M252973 修正 曰 一奉號 _ %牟 6 月 四、創作說明（1) 【新型所屬之技術領域；] 本創作係關於—種具有熱傳導接觸介面 別是指一種可降低散熱基材與熱源間接 特 【先前技術】 < ^ 4 ^ 已有許多種不同之結構被使用於對電子元 構上，目前最主要運用之方式，為利用叙擠型所^成、之= 熱體之結構，也就是運用鋁抽製之技術，直接形 f 片形狀之-種裝置’其表面形狀 發熱元件（如：中央處理器）進行設計，：m電子. =熱體1上设有略等於電子發熱元件頂面長寬之散： 10，散熱板10底面有一導熱板面12，= = = 板面1 2之相反側向外延伸机古 …、後於忒¥熱 之岐片1 1，以導敎板面狀如矩陣排列之突起 產生之熱導出，再：：：片 1 將電子發熱元件5所 出，也就是運用數倍於處=到之熱量導引排放 之表面積進行散熱之：：子；mm之岐片" 濟，製造最方便，故廣典沪、φ放了方式，在結構上最經 不會對電子發熱元件二：1 =為以鋁製成’其質輕， 來越』；ί;ϋ:ί級要之散熱效果，越 求也越來越快，也就Ϊ ^來越夕’對執行之速度，要 之時間内將電子發埶疋1 乂低熱阻之散熱器，能於最短 能維持電子發熱；：生之；量排除，* 體，並無法i到：：，用與電子發熱元件接觸之-般散熱 —二運引低^阻散熱之要求。 第5頁 SS^19213238 創作說明（2) 這疋口為驾知之電子元件散熱裝置（Heat 或cpu cooler)為減少於熱傳接觸介面（interface 〇；f hest transfer )之接觸熱阻（c〇ntact thermai raishnce )’吊用的做法為以機械加工將兩接觸面，儘量加工 ^在其Γ接觸介面處置人有-軟質填充材，如散熱膏3 、击ra π"13 &)或傳熱片4 (thermal pad )，以填 $ 之加工所造成之材料表面孔隙，但上述之做 傳（high heatnux)時熱阻仍高，但因 為銅與銘，因為車六易^ 使用。而常用之散熱基材 六旦私々 為車易取的’價格較大眾化，且於自然界之 子里車义夕，但因於銅或紹、^ ^ 、:、 微觀之顯微鏡下狀能看）整先滑加工不易（以 而增加熱阻。 心看）且極易於加工後形成氧化膜， 末或ίϊ :卜屬=:為ϊ Ϊ f介面填充材料多為氧化金屬粉 )即不佳：ί比；傳導係數“。一… 其柔軟性填充介面處之空；口差藓僅：藉軟質填充材料 之狀態如第_圓％ - 矾孔洞猎以減少熱阻。其微觀 熱膏3或^片斤：於==習知利用軟質填充材（散 ;具於政熱體1之散埶； 1 2處，而與電子元 、典 ^ 0之V…板片 第三圖為散熱體工與另一散:；： =相接觸之情形；又如 間夾著一層散熱膏 / 〇相接組合之情形；中 一般都會採用、，、、= 放熱膏能促進熱傳之進行， 二度相當大，即接觸熱阻；，需使工後之表面粗 此組合模式接觸熱阻仍大。由此=熱：降低熱阻，但 $ S知者之缺點即在於 89213238 曰 修正 四、創作說明（3) 熱阻太大。 【新型内容】 、，創作人為了提供一種降低熱阻士 以解決的知接觸熱阻大與製 …構，乃進行研發， 觸使用之問題。 兩種材料間欲平整平滑接 本創作之目的在於提供一 熱體，適用於電子發熱元件表面：散接觸介面之散 是電子散熱元件與散熱元件相.:構之相接合處或 散熱結構之散熱基材之熱源進入=熱：導介面，可於 材質，使散熱基材之表面粗糖度=入—層第二種熱傳導 滑度增加，可以有效減少軟f介（〇ughness)變小，平 而使接觸熱阻變小；也以該層孰：：量與厚度’進 元件之熱擴散（heat spreading) ^傳=材質’讓發熱 不平整而造成之接觸不良，成為n ’亦可彌補因局部 素。若採用抗氧化性較另觸熱阻之因 亦可降低介面之接觸❸且。纟不易生成氧化層皮膜， 為達成上述之目的，本創作士 表面於加工後附有一第二箱孰二構為：在散熱基材之 德對矣A 士 種…傳^材’並以散熱基材加工 二種埶傳導一散熱基材之表面相接觸，該第 蒸鑛==散熱ΐ材者，且能以電鐘、 材相接，第_藉=彳4道 ，权焊其中任一種與散熱基 〇 〇3〇t 熱傳導為薄的一層’ -般厚度在。.00卜 数λ材’猎以提高散熱基材接觸表面光度，降低散 之填充量及減少軟質 國咖 ΕΛ 細趣 Μ 祕 --——___ 第7頁 M252973 案號 89213238 $年€月Θ曰 修正 ? '創作說明（4) 填充材之填充厚度，同時增加熱擴散性，進而降低接觸熱 阻。 ’、、 【實施方式】 為使 貴審查委員能更進一步瞭解本創作為達成 目的所採取之技術、手段及功效，茲舉一較佳可行之實施 例並配合圖式詳細說明如后，相信本創作之目的、特徵與 優點，當可由此得一深入且具體之暸解。 ^ 參閱第四圖至第五圖所示 ， ，. 裡具有熱傳導 接觸介面之散熱體，在散熱基材2所形成之散熱體之 導熱板面21之表面於加工後附有一層之第二種熱傳導材 層2 2，並以散熱基材2之表面與熱源之發熱元件 ;發ΐ常d體20指為一散熱板基座，該熱源能為: X…、兀件5 (私電子發熱元件之中央處理器或 匕），也:以是指另一散熱基材所形成之電子散熱元^ 了 其中該第二種熱傳導材層2 2之埶僂婁孫教士 μ…、牛’ 2者，且第1敎：：： 傳導係數大於散熱基材 肴且第一種熱傳導材層2 2能以電鍍、蒸铲 (Physical vap〇r dep〇siti〇n)、熱壓合 ^ = f〇rglng) (ultrason.c weldlng) (brazing)、軟焊（s〇1 更斗 2相接，第二種熱傳導材 ％薄：任：種與散熱基材 0· 0 0卜〇· 030mm之間，葬以担古/、，專的層，一般厚度在 ，降低散熱基材2阿放熱基材2接觸表面光度 及減少軟質填充= 減少軟質填充材之填充量 降低接觸熱阻。 、予又’同時增加熱擴散性，進而 其中，第六圖顯示 四、創作說明（5) 2之導熱板面21為具有相者. 面加工磨平不易’加工後保；平滑盘防這些表 是在這盤凹凹凸凸之表面間會被空氣 二不:易展於 二種熱傳導材料層2 2時，，便會 、 田力上—層第 補，但第二種熱傳導材料声^太^ 。卩知之凹凸表面填 以能與電子發熱元件5 匕凹凸表面更小，所 二種熱傳導材料層22與發熱二二在第 另外，此貼附第二種熱傳導材：二2觸熱阻’ 亦可僅大於軟質之填充介面材，二其；二；；ϊ::數 *，進而降低接觸介面：：；補二充之厚 二，由於散熱膏之厚度降低，故，；ίί;?上散 知為低，所以，能大幅降：接：：：”之總和’亦比習 圖表不出另一種使用情形，為兩種散埶美 再乂第七 之狀態’這時會看到於散熱基材2上；：觸使用 2 2後以軟質填充劑之散熱膏3結合之=:種：傳：材層 7、七圖對f於第二、三圖，便能知道本！； “功】以第 外，本創作能不包含有軟質填充材質層，亦 ’另 接接觸降低熱阻之使用情形。 、 b因此產生直 、’、不上所述之結構，本創作運用設 底面之接合結構為以一接合物質處理過在f:基材 之材料被-熱阻較小之材料層取 降：…、阻大 '就疋增加一層熱傳導村料層，以該層達^ 素號 8921323^ ’再藉由散 面，與習知 因為本創作 完全不同， 面熱阻與結 阻與熱擴散 習知之傳熱， 以讓發熱元 為一完全與 明與圖式， 下述之專利 實施例與近 M252973 «創作說明⑹ ——JL£_ 由發熱元件或另—散熱元件低熱阻導埶之功用 熱體將熱排放出。本創作為一直接型：以 :J之間接型之熱傳結構，有很大之不同， 僅疋薄的一層，與習知之加上二至三層之处構 =知僅ff加熱擴散性，卻增加了接觸介 性兩種要素同時去解決熱 性，便能導引產生报好=提供優於 件等之熱量以低熱阻 習知不同之機構。 的/皿差）傳導出，故 i ^ ΐ所述為本創作之較佳實施例之詳細說 :圍=限制ϊ創！，本創作之所有範圍應以 似姓槿，比凡專利靶圍之精神與其類似變化之 姒 '、、。