CN110881263A - Heat dissipation unit and heat dissipation device thereof - Google Patents
Heat dissipation unit and heat dissipation device thereof Download PDFInfo
- Publication number
- CN110881263A CN110881263A CN201911101241.4A CN201911101241A CN110881263A CN 110881263 A CN110881263 A CN 110881263A CN 201911101241 A CN201911101241 A CN 201911101241A CN 110881263 A CN110881263 A CN 110881263A
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- China
- Prior art keywords
- plate body
- heat dissipation
- groove
- heat
- grooves
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention provides a heat radiation unit and a heat radiation device thereof, comprising a base and a heat radiation unit, wherein the base is provided with a first side and a second side, the heat radiation unit is provided with at least one heat radiation fin which is correspondingly arranged on the first side, the heat radiation fin is formed by a first plate body and a second plate body which are correspondingly covered, the first plate body and the second plate body jointly define a plurality of independent channels, the plurality of independent channels are mutually communicated, and a working fluid is filled in the plurality of independent channels.
Description
Technical Field
The present invention relates to a heat dissipation unit and a heat dissipation device thereof, and more particularly, to a heat dissipation unit and a heat dissipation device thereof capable of greatly increasing heat dissipation efficiency.
Background
The computing efficiency of the existing mobile equipment, personal computer, server, communication chassis or other systems or devices is improved, and the heat generated by the internal computing unit is also improved, so that the heat dissipation unit is relatively more needed to assist the heat dissipation of the existing mobile equipment, personal computer, server, communication chassis or other systems or devices.
Generally, a heat dissipation device (heat sink) commonly used in the industry is composed of a substrate and a plurality of heat dissipation fins disposed on one side of the substrate, wherein the heat dissipation fins on the substrate must be relatively increased in size and height to obtain a larger heat dissipation area and further dissipate the heat inside each device under the condition that the heat generated inside each device is gradually increased along with the improvement of the operation performance of each device, however, the heat dissipation efficiency of the heat dissipation fins is gradually reduced along with the increase of the height of the heat dissipation fins, thereby reducing the overall heat dissipation efficiency of the heat dissipation device.
As described above, the prior art has the following disadvantages:
1. the heat dissipation efficiency is extremely poor;
2. the heat sink is oversized.
Therefore, how to solve the above-mentioned problems and disadvantages is a direction in which the inventors of the present invention and related manufacturers engaged in the industry need to research and improve.
Disclosure of Invention
Accordingly, the present invention is directed to a heat dissipation unit that substantially increases heat dissipation efficiency.
A secondary objective of the present invention is to provide a heat dissipation unit capable of greatly reducing the volume of the heat dissipation device.
A secondary objective of the present invention is to provide a heat dissipation device with greatly increased heat dissipation efficiency.
A secondary objective of the present invention is to provide a heat dissipation device that can greatly reduce the volume of the heat dissipation device.
To achieve the above object, the present invention provides:
a heat dissipation unit is provided with at least one heat dissipation fin, and is characterized in that: the heat dissipation fin is formed by covering a first plate body and a second plate body correspondingly, the first plate body and the second plate body jointly define a plurality of independent channels, the independent channels are mutually communicated, and a working fluid is filled in the independent channels.
The heat dissipation unit, wherein: the heat dissipation fins are also provided with at least one groove, the groove is formed on any one of the first plate body or the second plate body, and the first plate body and the second plate body are correspondingly covered so that the groove forms the independent flow channel.
The heat dissipation unit, wherein: the heat dissipation fin is further provided with a plurality of grooves, the grooves are further provided with at least one first groove portion and at least one second groove portion, the first groove portion is formed in the first plate body, the second groove portion is formed in the second plate body, and the first plate body and the second plate body are covered and combined to enable the first groove portion and the second groove portion to form the independent flow channel.
The heat dissipation unit, wherein: the grooves are formed by machining, which is stamping.
The heat dissipation unit, wherein: the grooves are formed on the first plate body and the second plate body in a length staggered arrangement mode, or the grooves are formed on the first plate body and the second plate body in a straight side-by-side mode or in an inclined side-by-side mode.
