TWM257092U - Skived-fin type heat radiator - Google Patents

Skived-fin type heat radiator Download PDF

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Publication number
TWM257092U
TWM257092U TW093207199U TW93207199U TWM257092U TW M257092 U TWM257092 U TW M257092U TW 093207199 U TW093207199 U TW 093207199U TW 93207199 U TW93207199 U TW 93207199U TW M257092 U TWM257092 U TW M257092U
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TW
Taiwan
Prior art keywords
ring
fins
heat sink
creation
heat
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TW093207199U
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Chinese (zh)
Inventor
Liang-Fu Huang
Original Assignee
Liang-Fu Huang
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Publication date
Application filed by Liang-Fu Huang filed Critical Liang-Fu Huang
Priority to TW093207199U priority Critical patent/TWM257092U/en
Publication of TWM257092U publication Critical patent/TWM257092U/en
Priority to US11/122,029 priority patent/US20050257914A1/en
Priority to DE202005007230U priority patent/DE202005007230U1/en
Priority to JP2005003040U priority patent/JP3112376U/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/16Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A skived-fin annular heat sink is manufactured via a skived-fin technology and includes at least one bottom board and a plurality of fins. The at least one bottom board is bended to form a closed-shaped. The fins are extended outwardly from the at least one bottom board, wherein each of the fins has a bending portion for connecting the fin with the bottom board. Hence the skived-fin annular heat sink can be adapted to a chip of PCB with over limited space, and can used to increase the number of fins for increasing the heat-dissipating area between the chip and the heat sink.

