TW200825356A - Improvement on heat exchanger having a heat pipe - Google Patents

Improvement on heat exchanger having a heat pipe Download PDF

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Publication number
TW200825356A
TW200825356A TW097104163A TW97104163A TW200825356A TW 200825356 A TW200825356 A TW 200825356A TW 097104163 A TW097104163 A TW 097104163A TW 97104163 A TW97104163 A TW 97104163A TW 200825356 A TW200825356 A TW 200825356A
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TW
Taiwan
Prior art keywords
heat
heat pipe
base
pipe
pleated
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Application number
TW097104163A
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Chinese (zh)
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TWI359254B (en
Inventor
chong-xian Huang
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chong-xian Huang
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Application filed by chong-xian Huang filed Critical chong-xian Huang
Priority to TW097104163A priority Critical patent/TW200825356A/en
Priority to JP2008001556U priority patent/JP3142012U/en
Priority to US12/049,642 priority patent/US20090194255A1/en
Priority to DE202008006122U priority patent/DE202008006122U1/en
Publication of TW200825356A publication Critical patent/TW200825356A/en
Application granted granted Critical
Publication of TWI359254B publication Critical patent/TWI359254B/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention relates to an improvement on a heat exchanger having a heat pipe. It consists of a heat exchanger module, a base plate and a plurality of heat pipes. Heat exchanger fins with pleats at their root are fit in grooves on upper surface of the base plate and tightly riveted. On bottom surface of the base seat, a plurality of grooves are disposed to receive heat pipes. Heat pipes in grooves are pressed such that the flatness of the base plate surface is kept and the fit is tight. This invention provides a close contact between heat pipe and IC heat source. Efficient heat dissipation is resulted due to passing through the heat pipe.