The heat dissipation unit, wherein: at least one capillary structure is further arranged on the inner wall of each independent flow channel, and the capillary structure is any one of a grid body, a fiber body, a structure body with porous property and a groove.
The heat dissipation unit, wherein: the coating film is correspondingly arranged on the inner wall of the independent flow passage or the capillary structure or on the inner wall of the independent flow passage and the capillary structure at the same time.
The heat dissipation unit, wherein: the heat dissipation fins are also provided with a plurality of ribs which are arranged in a transverse or longitudinal direction or in a staggered way and are used for increasing the structural strength of the heat dissipation fins.
A heat dissipating device, comprising:
a base having a first side and a second side; and
the heat dissipation unit is provided with at least one heat dissipation fin which is correspondingly arranged on the first side, the heat dissipation fin is formed by correspondingly covering a first plate body and a second plate body, the first plate body and the second plate body jointly define a plurality of independent channels, the independent channels are mutually communicated, and a working fluid is filled in the independent channels.
The heat dissipation device, wherein: the heat dissipation fins are further provided with at least one groove, the groove is formed in any one of the first plate body or the second plate body, and the first plate body and the second plate body are correspondingly covered so that the groove is formed into the independent flow channel.
The heat dissipation device, wherein: the heat dissipation fin is further provided with a plurality of grooves, each groove is further provided with a first groove portion and a second groove portion, the first groove portions are formed on the first plate body, the second groove portions are formed on the second plate body, and the first plate body and the second plate body are covered and combined to enable the first groove portions and the second groove portions to form the independent flow channels.
The heat dissipation device, wherein: the grooves are formed by machining, which is stamping.
The heat dissipation device, wherein: the grooves are formed on the first plate body and the second plate body in a length staggered arrangement mode, or the grooves are formed on the first plate body and the second plate body in a straight side-by-side mode or in an inclined side-by-side mode.
The heat dissipation device, wherein: at least one capillary structure is further arranged on the inner wall of each independent flow channel, and the capillary structure is any one of a grid body, a fiber body, a structure body with porous property and a groove.
The heat dissipation device, wherein: the coating film is correspondingly arranged on the inner wall of the independent flow passage or the capillary structure or on the inner wall of the independent flow passage and the capillary structure at the same time.
The heat dissipation device, wherein: the heat dissipation fins are also provided with a plurality of ribs which are arranged in a transverse or longitudinal direction or in a staggered way and are used for increasing the structural strength of the heat dissipation fins.
The heat dissipation device, wherein: at least one caulking groove is formed on the first side of the base, and the radiating fins are correspondingly and fixedly arranged in the caulking groove.
The heat dissipation device, wherein: the heat dissipation unit is fixedly arranged in the embedding groove in any one mode of embedding, riveting, welding, gluing or buckling.
By the structural design of the invention, through the structural design of arranging the independent flow channels communicated with each other in the radiating fins, when the second side of the base is contacted with a heat source, the heat generated by the heat source is transferred from the second side to the first side of the base and then transferred to the heat sink fins, then the heat is transferred into the independent flow channels to enable the working fluid in the independent flow channels communicated with each other to form a gas state, and the gas working fluid can rapidly bring the heat to the other end far away from the heat source, and the gaseous working fluid is condensed into liquid working fluid, and then the liquid working fluid is reflowed to the radiating fins close to one end of the heat source by virtue of at least one capillary structure arranged on the inner wall of the independent flow channel, therefore, the heat dissipation fins with gas-liquid two-phase continuous circulation are formed, the effect of fast heat dissipation is achieved, and the heat dissipation efficiency of the heat dissipation device can be greatly improved.
In addition, through the structural design of the independent flow channels communicated with each other in the radiating fins, the problem of extremely poor radiating efficiency caused by overlarge volume of the radiating fins of the existing radiating device can be solved.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipating unit of the present invention;
FIG. 2 is a cross-sectional view of a first embodiment of the heat dissipating unit of the present invention;
FIG. 3 is an exploded perspective view of a second embodiment of the heat dissipating unit of the present invention;
FIG. 4 is a perspective assembly view of a second embodiment of the heat dissipating unit of the present invention;
FIG. 5 is a cross-sectional view of a second embodiment of the heat dissipating unit of the present invention;
FIG. 6 is a perspective view of a third embodiment of the heat dissipating unit of the present invention;
FIG. 7 is a perspective assembly view of the first and second embodiments of the heat dissipation device of the present invention;
fig. 8 is a cross-sectional view of a second embodiment of the heat sink of the present invention.