構，皆應包含於本創作之中。M252973 Revised Yi Feng No. _% Mou June Fourth, creation instructions (1) [Technical field to which the new type belongs;] This creation is about a kind of thermally conductive contact interface, which refers to a kind of material that can reduce the heat dissipation substrate and heat source indirectly [ [Previous technology] < ^ 4 ^ There are many different structures used in the construction of electronic elements. At present, the most important way is to use the structure of the squeeze type, which is the structure of the hot body. Aluminum drawing technology, direct f-sheet shape-a kind of device 'the surface shape of the heating element (such as: central processing unit) is designed: m electron. = The heating body 1 is provided with a length slightly equal to the top surface of the electronic heating element Wide spread: 10, the bottom surface of the heat dissipation plate 10 has a heat conducting plate surface 12, = = = the opposite side of the plate surface 1 2 extends outward from the machine ..., after the 热 ¥ hot qi sheet 1 1 to guide the plate surface For example, the heat generated by the protrusions arranged in a matrix is derived, and then ::: sheet 1 uses the surface of the electronic heating element 5 to release heat, which is to use a surface area that is several times greater than the amount of heat to guide the heat dissipation :: 子 ； mm 之 之Film " economy, the most convenient manufacturing, so Guangdian Hu, φ Put the way, the structure will not affect the electronic heating element most: 1 = made of aluminum 'its light weight, Lai Yue'; ϋ; 级: 级 grade required heat dissipation effect, more and more Fast, that is, 来 来 越 夕 'To the speed of execution, the time is required to send the electrons to a low thermal resistance heat sink, which can maintain the heat of the electrons for the shortest time; It is not possible to ::, use the general heat dissipation in contact with the electronic heating element-the second operation leads to the requirement of low resistance heat dissipation. Page 5 SS ^ 19213238 Creation Instructions (2) This is a well-known electronic component heat sink (Heat or cpu cooler) in order to reduce the contact thermal resistance (c〇ntact) of the heat transfer contact interface (interface 〇; f hest transfer) thermai raishnce) 'The method of lifting is to mechanically process the two contact surfaces as much as possible. ^ In its Γ contact interface, you have to deal with-soft fillers, such as thermal paste 3, ra π " 13 &) or heat transfer sheet. 4 (thermal pad), to fill the surface pores of the material caused by the processing, but the thermal resistance is still high when doing the above (high heatnux), but because of copper and Ming, because the car Liuyi ^ is used. The commonly used heat-dissipating base material of the six deniers is easy to get for the car. The price is more popular, and it is in the son of nature in the car Yi Xi, but because of copper or Shao, ^ ^,:, microscopic shape can be seen) It is not easy to slide first (thus increasing the thermal resistance. Looking at it) and it is very easy to form an oxide film after processing. 