; one side edge array of the plurality of radiating surfaces is communicated with the first air outlet, and the other side edge array of the plurality of radiating surfaces forms an air outlet structure.

In some embodiments, the bottom edge of the radiating surface is provided with a second connecting surface extending outwards along the direction of the normal vector of the radiating surface, the second connecting surfaces of adjacent radiating fins are connected, and the first connecting surfaces and the second connecting surfaces in the same radiating fin are arranged in the same and parallel direction.

In some embodiments, adjacent cooling surfaces are disposed parallel to each other, and the wave sizes of the vertical cross-sections of the respective cooling surfaces along the arrangement direction are uniform.

In some embodiments, the heat dissipating surfaces include a peak surface and a trough surface, the peak surface and the trough surface of adjacent heat dissipating surfaces are distributed in the same position, and the peak surfaces of adjacent heat dissipating surfaces are disposed opposite to each other, and the trough surfaces of adjacent heat dissipating surfaces are disposed opposite to each other.

In a second aspect, the present utility model further provides a heat dissipation system, including the foregoing heat dissipation device, a first circuit structure, and a first heat pipe, where the first circuit structure includes a first substrate and a first electronic component, and the first electronic component is disposed on the first substrate; one end of the first heat conduction pipe is connected with the first substrate, and the other end of the first heat conduction pipe is connected with the radiating fin of the radiating device and used for conducting heat on the first substrate to the radiating fin.

In some embodiments, the first electronic component is a processor or a display card.

In some embodiments, the heat dissipation system further includes a second circuit structure including a second substrate and a second electronic component disposed on the second substrate, and a second heat pipe; one end of the second heat conduction pipe is connected with the second substrate, and the other end of the second heat conduction pipe is connected with the radiating fin of the radiating device and is used for conducting heat on the second substrate to the radiating fin.

In some embodiments, the number of the heat dissipation devices is one, the first substrate is connected with the heat dissipation structure of the heat dissipation device through the first heat conduction pipe, and the second substrate is connected with the heat dissipation structure of the same heat dissipation device through the second heat conduction pipe; and/or the number of the heat dissipation devices is two, the heat dissipation devices comprise a first heat dissipation device and a second heat dissipation device, the first substrate is connected with a heat dissipation structure of the first heat dissipation device through a first heat conduction pipe, and the second substrate is connected with a heat dissipation structure of the second heat dissipation device through a second heat conduction pipe.

In some embodiments, the second electronic component is a processor or a display card.

In a third aspect, the present utility model further provides an electronic device, including a housing and a heat dissipation system, where the heat dissipation system is disposed in the housing, and the heat dissipation system is the heat dissipation system described above.

Compared with the prior art, the technical scheme is different from the prior art in that the radiating surfaces are made into the wavy shape, so that the contact area between the radiating air flow and the radiating surfaces is enlarged on the premise that the flow speed of the radiating air flow is not influenced, the radiating rate of the radiating surfaces is improved, the radiating structure is formed by arranging a plurality of radiating surfaces in an array mode, the radiating rate of the whole radiating structure is improved by multiple times through the improvement of the radiating rate of the single radiating surface, meanwhile, the occupied space of the radiating structure is not enlarged, and the radiating efficiency of the electronic element is obviously improved under the condition that the radiating space is limited.

The foregoing summary is merely an overview of the present application, and is provided to enable one of ordinary skill in the art to make more clear the present application and to be practiced according to the teachings of the present application and to make more readily understood the above-described and other objects, features and advantages of the present application, as well as by reference to the following detailed description and accompanying drawings.

Drawings

The drawings are only for purposes of illustrating the principles, implementations, applications, features, and effects of the present utility model and are not to be construed as limiting the application.

In the drawings of the specification:

FIG. 1 is a schematic view of a heat sink according to an embodiment;

fig. 2 is a schematic view of a heat dissipation structure according to an embodiment along an arrangement direction;

FIG. 3 is another schematic view of a heat dissipation structure according to an embodiment along an arrangement direction;

FIG. 4 is a schematic diagram of a heat dissipation system according to an embodiment;

fig. 5 is a schematic diagram of an electronic device with a heat dissipation system according to an embodiment.