Description

M257092M257092

號 932Q71QQNumber 932Q71QQ

、創作說明(1) 新型所屬之技術領域】 供曰:: : f::種剷削式環形散熱器,特別指-種提 =日日片月欠熱用且應用剷(鉋)削技術(skived—fin te“n〇i0gy)劇削鰭片並呈環形直立之散熱器。 先前技術】 作動密度的增加,資訊產品中之晶片在 負冇的範圍女i :、里,常使晶片本身之溫度超出其所能 負何的轭圍,尤其是中央處理器晶 =㈣增加,其產生的熱量若 ㈡及= 成零組件損耗乃至主機中斷的現象。的政…衣扰^ 為有效解決晶片的散熱問題, 裝-包含複數散熱轉片的散熱器,散執二:頂:加 直立之矩形或圓環形。其各有不^: 又大體可分為呈 多應用於晶片上*空間i限之電路板:用:圓J展形乃 製造圓環形散熱器之先前技術 ,士二如,I面卡。關於 (心…。,)、锻造⑹㈣:)通;;2=型 工、粉末成型、或壓鑄 '然而其 ^广)、機械加 加,其厚度不能Μ達否=即^法增 率上具有技術瓶頸。 口 在&幵政熱效 八以最普遍之擠型散熱器為例,其 至屬熔化後經_擠製模具而成二、、、呂材,將 前技術之成品如第-圖及第二圖所:有η面形狀。先 有一圓形筒狀部9 1及複數個由兮:J:散熱器9具 —ΖΓ:—~——_^同狀部9 1延伸出之散 M257092 案號93^1 oq 創作說明(2) 年 月 曰 修正 ^ ^中間設有一導熱塊9 3乃用以抵接於晶月 所2 $二二二=器9的材料性質多具備高熱傳導的特性, |所以畜曰日=^度上升時,散熱器g藉熱傳導效應迅速吸收 丨晶片的熱置]亚藉著複數個延伸的散熱鰭片9 ^將熱量傳 至周圍的空氣中,#由空氣的熱對流效應將熱散至外界。 此種擠型方法最為經濟,然而該製法的缺點乃受限於 其散熱片f要有一定的厚度及間距,無法太密’,常常不足 ^應付更高功率晶片的放熱速度,無法提供有效的散熱功 旎。,散熱鰭片之最大數目通常受限於j 〇 〇至1 2 〇片,因此 丨有如第二圖所示之環形散熱器9 a ,其具有複數片較厚之 I根部鰭片9 5由圓形筒狀部9 4向外延伸,每一根部鰭片 5再t f分叉出一對延伸鰭片9 6 ,藉此增加鰭片9 6 |數目以提昇散熱面積。然而該根部鰭片9 5的總數量仍然 受擠型製法的限制,所有延伸鰭片的數目也難以超過丨2 〇 先前技術另有一種製法,將數片薄型之散熱鰭片藉由 |鑲肷(bonding)或焊接(s〇i dering)組裝在底板上,此種製 法雖然有效增加散熱片數量以增加散熱裝置的散熱面積, 然而此種製法製成之散熱裝置的底板與散熱片之間由於# 直接連接,其導熱效果明顯受到影響。 是以,由上可知,上述習知的環形散熱器,在實際使 用上,顯然具有不便與缺失存在,而可待加以改善者。 緣是,本創作人有感上述缺失之可改善,乃特潛心研 究並配合學理之運用,終於提出一種設計合理且有效改善 |上述缺失之本創作。、 Creation of creation (1) The technical field of the new type] Supply: :: f :: a kind of shovel-type ring radiator, especially-a kind of shovel = day, day, and month underheating and the application of shovel (planing) cutting technology ( skived—fin te “n0i0gy” sharply cuts the fins and forms a circular upright radiator. Previous technology] As the density of motion increases, the wafers in information products are in the negative range. The temperature exceeds the yoke range that it can bear, especially if the central processing unit chip = , increases, if the heat generated by it is equal to zero component loss or even the host interruption. The political ... Cooling problem, install-a heat sink with a plurality of heat transfer blades, stubborn two: top: add an upright rectangular or circular ring. Each has its own ^: It can be roughly divided into multiple applications on the chip * space i limit Circuit board: The use of: round J is the previous technology for manufacturing circular heat sinks, Shi Erru, I face card. About (heart ...), forging ⑹㈣ :) pass; 2 = molding, powder Forming, or die-casting, but its thickness), mechanical addition, its thickness can not reach M = = increase rate It has a technical bottleneck. The most popular extrusion radiator is taken as an example. It is melted and extruded to form two, two, and three materials. The finished product of the previous technology is the first -The figure and the second figure: there is a shape of η plane. First, there is a circular cylindrical portion 91 and a plurality of ones: Xi: J: Zhisan M257092 Case No. 93 ^ 1 oq Creative Instructions (2) Year, month, and month revised ^ ^ There is a thermally conductive block 9 3 in the middle to abut the crystal moon 2 $ 二二二 = 器 9 The material properties are mostly high The characteristics of heat conduction, so when the day of the animal = ^ degree rises, the heat sink g quickly absorbs the heat of the chip by the heat conduction effect] The heat is transferred to the surrounding air by a plurality of extended heat dissipation fins 9 ^ #The heat is dissipated to the outside world by the thermal convection effect of air. This type of extrusion method is the most economical, but the disadvantage of this method is that its heat sink f must have a certain thickness and spacing and cannot be too dense ', which is often insufficient ^ To cope with the heat dissipation speed of higher power chips, it cannot provide effective heat dissipation function. The maximum number of heat dissipation fins is Limited to j 00 to 120, so there is a ring heat sink 9a as shown in the second figure, which has a plurality of thicker I root fins 9 5 outward from the circular cylindrical portion 9 4 Extending, each root fin 5 then tf branches out a pair of extending fins 9 6, thereby increasing the number of fins 9 6 | to increase the heat dissipation area. However, the total number of the root fins 9 5 is still subject to extrusion molding Limitation, the number of all extended fins is difficult to exceed 丨 2 〇 There is another manufacturing method in the prior art, a few thin heat sink fins are assembled on the base plate by bonding or welding (soi dering) Although this method effectively increases the number of heat sinks to increase the heat dissipation area of the heat sink, the thermal conductivity of the heat sink is significantly affected by the direct connection between the bottom plate of the heat sink and the heat sink. Therefore, it can be seen from the above that the above-mentioned conventional ring radiator has obvious inconveniences and defects in practical use, and needs to be improved. The reason is that the author feels that the above-mentioned shortcomings can be improved. He has devoted himself to research and cooperated with the application of theories to finally propose a reasonable design and effective improvement.

