CN210491506U

CN210491506U - Heat sink device

Info

Publication number: CN210491506U
Application number: CN201921146584.8U
Authority: CN
Inventors: 刘汉敏; 张健; 吕星星
Original assignee: Asia Vital Components Shenzhen Co Ltd
Current assignee: Asia Vital Components Shenzhen Co Ltd
Priority date: 2019-07-19
Filing date: 2019-07-19
Publication date: 2020-05-08
Anticipated expiration: 2029-07-19

Abstract

The utility model provides a heat abstractor, contain a base, a first cavity has, this first cavity has complex separation portion and separates formation complex number separation cavity in with this first cavity, this complex number separation cavity does not communicate with each other, and this complex number separation cavity is equipped with a first working fluid, this base upside is equipped with complex number two-phase flow heat radiation fin, this complex number two-phase flow heat radiation fin is inside to be formed with a second cavity respectively, this complex number separation cavity selects for intercommunication each other and do not communicate wherein arbitrary with this complex number second cavity, and then can reach the radiating effect of preferred.

Description

Heat sink device

Technical Field

The utility model relates to a heat abstractor especially indicates that it supplies the working fluid circulation to be equipped with the heat dissipation cavity at heat radiation fins and base inside to effectively reach the good heat abstractor of radiating effect.

Background

With the technological progress of the existing mobile devices, personal computers, servers, communication cabinets, base stations or other systems or devices, the computing functions and efficiency of the existing mobile devices are gradually enhanced, and the internal heating elements (such as but not limited to chips and various power elements) generate high heat during operation, so that the heat of the heating elements must be dissipated first, and in order to prevent the heating elements from overheating and causing failure of the heating elements, a heat dissipation device is usually installed on the heating elements to prolong the service life of the heating elements.

The existing heat dissipation device is provided with solid heat dissipation fins on the upper side of a temperature equalization plate, the heat dissipation area is enlarged by the solid heat dissipation fins to achieve the purpose of increasing the heat dissipation effect, or a fan is further arranged to generate larger air flow for heat dissipation, however, the internal space of the existing mobile equipment, personal computer, server, communication case, base station or other systems or devices is narrow and not suitable for arranging the fan, and the solid heat dissipation fins can influence the heat dissipation effect by the heat conductivity coefficient of the material, so the existing heat dissipation device provided with the solid heat dissipation fins on the upper side of the temperature equalization plate is not in line with the technical requirements of the future industry.

Therefore, the efforts of those skilled in the art to solve the above problems are directed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a do not receive material coefficient of heat conductivity and influence radiating effect's heat abstractor in narrow and small space, low wind flow environment.

To achieve the above object, the present invention provides a heat dissipation device, comprising:

the base is provided with a first cavity, the first cavity is provided with a plurality of separating parts for separating the first cavity to form a plurality of separating cavities, the plurality of separating cavities are not communicated with each other, a first working fluid is arranged in the plurality of separating cavities, a plurality of two-phase flow heat dissipation fins are arranged on the upper side of the base, second cavities are respectively formed in the plurality of two-phase flow heat dissipation fins, and the plurality of separating cavities and the plurality of second cavities are selected to be communicated with each other or not communicated with each other.

The heat dissipation device, wherein: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively and concavely arranged on any one of the upper plate and the lower plate, the upper plate, the lower plate and the concave part jointly define the first chamber, and the plurality of separating parts are selectively formed on any one of the upper plate and the lower plate.

The heat dissipation device, wherein: the substrate and the plurality of two-phase flow heat dissipation fins are integrally formed.

The heat dissipation device, wherein: the first chamber is provided with a first capillary structure, and the first capillary structure is selected from any one of a grid body, a fiber body, a structural body with porous property, a groove or any combination thereof.

The heat dissipation device, wherein: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one of a grid body, a fiber body, a structure body with porous property, a groove or any combination thereof.

The heat dissipation device, wherein: the coating film is correspondingly arranged on the inner walls of the first cavity and the second cavity or any one of the first capillary structure and the second capillary structure or the inner walls of the first cavity and the second cavity and the first capillary structure and the second capillary structure.

The heat dissipation device, wherein: the first working fluid is selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

The heat dissipation device, wherein: the plurality of separation chambers are not communicated with the plurality of second chambers, and the plurality of second chambers are provided with a second working fluid.

