JP3170757U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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JP3170757U
JP3170757U JP2011004133U JP2011004133U JP3170757U JP 3170757 U JP3170757 U JP 3170757U JP 2011004133 U JP2011004133 U JP 2011004133U JP 2011004133 U JP2011004133 U JP 2011004133U JP 3170757 U JP3170757 U JP 3170757U
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heat
transfer table
groove portion
heat transfer
heat pipe
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崇賢 ▲黄▼
崇賢 ▲黄▼
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崇賢 ▲黄▼
崇賢 ▲黄▼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements

Abstract

【課題】ずれが発生しにくい放熱装置を提供する。【解決手段】放熱装置は、伝熱台１と、伝熱台１に当接する少なくとも一つのヒートパイプ２とを備える。そのうち、伝熱台１は、ヒートパイプ２が組み立てられる底面１０、底面１０に凹状に設けられる溝部１２、および溝部１２の内壁から突出して一体に形成される固定リブ１２０を有する。ヒートパイプ２は、伝熱台１の溝部１２の内壁に当接する。固定リブ１２０は、ヒートパイプ２が溝部１２の内壁と当接する面を押し付けて変形させ、固定リブ１２０に対応する固定切欠きを形成する。これにより、ヒートパイプ２は、溝部１２の内部においてずれが発生しにくい。【選択図】図４Disclosed is a heat dissipating device that is less likely to be displaced. A heat radiating device includes a heat transfer table and at least one heat pipe that contacts the heat transfer table. Among them, the heat transfer table 1 includes a bottom surface 10 on which the heat pipe 2 is assembled, a groove portion 12 provided in a concave shape on the bottom surface 10, and a fixing rib 120 that is integrally formed to protrude from the inner wall of the groove portion 12. The heat pipe 2 abuts against the inner wall of the groove portion 12 of the heat transfer table 1. The fixing rib 120 presses and deforms the surface on which the heat pipe 2 comes into contact with the inner wall of the groove portion 12 to form a fixing notch corresponding to the fixing rib 120. As a result, the heat pipe 2 is less likely to be displaced inside the groove 12. [Selection] Figure 4

Description

本考案は、放熱装置に関し、特にヒートパイプおよび伝熱台の組立体に関する。   The present invention relates to a heat dissipation device, and more particularly to an assembly of a heat pipe and a heat transfer table.

ヒートパイプ（Ｈｅａｔ ｐｉｐｅ）と伝熱台との結合を利用し、伝熱台の伝熱効率を向上させることは、もはや従来の放熱器の一般的な手段または構成の一つである。さらに、従来技術によれば、半田部材を使用し、ヒートパイプを伝熱台に取り付けるか、または略楕円形の弓状溝部を利用し、ヒートパイプが接触する表面の変形を形成し、ヒートパイプを伝熱台の溝部の内部に結合した後のずれや脱落などの問題を防止する。   Using a combination of a heat pipe and a heat transfer table to improve the heat transfer efficiency of the heat transfer table is no longer a common means or configuration of a conventional radiator. Furthermore, according to the prior art, a solder member is used, and the heat pipe is attached to the heat transfer base, or a substantially elliptical arcuate groove is used to form a deformation of the surface with which the heat pipe comes into contact. This prevents problems such as slippage and dropout after coupling the inside of the groove of the heat transfer table.