Description of reference numerals: a heat dissipation unit 2; heat dissipating fins 20; a first plate body 201; a second plate body 202; the independent flow passage 21; a recess 210; the first groove portion 211; a second groove portion 212; a working fluid 22; a capillary structure 23; a filling port 24; the ribs 25; a base 3; a first side 30; a caulking groove 300; a second side 31; a heat sink 4; a heat source 5.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and fig. 2, which are an exploded perspective view and a cross-sectional view of a first embodiment of a heat dissipation unit of the present invention, as shown in the drawings, a heat dissipation unit 2 has at least one heat dissipation fin 20, the heat dissipation fin 20 is formed by a first plate 201 and a second plate 202 that are covered with each other, in this embodiment, at least one groove 210 is formed on the first plate 201 (of course, the groove 210 may also be formed on the second plate 202, in this embodiment, the first plate 201 is used as an illustration), in more detail, the first plate 201 of the heat dissipation fin 20 of this embodiment has a groove 210 structure, and the second plate 202 is a flat plate (without the groove 210 structure); the first plate body 201, the second plate body 201, 202 are correspondingly covered to make the groove 210 of the first plate body 201 and the second plate body 202 form a plurality of independent flow channels 21, the independent flow channels 21 are mutually communicated, and a working fluid 22 is filled in the independent flow channels 21 for air-liquid circulation, in addition, the inner wall of each independent flow channel 21 can be further provided with at least one capillary structure 23 (please refer to fig. 1 and fig. 2) or a coating film, the capillary structure 23 can be selected from a grid body or a fiber body or a structure body or a groove with porous property, so as to increase the efficiency of air-liquid circulation of the working fluid 22 in the independent flow channel 21.
The coating film can be arranged on the inner wall of the independent flow passage 21 or on one or both of the capillary structures 23.
Referring to fig. 3, 4 and 5, a perspective view and a cross-sectional view of a second embodiment of the heat dissipation unit of the present invention are shown, the difference between the second embodiment and the first embodiment is that at least one first groove 211 is formed on the first plate 201 of the heat dissipation fin 20, and at least one second groove 212 is formed on the second plate 202, that is, the first plate 201 and the second plate 202 are both formed with a groove structure, the first plate 201 and the second plate 202 are correspondingly covered to make the first groove 211 and the second groove 212 form the independent channel 21, and the independent channel 21 is also filled with the working fluid 22.
The manufacturing process of the heat sink 20 is substantially as follows: first, one of the first and second plate bodies 201, 202 is machined to form the groove 210, or the first and second plate bodies 201, 202 are machined to form the first and second grooves 211, 212, the groove 210 or the first and second grooves 211, 212 are formed by the machining through a stamping process, the first and second plate bodies 201, 202 are correspondingly covered and fixed by welding or other combination methods, so that the groove 210 formed on the first plate body 201 or the second plate body 202 (or the first groove 211 formed on the first plate body 201 and the second groove 212 formed on the second plate body 202) forms the structure of the independent flow channel 21, the independent flow channel 21 is vacuumized, and the working fluid 22 (which may be selected from ammonia, water, hydrocarbon, or other refrigerant) is filled into a filling port 24 (as shown in fig. 4) of the heat dissipation fin 20 Any of the above) and then sealing the periphery of the plurality of grooves 210 and the filling opening 24, thereby forming the heat dissipation fin 20 structure of the present invention.
It should be noted that the shape, size, arrangement and arrangement direction of the concave groove 210 (or the first and second groove portions 211 and 212) are not particularly limited, and include: the grooves 210 may be formed on the first and second plate bodies 201 and 202 in different staggered arrangements, or the arrangement direction of the grooves 210 may be formed on the first and second plate bodies 201 and 202 in a straight or oblique parallel manner (as shown in fig. 4), which can be adjusted according to the needs of the user; as long as the groove 210 (or the first and second grooves 211 and 212) is formed by the mutual covering of the first and second plates 201 and 202 to form the aforementioned structure of the independent flow channel 21, the structure is included in the scope of the present invention, as will be described in the first paragraph; in addition, the inner wall of the independent flow channel 21 and the capillary structure or a part between the inner wall and the capillary structure may be further provided with the aforementioned coating (not shown) to increase the efficiency of gas-liquid circulation of the working fluid 22 in the independent flow channel 21.
