CN218039178U

CN218039178U - Liquid cooling heat dissipation device

Info

Publication number: CN218039178U
Application number: CN202222229542.9U
Authority: CN
Inventors: 常青保
Original assignee: Chengdu Gongtong Radiator Co ltd
Current assignee: Chengdu Gongtong Radiator Co ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2022-12-13
Anticipated expiration: 2032-08-24

Abstract

The utility model discloses a liquid cooling heat dissipation device, which comprises a chip component; the liquid cooling welding assembly is arranged on the chip assembly and is provided with a water inlet joint and a water outlet joint; and the upper cover heat dissipation assembly is arranged at the outer end of the liquid cooling welding assembly and fixed on the chip assembly through screws. The heat dissipation device can be used for water cooling in the case, and has good heat dissipation effect and high strength.

Description

Liquid cooling heat dissipation device

Technical Field

The utility model relates to a radiator technical field specifically says a liquid cooling heat abstractor.

Background

In recent years, with the development of scientific technology, the rise of technologies such as a convenient mobile technology, 5G mobile communication, cloud computing, a data center, a block chain system, artificial intelligence and the like, the amount of data generated in each industry is increasing day by day, especially, the rise of a high-density server promoted by the application of each technical node, a core chip, a display card and the like in the server need high-efficiency heat dissipation, and how to simultaneously give consideration to high-efficiency computing and high-efficiency heat dissipation is a key problem to be considered in the construction of the server.

The existing radiator has only 1 or no reinforcing rib inside, when the radiator is used for a high-pressure radiating system, the support of the radiator cannot be met, so that a radiating substrate or an upper cover is deformed, the radiating performance is influenced, chips are burnt out, and the like, and the system cannot work normally; moreover, the existing radiator assembly does not have a chip radiating structure mode, and other chips and component radiating assemblies need to be designed with increased cost, so that the comprehensive cost is increased, and the product competitiveness is influenced.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above-mentioned not enough, the utility model provides a liquid cooling heat abstractor here provides, and this liquid cooling heat abstractor installs on the chip subassembly, utilizes microchannel bidirectional flow structure, and the intensive heat dissipation, simple structure, the radiating efficiency is high, and the comprehensive cost is low, and high pressure welding structure that bears satisfies core chip and other components and parts heat dissipation demands simultaneously.

The utility model is realized in such a way that a liquid cooling heat dissipation device is constructed, which comprises a chip component;

the liquid cooling welding assembly is arranged on the chip assembly and is provided with a water inlet joint and a water outlet joint; and

and the upper cover heat dissipation assembly is arranged at the outer end of the liquid cooling welding assembly and is fixed on the chip assembly through screws.

Further, liquid cooling welded assembly includes heat dissipation base plate and heat dissipation apron, heat dissipation base plate center department is provided with the mounting groove, is provided with the fin in the mounting groove, be provided with the connecting hole that the screw of being convenient for passed on the outer end four corners of heat dissipation base plate.

Further, the bottom of the heat dissipation cover plate is provided with a boss, the boss corresponds to the mounting groove to keep the heat dissipation substrate and the heat dissipation cover plate connected to form a containing cavity, the top of the heat dissipation cover plate is provided with a connecting groove and a through hole, the connecting groove is used for connecting a water inlet connector and a water outlet connector, the inner side of the bottom of the heat dissipation cover plate is provided with a reinforcing rib, the inner bottom of the heat dissipation cover plate is provided with a communicating groove which is staggered with the reinforcing rib, and the communicating groove and the through hole are kept communicated.

Furthermore, a central hole is formed in the middle of the upper cover heat dissipation assembly, a heat dissipation cover plate can conveniently penetrate through the central hole, groove bodies are formed in two sides of the top of the upper cover heat dissipation assembly, heat dissipation fins are installed in the groove bodies, and a positioning boss and a positioning pin are further arranged at the bottom of the upper cover heat dissipation assembly.

Furthermore, the radiating fin and the radiating component of the upper cover are integrally formed, and the radiating fin and the radiating substrate are integrally formed, so that the purpose of the arrangement is to reduce heat transfer resistance and maximize the radiating performance.

Furthermore, the water inlet joint and the water outlet joint are welded in a connecting groove of the heat dissipation cover plate and are kept communicated with the through hole, and the heat dissipation cover plate is kept welded with a mounting groove of the heat dissipation base plate through a boss at the bottom.

Furthermore, the heat dissipation substrate, the heat dissipation cover plate, the water inlet joint and the water outlet joint are made of copper alloy, and the upper cover heat dissipation assembly is made of aluminum alloy.