Reference numerals referred to in the above drawings are explained as follows:

1. a blower;

11. a first air inlet;

12. a first air outlet;

2. a heat dissipation structure;

21. a heat sink;

211. a heat radiating surface;

212. a first connection surface;

213. a second connection surface;

214. a peak surface;

215. trough surfaces;

3. a first circuit structure;

31. a first substrate;

32. a first electronic component;

33. a first heat conduction pipe;

4. a second circuit structure;

41. a second substrate;

42. a second electronic component;

43. a second heat conduction pipe;

5. a housing.

Detailed Description

In order to describe the possible application scenarios, technical principles, practical embodiments, and the like of the present application in detail, the following description is made with reference to the specific embodiments and the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples and are not intended to limit the scope of protection of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of the phrase "in various places in the specification are not necessarily all referring to the same embodiment, nor are they particularly limited to independence or relevance from other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the technical features mentioned in the embodiments may be combined in any manner to form a corresponding implementable technical solution.

Unless defined otherwise, technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains; the use of related terms herein is for the description of specific embodiments only and is not intended to limit the present application.

In the description of the present application, the term "and/or" is a representation for describing a logical relationship between objects, which means that there may be three relationships, e.g., a and/or B, representing: there are three cases, a, B, and both a and B. In addition, the character "/" herein generally indicates that the front-to-back associated object is an "or" logical relationship.

In this application, terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual number, order, or sequence of such entities or operations.

Without further limitation, the use of the terms "comprising," "including," "having," or other like open-ended terms in this application are intended to cover a non-exclusive inclusion, such that a process, method, or article of manufacture that comprises a list of elements does not include additional elements in the process, method, or article of manufacture, but may include other elements not expressly listed or inherent to such process, method, or article of manufacture.

As in the understanding of the "examination guideline," the expressions "greater than", "less than", "exceeding", and the like are understood to exclude the present number in this application; the expressions "above", "below", "within" and the like are understood to include this number. Furthermore, in the description of the embodiments of the present application, the meaning of "a plurality of" is two or more (including two), and similarly, the expression "a plurality of" is also to be understood as such, for example, "a plurality of groups", "a plurality of" and the like, unless specifically defined otherwise.

In the description of the embodiments of the present application, spatially relative terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counter-clockwise," "axial," "radial," "circumferential," etc., are used herein as terms of orientation or positional relationship based on the specific embodiments or figures, and are merely for convenience of description of the specific embodiments of the present application or ease of understanding of the reader, and do not indicate or imply that the devices or components referred to must have a particular position, a particular orientation, or be configured or operated in a particular orientation, and therefore are not to be construed as limiting of the embodiments of the present application.

Unless specifically stated or limited otherwise, in the description of the embodiments of the present application, the terms "mounted," "connected," "affixed," "disposed," and the like are to be construed broadly. For example, the "connection" may be a fixed connection, a detachable connection, or an integral arrangement; the device can be mechanically connected, electrically connected and communicated; it can be directly connected or indirectly connected through an intermediate medium; which may be a communication between two elements or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those skilled in the art to which the present application pertains according to the specific circumstances.

Referring to fig. 1 and 4, the present embodiment provides a heat dissipating device, which includes a fan 1 and a heat dissipating structure 2, wherein the fan 1 has a first air inlet 11 and a first air outlet 12; the heat dissipation structure 2 comprises a plurality of heat dissipation fins 21 which are arranged in an array, each heat dissipation fin 21 comprises a heat dissipation surface 211, and the vertical section of the heat dissipation surface 211 along the arrangement direction is in a wave shape; the top edge of the heat radiating surface 211 is provided with a first connecting surface 212 extending outwards along the arrangement direction of the heat radiating surface 211; the first connection surfaces 212 of the adjacent heat dissipation fins 21 are connected; one side edge of the plurality of radiating surfaces 211 is arranged in an array manner and communicated with the first air outlet 12, and the other side edge of the plurality of radiating surfaces 211 is arranged in an array manner to form an air outlet structure.