Referring to fig. 6, a perspective view of a third embodiment of the heat dissipating unit of the present invention is different from the first embodiment in that the heat dissipating fins 20 further form a plurality of ribs 25, the plurality of ribs 25 are not limited in number and arrangement direction (may be arranged in a horizontal or vertical direction or in a staggered manner), and are adjusted according to the requirement of a user, and the structure of the ribs 25 is used to increase the structural strength of the heat dissipating fins 20, so that the heat dissipating fins 20 are not easily deformed.
Please refer to fig. 7, which is a perspective assembly diagram of the first and second embodiments of the heat dissipation device of the present invention, the heat dissipation device 4 is formed by matching the heat dissipation unit 2 with a base 3, the base 3 has a first side 30 and a second side 31, the first side 30 forms at least one caulking groove 300, the heat dissipation fins 20 are correspondingly fixed in the caulking groove 300, and the fixing manner of the heat dissipation fins 20 can be selected to be fixed in the caulking groove 300 by using any one of the methods of tabling, riveting, welding, gluing, or clamping.
Referring to fig. 8, by the structural design of the present invention, through the structural design of the independent channels 21 disposed in the heat dissipating fins 20 and mutually communicated with each other, when the second side 31 of the base 3 contacts a heat source 5, the heat generated by the heat source 5 is transferred from the second side 31 to the first side 30 of the base 3 and then transferred to the heat dissipating fins 20, and then the heat is transferred to the independent channels 21, so that the working fluid 22 in the independent channels 21 is in a gaseous state, and the gaseous working fluid 22 rapidly carries the heat to the other end away from the heat source 5, and after the gaseous working fluid 22 is condensed into the liquid working fluid 22, the liquid working fluid 22 flows back to the heat dissipating fins 20 near one end of the heat source 5 by the capillary structure 23 disposed on the inner wall of the independent channels 21, so as to form the heat dissipating fins 20 with a gas-liquid two-phase continuous circulation, the effect of quick heat release is achieved, and the heat dissipation efficiency of the heat dissipation device 4 can be greatly improved.
In addition, the structural design of the independent flow channel 21 in the heat dissipation fins 20 of the invention can also improve the problem of extremely poor heat dissipation efficiency caused by the overlarge volume of the heat dissipation fins 20 of the existing heat dissipation device 4, and the invention utilizes the structural design of the independent flow channel 21 with gas-liquid two phases, so that the heat dissipation device 4 has small volume but does not influence the heat dissipation efficiency and is even better than the existing heat dissipation device.
As described above, the present invention has the following advantages over the prior art:
1. the heat dissipation efficiency is greatly improved;
2. the volume of the heat dissipation device is greatly reduced.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (18)
1. A heat dissipation unit is provided with at least one heat dissipation fin, and is characterized in that: the heat dissipation fin is formed by covering a first plate body and a second plate body correspondingly, the first plate body and the second plate body jointly define a plurality of independent channels, the independent channels are mutually communicated, and a working fluid is filled in the independent channels.
2. The heat-dissipating unit of claim 1, wherein: the heat dissipation fins are also provided with at least one groove, the groove is formed on any one of the first plate body or the second plate body, and the first plate body and the second plate body are correspondingly covered so that the groove forms the independent flow channel.
3. The heat-dissipating unit of claim 1, wherein: the heat dissipation fin is further provided with a plurality of grooves, the grooves are further provided with at least one first groove portion and at least one second groove portion, the first groove portion is formed in the first plate body, the second groove portion is formed in the second plate body, and the first plate body and the second plate body are covered and combined to enable the first groove portion and the second groove portion to form the independent flow channel.
4. The heat dissipating unit of claim 2 or 3, wherein: the grooves are formed by machining, which is stamping.
5. The heat dissipating unit of claim 2 or 3, wherein: the grooves are formed on the first plate body and the second plate body in a length staggered arrangement mode, or the grooves are formed on the first plate body and the second plate body in a straight side-by-side mode or in an inclined side-by-side mode.