Description

200825356 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種附熱管的散熱器改良設計，其係在 散熱籍片末端設屢褶根部，以供熱管可對應置入並壓擠整 平而緊配後合’同時於熱管底面形成—M平部，使熱管的 壓平部可與晶體貼觸，直接通過熱管快速散熱。 【先前技術】 白知附有齡的散熱器，其係包括散熱模組、底座與 :個以上的熱管所組成，散熱模組係由複數散熱鰭片（或 稱U)堆1排列而構成，並在散熱模組穿置結合一個 i ^的熱& :以組成―附有熱管的散熱器。前述習知散熱 二_焊接媒介’將散熱鰭片與底座或是散熱 二熱德叫接結合，但若是齡與底座係不同材質 續即需事先電鑛化學鎳處理，故組合裝配均複雜 孰其成本n ’不良率亦高，不僅底座與散熱模組或 心吕的熱傳導效率會降低，也不符合環保原則。 μ 4矣附有勢管的散熱器，其係利用底座的底面 ==㈣觸，故晶體熱源是先通過底座再被傳 數（ ？、、、板組’然而，鋁質或銅質底座的熱傳導係 管卻|法在Γΐ小於熱管的熱傳導係數⑽），但熱 效率較=:日，即接觸晶體熱源，仍必須倚賴熱傳導 反而被拖慢；=因此’整體的熱源傳送速度 【發明内容】 200825356 本發明之主要目的，乃在於提供一種附熱管的散熱器 改良設計，係包括散熱模組、底座及一個以上的熱管所組 成，各散熱鰭片係以末端壓褶根部鉚合嵌入底座上端面， 且熱管係對應置入底座下端表面預設的嵌溝再施壓擠整平 ，以呈緊配嵌入，並同時在熱管底面形成一與底座下端表 面呈平整切齊的壓平部，故熱管可在第一時間與晶體熱源 直接接觸，以能通過高熱傳導係數的熱管直接快速的傳導 熱溫，達到迅速散熱效果。 § 本發明之次要目的，乃在於提供一種附熱管的散熱器 改良設計，其係在底座下端表面開設一個以上的嵌溝，以 供熱管對應置入再壓擠整平，使熱管被壓平的管身係鑲嵌 緊配於嵌溝而呈現相對匹配的形狀，故其結合非常穩固。 本發明之又一目的，乃在於提供一種附熱管的散熱器 改良設計，所述散熱模組之散熱鰭片與底座、熱管均為緊 配組成，故遇熱膨脹時整體結合將更為緊配穩固，能提高 其導熱、散熱效率，整體組成亦完全不需要錫焊接合，亦 ⑩無需使用電鍍鎳加工處理，故不會污染環境，更符合環保 要求。 、 本發明之另一目的，乃在於提供一種附熱管的散熱器 改良設計，所述散熱器鰭片末端的壓褶根部，其係經過對 摺或彎折加工而形成一具有選定形狀的壓褶根部，該壓褶 根部的形狀不拘，例如可將根部翻轉倒折而直接貼觸壓褶 成型，或是將根部翻轉倒折後再貼觸壓褶呈L形、三角形 、多角形、倒T形，或是將根部翻轉倒折後再貼觸壓褶呈 200825356 制 捲曲形’均屬簡易加I可行’故實施時無特定 的形狀限 【實施方式】 茲依附圖實施例將本發明結構特徵及其他 洋細說明如下： 、 散教^^圖至第三圖所示，係將本發明所為「附熱管的 設計，係包括散熱模組1、底座2及-個以 上的熱管3所組成，其中·· ，熱模組！，係由複數個散熱鰭^相鄰間隔而堆疊 ‘：：，的散熱座體’而散熱鰭片11設有貫穿孔111， 緊配貫穿’各散熱籍片1係可為相同或不相 根部m 亚在各散熱鰭片η末端形成一呈對摺狀的屢褶 底座2，係-銘材、銅材或其他導熱材料的金屬座體 褶根ϋ面!T擠形模成形設有與複數個散熱籍片1的麗 _王相對匹配的複數個嵌槽2卜或更進一步於嵌 ， 土囬巧立日叹有一斷面可呈V形的長凹槽22 '$亚4底座2的下端表面23開設-個以上的嵌溝24 ’用以提供敎管3斜座耍 配嵌人· ”、、 +應置入後再施予壓擠整平，而形成緊 一個以上的熱管3 ’為兩端均封閉的彎管體（如圖所 )’管體内部並填裝工作液，管體具有兩個 延伸臂 31、32，JL φ 沾 2ΐ ,, ΒΛ 116/、肀的一延伸臂31係緊配貫穿各散熱鰭片 的貝牙孔in ’另一延伸臂32則對應置入底座2下端表 200825356 面23的嵌溝24並通過壓擠整平而緊配喪人，同時於熱管3 底面形成=壓平部33，使壓平部33與底座2的下端表面23 係平正切μ ’且壓平部33係顯露於底座2的下端表面23 ; 利用上述構件，即可將散熱鰭片11末端的壓褶根部112 鉚合故入底座2的上端面，並使熱管3置人底座2下端表 面=的嵌溝24後再㈣整平㈣成—壓平部％，故可利用 熱管3的壓平部33在第-時間與晶體熱源直接接觸，以能 通過高熱傳導係數的熱管3直接快速的進行熱源傳導，達200825356 IX. Description of the invention: [Technical field of the invention] The present invention relates to an improved design of a heat sink with a heat pipe, which is provided with a pleat root at the end of the heat radiating film, so that the heat pipe can be correspondingly placed and pressed and leveled And the tight fit and the same 'formed at the bottom of the heat pipe - M flat part, so that the flattened part of the heat pipe can be in contact with the crystal, and the heat is quickly dissipated directly through the heat pipe. [Prior Art] Baizhi has an age-old radiator, which comprises a heat dissipation module, a base and more than one heat pipe, and the heat dissipation module is composed of a plurality of heat dissipation fins (or U) stacks 1 arranged. And the heat dissipation module is placed in combination with an i ^ heat & : to form a heat sink with a heat pipe attached. The above-mentioned conventional heat-dissipating two-welding medium combines the heat-dissipating fins with the base or the heat-dissipating heat. However, if the age and the base system are different, the material needs to be treated with electro-chemical nickel in advance, so the combination assembly is complicated. The cost n' defect rate is also high, and not only the heat transfer efficiency of the base and the heat dissipation module or the heart is lowered, but also the environmental protection principle is not met. μ 4矣 radiator with attached potential tube, which uses the bottom surface of the base == (four) to touch, so the crystal heat source is first passed through the base and then transferred (?,,, plate group ' However, aluminum or copper base The heat conduction system is less than the heat transfer coefficient of the heat pipe (10), but the thermal efficiency is lower than the day: that is, the contact with the crystal heat source must still be slowed down by the heat conduction; = therefore the overall heat source transmission speed [invention] 200825356 The main object of the present invention is to provide an improved heat sink design with a heat pipe, which comprises a heat dissipation module, a base and one or more heat pipes, and each of the heat dissipation fins is riveted into the upper end surface of the base with a pleated root end. The heat pipe is correspondingly inserted into the groove of the lower end surface of the base and then pressed and leveled to be tightly fitted, and at the same time, a flat portion which is flush with the lower end surface of the base is formed on the bottom surface of the heat pipe, so the heat pipe can be In the first