或: = general =: ϊ Ϊ f interface filling materials are mostly oxidized metal powder) is not good: ί The coefficient of conductivity ". One ... Its softness fills the void at the interface; the difference in moss is only: by the state of the soft filling material such as the first %%-alum hole hunting to reduce thermal resistance. Its micro thermal paste 3 or ^ sheet Jin: Yu == Learn to use soft filling materials (scattered; scattered with the heating element 1; 12 points, and the V with the electronic element, code ^ 0 ... The third picture is the heat sink and other Yisan:;: = contact situation; also like a case of sandwiching a layer of thermal paste / 〇 contact combination; generally used ,,,, = exothermic paste can promote heat transfer, the second degree is quite large, That is, the contact thermal resistance; the surface after work needs to be coarse. The contact thermal resistance of this combination mode is still large. Therefore = thermal: reduce the thermal resistance, but The shortcoming of $ S knower is that 89213238 Amendment IV. Creation Note (3) The thermal resistance is too large. [New content], the creator in order to provide a low thermal resistance to solve the problem of large contact thermal resistance and system ... The purpose of this creation is to provide a heat body suitable for the surface of electronic heating elements: the scattered contact interface is the phase between the electronic heat dissipation element and the heat dissipation element .: The heat source of the heat-conducting substrate at the junction of the structure or the heat-dissipating structure = heat: the conductive interface can be used on the material to make the surface of the heat-dissipating substrate have a coarse sugar content = in-the second type of heat conduction slip increases, which can effectively reduce the soft f 〇ughness becomes smaller, flat and the contact thermal resistance becomes smaller; also this layer 孰 :: quantity and thickness 'heat spreading of the element into the element ^ pass = material' makes the heat caused by uneven contact Defective, becoming n 'can also make up for local factors. If the oxidation resistance is lower than the thermal resistance, it can also reduce the interface contact. Also, it is not easy to form an oxide film. In order to achieve the above purpose, this creation The surface is attached with a second box after processing. The second structure is: the heat sinking substrate is matched with the A type ... transmitting materials, and the heat sinking substrate is processed into two kinds of heat conducting substrates. The first steam ore == heat-dissipating material, and can be connected by electric clocks and materials, the first _ borrow = 彳 4, any one of the right welding and the heat-radiating base 〇03〇t thermal conduction into a thin layer '-general thickness The .00 number of λ materials' hunting to improve the luminosity of the contact surface of the heat-dissipating substrate, reduce the amount of scattered filling and reduce the soft national coffee ΕΛ Fine fun M secret ------ ___ page 7 M252973 case number 89213238 $ year € month Θ said correction? 