第6頁 M257092 _案號 932Q7199_年月日__ 四、創作說明(3) 【新型内容】 本創作之主要目的係提供一種剷削式環形散熱器,能 提高散熱鰭片數目以增加散熱面積,又具良妤熱傳導效 果,特別適用於晶片上方空間受限之電路板上。 為達上述之目的,本創作之一種剷削式環形散熱器, •乃藉剷削技術(s k i v e d - f i η ΐ e c h η ο 1 〇 g y )製造而成,包括 至少一彎折之金屬底板,乃呈封閉環繞狀;及複數經剷削 形成的散熱鰭片由該底板向外延伸,其中每一散熱鰭片之 底部乃略為彎曲地與該底板連接。 茲配合圖式將本創作之較佳實施例詳細說明如下,但 是此等說明僅係用來說明本創作,而非對本創作的權利範 圍作任何的限制。 【實施方式】 請參閱第三圖,係本創作中藉由到削技 片之過程示意圖。本創作之剷削式環形散熱器 $热缚 再 接著以 技術(ski ved-fin techno logy)製造之環形散敎,由剷削 技術或稱削鰭技術,在目前乃為所有散熱界…、°剷削 與最佳之技術。在剷削製造過程乃先取—平1 &中最先進 計算並取一預定角度固定該工件1於—治具=工件1 沖床、銑床、鉋床或專用機械,如精宓=二 上;接著 (CNC),以剷(鉋)刀3用木工鉋削的眉利之銑床 定的前端後;再將工件1重覆鉋出片狀之鱗、心則斷一預 斷,之後將鉋製而成之該鰭片1 1以搞冬’ 1 1而不鉋 w §之方法蚁丄Page 6 M257092 _Case No. 932Q7199_Year Month and Day__ IV. Creation Instructions (3) [New Content] The main purpose of this creation is to provide a spade ring heat sink, which can increase the number of fins to increase the heat dissipation area. With good thermal conductivity, it is especially suitable for circuit boards with limited space above the chip. In order to achieve the above purpose, a spade ring radiator of this creation is made by skived-fi η ΐ ech η ο 1 〇gy, including at least one bent metal base plate, It is closed and surrounded; and a plurality of radiating fins formed by cutting extend outward from the bottom plate, wherein the bottom of each radiating fin is connected to the bottom plate with a slight bend. The preferred embodiments of this creation are described in detail below with reference to the drawings, but these descriptions are only used to describe this creation, not to limit any scope of rights of this creation. [Embodiment] Please refer to the third picture, which is a schematic diagram of the process of cutting the film in this creation. The shovel-type ring radiator $ The thermal binding of this creation is then followed by the ring-shaped scatter made by ski ved-fin techno logy. The shovel or fin-cut technology is currently used for all heat dissipation circles ..., ° Shovel and the best technology. In the shovel manufacturing process, the most advanced calculation is first taken in-flat 1 & a predetermined angle is taken to fix the workpiece 1 in-fixture = workpiece 1 punch, milling machine, planer or special machinery, such as precision 二 = two upper; then ( CNC), using a shovel (planer) knife 3 to plan the front end of a sharp-edged milling machine; then work piece 1 is repeatedly planed to form flaky scales, and the heart is broken. The fins 1 1 use the method of winter '1 1 without shaving w §

第7頁 无豆立與工 M257092 年月日 修正 ___案號 93207]g£ 四、創作說明(4) 件1垂直’亚且形成一連接之彎曲部1 1 2連接該工件1 及鰭片1 1 。由於乃是一體成型,沒有任何接合,所以鰭 片與=件之,沒有任何介面或熱阻抗的問題。 一請參閱f四圖’係本創作中應㈣削技術製成散熱片 之不意圖。藉由剷削製程所得之工件1乃具有極薄且間距 極小之複數鰭片1 1各藉由彎曲部1 1 2連接於該工件1 之下半部。將該工件1最後之尾段i 3切斷後,視不同實 施例所需之工件1的長度予以切斷,再藉由彎折之治具將 該工件1彎折。 Μ ,係分別為本創作 圖、沿第五圖之6 之到削式環形散執 #、、N 狀豎立之散熱器4 之剷削式環形 一 6剖線之剖 器4乃將工件 ’其具有極薄Page 7 Wudou Lihe Industry and Engineering Co., Ltd. M257092 Date of Amendment _Case No. 93207] g £ Fourth, creation instructions (4) Piece 1 is vertical and sub-shaped and forms a connected curved portion 1 1 2 Connects the workpiece 1 and fins Slice 1 1. Since it is integrally formed without any joints, there is no interface or thermal resistance problem between the fins and the pieces. Firstly, please refer to “f. Figure 4”, which is not intended to be a heat sink in this creation. The workpiece 1 obtained by the shovel manufacturing process has a plurality of fins 1 1 which are extremely thin and have a small pitch, and are each connected to the lower half of the workpiece 1 by a curved portion 1 12. After cutting the last tail section i 3 of the workpiece 1, the workpiece 1 is cut according to the length of the embodiment, and then the workpiece 1 is bent by a bending jig. Μ is the cutting device 4 of this creative drawing, along the fifth figure 6 to the cut-type annular diffuser #, and the N-shaped erected radiator 4 of the shovel-shaped annular 6-section line. Extremely thin