しかし、前述とおり、ヒートパイプと伝熱台とは、半田部材などの接着剤で固定しておかないと、ヒートパイプと伝熱台との接触面が弓状のため、移動または脱落などのずれ問題が発生するおそれがある。さらに、結合するヒートパイプが複数であるとき、溝部が略楕円形で形成されるため、各ヒートパイプ相互の間隔が大きくなる。複数のヒートパイプに適用した場合、各ヒートパイプを有効に集めることができない。一方、半田部材などの接着剤を使用して固定する場合、半田部材が少なすぎて接着できない、または半田部材が多すぎて溢れだすなどの問題がある。そのほか、従来の方法は、半田部材を使用し、製造コストがアップし、理想的と言えない。   However, as described above, if the heat pipe and the heat transfer table are not fixed with an adhesive such as a solder member, the contact surface between the heat pipe and the heat transfer table is arched, so it will not move or drop. Problems may occur. Furthermore, when there are a plurality of heat pipes to be coupled, the groove portion is formed in an approximately elliptical shape, so that the interval between the heat pipes increases. When applied to a plurality of heat pipes, each heat pipe cannot be collected effectively. On the other hand, when fixing using an adhesive such as a solder member, there is a problem that the solder member is too small to be bonded, or there are too many solder members to overflow. In addition, the conventional method uses a solder member, increases the manufacturing cost, and is not ideal.

本考案は、このような点に鑑みて創作されたものであり、その目的は、半田部材を使用せず、ずれが発生しにくく、複数のヒートパイプを有効的に集めることが可能な放熱装置を提供することにある。   The present invention was created in view of the above points, and a purpose of the present invention is to use a heat dissipation device that does not use a solder member, is less likely to be displaced, and can effectively collect a plurality of heat pipes. Is to provide.

前述目的を達成するため、本考案による放熱装置は、伝熱台と、伝熱台に当接する少なくとも一つのヒートパイプと、を備える。そのうち、伝熱台は、ヒートパイプが組み立てられる組立面、組立面に凹状に設けられる溝部、および溝部の内壁から突出して一体に形成される固定リブを有する。ヒートパイプは、伝熱台の溝部の内壁に当接し、溝部の内壁と当接する面が固定リブに押し付けられることで変形し、固定リブに対応する固定切欠きが形成される。これにより、ヒートパイプは溝部の内部においてずれが発生しにくい。   In order to achieve the above-mentioned object, a heat radiating device according to the present invention includes a heat transfer table and at least one heat pipe that comes into contact with the heat transfer table. Among them, the heat transfer table has an assembly surface on which the heat pipe is assembled, a groove portion provided in a concave shape on the assembly surface, and a fixing rib that is integrally formed protruding from the inner wall of the groove portion. The heat pipe abuts against the inner wall of the groove portion of the heat transfer table, and the surface that abuts the inner wall of the groove portion is deformed by being pressed against the fixing rib, so that a fixing notch corresponding to the fixing rib is formed. As a result, the heat pipe is less likely to be displaced inside the groove.

本考案の第１実施例による放熱装置の斜視図である。1 is a perspective view of a heat dissipation device according to a first embodiment of the present invention. 本考案の第１実施例による放熱装置のヒートパイプと伝熱台とが組合せ前の模式図その一である。The heat pipe of the heat radiating device according to the first embodiment of the present invention and the heat transfer table are schematic diagrams before the combination. 本考案の第１実施例による放熱装置のヒートパイプと伝熱台とが組合わせ前の模式図その二である。The heat pipe of the heat radiating device by 1st Example of this invention and the heat-transfer stand are the schematic diagrams before the combination. 本考案の第１実施例による放熱装置のヒートパイプと伝熱台とが組合わせ後の模式図である。It is the schematic diagram after the heat pipe and heat-transfer stand of the thermal radiation apparatus by 1st Example of this invention are combined. 本考案の第２実施例による放熱装置のヒートパイプと伝熱台とが組合わせ前の模式図である。It is the schematic diagram before the heat pipe and heat-transfer stand of the thermal radiation apparatus by 2nd Example of this invention are combined. 本考案の第２実施例による放熱装置のヒートパイプと伝熱台とが組合わせ後の模式図である。It is the schematic diagram after the heat pipe and heat-transfer stand of the thermal radiation apparatus by 2nd Example of this invention are combined. 本考案の第３実施例による放熱装置のヒートパイプと伝熱台が組合わせ前の模式図である。It is the schematic diagram before the heat pipe and heat-transfer stand of the thermal radiation apparatus by 3rd Example of this invention are combined. 本考案の第３実施例による放熱装置のヒートパイプと伝熱台とが組合わせ後の模式図である。It is the schematic diagram after the heat pipe and heat-transfer stand of the thermal radiation apparatus by 3rd Example of this invention are combined. 本考案の第４実施例による放熱装置のヒートパイプと伝熱台とが組合わせ後の模式図である。It is the schematic diagram after the heat pipe and heat-transfer stand of the thermal radiation apparatus by 4th Example of this invention are combined.