time, it is in direct contact with the crystal heat source, so that the heat can be directly and quickly transmitted through the heat pipe with high heat transfer coefficient to achieve rapid heat dissipation. § A secondary object of the present invention is to provide an improved heat sink design with a heat pipe, which is provided with more than one recessed groove on the lower end surface of the base for the corresponding insertion and re-pressing of the heat pipe, so that the heat pipe is flattened. The tube body is inlaid tightly to the groove and presents a relatively matching shape, so the combination is very stable. Another object of the present invention is to provide an improved design of a heat sink with a heat pipe. The heat sink fins of the heat dissipation module are closely matched with the base and the heat pipe, so that the overall combination will be more tight and stable when subjected to thermal expansion. It can improve its heat conduction and heat dissipation efficiency. The overall composition also does not require tin solder joints. It also does not require the use of electroplated nickel processing, so it will not pollute the environment and meet environmental protection requirements. Another object of the present invention is to provide an improved design of a heat sink with a heat pipe, wherein the pleated root end of the heat sink fin is folded or bent to form a pleated root having a selected shape. The shape of the pleated root portion is not limited. For example, the root portion may be inverted and folded to directly contact the pleating shape, or the root portion may be inverted and folded, and then the pleats may be L-shaped, triangular, polygonal, and inverted T-shaped. Or flipping the roots upside down and then applying the crimping to the 200825356 crimping shape is a simple plus I can be implemented. Therefore, there is no specific shape limit. [Embodiment] The structural features of the present invention and other embodiments will be described with reference to the accompanying drawings. The details of the details are as follows: 、 散 教 ^ ^ 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图· The thermal module! is composed of a plurality of heat-dissipating fins adjacent to each other and stacked with a '::, heat-dissipating body' and the heat-dissipating fins 11 are provided with through-holes 111, which are closely arranged through the 'heat-dissipating pieces 1 For the same or non-intermediate m The end of the heat-dissipating fin η forms a double-folded pleated base 2, which is a metal seat pleated surface of the name material, copper material or other heat-conducting material! The T-shaped die-shaped molding is provided with a plurality of heat-dissipating pieces 1 The _ _ king is relatively matched with a plurality of grooves 2 or even further embedded, and the soil is sighed with a long groove 22 having a V-shaped cross section. The lower end surface 23 of the base 4 is opened. The above-mentioned recessed groove 24' is used to provide the slanting seat of the stern tube 3, and the slanting seat is to be fitted with the squaring, and then the squeezing and squeezing are applied, and the heat pipe 3' is formed to be closed at both ends. The curved pipe body (as shown in the figure) is filled with the working fluid inside the pipe body, and the pipe body has two extending arms 31, 32, JL φ 2 ΐ 2 ΐ, ΒΛ 116/, an extension arm 31 of the 肀 is tightly arranged The fin hole of the heat dissipating fin in 'the other extension arm 32 is correspondingly inserted into the groove 24 of the surface 23 of the lower end of the base 2 of the table 2, 200825356, and is compacted by pressing and leveling, and is formed on the bottom surface of the heat pipe 3 = flattening a portion 33, the flattening portion 33 is flattened with the lower end surface 23 of the base 2 and the flattened portion 33 is exposed on the lower end surface 23 of the base 2; The pleated root portion 112 at the end of the heat dissipation fin 11 can be riveted into the upper end surface of the base 2, and the heat pipe 3 can be placed on the lower end surface of the base 2 = the groove 24 and then (4) leveled (four) into a flattened portion, Therefore, the flattening portion 33 of the heat pipe 3 can be directly contacted with the crystal heat source at the first time, so that the heat source can be directly and quickly conducted through the heat pipe 3 having a high heat transfer coefficient.