The heat dissipation device, wherein: the second working fluid is selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

The heat dissipation device, wherein: the plurality of two-phase flow heat dissipation fins are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, ejection and inflation processing.

The heat dissipation device, wherein: the base and the plurality of two-phase flow heat dissipation fins are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.

To achieve the above object, the present invention further provides a heat dissipation device, comprising:

the base is provided with a first cavity which is a single independent cavity and is provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow radiating fins, a second cavity is formed inside each of the plurality of two-phase flow radiating fins, each of the plurality of second cavities is provided with a second working fluid, and the single independent cavity is not communicated with the plurality of second cavities.

The heat dissipation device, wherein: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate, and the upper plate, the lower plate and the concave part jointly define the first chamber.

The heat dissipation device, wherein: the substrate and the plurality of heat dissipation members are integrally formed.

The heat dissipation device, wherein: the first working fluid and the second working fluid are selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

The heat dissipation device, wherein: the heat sink is formed by mechanical processing, which is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation.

The heat dissipation device, wherein: the base and the plurality of heat sinks are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.

Rely on the utility model discloses this design compares with current solid heat radiation fins and can not receive the coefficient of heat conductivity influence of material itself in narrow and small space, low wind flow environment, reaches the radiating effect's of preferred efficiency.

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. The embodiments of the present invention are explained in detail by referring to the drawings and the embodiments herein, and the principle of the invention is illustrated.

Drawings

Fig. 1 is a perspective combination view of a first embodiment of the heat dissipation device of the present invention;

fig. 2 is a combined sectional view of a first embodiment of the heat dissipating device of the present invention;

fig. 3 is a combined sectional view of a second embodiment of the heat dissipating device of the present invention;

fig. 4 is a combined sectional view of a third embodiment of the heat dissipating device of the present invention;

fig. 5 is a combined sectional view of a fourth embodiment of the heat dissipating device of the present invention;

fig. 6 is a combined sectional view of a fourth embodiment of the heat dissipating device of the present invention;

fig. 7 is a combined sectional view of a fourth embodiment of the heat dissipating device of the present invention.

Description of reference numerals: a heat sink 1; a base 11; an upper plate 111; a lower plate 112; a recess 113; a first chamber 114; a partition 115; a separation chamber 116; a single independent chamber 117; a first capillary structure 118; two-phase flow heat dissipation fins 12; a second chamber 121; a second working fluid 122; a second capillary structure 123; a first working fluid 13.

Detailed Description

The above objects, together with the structure and functional characteristics of the invention, will be best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.

Please refer to fig. 1 and fig. 2, which are a perspective combination view and a combination cross-sectional view of a heat dissipation device according to a first embodiment of the present invention, as shown in the drawings, the heat dissipation device 1 of the present invention is applied to a heat source of an electronic device that needs heat dissipation, and the heat dissipation device 1 of the present embodiment is attached to one or a plurality of heat generating elements (not shown) disposed on a board (such as a circuit board or a motherboard) of the electronic device in a contact manner, so as to dissipate heat generated by the heat generating elements. The heating element is not limited to the cpu and the display processing chip, and in specific implementations, the heating element may be selected from a transistor or a power element on a south bridge chip, a north bridge chip, or a circuit board, or other electronic elements requiring heat dissipation.

The heat dissipation device 1 includes a base 11, a plurality of two-phase flow heat dissipation fins 12 and a first working fluid 13, wherein the base 11 has an upper plate 111, a lower plate 112, a recess 113 and a first cavity 114.

The upper plate 111 and the lower plate 112 are correspondingly covered, the upper plate 111 on the upper side of the base 11 is provided with the plurality of two-phase flow heat dissipation fins 12, and the lower side of the lower plate 112 is used for being attached to the heating element to absorb heat. In the present embodiment, the recess 113 is selected to be recessed in the lower plate 112, and in other embodiments, the recess 113 may also be selected to be recessed in the upper plate 111, and the upper plate, the

lower plate

111, 112 and the recess 113 together define the first chamber 114. The first chamber 114 has a plurality of partitions 115 to partition the first chamber 114 into a plurality of partitioned chambers 116, in this embodiment, the plurality of partitions 115 are selectively formed on the lower plate 112, in other embodiments, the plurality of partitions 115 are selectively formed on the upper plate 111. The plurality of separation chambers 116 are not communicated with each other, the plurality of separation chambers 116 are provided with the first working fluid 13, and the first working fluid 13 is selected from any one of a gas-phase fluid and a gas-liquid two-phase change fluid.