以下、本考案の実施例による放熱装置を図面に基づいて説明する。ただし、添付図面は参考と説明を目的とし、本考案になんらの制限を加わるものではない。   Hereinafter, a heat dissipation device according to an embodiment of the present invention will be described with reference to the drawings. However, the attached drawings are for reference and explanation and do not limit the present invention.

（第１実施例）
図１を参照する。本考案の第１実施例による放熱装置は、伝熱台１と、伝熱台１に当接する少なくとも一つのヒートパイプ（Ｈｅａｔ ｐｉｐｅ）２と、を備える。ヒートパイプ２を介して伝熱台１に結合し、伝熱台１の伝熱効果を向上させる。 (First embodiment)
Please refer to FIG. The heat radiating device according to the first embodiment of the present invention includes a heat transfer table 1 and at least one heat pipe 2 in contact with the heat transfer table 1. It couple | bonds with the heat-transfer stand 1 via the heat pipe 2, and the heat-transfer effect of the heat-transfer stand 1 is improved.

伝熱台１は、銅またはアルミなど良好な伝熱性を有する部材からなる。例えば、放熱器として、熱源が発生する台に貼り合わせる。さらに、伝熱台１は、熱源に貼り合わせる少なくとも一つの底面１０と、底面１０と反対側の上面１１と、を備える。本実施例において、ヒートパイプ２は、伝熱台１の底面１０に結合する。伝熱台１は、上面１１が複数のヒートシンク３に結合し、放熱器を構成することができる。   The heat transfer table 1 is made of a member having good heat transfer properties such as copper or aluminum. For example, as a radiator, it is bonded to a table where a heat source is generated. Furthermore, the heat transfer table 1 includes at least one bottom surface 10 to be bonded to a heat source, and an upper surface 11 opposite to the bottom surface 10. In the present embodiment, the heat pipe 2 is coupled to the bottom surface 10 of the heat transfer table 1. The heat transfer table 1 can have a top surface 11 coupled to a plurality of heat sinks 3 to form a radiator.

図２を合わせて参照する。伝熱台１の底面１０に、ヒートパイプ２と対応する数の溝部１２が凹状に設けられる。しかし、溝部１２は、伝熱台１の底面１０に設けられることに限らない。各溝部１２の断面は、半円形よりやや大きい弓状を呈する。ヒートパイプ２をそれぞれ各溝部１２に圧入する。各溝部１２の内壁に、内面から少なくとも一つの固定リブ１２０が突出して一体に形成される。各固定リブ１２０は、それぞれ対応する溝部１２の長さ方向に沿って伸びるように形成される。   Please refer to FIG. A number of grooves 12 corresponding to the heat pipes 2 are provided in a concave shape on the bottom surface 10 of the heat transfer table 1. However, the groove 12 is not limited to being provided on the bottom surface 10 of the heat transfer table 1. The cross section of each groove 12 has an arcuate shape that is slightly larger than the semicircular shape. Each heat pipe 2 is press-fitted into each groove 12. At least one fixing rib 120 protrudes from the inner surface of the inner wall of each groove portion 12 and is integrally formed. Each fixing rib 120 is formed so as to extend along the length direction of the corresponding groove portion 12.