到迅速散熱效果。 如弟四圖所示，上述散熱鰭片11的壓褶根部112於後 入底座2的嵌槽21後，係可配合長凹槽22再推擠加壓（如 第四圖之箭號方向示意），迫使底座2的嵌槽21㈣片u =稽根部m形成緊密的包置鉚合，而快速完成韓片n ”底座2的組錢合，故整體㈣極簡便快速，且处人移 固’亦完全不需使制钱、料或其他媒介減劑;^ d保原則。至於所述底座2的複數個嵌_，其係利用 預先播形模成形，故亦能省詞設溝槽的後加卫製程。 如第五圖所示，於本發明實施為兩個教 : 個熱管3係呈V字形的排列配置，令兩個熱管3的壓；部 3:=二同理，於實施為三個熱管3時，則三個執 吕士 3即可王W字形的排列配置，或使用三個以上的執管^ %’亦均疋令各熱管3_平部33皆為彼 能集中貼靠於晶體的熱源部位，達到迅速傳導熱^效: 200825356 此外，所述底座2的後溝24形狀，實施時並無特別限 制的必要，嵌溝24主要是提供熱管3可對應置入再施予壓 擠整平Μ吏熱管3被壓平的管身鑲嵌於嵌溝％而呈現與谈 溝24相對匹配_狀’因此，壓平糾的管身形狀可能隨 者鼓溝24的形狀而任意改變，但熱管3被壓平的管身轉 幻4都會形成很穩固的緊配結合，例如第六圖或第七圖等: 貫施例所示’該壓平部33的管身係可呈現為多邊形的匹配 :狀’或任意幾何形狀（如三角形等），或是其他呈規則 或不規則形狀者，皆屬可行實施。 同理可知，上述設於散熱鰭片”末端的壓褶根部ιΐ2 ’其形狀亦可適當改變，例如可將_根部112翻轉倒折 而直接貼顧褶成型，或㈣褶根部u 觸塵組形(如第八圖），或將壓摺根細翻= 後再貼觸Μ稽呈三角形（如第九圖），或可將愿褶根部⑴ 翻轉倒折後再貼觸壓褶呈倒τ形（如第十圖），或將壓褶 根部112翻轉倒折後再貼觸壓褶呈捲曲形（如第十一圖） ’有關各種塵褶根部112的屢褶形狀，實施時並無特定限 制的必要。 、 依本發明所組成的附熱管散熱器，所述散熱模組！、 底座2及熱管3均為緊g己組成，故遇熱膨脹時整體結合將 :為緊配穩固’並能提高其導熱散熱效率，整體組成亦不 需使用錫焊接合，亦無需使用電鋪加H故非常符 合環保要求，不會污染環境。 、 當然本發明係可配合習知扣具、支架或其他相應匹配 200825356 式鎖框’以便將本發明的附熱管散熱器鎖固定位 於電路基《指定位置，針料_賴 = 狀當然有所不同，惟目的始户从， ，、扣具形 產生良好的結合，或者，=力=散熱器與晶體周邊可 配置紝人細弋: 、、再加強其散熱功能，亦可增加 此陳明。 叫扇’凡此均屬已知技術，併 綜士:斤：’可知本發明所為「附熱管的散熱器改良」 二ΐ Γ態於申請前並無相同應用，手段應用符合 請新型，懇祈賜准專利為禱。力尤.、、員者，魏法申 【圖式簡單說明】 第一圖為本發明的組合立體圖。 圖為本發明中散熱模組與底座的分解示意圖。 ^二圖為本發明尚未植人熱管的狀態示意圖。 第四圖為本發明的組合斷面圖。 第五圖為本發明於側面位置的組合示音圖。 第六圖2發明針對底座嵌溝與熱管壓平部管身實施 ^ 為夕邊形匹配形狀的組合示意圖。 第七圖為本發明針對底座喪溝與熱管壓平部管身實施 為其他匹配形狀的組合示意圖。 第八圖為本發明鰭片愿褶根部第二種成型態樣的實施 示意圖。 第九圖為本發明韓片壓褶根部第三種成型態樣的實施 示意圖。 200825356 種成型態樣的實施 五種成型態樣的實 第十圖為本發明W動f根部第四 示意圖。. 第十-圖為本發明鯖Μ褶根部第 施示意圖。 【主要元件符號說明】To the rapid cooling effect. As shown in FIG. 4, the pleated root portion 112 of the heat dissipation fin 11 is inserted into the groove 21 of the base 2, and can be pushed and pressed with the long groove 22 (as indicated by the arrow direction of the fourth figure). ), forcing the groove 21 of the base 2 (four) piece u = the root portion m to form a tight package riveting, and quickly complete the combination of the Korean piece n "base 2, so the whole (four) is extremely simple and fast, and the person is moving and solid' There is also no need to reduce the production of money, materials or other media; ^ d guarantee principle. As for the plurality of embedded _ of the base 2, which is formed by using a pre-casting mold, it can also save the words after the groove As shown in the fifth figure, the present invention is implemented as two teachings: one heat pipe 3 is arranged in a V-shape, so that the pressure of the two heat pipes 3; the third part: = two is the same, implemented as When three heat pipes are used, the three squadrons can be arranged in a W-shaped arrangement, or three or more admins can be used. Depending on the heat source of the crystal, rapid conduction heat is achieved: 200825356 In addition, the shape of the rear groove 24 of the base 2 is not particularly limited in implementation, and is embedded. 24 mainly provides the heat pipe 3 can be placed correspondingly and then applied to the pressing and flattening. The heat pipe 3 is flattened and the pipe body is embedded in the groove 100, and the pipe groove 24 is relatively matched with the shape of the groove. Therefore, the tube is flattened and corrected. The shape of the body may vary arbitrarily with the shape of the sulcus 24, but the tube 4 of the heat pipe 3 that is flattened will form a very tight tight fit, such as the sixth or seventh figure: 'The body of the flattened portion 33 can be rendered as a polygonal match: a shape 'or any geometric shape (such as a triangle, etc.), or other regular or irregular shape, which is feasible. The shape of the pleated root portion ι2' provided at the end of the heat-dissipating fin may be appropriately changed. For example, the _ root portion 112 may be inverted and folded directly to form a pleat shape, or (4) the pleat root portion may be a dust-collecting group (such as the eighth figure). ), or the crimping root is finely turned = after the triangle is pressed (as shown in the ninth figure), or the pleat root (1) can be flipped and folded, and then the pleats are inverted and inverted (as shown in the tenth figure) ), or the pleated root 112 is inverted and folded, and then the pleats are curled (as shown in Figure 11). The pleated shape of the various dust pleat roots 112 is not required to be specifically limited in implementation. The heat pipe radiator according to the invention, the heat dissipation module! The base 2 and the heat pipe 3 are all tightly composed, so when combined with thermal expansion, the overall combination will be: tightly matched and can improve the heat dissipation and heat dissipation efficiency, and the whole composition does not need to be welded by tin, and there is no need to use electric welding. H is very environmentally friendly and will not pollute the environment. Of course, the present invention can be used with conventional fasteners, brackets or other corresponding matching 200825356 type lock frame 'to fix the heat pipe radiator lock of the present invention at the designated position of the circuit base, of course, the needle material _ 赖 = shape is of course different However, the purpose of the household from the,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Calling Fan's are all known technologies, and the generals: Jin: 'I know that the invention is "the heat sink with heat pipe improvement". The second application is not the same application before the application, the application of the application is in line with the new type, Granting a patent is a prayer. Li You.,, Member, Wei Fashen [Simple Description of the Drawings] The first figure is a combined perspective view of the present invention. The figure is an exploded view of the heat dissipation module and the base in the present invention. ^ 二图 is a schematic diagram of the state of the invention in which the heat pipe has not been implanted. The fourth figure is a combined sectional view of the present invention. The fifth figure is a combined sound diagram of the present invention at the side position. The sixth figure 2 is a schematic diagram of the combination of the base groove and the heat pipe flattening body body. The seventh figure is a combination diagram of the present invention for the matching structure of the base sulcus and the heat pipe flattening body. The eighth figure is a schematic view showing the implementation of the second molding aspect of the fin pleat root portion of the present invention. The ninth figure is a schematic view showing the implementation of the third molding aspect of the Korean pleated root portion of the present invention. Implementation of 200825356 moldings The tenth figure of the five moldings is the fourth schematic diagram of the roots of the W-moving f of the present invention. The tenth-figure is a schematic view of the pleated root portion of the present invention. [Main component symbol description]