The utility model discloses following beneficial effect has:

compared with the prior art, the utility model has the advantages that,

1. the heat dissipation is enhanced by utilizing a micro-channel bidirectional water flow structure;

2. a high-pressure-bearing welding structure (a plurality of reinforcing ribs are designed, and the maximum number of the reinforcing ribs is generally 1 in the conventional process);

3. meanwhile, the heat dissipation requirements of a core chip and other components are met;

4. simple structure, high heat dissipation efficiency and low comprehensive cost.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is an exploded schematic view of the present invention;

FIG. 3 is a schematic structural diagram of a chip module according to the present invention;

fig. 4 is a schematic structural view of the heat dissipation substrate of the present invention;

FIG. 5 is a rear view of FIG. 4;

fig. 6 is a schematic structural view of the heat dissipation cover plate of the present invention;

FIG. 7 is a rear view of FIG. 6;

fig. 8 is a schematic structural view of the upper cover heat dissipation assembly of the present invention;

FIG. 9 is a rear view of FIG. 8;

fig. 10 is a schematic structural view of two connectors according to the present invention;

fig. 11 is a schematic connection diagram of the heat dissipation substrate, the heat dissipation cover plate and two connectors according to the present invention;

FIG. 12 is a schematic view of the present invention with the chip assembly removed;

FIG. 13 is a front view of FIG. 12;

FIG. 14 is a top view of FIG. 12 (the direction of the arrows being the direction of liquid flow);

FIG. 15 isbase:Sub>A cross-sectional view A-A of FIG. 14;

in the figure: 1. a chip component; 2. a heat-dissipating substrate; 2.1, mounting grooves; 2.2, connecting holes; 3. a heat dissipation cover plate; 3.1, a boss; 3.2, connecting grooves; 3.3, through holes; 3.4, communicating the grooves; 3.5, reinforcing ribs; 4. an upper cover heat dissipation assembly; 4.1, a groove body; 4.2, a central hole; 4.3, positioning a boss; 4.4, positioning pins; 5. a water inlet joint; 6. a water outlet joint; 7. a screw; 8. and a heat sink.

Detailed Description

The present invention will be described in detail with reference to fig. 1 to 15, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses an improve and provide a liquid cooling heat abstractor here, can implement according to following mode:

as shown in fig. 1 to 3, a liquid cooling heat dissipation device includes a chip package 1;

the liquid cooling welding assembly is arranged on the chip assembly 1, and a water inlet joint 5 and a water outlet joint 6 are arranged on the liquid cooling welding assembly; and

and the upper cover heat dissipation assembly 4 is arranged at the outer end of the liquid cooling welding assembly and is fixed on the chip assembly 1 through a screw 7.

As shown in fig. 4 and fig. 5, in this embodiment, the liquid cooling welding assembly includes a heat dissipation substrate 2 and a heat dissipation cover plate 3, a mounting groove 2.1 is disposed at a center of the heat dissipation substrate 2, a heat dissipation sheet 8 is disposed in the mounting groove 2.1, and connection holes 2.2 for screws 7 to pass through are disposed at four corners of an outer end of the heat dissipation substrate 2.

As shown in fig. 6 and 7, in this embodiment, the bottom of the heat dissipating cover plate 3 is provided with a boss 3.1, the boss 3.1 corresponds to the mounting groove 2.1 to keep the heat dissipating substrate 2 and the heat dissipating cover plate 3 connected to form a containing cavity, the top of the heat dissipating cover plate 3 is provided with a connecting groove 3.2 and a through hole 3.3, the connecting groove 3.2 is used for connecting a water inlet connector 5 and a water outlet connector 6, the inner side of the bottom of the heat dissipating cover plate 3 is provided with a reinforcing rib 3.5, the inner bottom of the heat dissipating cover plate 3 is provided with a communicating groove 3.4 mutually staggered with the reinforcing rib 3.5, and the communicating groove 3.4 and the through hole 3.3 keep communicating.

As shown in fig. 8 and 9, in this embodiment, a central hole 4.2 is formed in the middle of the upper cover heat dissipation assembly 4, the central hole 4.2 is convenient for the heat dissipation cover plate 3 to pass through, two sides of the top of the upper cover heat dissipation assembly 4 are provided with groove bodies 4.1, heat dissipation fins 8 are installed in the groove bodies 4.1, and a positioning boss 4.3 and a positioning pin 4.4 are further provided at the bottom of the upper cover heat dissipation assembly 4.

In this embodiment, the heat sink 8 and the top cover heat sink assembly 4 are integrally formed, and the heat sink 8 and the heat sink base plate 2 are integrally formed.

In this embodiment, water supply connector 5 and the welding of water outlet connector 6 are in the spread groove 3.2 of heat dissipation apron 3 and keep and communicate with through-hole 3.3, heat dissipation apron 3 keeps the welding through the boss 3.1 of bottom and the mounting groove 2.1 of heat dissipation base plate 2.