A second chamber 121 is formed inside each of the two-phase flow heat dissipation fins 12, and the plurality of separation chambers 116 and the plurality of second chambers 121 are communicated with each other. The plurality of two-phase flow heat dissipation fins 12 are formed by a machining method, which is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation. The base 11 and the plurality of two-phase flow heat dissipation fins 12 are made of any one of gold, silver, copper alloy, aluminum alloy, commercially pure titanium, titanium alloy, and stainless steel. In the present embodiment, the two-phase heat dissipation fins 12 are shown as being bonded to the upper plate 111, the two-phase heat dissipation fins 12 are bonded to the upper plate 111 by, for example, but not limited to, welding, embedding, clipping, gluing or buckling, and in other embodiments, the substrate 11 and the two-phase heat dissipation fins 12 are integrally formed by 3D printing.

Rely on the utility model discloses this design, this base 11 downside absorbs the heat after the heat, this first working fluid 13 absorbs the heat of this base 11 in this plural number partition cavity 116, this first working fluid 13 reaches the effect of samming to the horizontal direction transmission rapidly with the heat, this first working fluid 13 gets into this plural number second cavity 121 simultaneously, the first working fluid 13 that gets into this plural number second cavity 121 passes the heat toward the vertical direction rapidly to rely on this plural number two-phase flow heat radiation fins 12 to absorb the heat of this first working fluid 13 and outside radiation heat dissipation, consequently the utility model discloses a heat abstractor 1 can not receive the coefficient of heat conductivity influence of material itself in the environment of narrow and small space, low wind flow, reaches the efficiency of the radiating effect of preferred.

Please refer to fig. 3, which is a combined cross-sectional view of a second embodiment of the heat dissipation device of the present invention and assisted by fig. 1 to fig. 2, as shown in the figures, part of the structure and function of the present embodiment are the same as those of the first embodiment, and therefore will not be described herein again, but the present embodiment is different from the first embodiment in that the plurality of separation chambers 116 are not communicated with the plurality of second chambers 121, the plurality of second chambers 121 are provided with a second working fluid 122, and the second working fluid 122 is selected from one of a gas-phase fluid and a gas-liquid two-phase fluid.

After the heat is absorbed by the lower side of the base 11, the first working fluid 13 absorbs the heat of the base 11 in the plural separation chambers 116, and simultaneously the heat of the base 11 is absorbed by the lower sides of the plural two-phase flow heat dissipation fins 12, the heat is rapidly transferred to the vertical direction by the second working fluid 122, and the heat of the second working fluid 122 is absorbed by the plural two-phase flow heat dissipation fins 12 and is radiated to the outside, because the plural separation chambers 116 and the plural second chambers 122 are not communicated with each other, after the heat is rapidly transferred to the horizontal direction by the first working fluid 13 to achieve the effect of uniform temperature, the distance that the first working fluid 13 is condensed and returned to the lower plate 112 from the upper plate 111 is short, so that the first working fluid 13 with the lower temperature of the heating element can be rapidly provided for absorbing heat.

Please refer to fig. 4, which is a cross-sectional view of a third embodiment of the heat dissipation device of the present invention and additionally refer to fig. 3, as shown in the figure, part of the structure and function of the present embodiment are the same as those of the second embodiment, and therefore will not be described herein again, but the difference between the present embodiment and the second embodiment is that the first chamber 114 is a single independent chamber 117 without a partition 116, and the single independent chamber 117 is not communicated with the plurality of second chambers 121.

The first working fluid 13 in the single independent chamber 116 can rapidly transfer heat to the surrounding horizontal direction to achieve the effect of temperature equalization.

Referring to fig. 5 to 7, which are combined cross-sectional views of a fourth embodiment of the heat dissipation device of the present invention and referring to fig. 1 to 4, as shown in the figures, part of the structure and function of the present embodiment are the same as those of the first, second, and third embodiments, and therefore will not be described herein again, but the difference between the present embodiment and the first, second, and third embodiments is that the first chamber 114 is provided with a first capillary structure 118, the plurality of second chambers 121 are respectively provided with a second capillary structure 123, and the first capillary structure, the second capillary structure 118, and the second capillary structure 123 are respectively selected to be any one of a mesh body, a fiber body, a structure body with porous property, or a groove, or any combination thereof.