乃是將該工件1縱 閱第四A圖,為本 視圖。該工件1乃 持以水平刀鋒垂直 1 a係斜向地連接 相夾的角度係決定 右該工件1以一爽 以一斜 向於一 藉由治 片’而 另一種剷削角 散熱器,會得 優點於後面的 上述本創作的實施例 上,經剷削而得。請參 削過程另一種實施例的俯 治具2上,該剷刀3仍維 。如此得到複數鰭片1 該鰭片1 1 a與該工件1 設於該治具2上的角度。 具2 ’該鰭片1 1 a也是 其中該鰭片1 1 a會稍傾 度的工件1及鰭片1 1 a 到呈螺旋形排列的散熱鰭 段落將會描述。 請參閱第五及第六圖 散熱器較佳實施例之俯視 視圖。本創作較佳實施例 穹折形成一封閉圓形環繞 向置於該治具 創作之工件剷 斜向地置於該 地剷削該工件 於該工件1。 於該工件1擺 角Θ置於該治 角Θ連接於該工件1上 側邊。將此 具捲成環形 具有另外的 M257092 修正This work 1 is viewed through the fourth A diagram and is a front view. The workpiece 1 is held at an angle that is connected diagonally with a horizontal blade vertical 1 a. The workpiece 1 is determined to be right. The workpiece 1 is slanted to an oblique to a through chip, and another shovel angle radiator. The advantages are obtained by scooping in the above-mentioned embodiment of the present invention. Please refer to the cutting process 2 of the other embodiment of the cutting process, the blade 3 is still dimensioned. In this way, the angle between the plurality of fins 1, the fins 1 1 a and the workpiece 1 on the jig 2 is obtained. With 2 ′, the fin 1 1 a is also the workpiece 1 and the fin 1 1 a where the fin 1 1 a will be slightly inclined to the spirally arranged cooling fins. The paragraph will be described. Please refer to the fifth and sixth figures for a top view of the preferred embodiment of the heat sink. The preferred embodiment of the present invention is dome-shaped to form a closed circular circle. The workpiece shovel placed on the jig is placed obliquely on the ground to scrape the workpiece on the workpiece 1. The swing angle Θ of the workpiece 1 is placed at the treatment angle Θ connected to the upper side of the workpiece 1. Roll this tool into a ring with additional M257092 correction

案號 932071 qo 四、創作說明(5) 之散熱鰭片4 4乃藉由彎曲部 之底板4 2,且形成一連接 〜接連接於其圓環狀 之製程,本創作之剷削式俨形Λ丄稭此上述剷削及彎折 散熱器增加更大散埶面‘衣‘:熱器4乃較先前各種環形 用υ卸積’亚且具多 埶 該劇削式環形散熱器4中間設置埶& 5 ς接。再於 6 ’將熱傳導至該剷削式環形散熱= 抵接於晶片 晴參閱第五Α圖,為本創 環形散熱器側視圖。本創作祆據弟四A圖所得之剷削 得到-環形散丄本創:二據 有斜向排列的散妖,片44視硯I,該環形散熱器4 ’具 有一向上傾斜的角^ ^提^且該散熱錯片“,乃具 於鰭片的下方並位於晶片的η、車乂大的,流流通的空間位 圍流入位於該環形散:哭4 ,可供氣流更順暢地由外 rr曰上 欢熟4下方的晶片附近;或者驻士 :夺,氣流因傾斜的韓片將形成傾斜向下氣 :生向該晶片的周圍,可有效改善垂直向下而 散熱效果。 成…在的情況’因此具有更佳的 埶。a f外’本創作也可形成如第五Β圖的螺旋狀的環形 …、m 4具有斜向同一邊的散熱鰭片4 4 ”。此實 於第四A圖的步驟時提供一平行四邊形的工件。、,’、在 =閱第六AH’為本創作之制式環形散熱器鱼導 :ί:1之另一實施例的剖視圖。本創作可提供-呈錐狀 、V…、塊5 ,另外該環形散熱器4,則形成一且有錐狀的 J置空間,藉此該環形散熱器4 ’容易與該導熱塊5 ”組 an· 第9頁 M257092Case No. 932071 qo Fourth, the heat dissipation fins 4 4 of the creation description (5) are made by the bottom plate 4 2 of the bending part, and form a connection ~ connected to the ring-shaped process. The above-mentioned shovel and bend radiators increase the size of the diffuser surface: the heat exchanger 4 is more unloaded than the previous various types of rings, and has a large number of intermediately disposed heat sinks埶 & 5 At 6 ’, the heat is conducted to the spade ring heat sink = abut the chip. See Figure 5A for a side view of the original ring heat sink. This creation is based on the shovel obtained from the fourth image of the younger brother. The ring is scattered. The original: two according to the obliquely arranged scattered demon, film 44 as shown in Figure I. The ring radiator 4 'has an upwardly inclined angle. It is mentioned that the heat-dissipating fin "is located below the fins and is located on the η of the chip, and the size of the car is large, and the space flowing through it flows into the ring-shaped diffuser: cry 4 for more smooth air flow from the outside rr said near the wafer under the upper 4; or resident: capture, the Korean film with the airflow inclined will form a downward downward air: it is generated around the chip, which can effectively improve the vertical downward heat dissipation effect. In the case of 'therefore, there is a better 埶. Af outside' this creation can also form a spiral ring like the fifth B figure ..., m 4 has heat dissipation fins 4 4 diagonally on the same side ". This step in Fig. 4A provides a parallelogram-shaped workpiece. ,,,, = See the sixth AH ′ is a cross-sectional view of another embodiment of the ring-shaped radiator fish guide of the creation: ί: 1. This creation can provide-a cone-shaped, V ..., block 5, in addition, the ring-shaped heat sink 4 forms a J-shaped space with a cone-shaped, thereby the ring-shaped heat sink 4 'is easy to connect with the heat-conducting block 5 "group an · Page 9 M257092