In this embodiment, the heat dissipation substrate 2, the heat dissipation cover plate 3, the water inlet connector 5 and the water outlet connector 6 are made of copper alloy, and the upper cover heat dissipation assembly 4 is made of aluminum alloy.

The principle of the heat dissipation device is as follows: when the chip assembly 1 works, a large amount of heat is generated by calculation of a chip and a component, the heat of a core chip is large, the core chip is conducted to a heat dissipation substrate 2 of the liquid cooling welding assembly, heat is simultaneously conducted to a heat dissipation sheet 8 after heat absorption, the heat dissipation sheet 8 exchanges heat with liquid in a cavity at the moment, the temperature of the chip is reduced, the temperature of the liquid is increased after heat release, and the liquid is cooled through an external heat dissipation device; the heat of the components beside the chipset is conducted to the upper cover heat dissipation assembly 4 and then conducted to the heat dissipation fins 8, at this time, one part of the heat is dissipated naturally, and the other part of the heat is dissipated by conduction of the contact liquid cooling welding assembly, so that the components are cooled.

Liquid cooling heat abstractor cavity rivers are to: as shown in fig. 5, 6 and 14, the cold water reaches the middle through the water inlet joint 5, is divided into two parts by the reinforcing ribs 3.5 in the upper half part and flows into the radiating fins 8, fully ensures that the cold water is contacted with the radiating fins 8 to realize heat exchange through the fixing direction of the radiating fins 8, finally converges to the water outlet joint 6 to be discharged, and performs circulating refrigeration and heat exchange.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid cooling heat sink, characterized by: comprises that

A chip assembly (1);

the liquid cooling welding assembly is arranged on the chip assembly (1) and is provided with a water inlet joint (5) and a water outlet joint (6); and

and the upper cover heat dissipation assembly (4) is arranged at the outer end of the liquid cooling welding assembly and fixed on the chip assembly (1) through a screw (7).

2. A liquid-cooled heat sink as recited in claim 1, further comprising: the liquid cooling welding assembly comprises a heat dissipation base plate (2) and a heat dissipation cover plate (3), wherein a mounting groove (2.1) is formed in the center of the heat dissipation base plate (2), heat dissipation fins (8) are arranged in the mounting groove (2.1), and connecting holes (2.2) convenient for screws (7) to penetrate are formed in four corners of the outer end of the heat dissipation base plate (2).

3. A liquid-cooled heat sink as recited in claim 2, further comprising: the bottom of the heat dissipation cover plate (3) is provided with a boss (3.1), the boss (3.1) corresponds to the mounting groove (2.1) to keep the heat dissipation base plate (2) and the heat dissipation cover plate (3) connected to form a containing cavity, the top of the heat dissipation cover plate (3) is provided with a connecting groove (3.2) and a through hole (3.3), the connecting groove (3.2) is used for connecting a water inlet connector (5) and a water outlet connector (6), the inner side of the bottom of the heat dissipation cover plate (3) is provided with a reinforcing rib (3.5) and the inner bottom of the heat dissipation cover plate (3) is provided with a communicating groove (3.4) which is mutually staggered with the reinforcing rib (3.5), and the communicating groove (3.4) and the through hole (3.3) are kept communicated.

4. A liquid-cooled heat sink as recited in claim 3, further comprising: the middle part of the upper cover heat dissipation assembly (4) is provided with a center hole (4.2), the center hole (4.2) is convenient for a heat dissipation cover plate (3) to pass through, two sides of the top of the upper cover heat dissipation assembly (4) are provided with groove bodies (4.1) and heat dissipation fins (8) are arranged in the groove bodies (4.1), and the bottom of the upper cover heat dissipation assembly (4) is further provided with a positioning boss (4.3) and a positioning pin (4.4).

5. The liquid-cooled heat sink as set forth in claim 4, wherein: the radiating fin (8) and the upper cover radiating component (4) are integrally formed, and the radiating fin (8) and the radiating substrate (2) are integrally formed.

6. A liquid-cooled heat sink as set forth in claim 3, wherein: the water inlet connector (5) and the water outlet connector (6) are welded in a connecting groove (3.2) of the heat dissipation cover plate (3) and are kept communicated with the through hole (3.3), and the heat dissipation cover plate (3) is kept welded with an installation groove (2.1) of the heat dissipation base plate (2) through a boss (3.1) at the bottom.

7. A liquid-cooled heat sink as recited in claim 2, further comprising: the heat dissipation base plate (2), the heat dissipation cover plate (3), the water inlet joint (5) and the water outlet joint (6) are made of copper alloy, and the upper cover heat dissipation assembly (4) is made of aluminum alloy.