CN106686942B

CN106686942B - Combined structure of heat radiator

Info

Publication number: CN106686942B
Application number: CN201510760962.1A
Authority: CN
Inventors: 蓝文基
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2015-11-10
Filing date: 2015-11-10
Publication date: 2023-03-24
Anticipated expiration: 2035-11-10
Also published as: CN106686942A

Abstract

The invention provides a heat sink composite structure, comprising at least one heat pipe and a first and second heat radiation fin group, wherein the heat pipe is provided with a heat absorption part, at least one heat radiation part and a bending part connecting the heat absorption part and the heat radiation part, the heat radiation part is sleeved in a plurality of through holes of the second heat radiation fin group, the bending part is sleeved in a plurality of slots of the first heat radiation fin group, and a closed side in the slots is contacted and attached along a bending outer side of the bending part, thereby improving the utilization rate of the heat pipe and further achieving the effect of increasing the heat radiation area and the heat radiation efficiency.

Description

Combined structure of heat radiator

[ technical field ] A method for producing a semiconductor device

The present invention relates to a heat dissipation device assembly, and more particularly, to a heat dissipation device assembly having increased heat dissipation area and improved heat pipe utilization.

[ background of the invention ]

Generally, electronic components generate heat during operation, and particularly, with the recent technological progress, after the functions and performance of electronic products are greatly improved, the heat generated inside the electronic components is greatly increased.

The conventional heat dissipation device generally includes a heat conduction base, a plurality of heat pipes and a plurality of heat dissipation fins, wherein the bottom side of the heat conduction base is attached to a heat generating element (such as a processor or a graphic display), the heat pipes are U-shaped heat pipes, and each heat pipe includes a horizontal heat absorption portion and a heat dissipation portion extending from two ends of the heat absorption portion. The heat absorbing part of the heat pipes is embedded on the other side of the opposite bottom side of the heat conducting base, and the heat dissipating fins are connected to the heat dissipating part of the heat pipes in a one-to-one mode. Therefore, the heat generated by the heating element is firstly conducted to the heat conducting seat, then the heat conducting seat conducts the heat to the heat pipe, finally the heat is conducted to the heat dissipation fins by the heat pipe, and then the heat energy is dissipated to the air by the heat exchange between the surfaces of the heat dissipation fins and the surrounding air.

Although the known heat dissipation device can achieve the heat dissipation effect, the known heat dissipation device still has some defects in actual use, that is, when the heat dissipation fins are combined with the heat pipes, the heat pipes can only be connected in a penetrating way at the straight pipe (namely the heat dissipation part), but the problem that the design of the penetrating heat dissipation fins cannot be overcome at the bent part between the heat absorption part and the heat dissipation part in the prior art, so that the space of the bent part of the heat pipe is limited and cannot be effectively utilized, and only the space is reserved for allowing air to pass through, so that the utilization rate of the heat pipes is reduced, and the heat dissipation area cannot be increased is caused. In addition, due to the power increase of the heating element, the heat dissipation area has been saturated in the limited space, so that the overall heat dissipation performance of the heat dissipation device is affected.

[ summary of the invention ]

To effectively solve the above problems, the present invention provides a heat sink assembly structure for increasing the utilization rate of heat pipes and increasing the heat dissipation area.

Another objective of the present invention is to provide a heat sink assembly structure with enhanced heat dissipation performance.

To achieve the above object, the present invention provides a heat dissipation device assembly structure, comprising: at least one heat pipe having a heat absorbing part, at least one heat radiating part, and a bent part connecting the heat absorbing part and the heat radiating part; a first heat dissipation fin group, which is provided with a plurality of stacked first heat dissipation fins, wherein the first heat dissipation fins are provided with a plurality of slots, the bending part is sleeved in the slots, the slots define an open side and a closed side opposite to the open side, and the closed side is attached along a bent outer side of the bending part; and a second heat radiation fin group, opposite to the first heat radiation fin group, the second heat radiation fin group has a plurality of second heat radiation fins which are stacked mutually, the second heat radiation fins have a plurality of through holes, and the heat radiation part is sleeved in the corresponding through holes.

The slots are formed along the extending direction of the bending part corresponding to the heat pipe, and the partial outer contour line of the horizontal section of the bending part of the heat pipe is consistent with the closed side contour line of the corresponding slots.

The edges of the first radiating fins are bent downwards and extend to form folded edges, the folded edges of the first radiating fins are mutually stacked and connected to form the first radiating fin group, and the folded edges of the first radiating fins in the grooves jointly form the closed side.

The heat pipe has a horizontal section and a vertical section perpendicular to the horizontal section, the horizontal section is a heat absorption part, and the vertical section is a heat release part.

The heat pipe comprises a base, wherein the base is provided with at least one groove, the groove penetrates through the base, a heat absorption part of the heat pipe is accommodated in the groove, and the upper side and the lower side of the heat absorption part are flush with and correspond to the top surface and the bottom surface of the base.

