CN215729631U

CN215729631U - Universal CPU board card compatible with air cooling and cold guiding and heat dissipation

Info

Publication number: CN215729631U
Application number: CN202122477305.XU
Authority: CN
Inventors: 方东升; 艾宇; 窦红权
Original assignee: Shenzhen Xingyan Technology Co ltd
Current assignee: Shenzhen Xingyan Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-02-01
Anticipated expiration: 2031-10-14

Abstract

The utility model discloses a general CPU board card compatible with air cooling and cold guiding heat dissipation.A cover plate is arranged on one surface of a cold guiding plate, which is away from a board card body, and a heat dissipation fan is arranged on the cover plate, wherein the air outlet side of the heat dissipation fan is opposite to a central heat dissipation area of a cold guiding plate; the cold guide plate is provided with radiating fins radiating from the central radiating area to the left side and the right side of the cold guide plate, and the free end of each radiating fin points to be orthogonal to the installation direction of the cold guide plate; the cover plate covers the upper end faces of the radiating fins. Therefore, the CPU board card can conduct cold heat dissipation through the cold guide plate, air cooling heat dissipation can be conducted through the cooling fan, and compatibility of the CPU board card on cold heat dissipation and air cooling heat dissipation is met.

Description

Universal CPU board card compatible with air cooling and cold guiding and heat dissipation

Technical Field

The utility model relates to the technical field of CPCI board cards, in particular to a general CPU board card compatible with air cooling and cold conduction and heat dissipation.

Background

In the field of reinforced computers, the CPCI board card locks the mainboard on the cold guide plate to form a reinforced CPCI board card, the cold guide plate is made of aluminum alloy, and the heat dissipation of the mainboard can be realized by reinforcing the mainboard.

At present, the mainstream heat dissipation modes of a main CPU board (hereinafter referred to as a CPU board) of a CPCI include cold conduction heat dissipation and air cooling heat dissipation, wherein the air cooling heat dissipation is to directly mount the CPU board in an air cooling case for heat dissipation, the cold conduction heat dissipation is to mount the CPCI board on a cold conduction shell, and then mount the cold conduction shell in the cold conduction case for heat dissipation, and the two heat dissipation modes cause that the structures of the CPU board are different, so that the CPU board cannot be compatible with the air cooling and the cold conduction.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems in the prior art, the utility model mainly aims to provide a general CPU board card compatible with air cooling and cold conducting heat dissipation, and aims to solve the problem that the CPU board card cannot be compatible with air cooling and cold conducting.

In order to achieve the purpose, the general CPU board card compatible with air cooling and cold guiding heat dissipation provided by the utility model comprises a cold guiding plate and a board card body locked on the cold guiding plate, wherein a cover plate is arranged on one surface of the cold guiding plate, which is away from the board card body, a heat dissipation fan is arranged on the cover plate, and the air outlet side of the heat dissipation fan is opposite to a central heat dissipation area of the cold guiding plate; the cold guide plate is provided with radiating fins radiating from a central radiating area to the left side and the right side of the cold guide plate, and the free ends of the radiating fins point to be orthogonal to the installation direction of the cold guide plate; the cover plate covers the upper end face of the radiating fin.

Optionally, the cover plate is provided with a flat air inlet pipe arranged in parallel to the installation direction of the cold guide plate, and an air outlet of the flat air inlet pipe is communicated with the air inlet side of the cooling fan.

Optionally, the heat dissipation fins are disposed close to end side corner fillets or chamfers of a central heat dissipation area of the heat dissipation fan.

Optionally, a rubber gasket is disposed between the cover plate and the cold conducting plate.

According to the utility model, the cover plate is arranged on one surface of the cold guide plate, which is away from the plate card body, and the heat dissipation fan is arranged on the cover plate, wherein the air outlet side of the heat dissipation fan is opposite to the central heat dissipation area of the cold guide plate; the cold guide plate is provided with radiating fins radiating from the central radiating area to the left side and the right side of the cold guide plate, and the free end of each radiating fin points to be orthogonal to the installation direction of the cold guide plate; the cover plate covers the upper end faces of the radiating fins. Therefore, adjacent radiating fins form radiating channels, when the radiating fan is started, cold air can be blown to the cold guide plates and flows into each radiating channel in the central radiating area, and heat absorbed by the cold guide plates is taken away; meanwhile, the cold guide plate can conduct absorbed heat to the cold guide case for cold guide and heat dissipation.

Compared with the prior art, the cooling fan is arranged on the cold guide plate, so that the CPU board card can conduct cold and dissipate heat through the cold guide plate, and can also conduct air cooling and heat dissipation through the cooling fan, and the compatibility of the CPU board card on the cold guide heat dissipation and the air cooling heat dissipation is met.