引き続き、図３と図４とを合わせて参照する。各ヒートパイプ２を対応する溝部１２に圧入したとき、ヒートパイプ２は、溝部１２の内部に進入し、溝部１２内部の固定リブ１２０に対向して互いにあてがいを形成する。これにより、固定リブ１２０は、ヒートパイプ２の対応する面を押し付けて変形させ、固定切欠き２０を形成する。固定リブ１２０は、ヒートパイプ２の対応する面を圧迫する。これにより、ヒートパイプ２と伝熱台１との接触関係は、弓状接触関係ではない。ヒートパイプ２が伝熱台１の溝部１２からの緩みや脱落などの問題を有効的に防止することができる。そのほか、ヒートパイプ２は、半田部材を使用しなくても、伝熱台１と結合し、かつ相互に直接的に接触（すなわち、その間に半田部材を使用しない）することができる。このほか、ヒートパイプ２が溝部１２に進入していない部分は、圧迫を受けて受熱面２１を形成する。受熱面２１と伝熱台１の底面１０とが同じ高さになり、熱源との接触に便利である。   Subsequently, FIG. 3 and FIG. 4 will be referred to together. When each heat pipe 2 is press-fitted into the corresponding groove portion 12, the heat pipe 2 enters the inside of the groove portion 12 and faces the fixed rib 120 inside the groove portion 12 to form an assignment with each other. Thereby, the fixing rib 120 presses and deforms the corresponding surface of the heat pipe 2 to form the fixing notch 20. The fixing rib 120 presses the corresponding surface of the heat pipe 2. Thereby, the contact relationship between the heat pipe 2 and the heat transfer table 1 is not an arcuate contact relationship. Problems such as loosening or dropping off of the heat pipe 2 from the groove 12 of the heat transfer table 1 can be effectively prevented. In addition, the heat pipe 2 can be coupled to the heat transfer table 1 and can be in direct contact with each other (that is, no solder member is used therebetween) without using a solder member. In addition, the portion where the heat pipe 2 has not entered the groove portion 12 is pressed to form the heat receiving surface 21. The heat receiving surface 21 and the bottom surface 10 of the heat transfer table 1 have the same height, which is convenient for contact with the heat source.

（第２実施例）
図５と図６とを参照する。各溝部１２の固定リブ１２０は、複数であっても良い。複数の固定リブ１２０は、溝部１２の内壁において、互いに離間して均一に配列されても良い。これにより、ヒートパイプ２と伝熱台１との固定効果を向上させることができる。 (Second embodiment)
Please refer to FIG. 5 and FIG. There may be a plurality of fixing ribs 120 in each groove 12. The plurality of fixing ribs 120 may be arranged uniformly on the inner wall of the groove portion 12 so as to be separated from each other. Thereby, the fixing effect of the heat pipe 2 and the heat transfer table 1 can be improved.

（第３実施例）
図７と図８とを参照する。対応する溝部１２の片側の内縁に沿って、または各溝部１２の両側の内縁に沿って、固定リブ１２０を設置することができる。これにより、前述の目的を達成することができる。ヒートパイプ２は、溝部１２の内側に当接する。また、固定リブ１２０は、ヒートパイプ２が溝部１２からの脱落を有効的に防止することができる。 (Third embodiment)
Please refer to FIG. 7 and FIG. The fixing rib 120 can be installed along the inner edge on one side of the corresponding groove 12 or along the inner edge on both sides of each groove 12. Thereby, the above-mentioned purpose can be achieved. The heat pipe 2 contacts the inside of the groove 12. Further, the fixing rib 120 can effectively prevent the heat pipe 2 from dropping from the groove portion 12.

（第４実施例）
図９を参照する。前述第２実施例および第３実施例をさらに一体に整合することによって、前述２つの実施例の長所と効果を兼ね合わせることができる。 (Fourth embodiment)
Please refer to FIG. By further integrating the second and third embodiments, the advantages and effects of the two embodiments can be combined.

このように、前述の構成と組み合わせによって、本考案による放熱装置が得られる。   Thus, the heat radiating device according to the present invention can be obtained in combination with the above-described configuration.