The length of the slots is greater than the length of the through holes.

Through the structural design of the invention, the effects of improving the utilization rate of the heat pipe and increasing the heat dissipation area can be effectively achieved, and the overall heat dissipation efficiency of the heat dissipation device combination structure can be further effectively improved.

[ description of the drawings ]

FIG. 1 is an exploded perspective view of an embodiment of the present invention;

FIG. 2 is a perspective view of an assembly of an embodiment of the present invention;

FIG. 3 is a top view of a horizontal cross-sectional combination of a slot of a first set of heat sink fins and a heat pipe bend according to an embodiment of the present invention;

FIG. 4 is another top view of the combination of the slot of the first set of heat sink fins and the horizontal cross section of the curved portion of the heat pipe according to the embodiment of the present invention.

The components represented by the respective numbers in the drawings are:

combined structure of radiator 82301

Heat pipe 823011

Heat absorbing part 8230111

Heat radiating part 8230112

Bending portion 8230113

Capillary structure 8230115

8230in the first set of heat dissipating fins 13

8230131 parts of first heat dissipation fin

Grooving 82301311

Open side 82301312

Sealing side 82301313

Flanging 823080 and 1315

8230and 14 parts of a second heat dissipating fin group

8230141 second heat dissipation fin

Perforation 82301411

Base 8230; 15

Groove 8230151

[ detailed description ] A

The above objects of the present invention, together with the structural and functional features thereof, will be best understood from the following description taken in conjunction with the accompanying drawings.

The invention provides a heat dissipation device combination structure which is applied to and arranged on a relative heating element (such as a processor or a graphic processor) to quickly dissipate heat of the relative heating element. Referring to fig. 1 and fig. 2, there are shown exploded and assembled perspective views of the embodiment of the present invention, with the assistance of fig. 3. The heat dissipation device assembly 1 includes at least one heat pipe 11, a first heat dissipation fin set 13, a second heat dissipation fin set 14, and a base 15, where the heat pipe 11 is illustrated as 4 heat pipes 11 in this embodiment, but not limited thereto, and in a specific implementation, the number of the heat pipes 11 may be one or more than two. The heat pipe 11 is substantially U-shaped, and has a heat absorbing part 111, a heat radiating part 112 parallel to the left and right, and a curved part 113 connecting the heat absorbing part 111 and the heat radiating part 112, wherein the heat absorbing part 111 is a flat horizontal section, and the heat radiating part 112 is a vertical section perpendicular to the horizontal section. Wherein a capillary structure 115 (such as sintered powder, metal grid, groove or fiber) is disposed in the heat pipe 11, and a working fluid (such as pure water or methanol) is filled in the heat pipe.

The base 15 is plate-shaped and has at least one groove 151, and the groove 151 is illustrated as 4 grooves 151 in the embodiment, but is not limited thereto. The grooves 151 penetrate the base 15, the heat absorbing portions 111 of the heat pipes 11 are accommodated in the grooves 151 and fixedly connected to the base 15 by welding or gluing, etc., so as to absorb heat from the base 15, the upper and lower sides of the heat absorbing portions 111 are flush with the top and bottom surfaces of the base 15, and the heat dissipating portion 112 is located above the base 15 and substantially perpendicular to the base 15.

The first heat dissipating fin set 13 is formed by stacking a plurality of first heat dissipating fins 131, the first heat dissipating fins 131 have a plurality of slots 1311, the slots 1311 are formed along the extending direction of the bending portions 113 corresponding to the heat pipes 11, the bending portions 113 of the heat pipes 11 are sleeved in the slots 1311, the slots 1311 define an open side 1312 and a closed side 1313 corresponding to the open side 1312, the closed side 1313 is attached along a bent outer side of the bending portion 113, and a part of the outer contour of the horizontal cross section of the bending portion 113 of the heat pipe 11 is consistent with a part of the contour of the closed side 1313 attached to the corresponding slot 1311 (as shown in fig. 3), for example, in fig. 4, 8 horizontal cross section dotted lines are the outer contour of the closed side 1313 of the bending portion 112 located above the adjacent heat dissipating portion 112 toward the lower portion 111, so that the heat dissipating portion 113 of each horizontal cross section is attached to the closed side of the corresponding slot 1311, and the heat dissipating fins 113 are capable of increasing the heat dissipating area of the heat pipe and the heat dissipating device, thereby increasing the heat dissipating efficiency of the heat pipe 11. In the present embodiment, after two stacked first heat dissipation fins 131 are directly abutted against the curved portions 113 of the heat pipes 11 through a fixture, the curved outer sides of the curved portions 113 of the heat pipes 11 are connected to the contact portions of the closed sides 1313 through a welding method, so as to achieve the effects of saving assembly time, facilitating assembly and being fast.