'Creation Note (4) Filling thickness of the filler material, at the same time increase the thermal diffusivity, thereby reducing the contact thermal resistance. ',, [Implementation Modes] In order to allow your reviewers to further understand the techniques, means and effects adopted by this creation to achieve the purpose, a better and feasible embodiment will be given in conjunction with the detailed description of the drawings as follows. I believe this The purpose, characteristics and advantages of creation should be understood in detail. ^ Refer to the fourth to fifth figures. The heat sink with a thermally conductive contact interface is inside. The surface of the heat sink plate 21 of the heat sink formed by the heat sink substrate 2 is attached with a second layer after processing. Heat conducting material layer 22, and the surface of the heat-dissipating substrate 2 and the heat source of the heat source; the hair body 20 is a heat sink base, and the heat source can be: X ..., Wu 5 (private electronic heating element) The central processor or dagger) also refers to the electronic heat sink formed by another heat sink substrate ^ which includes the second heat conductive material layer 2 2 of the Lou Sun priest μ, ... And the first 敎 ::: The conductivity coefficient is greater than the heat dissipation substrate and the first thermally conductive material layer 22 can be electroplated, steamed shovel (Physical vap〇r dep〇siti〇n), thermocompression bonding ^ = f〇rglng) (ultrason.c weldlng) (brazing), soft soldering (s〇1 but more bucket 2 are connected, the second type of heat conductive material is thin: any: between the type and the heat-dissipating substrate 0. 0 0 0 0 030 mm, buried with Dangu / ,, the special layer, the general thickness is in, reduce the heat radiation substrate 2 A exothermic substrate 2 contact surface luminosity and reduce the soft filling = reduce the soft filling The filling amount of the material reduces the thermal resistance of the contact. At the same time, it also increases the thermal diffusivity, and further, the sixth figure shows the fourth, the creation description (5) 2 of the heat conductive plate surface 21 is a phase. Surface processing is not easy to smooth. After processing, the smooth disk prevents these watches from being exposed to air between the concave and convex surfaces of the disk: when it is easy to spread on the two kinds of thermally conductive material layers 22, it will be on the top of the layer, but the first The two kinds of heat conducting materials are ^ too ^. The known uneven surface is filled with an electronic heating element 5 which has a smaller uneven surface, so the two kinds of heat conducting material layer 22 and the heat emitting two are in the second place, and the second kind of heat conducting material is attached here ： 二 2Contact thermal resistance 'can also only be greater than the soft filling interface material, two; two ;; ϊ :: number *, thereby reducing the contact interface ::; the second thickness of the second filling, because the thickness of the thermal paste is reduced, Therefore, "?" Is low on the knowledge of Sanshang, so it can be greatly reduced: "The sum of" :: "is also less than Xi Xi's chart. It cannot be used in another way, it is two states of Sanmei and then seventh" At this time, it will be seen on the heat dissipation substrate 2; The combination of