Optionally, the first air inlet 11 of the blower 1 is disposed at a side of the blower 1, so as to suck the external air to the maximum extent. The heat dissipation structure 2 is formed by arranging a plurality of heat dissipation fins 21 in an array, the heat dissipation fins 21 are provided with heat dissipation surfaces 211, the heat dissipation surfaces 211 are fully contacted with air flow generated by the fan 1, so that heat on the heat dissipation fins 21 is subjected to heat exchange into the air flow through the heat dissipation surfaces 211, and the effect of reducing the temperature of the heat dissipation fins 21 is achieved.

When the vertical section of the heat dissipating surface 211 along the arrangement direction is wavy, the contact area between the heat dissipating surface 211 and the air flow can be increased, thereby improving the heat dissipating efficiency of the heat dissipating surface 211. For example, the wave shape shown in fig. 1 can sufficiently increase the contact area between the heat radiation surface 211 and the airflow. When the plurality of heat radiating fins 21 are arranged together, the heat radiating efficiency of the single heat radiating surface 211 is increased by a multiple, thereby further increasing the heat radiating efficiency of the heat radiating structure 2.

The plurality of first connection surfaces 212 abut against each other, so that the plurality of heat dissipation fins 21 are arranged in a regular manner. Meanwhile, the first connecting surface 212 is arranged at the top edge of the radiating surface 211, so that a channel with a certain gap is formed between the radiating surface 211 and the radiating surface 211, air flow is convenient to pass, air flow is prevented from flowing out from the periphery of the radiating surface 211, the air flow direction is more concentrated, and the radiating efficiency is convenient to improve.

By making the radiating surface 211 into the wave shape, the contact area between the radiating airflow and the radiating surface 211 is enlarged on the premise that the flow speed of the radiating airflow is not influenced by the radiating surface 211, so that the radiating rate of the radiating surface 211 is improved, the radiating structure 2 is formed by arranging a plurality of radiating surfaces 211 in an array manner, the radiating rate of the whole radiating structure 2 is doubled by improving the radiating rate of the single radiating surface 211, and meanwhile, the occupied space of the radiating structure 2 is not enlarged, so that the radiating efficiency of the electronic element is remarkably improved under the condition that the radiating space is limited.

Referring to fig. 1, in some embodiments, the bottom edge of the heat dissipating surface 211 is provided with a second connecting surface 213 extending outwards along the normal vector direction of the heat dissipating surface 211, the second connecting surfaces 213 of adjacent heat dissipating fins 21 are connected, and the first connecting surfaces 212 and the second connecting surfaces 213 in the same heat dissipating fin 21 extend outwards in the same direction and are arranged in parallel. The normal vector direction refers to a direction perpendicular to the heat dissipating surface 211, and a bottom edge of the heat dissipating surface 211 is provided with a second connection surface 213 extending outwards along the normal vector direction of the heat dissipating surface 211, which means that the second connection surface 213 is perpendicular to the heat dissipating surface 211 and is disposed at the bottom edge of the heat dissipating surface 211. When the first connecting surface 212 and the second connecting surface 213 are parallel to each other and the outward extending directions are the same, the structure of the heat sink 21 is U-shaped; alternatively, when the first connection surface 212 and the second connection surface 213 are parallel to each other but extend in opposite directions, the structure of the heat sink 21 is Z-shaped. The second connection surface 213 is the same with the effect of the first connection surface 212 for the radiating surface 211 of each fin 21 can be regularly arranged, simultaneously, makes between radiating surface 211 and the radiating surface 211 form the air current passageway, avoids the air current to flow out from the periphery of radiating surface 211, makes the air current flow direction more concentrated, is convenient for improve radiating efficiency.