1散熱模組 3熱管 111貫穿孔 21傲槽 23 下端表面 31、32延伸臂 2 底座 11散熱鰭片 Π2 壓褶根部 22 長凹槽 24诞溝 33 壓平部1 heat dissipation module 3 heat pipe 111 through hole 21 ao slot 23 lower end surface 31, 32 extension arm 2 base 11 heat sink fin Π 2 pleated root 22 long groove 24 ditches 33 flattening

Claims (1)

200825356 、申請專利範圍： 底座及 、一種附熱管的散熱器改良，係包括散熱模紐 一個以上的熱管所組成，其特徵在於·· 散熱模組，係由複數個散熱鰭片相鄰間隔而堆義 形成一塊狀的散熱座體，散熱鰭片係設有貫穿孔，^ 散熱鰭片末端並形成一呈對摺狀的壓褶根部； D 底座，係-金屬座體，其上端面係以擠形模成形 設有與複數健熱鰭片的_根部呈相對匹配的複數 個欲槽，_並在底座的下端表_設—個以上的嵌 溝， 们以上的熱管，為兩端均封閉的彎管體， 内部亚填裝工作液’管體具有兩個延伸臂，其中一^ #臂係緊配貫穿各散熱鰭片的貫穿孔，另—延伸臂則 對，置入底座下端表面的嵌溝，並通過壓擠整平而緊 配嵌入’同時於熱管底面形成一壓平部，使壓平部盥 纟座的τ端表面係平整切齊，且壓平部係顯露於底座 攀 的下端表面； 山利用上述構件，散熱鰭片末端的壓褶根部係鉚合 =底座的上端面’並使熱管置人底座下端表面的歲 溝後再昼擠整平而形成_壓平部，故可利用熱管的壓 平部在第一時間與晶體熱源直接接觸，而直接快速進 行熱源傳導及散熱。 2、如申請專利範圍第丄項所述附熱管的散熱器改良，該 缝係於各㈣間隔的相鄰壁面均設有長凹槽。 12 200825356 ^申明專利範圍第2項所述附熱管的散熱器改良，該 長凹槽的斷面係呈从形。 4、2請專利範圍第1項所述附熱管的散熱器改良，所 i個以上的熱管，各熱管的壓平部係彼此相鄰接近 5而集中貼靠於晶體的熱源部位。 請專利範圍第i項所述附熱管的散熱器改良，該 …、管壓平部的管身係鑲嵌於底座的嵌溝而呈現與嵌溝 相對匹配的形狀。 6 '，申請專利範圍第」項所述附熱管的散熱器改良，各 放熱鰭片末端的壓褶根部係翻轉倒折而貼觸壓褶成型 〇 Y、 j申明專利範圍第1項所述附熱管的散熱器改良，各 政熱讀片末端的壓褶根部係翻轉倒折後再貼觸壓褶呈 L形。 8、 申請專利範圍第1項所述附熱管的散熱器改良，各 政熱·鰭片末端的壓褶根部係翻轉倒折後再貼觸壓褶呈 三角形。 9、 如申請專利範圍第丄項所述附熱管的散熱器改良，各 政熱鰭片末端的壓褶根部係翻轉倒折後再貼觸壓褶呈 倒T形。 10、 如申請專利範圍第1項所述附熱管的散熱器改良，各 政熱鰭片末端的壓褶根部係翻轉倒折後再貼觸壓褶呈 捲曲形。 13200825356, the scope of application for patents: The base and a heat sink with a heat pipe are modified, and are composed of more than one heat pipe of a heat dissipation die. The feature is that the heat dissipation module is composed of a plurality of heat dissipation fins adjacent to each other. Forming a block-shaped heat sink body, the heat sink fins are provided with through holes, ^ heat sink fin ends and form a pleated root portion in a folded shape; D base, system-metal seat body, the upper end face is squeezed The shape forming has a plurality of grooves corresponding to the _ roots of the plurality of hot fins, and _ and at the lower end of the base _ set more than one groove, the heat pipes above are closed at both ends The curved pipe body, the inner sub-filling working fluid 'tube body has two extension arms, one of which is tightly fitted through the through-holes of the heat-dissipating fins, and the other-extension arm is paired, and is embedded in the lower end surface of the base The groove is tightly fitted by pressing and flattening to form a flattened portion on the bottom surface of the heat pipe, so that the surface of the flat end of the flattened seat is flat and the flattened portion is exposed at the lower end of the base. Surface; mountain uses the above structure The pleated root at the end of the fin is riveted = the upper end surface of the base and the heat pipe is placed on the groove of the lower end surface of the base, and then squeezed and leveled to form a flattened portion, so that the flattening of the heat pipe can be utilized The part directly contacts the crystal heat source in the first time, and directly conducts heat source conduction and heat dissipation. 2. If the heat sink of the heat pipe is improved as described in the scope of the patent application, the slit is provided with a long groove on each adjacent wall surface of each of the (four) intervals. 12 200825356 [Improved in the heat sink of the heat pipe according to Item 2 of the patent scope, the section of the long groove is in a shape of a slave. 4, 2 Please improve the radiator of the heat pipe mentioned in the first paragraph of the patent scope. For more than one heat pipe, the flattening portions of the heat pipes are adjacent to each other and are close to each other and are concentrated on the heat source portion of the crystal. The radiator of the heat pipe according to item i of the patent scope is improved, and the pipe body of the pipe flattening portion is embedded in the groove of the base to have a shape matching the groove. 6 ', the heat sink of the heat pipe mentioned in the patent application scope is improved, and the pleated roots at the ends of the heat-releasing fins are inverted and folded and the pleated molding is formed. 〇Y, j declares that the patent scope is as described in item 1 The heat pipe of the heat pipe is improved, and the pleated roots at the end of each heat reading sheet are inverted and folded, and then the pleats are L-shaped. 8. The radiator of the heat pipe mentioned in the first paragraph of the patent application is improved. The pleated roots of the fins at the end of each heat and fin are inverted and folded, and then the pleats are triangular. 9. If the heat sink with the heat pipe mentioned in the scope of the patent application is improved, the pleated roots at the end of each heat fin are inverted and folded, and then the pleats are inverted T-shaped. 10. If the radiator of the heat pipe mentioned in the first paragraph of the patent application is improved, the pleated root of the end of each heat fin is inverted and folded, and then the pleat is curled. 13
TW097104163A 2008-02-04 2008-02-04 Improvement on heat exchanger having a heat pipe TW200825356A (en)