Meanwhile, the utility model also arranges the radiating fins radiating from the central radiating area to the left and right sides of the radiating fins on the cold guide plate, arranges the cover plate on the upper end surfaces of the radiating fins, and arranges the radiating fan on the cover plate, thereby enabling the cold air blown by the radiating fan to be uniformly distributed in the radiating channel formed by the adjacent radiating fins, uniformly radiating the cold guide plate and improving the radiating effect of the CPU board card.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a cold conducting plate according to an embodiment of the present invention;

FIG. 3 is a schematic view of the flow of the heat dissipating air flow over the cold conducting plate in accordance with one embodiment of the present invention;

fig. 4 is a schematic application diagram of an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 in the specification, an embodiment of the present invention provides a general CPU board compatible with air cooling and cold guiding and heat dissipating, which includes a cold guiding plate 120 and a board body 110 locked on the cold guiding plate 120, wherein a cover plate 130 is disposed on a surface of the cold guiding plate 120 away from the board body 110, a heat dissipating fan 150 is disposed on the cover plate 130, and an air outlet side of the heat dissipating fan 150 faces a central heat dissipating area of the cold guiding plate 120; the cold guide plate 120 is provided with heat dissipation fins 120a radiating outward from the central heat dissipation region, the heat dissipation fins 120a are uniformly distributed with the central heat dissipation region as the center, and the free ends of the heat dissipation fins 120a extend to the left and right sides of the cold guide plate 120 along the direction orthogonal to the installation direction of the cold guide plate 120.

The cover plate 130 covers the upper end surface of each of the radiator fins 120a so that the adjacent radiator fins 120a can constitute one radiator passage 120 b. A flat air inlet pipe 140 is disposed on the cover plate 130 in parallel with the installation direction of the cold guide plate 120, and an air outlet of the flat air inlet pipe 140 is communicated with an air inlet side of the heat dissipation fan 150.

When the CPU board card 100 is applied, the CPU board card 100 is inserted into a clamping groove in the cold guide case 200, and the cold guide plate 120 is directly contacted with the cold guide case 200 to conduct and dissipate heat; when air-cooling heat dissipation is required, the heat dissipation fan 150 is activated, the heat dissipation fan 150 sucks in cold air from the outside through the flat air inlet pipe 140 from the back side of the chassis 200, and then blows the cold air vertically to the central heat dissipation area of the heat dissipation plate 120, and the cold air is distributed from the central heat dissipation area to the heat dissipation channels 120b between the adjacent heat dissipation fins 120a, and is blown out from the heat dissipation holes at the left and right sides of the cold dissipation chassis 200, so as to take away the heat absorbed by the heat dissipation plate 120.

Compared with the prior art, the cooling fan 150 is arranged on the cold guide plate 120, so that the CPU board 100 can conduct cold and dissipate heat through the cold guide plate 120 and can also conduct air cooling and heat dissipation through the cooling fan 150, and the compatibility of the CPU board 100 on cold guide and heat dissipation and air cooling and heat dissipation is met.

And, through setting up the radiating fin 120a radiating to its left and right sides from its central heat dissipation area on leading cold plate 120, and set up the cover plate 130 on the up end of radiating fin 120a, set up the radiator fan 150 on the cover plate 130, therefore, make the radiator fan 150 blow out the cold air and can distribute to the heat dissipation channel 120b that adjacent radiating fin 120a forms evenly, carry on the uniform heat dissipation to leading cold plate 120, can promote the radiating effect of the CPU integrated circuit board 100.

Optionally, in this embodiment, a rubber gasket is disposed between the cover plate 130 and the cold conducting plate 120 to seal an assembly gap between the cover plate 130 and the heat dissipating fins 120a, so as to prevent air leakage at a joint between the cover plate 130 and the heat dissipating fins 120a, so that cold air flowing from the central heat dissipating area can flow in the heat dissipating channel 120b, thereby effectively taking away heat absorbed by the cold conducting plate 120.

Alternatively, in the present embodiment, the heat dissipation fins 120a are disposed close to the corner fillets or chamfers at the end sides of the central heat dissipation area of the heat dissipation fan 150, so as to reduce the air intake resistance of each heat dissipation channel 120b, so that the cool air blown by the heat dissipation fan 150 can effectively flow from the central heat dissipation area to the heat dissipation channels 120 b.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A general CPU board card compatible with air cooling and cold guiding and heat dissipation comprises a cold guiding plate and a board card body locked on the cold guiding plate, and is characterized in that a cover plate is arranged on one side of the cold guiding plate, which is far away from the board card body, a heat dissipation fan is arranged on the cover plate, and the air outlet side of the heat dissipation fan is opposite to a central heat dissipation area of the cold guiding plate; the cold guide plate is provided with radiating fins radiating from a central radiating area to the left side and the right side of the cold guide plate, and the free ends of the radiating fins point to be orthogonal to the installation direction of the cold guide plate; the cover plate covers the upper end face of the radiating fin.

2. The universal CPU board of claim 1, wherein the cover plate has a flat air inlet pipe disposed parallel to the installation direction of the cold conducting plate, and the air outlet of the flat air inlet pipe is connected to the air inlet side of the heat dissipating fan.

3. The universal CPU board of claim 2, wherein the heat sink fins are disposed proximate to corner fillets or chamfers at the ends of the central heat sink region of the heat sink fan.

4. The universal CPU board compatible with air cooling and heat dissipation as recited in claim 3, wherein a rubber gasket is disposed between the cover plate and the heat dissipation plate.