Referring to fig. 2 and 3, in some embodiments, adjacent heat dissipating surfaces 211 are disposed parallel to each other, and the wave sizes of the vertical cross sections of the heat dissipating surfaces 211 along the arrangement direction are uniform. There are two embodiments in which the wave shape is uniform in size. For convenience of distinction, the adjacent heat dissipating surfaces 211 are divided into heat dissipating surfaces a and B, wherein the heat dissipating surfaces a include a crest A1 and a trough A2, and the heat dissipating surfaces B include a crest B1 and a trough B2.

In the first embodiment, the wave crest A1 is opposite to the wave trough B2, the wave trough A2 is opposite to the wave crest B1, so that the heat dissipation structure 2 shown in fig. 2 is formed, the size of the gap between two adjacent heat dissipation surfaces 211 in the heat dissipation structure 2 is changed regularly, when the air flow passes through a single gap, different flow rates can be generated due to different gaps, so that mutual disturbance and collision exist between the air flows, and the heat exchange rate between the air flow and the heat dissipation surfaces 211 is improved.

In the second embodiment, the wave crest A1 is opposite to the wave crest B1, and the wave trough A2 is opposite to the wave trough B2, so that the heat dissipation structure 2 shown in fig. 3 is formed, and the size of the gap between two adjacent heat dissipation surfaces 211 in the heat dissipation structure 2 is kept consistent, so that a uniform heat dissipation effect can be achieved.

Referring to fig. 3, in some embodiments, the heat dissipating surfaces 211 include a peak surface 214 and a valley surface 215, the peak surface 214 and the valley surface 215 of adjacent heat dissipating surfaces 211 are distributed at the same position, and the peak surfaces 214 of adjacent heat dissipating surfaces 211 are disposed opposite to each other, and the valley surfaces 215 of adjacent heat dissipating surfaces 211 are disposed opposite to each other. The gap between two adjacent heat dissipation surfaces 211 in the heat dissipation structure 2 is kept consistent, and a uniform heat dissipation effect can be achieved.

Referring to fig. 4, the present utility model further provides a heat dissipation system, which includes the foregoing heat dissipation device, a first circuit structure 3, and a first heat pipe 33, where the first circuit structure 3 includes a first substrate 31 and a first electronic component 32, and the first electronic component 32 is disposed on the first substrate 31; one end of the first heat conducting tube 33 is connected with the first substrate 31, and the other end of the first heat conducting tube 33 is connected with the radiating fin 21 of the radiating device, so as to conduct heat on the first substrate 31 to the radiating fin 21.

The first substrate 31 is a planar plate structure for carrying the first electronic component 32, and has three functions of conduction, insulation and support, and the electronic component is disposed on the substrate to form an electronic circuit so as to implement logic operation. The other side of the first substrate 31 is connected to the first heat conductive pipe 33, so that in order to increase the heat conduction rate of the first heat conductive pipe 33, the contact area between the first heat conductive pipe 33 and the first substrate 31 may be increased, for example, the first heat conductive pipe 33 is transversely attached to the back surface of the first substrate 31. The first heat conducting pipe 33 has good heat conducting performance, and can transfer heat from the first substrate 31 to the heat dissipating device, and then the fan 1 conducts the heat on the heat dissipating fin 21 to the air.

By providing the first heat pipe 33 and the heat dissipating device, heat in the first circuit structure 3 can be dissipated into the heat dissipating device through the first heat pipe 33, thereby reducing the temperature of the first circuit structure 3 and improving the logic operation efficiency of the first electronic component 32.

In some embodiments, the first electronic component 32 is a processor or a display card. The CPU is used as the operation and control core of computer system and is the final execution unit for information processing and program running. The display card is one of the basic components of the personal computer, converts the display information required by the computer system to drive the display, provides progressive or interlaced scanning signals for the display, controls the correct display of the display, is an important component for connecting the display and a personal computer main board, is one of important equipment of man-machine, and is also used for deep learning and other operations at the present stage of built-in parallel computing capacity.