When the plurality of separation chambers 116 and the plurality of second chambers 121 are communicated with each other, the first and second

capillary structures

118, 123 are connected to each other by capillary (as shown in fig. 5), and the first and second

capillary structures

118, 123 can rapidly return the condensed first working fluid 13 in the plurality of second chambers 121 to the plurality of separation chambers 116. When the plurality of separation chambers 116 (shown in fig. 6) or the single independent chamber 117 (shown in fig. 7) is not communicated with the plurality of second chambers 121, the first capillary structure 118 may rapidly flow back the first working fluid 13 condensed on the upper plate 111 to the lower plate 112, and the second capillary structure 123 may rapidly flow back the second working fluid 122 condensed on the second chambers 121 to the lower sides of the second chambers 121.

The term "capillary connection" refers to the connection of the porous structure of the first capillary structure 118 to the porous structure of the second capillary structure 123, so that the capillary force can be transmitted or extended from the first capillary structure 118 to the second capillary structure 123.

In an alternative embodiment, the second capillary structure 123 may be omitted, and the first and second working

fluids

13 and 122 may flow back by gravity.

In another alternative embodiment, a coating film (not shown) is correspondingly disposed on the inner walls of the first and

second chambers

114, 121 or on one of the first and second

capillary structures

118, 123 or on the inner walls of the first and

second chambers

114, 121 and the first and second

capillary structures

118, 123, so as to increase the hydrophilicity of the inner walls of the first and

second chambers

114, 121, the first and second

capillary structures

118, 123, thereby achieving the effect of rapidly and intensively reflowing the first and second working

fluids

13, 122.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A heat dissipating device, comprising:

2. The heat dissipating device of claim 1, wherein: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively and concavely arranged on any one of the upper plate and the lower plate, the upper plate, the lower plate and the concave part jointly define the first chamber, and the plurality of separating parts are selectively formed on any one of the upper plate and the lower plate.

3. The heat dissipating device of claim 1, wherein: the substrate and the plurality of two-phase flow heat dissipation fins are integrally formed.

4. The heat dissipating device of claim 1, wherein: the first chamber is provided with a first capillary structure, and the first capillary structure is selected from any one of a grid body, a fiber body, a structural body with porous property, a groove or any combination thereof.

5. The heat dissipating device of claim 4, wherein: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one of a grid body, a fiber body, a structure body with porous property, a groove or any combination thereof.

6. The heat dissipating device of claim 5, wherein: the coating film is correspondingly arranged on the inner walls of the first cavity and the second cavity or any one of the first capillary structure and the second capillary structure or the inner walls of the first cavity and the second cavity and the first capillary structure and the second capillary structure.

7. The heat dissipating device of claim 1, wherein: the first working fluid is selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

8. The heat dissipating device of claim 1, wherein: the plurality of separation chambers are not communicated with the plurality of second chambers, and the plurality of second chambers are provided with a second working fluid.

9. The heat dissipating device of claim 8, wherein: the second working fluid is selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

10. The heat dissipating device of claim 1, wherein: the plurality of two-phase flow heat dissipation fins are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, ejection and inflation processing.

11. The heat dissipating device of claim 1, wherein: the base and the plurality of two-phase flow heat dissipation fins are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.

12. A heat dissipating device, comprising:

13. The heat dissipating device of claim 12, wherein: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate, and the upper plate, the lower plate and the concave part jointly define the first chamber.

14. The heat dissipating device of claim 12, wherein: the substrate and the plurality of heat dissipation members are integrally formed.

15. The heat dissipating device of claim 12, wherein: the first chamber is provided with a first capillary structure, and the first capillary structure is selected from any one of a grid body, a fiber body, a structural body with porous property, a groove or any combination thereof.

16. The heat dissipating device of claim 15, wherein: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one of a grid body, a fiber body, a structure body with porous property, a groove or any combination thereof.

17. The heat dissipating device of claim 16, wherein: the coating film is correspondingly arranged on the inner walls of the first cavity and the second cavity or any one of the first capillary structure and the second capillary structure or the inner walls of the first cavity and the second cavity and the first capillary structure and the second capillary structure.

18. The heat dissipating device of claim 12, wherein: the first working fluid and the second working fluid are selected from one of gas-phase fluid and gas-liquid two-phase change fluid.

19. The heat dissipating device of claim 12, wherein: the heat sink is formed by mechanical processing, which is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation.

20. The heat dissipating device of claim 12, wherein: the base and the plurality of heat sinks are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.