The two opposite edges of the plurality of first heat fins 131 are bent downward to form folded edges 1315, the folded edges 1315 of the first heat fins 131 are stacked and connected to form the first heat fin set 13, the folded edges 1315 of the first heat fins 131 in the slots 1311 together form a large-area closed side 1313, and the large-area closed side 1313 contacts and attaches to the curved outer side of the opposite curved portion 113, so that heat absorbed by the curved portion 113 of the heat pipe 11 can be quickly conducted to the first heat fins 131 for outward heat dissipation.

The second heat dissipating fin set 14 is connected to the first heat dissipating fin set 13 and located above the first heat dissipating fin set 13, the second heat dissipating fin set 14 has a plurality of stacked second heat dissipating fins 141, the second heat dissipating fins 141 have a plurality of through holes 1411, the heat releasing portion 112 is sleeved in the corresponding through holes 1411, and the length of the slot 1311 is greater than the length of the through holes 1411.

Therefore, through the structural design that the heat releasing portion 112 and the bending portion 113 of the heat pipe 11 of the present invention can be attached and connected to the first and second heat dissipating

fin sets

13, 14, the utilization rate of the heat pipe 11 is increased, the heat dissipating area is increased, and the overall heat dissipating efficiency is further effectively enhanced.

In an alternative embodiment, a pressing plate (not shown) having a plurality of holes for passing the heat pipe 11 may be additionally disposed on the top surface of the base 15, and the heat absorbing portion 111 of the heat pipe 11 accommodated in the base 15 may be pressed and fixed by the pressing plate, thereby fixing the heat pipe 11 on the base 15.

In the above embodiment, the heat pipe 11 of the present invention is not limited to the above-mentioned substantially U-shaped, and the heat pipe 11 of the L-shape may be selected to provide the heat absorbing portion 111 (i.e. the flat horizontal section), the heat radiating portion 112 perpendicular to the heat absorbing portion 111 (i.e. the vertical section perpendicular to the horizontal section), and the bending portion 113 connecting the heat absorbing portion 111 and the heat radiating portion 112, so the present invention uses the L-shaped heat pipe 11, and in this case, the combination of the heat pipe 11, the base 15, and the first and second heat radiating

fin groups

13 and 14 may be the combination of the U-shaped heat pipe 11 in the above-mentioned embodiment. In addition, the heat absorbing portion 111 of the heat pipe 11 can be directly attached to the heat generating element without the base 15.

In an alternative embodiment, a fastener (not shown) may be additionally disposed on the top surface of the base 15, and the fastener is located on the top surface of the base 15 between the two first heat dissipation fins 131, so that the heat dissipation device assembly 1 can be more firmly combined on the heat generating element through the fastener.

However, the above-described preferred embodiments of the present invention are only examples of the present invention, and all changes in the method, shape, structure and apparatus using the above-described method, shape, structure and apparatus of the present invention are all included in the scope of the claims of the present invention.

Claims

1. A heat sink assembly, comprising:

at least one heat pipe having a heat absorbing part, at least one heat radiating part, and a bent part connecting the heat absorbing part and the heat radiating part;

the first radiating fin group is provided with a plurality of stacked first radiating fins, the edges of the first radiating fins are bent downwards and extend to form a folded edge, the folded edges of the first radiating fins are stacked and connected with each other to form the first radiating fin group, the first radiating fins are provided with a plurality of slots, the bending part is sleeved in the slots, the slots define an open side and a closed side opposite to the open side, the folded edges of the first radiating fins in the slots form the closed side together, and the closed side is attached along a bent outer side of the bending part; and

a second heat radiation fin group opposite to the first heat radiation fin group, the second heat radiation fin group has plural second heat radiation fins stacked, the second heat radiation fins have plural through holes, the heat radiation part is sleeved in the corresponding through holes.

2. The heat dissipating device assembly of claim 1, wherein the slots are formed along the extension direction of the bending portion of the heat pipe, and the outer contour of the horizontal section of the bending portion of the heat pipe is identical to the contour of the closed side portion of the slots.

3. The heat dissipating device assembly of claim 1, wherein the heat pipe has a horizontal section and a vertical section perpendicular to the horizontal section, the horizontal section being a heat absorbing portion and the vertical section being a heat dissipating portion.

4. The heat dissipating device assembly of claim 1, further comprising a base having at least one groove extending therethrough, wherein the heat absorbing portion of the heat pipe is received in the groove, and wherein the upper and lower sides of the heat absorbing portion are flush with the top and bottom surfaces of the base.

5. The heat sink assembly as recited in claim 2 wherein the length of said slot is greater than the length of said perforations.

6. The heat sink assembly according to claim 1, wherein a pressure plate is disposed on the top surface of the base, the pressure plate having a plurality of holes for the heat pipe to pass through.

7. The heat sink assembly according to claim 1, wherein the heat pipe has one of a U-shape and an L-shape.

8. The heat sink assembly as claimed in claim 1, wherein a fastener is disposed on the top surface of the base, the fastener being disposed on the top surface of the base between the first plurality of heat sink fins.