The electronic component generates larger heat in high-speed operation, and further affects the working temperature of the electronic component, thereby affecting the operation processing rate of the electronic component, and therefore, the heat generated by the electronic component needs to be timely conducted out. The heat dissipation device is applied to the processor or the display card, and can cool and dissipate heat of the processor or the display card to the greatest extent in a limited space, so that the running speed of the processor or the display card is kept.

Referring to fig. 4, in some embodiments, the heat dissipation system further includes a second circuit structure 4 and a second heat conductive pipe 43, where the second circuit structure 4 includes a second substrate 41 and a second electronic component 42, and the second electronic component 42 is disposed on the second substrate 41; one end of the second heat conductive pipe 43 is connected to the second substrate 41, and the other end of the second heat conductive pipe 43 is connected to the heat sink 21 of the heat sink, so as to conduct heat on the second substrate 41 to the heat sink 21.

The second substrate 41 is a planar plate-like structure for carrying the second electronic component 42, and has three functions of conduction, insulation and support, and the electronic component is disposed on the substrate to form an electronic circuit for realizing logic operation. The other side of the second substrate 41 is connected to the second heat conductive pipe 43, so that in order to increase the heat conduction rate of the second heat conductive pipe 43, the contact area between the second heat conductive pipe 43 and the second substrate 41 may be increased, for example, the second heat conductive pipe 43 is transversely attached to the back surface of the second substrate 41. The second heat conducting pipe 43 has good heat conducting performance, and can transfer heat from the second substrate 41 to the heat dissipating device, and then the fan 1 conducts the heat on the heat dissipating fin 21 to the air.

By providing the second heat-conducting tube 43 and the heat dissipating device, the heat in the second circuit structure 4 can be dissipated into the heat dissipating device through the second heat-conducting tube 43, so that the temperature of the second circuit structure 4 is reduced, and the logic operation efficiency of the second electronic component 42 is improved.

In some embodiments, the number of heat dissipation devices is one, the first substrate 31 is connected to the heat dissipation structure 2 of the heat dissipation device through the first heat conduction pipe 33, and the second substrate 41 is connected to the heat dissipation structure 2 of the same heat dissipation device through the second heat conduction pipe 43; and/or the number of the heat dissipation devices is two, including a first heat dissipation device and a second heat dissipation device, the first substrate 31 is connected with the heat dissipation structure 2 of the first heat dissipation device through the first heat conduction pipe 33, and the second substrate 41 is connected with the heat dissipation structure 2 of the second heat dissipation device through the second heat conduction pipe 43.

In some cases, the number of heat dissipation devices is one, and the first substrate 31 is connected to the heat dissipation structure 2 of the heat dissipation device through the first heat conduction pipe 33, and the second substrate 41 is connected to the heat dissipation structure 2 of the same heat dissipation device through the second heat conduction pipe 43; thus, the heat dissipation device can receive heat of two circuits at the same time and exhaust the heat through the air flow.

In other preferred embodiments, the number of the heat dissipation devices may be two, the first heat dissipation device is connected with the first heat conduction tube 33, the second heat dissipation device is connected with the second heat conduction tube 43, the heat dissipation between the first circuit structure 3 and the second circuit structure 4 can be not affected by each other through the form of heat dissipation respectively, meanwhile, the number of the heat dissipation fins 21 in the heat dissipation device can be reasonably increased or decreased according to the heat dissipation requirement, the size can be also adjusted, the occupied space of the heat dissipation device is further reduced, and the space requirement of some electronic devices (such as mobile phones, thin clients and the like) at present is met.

In some embodiments, the second electronic component 42 is a processor or a display card. The CPU is used as the operation and control core of computer system and is the final execution unit for information processing and program running. The display card is one of the basic components of the personal computer, converts the display information required by the computer system to drive the display, provides progressive or interlaced scanning signals for the display, controls the correct display of the display, is an important component for connecting the display and a personal computer main board, is one of important equipment of man-machine, and is also used for deep learning and other operations at the present stage of built-in parallel computing capacity.