以上、本考案はこのような実施例に限定されるものではなく、考案の趣旨を逸脱しない範囲において、種々の形態で実施することができる。   As mentioned above, this invention is not limited to such an Example, In the range which does not deviate from the meaning of invention, it can implement with a various form.

１ ・・・伝熱台
１０ ・・・底面
１１ ・・・上面
１２ ・・・溝部
１２０・・・固定リブ
２ ・・・ヒートパイプ
２０ ・・・固定切欠き
２１ ・・・受熱面
３ ・・・ヒートシンク DESCRIPTION OF SYMBOLS 1 ... Heat-transfer stand 10 ... Bottom 11 ... Upper surface 12 ... Groove 120 ... Fixed rib 2 ... Heat pipe 20 ... Fixed notch 21 ... Heat receiving surface 3 ... ·heatsink

Claims (10)

ヒートパイプが組み立てられる組立面、前記組立面に凹状に設けられる溝部、および前記溝部の内壁から突出して設けられる固定リブを有する伝熱台と、
前記伝熱台の前記溝部に圧入され、前記溝部の内壁と当接する面が前記固定リブに押し付けられることで変形し、前記固定リブに対応する固定切欠きが形成されるヒートパイプと、
を備えることを特徴とする放熱装置。 An assembly surface on which a heat pipe is assembled, a groove provided in a concave shape on the assembly surface, and a heat transfer table having a fixing rib provided protruding from an inner wall of the groove,
A heat pipe that is press-fitted into the groove portion of the heat transfer table and is deformed by pressing a surface that contacts the inner wall of the groove portion against the fixed rib, and a fixed notch corresponding to the fixed rib is formed;
A heat dissipating device comprising: 前記伝熱台の前記組立面は下向きに配置される面であることを特徴とする請求項１記載の放熱装置。   The heat radiating device according to claim 1, wherein the assembly surface of the heat transfer table is a surface disposed downward. 前記伝熱台の前記溝部の断面は、半円形より大きい弓状を呈することを特徴とする請求項１記載の放熱装置。   The heat radiating device according to claim 1, wherein a cross section of the groove portion of the heat transfer table has an arc shape larger than a semicircular shape. 前記溝部の前記固定リブは、複数であることを特徴とする請求項１記載の放熱装置。   The heat radiating device according to claim 1, wherein the fixing rib of the groove portion is plural. 複数の前記固定リブは、前記溝部の内壁において、互いに離間して形成されることを特徴とする請求項４記載の放熱装置。   The heat dissipating device according to claim 4, wherein the plurality of fixing ribs are formed apart from each other on the inner wall of the groove. 前記固定リブは、対応する前記溝部の長さ方向に沿って伸びるように形成されることを特徴とする請求項１、請求項４、および請求項５のいずれか一項に記載の放熱装置。   6. The heat dissipation device according to claim 1, wherein the fixing rib is formed so as to extend along a length direction of the corresponding groove portion. 前記固定リブは、対応する前記溝部の片側の内縁に沿って設けられることを特徴とする請求項１、請求項４、および請求項５のいずれか一項に記載の放熱装置。   6. The heat dissipation device according to claim 1, wherein the fixing rib is provided along an inner edge on one side of the corresponding groove portion. 前記固定リブは、対応する前記溝部の両側の内縁に沿って設けられることを特徴とする請求項１、請求項４、および請求項５のいずれか一項に記載の放熱装置。   6. The heat dissipation device according to claim 1, wherein the fixing rib is provided along inner edges on both sides of the corresponding groove portion. 6. 前記ヒートパイプは、複数であり、
前記伝熱台の前記溝部は、前記ヒートパイプと同じ数であることを特徴とする請求項１記載の放熱装置。 The heat pipe is plural,
The heat radiating device according to claim 1, wherein the number of the groove portions of the heat transfer table is the same as that of the heat pipes. 前記ヒートパイプと前記伝熱台とは、当接することを特徴とする請求項１記載の放熱装置体。   The heat dissipation device body according to claim 1, wherein the heat pipe and the heat transfer table are in contact with each other.
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