the heat dissipation paste 3 of the agent =: species: transmission: material layer 7, the seventh picture is f to the second and third picture, you can know the book !; "function", the creation can not include a soft filling material Layer, also used in the case of "other contact to reduce thermal resistance." B thus produces a straight, ', structure not described above, this creation uses a bonding structure with a bottom surface treated with a bonding substance over f: The material is taken down by a material layer with a low thermal resistance: ..., if the resistance is large, add a layer of heat conduction material to this layer to reach ^ prime number 8921323 ^ 'and then through the scattered surface, and the acquaintance because of this creation completely Different, the surface heat resistance and junction resistance and heat diffusion are familiar with heat transfer, so that the heating element is a complete and clear and diagram, the following patent embodiment and the near M252973 «Creation Note ⑹-JL £ _ by the heating element Or another-the heat-dissipating function of the heat-dissipating element's low thermal resistance will dissipate the heat. This creation is a direct type: the heat transfer structure of the indirect connection type: J is very different. It is only a thin layer, and the conventional structure is added with two to three layers. However, the two elements of contact medium are added to solve the thermal property at the same time, and it can guide the production of a good report = provide better heat than parts, etc., and learn different mechanisms with low thermal resistance. / 差 差), so i ^ ΐ is a detailed description of the preferred embodiment of the creation: Wai = limit ϊ creation! All the scope of this creation should be similar to the surname of hibiscus, the spirit of the target range of Fanfan and similar changes. The structure should be included in this creation.
第10頁 M252973 案號89213238_^年 < 月义日 修正 圖式簡單說明 【圖式簡單說明】 第一圖為習知之立體分解圖。 第二圖為習知第一圖之部份顯微放大剖視圖。 第三圖為習知另一實施顯微放大剖視圖。 第四為本創作之立體分解圖。 第五圖為本創作之組合剖視圖。 第六圖為本創作第四圖之部份顯微放大剖視圖 第七圖為本創作之另一實施顯微放大剖視圖。 符號說明： 1散熱體 1 1岐片 2散熱基材 2 1導熱板面 3散熱膏 5發熱元件 1 0散熱板 1 2導熱板面 2 0散熱體 2 2第二種熱傳導材層 4傳熱片Page 10 M252973 Case No. 89213238_ ^ year < month right day correction Simple illustration of the drawing [Simplified illustration of the drawing] The first image is a conventional exploded perspective view. The second figure is a partially enlarged sectional view of the conventional first figure. The third figure is a microscopic enlarged sectional view of another conventional implementation. The fourth is a three-dimensional exploded view of the creation. The fifth figure is a sectional view of the composition. The sixth figure is a partially enlarged microscopic sectional view of the fourth figure of the creation. The seventh figure is a microscopic enlarged sectional view of another implementation of the creation. Explanation of symbols: 1 heat sink 1 1 fin 2 heat sink substrate 2 1 heat conducting plate surface 3 heat dissipation paste 5 heating element 1 0 heat sink plate 1 2 heat conducting plate surface 2 0 heat sink 2 2 second heat conducting material layer 4 heat transfer plate
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