The electronic component generates larger heat in high-speed operation, and further affects the working temperature of the electronic component, thereby affecting the operation processing rate of the electronic component, and therefore, the heat generated by the electronic component needs to be timely conducted out. The heat dissipation device is applied to the processor or the display card, and can cool and dissipate heat of the processor or the display card to the greatest extent in a limited space, so that the running speed of the processor or the display card is kept.

Referring to fig. 5, the present utility model further provides an electronic device, which includes a housing 5 and a heat dissipation system, wherein the heat dissipation system is disposed in the housing 5, and the heat dissipation system is the heat dissipation system described above. The electronic device is composed of electronic components such as an integrated circuit, a transistor, an electronic tube, and the like, and the electronic device applying electronic technology (including) software to play a role includes an electronic computer, a robot controlled by the electronic computer, a numerical control or program control system, and the like.

According to the technical scheme, the radiating surfaces 211 are made into the wavy shape, so that the contact area between the radiating air flow and the radiating surfaces 211 is enlarged on the premise that the flow speed of the radiating air flow is not influenced, the radiating rate of the radiating surfaces 211 is improved, the radiating structure 2 is formed by arranging a plurality of radiating surfaces 211 in an array mode, the radiating rate of the whole radiating structure 2 is improved by the improvement of the radiating rate of the single radiating surface 211, meanwhile, the occupied space of the radiating structure 2 is not enlarged, and the radiating efficiency of an electronic element is remarkably improved under the condition that the radiating space is limited.

The technical solutions described in the present application will be further understood in conjunction with the following specific examples:

taking a thin client as an example, the technical scheme can be used for solving the overall heat dissipation problem of the thin client under the conditions of domestic CPU and display card. The display card and the CPU are divided into two heat dissipation devices, so that the heat dissipation problem of the CPU and the heat dissipation problem of the display card are respectively solved, the better heat dissipation scheme is to connect the display card and the CPU together through a heat pipe and use a heat dissipation module device, but the defects are that the size of a thin client product is smaller and the space is insufficient, so that the design form of the conventional heat pipe heat dissipation device cannot meet the heat dissipation requirement. The design form of the heat dissipating device is adjusted by the technical scheme provided by the application, and the problem that the heat exchanging area of the heat dissipating surface 211 in the heat dissipating device is insufficient is solved.

The integral heat dissipation system adopts a first circuit structure 3, a second circuit structure 4, a first heat conduction pipe 33, a second heat conduction pipe 43, a fan 1 and a heat dissipation structure 2, wherein a first electronic component 32 in the first circuit structure 3 is a CPU, a second electronic component 42 in the second circuit structure 4 is a display card, the CPU is arranged on a first substrate 31, the first substrate 31 is connected with the heat dissipation structure 2 through the first heat conduction pipe 33, the display card is arranged on a second substrate 41, the second substrate 41 is connected with the heat dissipation structure 2 through the second heat conduction pipe 43, the heat dissipation structure 2 is overlapped by a plurality of heat dissipation fins 21 and is arranged at a first air outlet 12 of the fan 1, heat in the heat dissipation structure 2 is brought out to the outside of a case through the heat dissipation of the CPU and the display card by means of the heat dissipation surface 211 in the fan 1 and the heat dissipation structure 2.

In the heat exchange process of the fan 1 and the heat radiation structure 2, the main heat radiation mode is heat convection of the heat radiation fins 21 and air, so that the larger the area of the heat radiation fins 21 is, the larger the area of the heat radiation fins participating in the heat convection is, and more heat can be taken away. The conventional fin 21 is flat, so that there are relatively few surfaces involved in heat exchange. The embodiment adopts the wave-shaped heat dissipation structure 2, so that the whole wave surface participates in heat exchange, the heat exchange area is larger, and more heat can be taken away.