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TW097104163A TW200825356A (en) 2008-02-04 2008-02-04 Improvement on heat exchanger having a heat pipe
JP2008001556U JP3142012U (en) 2008-02-04 2008-03-17 Radiator with heat pipe
US12/049,642 US20090194255A1 (en) 2008-02-04 2008-03-17 Cooler device
DE202008006122U DE202008006122U1 (en) 2008-02-04 2008-05-03 cooler

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US7278470B2 (en) * 2005-11-21 2007-10-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101039566A (en) * 2006-03-17 2007-09-19 富准精密工业(深圳)有限公司 Heat abstractor and electronic device using the same
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US7600558B2 (en) * 2006-08-22 2009-10-13 Shyh-Ming Chen Cooler
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US7610948B2 (en) * 2007-07-25 2009-11-03 Tsung-Hsien Huang Cooler module
US7650929B2 (en) * 2007-09-30 2010-01-26 Tsung-Hsien Huang Cooler module

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* Cited by examiner, † Cited by third party
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CN102121801A (en) * 2011-03-04 2011-07-13 东莞汉旭五金塑胶科技有限公司 Limiting assembling structure for heat pipe and heat conduction seat
DE202012010603U1 (en) 2012-10-27 2012-11-21 Asia Vital Components Co., Ltd. heatsink
CN107968078A (en) * 2017-11-14 2018-04-27 华南理工大学 Heat pipe embedded-type heat-dissipating device and its manufacture method

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JP3142012U (en) 2008-05-29
DE202008006122U1 (en) 2008-07-24
TWI359254B (en) 2012-03-01

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