6. The heat-dissipating unit of claim 1, wherein: at least one capillary structure is further arranged on the inner wall of each independent flow channel, and the capillary structure is any one of a grid body, a fiber body, a structure body with porous property and a groove.
7. The heat-dissipating unit of claim 6, wherein: the coating film is correspondingly arranged on the inner wall of the independent flow passage or the capillary structure or on the inner wall of the independent flow passage and the capillary structure at the same time.
8. The heat-dissipating unit of claim 1, wherein: the heat dissipation fins are also provided with a plurality of ribs which are arranged in a transverse or longitudinal direction or in a staggered way and are used for increasing the structural strength of the heat dissipation fins.
9. A heat dissipating device, comprising:
a base having a first side and a second side; and
the heat dissipation unit is provided with at least one heat dissipation fin which is correspondingly arranged on the first side, the heat dissipation fin is formed by correspondingly covering a first plate body and a second plate body, the first plate body and the second plate body jointly define a plurality of independent channels, the independent channels are mutually communicated, and a working fluid is filled in the independent channels.
10. The heat dissipating device of claim 9, wherein: the heat dissipation fins are further provided with at least one groove, the groove is formed in any one of the first plate body or the second plate body, and the first plate body and the second plate body are correspondingly covered so that the groove is formed into the independent flow channel.
11. The heat dissipating device of claim 9, wherein: the heat dissipation fin is further provided with a plurality of grooves, each groove is further provided with a first groove portion and a second groove portion, the first groove portions are formed on the first plate body, the second groove portions are formed on the second plate body, and the first plate body and the second plate body are covered and combined to enable the first groove portions and the second groove portions to form the independent flow channels.
12. The heat dissipating device of claim 10 or 11, wherein: the grooves are formed by machining, which is stamping.
13. The heat dissipating device of claim 10 or 11, wherein: the grooves are formed on the first plate body and the second plate body in a length staggered arrangement mode, or the grooves are formed on the first plate body and the second plate body in a straight side-by-side mode or in an inclined side-by-side mode.
14. The heat dissipating device of claim 9, wherein: at least one capillary structure is further arranged on the inner wall of each independent flow channel, and the capillary structure is any one of a grid body, a fiber body, a structure body with porous property and a groove.
15. The heat dissipating device of claim 14, wherein: the coating film is correspondingly arranged on the inner wall of the independent flow passage or the capillary structure or on the inner wall of the independent flow passage and the capillary structure at the same time.
16. The heat dissipating device of claim 9, wherein: the heat dissipation fins are also provided with a plurality of ribs which are arranged in a transverse or longitudinal direction or in a staggered way and are used for increasing the structural strength of the heat dissipation fins.
17. The heat dissipating device of claim 9, wherein: at least one caulking groove is formed on the first side of the base, and the radiating fins are correspondingly and fixedly arranged in the caulking groove.
18. The heat dissipating device of claim 17, wherein: the heat dissipation unit is fixedly arranged in the embedding groove in any one mode of embedding, riveting, welding, gluing or buckling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910010181.9A CN109640594A (en) | 2019-01-03 | 2019-01-03 | Heat-sink unit and its radiator |
| CN2019100101819 | 2019-01-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110881263A true CN110881263A (en) | 2020-03-13 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910010181.9A Pending CN109640594A (en) | 2019-01-03 | 2019-01-03 | Heat-sink unit and its radiator |
| CN201911101241.4A Pending CN110881263A (en) | 2019-01-03 | 2019-11-12 | Heat dissipation unit and heat dissipation device thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910010181.9A Pending CN109640594A (en) | 2019-01-03 | 2019-01-03 | Heat-sink unit and its radiator |
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| CN (2) | CN109640594A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446398A (en) * | 2019-07-19 | 2019-11-12 | 深圳兴奇宏科技有限公司 | Radiator |
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2019
- 2019-01-03 CN CN201910010181.9A patent/CN109640594A/en active Pending
- 2019-11-12 CN CN201911101241.4A patent/CN110881263A/en active Pending
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| CN109640594A (en) | 2019-04-16 |
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