The CPU and the display card are integrated in the whole machine, one heat radiating device solves two high-power heating chips, the heat radiating surface 211 in the heat radiating structure 2 adopts a wave tooth design form, the limited space is fully utilized for heat exchange, the heat exchanging area is improved by more than 10% compared with the conventional heat radiating surface 211, and the whole heat radiating efficiency is higher.

Finally, it should be noted that, although the foregoing embodiments have been described in the text and the accompanying drawings of the present application, the scope of the patent protection of the present application is not limited thereby. All technical schemes generated by replacing or modifying equivalent structures or equivalent flows based on the essential idea of the application and by utilizing the contents recorded in the text and the drawings of the application, and the technical schemes of the embodiments are directly or indirectly implemented in other related technical fields, and the like, are included in the patent protection scope of the application.

Claims (10)

1. A heat sink, comprising:

the fan is provided with a first air inlet and a first air outlet;

the heat dissipation structure comprises a plurality of heat dissipation fins which are arranged in an array manner, wherein each heat dissipation fin comprises a heat dissipation surface, and the vertical section of the heat dissipation surface along the arrangement direction is in a wave shape; the top edge of the radiating surface is provided with a first connecting surface extending outwards along the arrangement direction of the radiating surface; the first connecting surfaces of the adjacent radiating fins are connected;

one side edge array of the radiating surfaces is communicated with the first air outlet, and the other side edge array of the radiating surfaces is arranged to form an air outlet structure.

2. The heat dissipating device of claim 1, wherein the bottom edge of the heat dissipating surface is provided with a second connecting surface extending outward in a direction along a normal vector of the heat dissipating surface, the second connecting surfaces of adjacent heat dissipating fins are connected, and the first connecting surfaces and the second connecting surfaces in the same heat dissipating fin extend outward in the same direction and are arranged in parallel.

3. The heat dissipating device of claim 1, wherein adjacent heat dissipating surfaces are disposed parallel to each other, and each heat dissipating surface has a uniform wave size along a vertical section of the arrangement direction.

4. A heat dissipating device according to claim 1 or 3, wherein the heat dissipating surfaces comprise peak surfaces and valley surfaces, the peak surfaces and the valley surfaces of adjacent heat dissipating surfaces are arranged in the same distribution position, and the peak surfaces of adjacent heat dissipating surfaces are arranged opposite to each other, and the valley surfaces of adjacent heat dissipating surfaces are arranged opposite to each other.

5. A heat dissipation system, comprising:

a heat dissipating device as defined in any one of claims 1 to 4;

a first circuit structure including a first substrate and a first electronic component disposed on the first substrate;

and one end of the first heat conduction pipe is connected with the first substrate, and the other end of the first heat conduction pipe is connected with the radiating fin of the radiating device and is used for conducting heat on the first substrate to the radiating fin.

6. The heat dissipation system of claim 5, wherein the first electronic component is a processor or a display card.

7. The heat dissipation system as set forth in claim 5, comprising:

a second circuit structure including a second substrate and a second electronic component disposed on the second substrate;

and one end of the second heat conduction pipe is connected with the second substrate, and the other end of the second heat conduction pipe is connected with the radiating fin of the radiating device and is used for conducting heat on the second substrate to the radiating fin.

8. The heat dissipating system of claim 7,

the number of the heat dissipation devices is one, the first substrate is connected with the heat dissipation structure of the heat dissipation device through the first heat conduction pipe, and the second substrate is connected with the heat dissipation structure of the same heat dissipation device through the second heat conduction pipe;

and/or the number of the heat dissipation devices is two, the heat dissipation device comprises a first heat dissipation device and a second heat dissipation device, the first substrate is connected with the heat dissipation structure of the first heat dissipation device through the first heat conduction pipe, and the second substrate is connected with the heat dissipation structure of the second heat dissipation device through the second heat conduction pipe.

9. The heat dissipation system of claim 7 or 8, wherein the second electronic component is a processor or a display card.

10. An electronic device, comprising:

a housing;

a heat dissipation system disposed within the housing, the heat dissipation system being as claimed in any one of claims 5 to 9.

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