_案號 93207199 四、創作說明(6) 該剷削式環形散熱器4 a 另具有一往外延伸之底緣5 2 板4 2 a ,藉此可增加該導熱 散熱器4 a的面積。 本創作之劇削 製程,所以不限於 銅合金。在本較佳 形,當然也可以不 之剷削式環形散熱 散熱器4 a乃具有 a連接於該底板4 之不同形狀鰭片, 不同之剖面形狀, 削的過程中即可得 不勝枚舉,例如也 式環形散熱器的材質 紹材或铭合金,也可 實施例中該散熱鰭片 限制於矩形。如第七 器第二實施例之剖視 一底板4 2 a ,及複 2 a ,如此更有利於 只要在剷削製程前, 例如切削掉一縱向的 到上述梯形的鰭片4 可以是扇形、或弧形 ,由於是利用剷削 以方便地應用銅或 4 4之形狀乃為矩 圖所示,係本創作 圖,該剷削式環形 數片梯形鰭片4 4 熱能之散發。上述 於工件1先切削成 二角形材料,於到 4 a 。因此其形狀 等。 中間之導熱塊5 a也可以是 a乃抵接於散熱器、4之該底 塊5 a傳導至該剷削式環形 參閱第 俯視圖 件彎折 形成一 兩個相 施例中 各具有 彼此銜 兩個以 於兩個 係本創 創作之 合並銜 環形。 圓產彳削 器乃具 製成之 成封閉 件彎折 施例可 $之剷削 暫拆製程 接兩個半 其中此實 式環形散 有兩個底 敢熱鰭片 之環繞狀 後, 降低 再加 工件 式環形散 中,也可 圓剷削式 施例之圖 熱器4 b 板4 2 b 4 4b。。由上述 以銜接組 1彎折之 熱器第三實 以由兩件以 環形散熱器 示,該散熱 組裝而成, ,每一底板 該對底板4 得知,本創 合而成,而 困難度,而 M257092 、創作說明(7) 件1彼此之連接再藉由連接零件即可輕易連接,例如可 設置一具夾合功能之連接件7 b於連接缝4 6 b處, 合兩個半圓剷肖丨丨戎摄花ίβ β、山.〜π ,、丨 工 以各 、> ——"恥〜疋设仟丫 b於連接縫4 0 D /是, 以夹合兩個f圓剷削式環形散熱器4 b尾端,即得以固定 之;或者可藉由娜針鉚合散熱鰭片而組合;或者也可以籍 由焊接而結合。 實施例 再明參閱第九圖,係本創作之剷削式環形散熱器第四 例f俯視圖。本創作之剷削式環形散熱器也可以不限 制於圓琛形,也可以是矩形環狀散熱器,如圖示所示, 實施例中剷削士環形散熱器4 c乃具有一呈封閉矩形狀的 底板42 數片散熱鰭片44 C乃由該底板42向外 延伸。”::在工件彎折上也較易彎折,而中間之導敎 德5 c與日日片凡全接觸時也更節省面積。 本創作之創作特徵及特點〕 因此藉本創作所能& 4 本創作之到“;=特點及功能經整理如后: 不人瓮俨壯飞开y政熱器具有更多的極薄之鰭片吉 接連ί面;衣並板’乃較先前各種環形散熱器增加更 多散熱面積亚且具良好熱傳導兮專 s加更 本創作之剷削式環來埒f ;:效果。 金、銅戒銅合金。本創=盗可以方便地應用鋁或鋁合 i晶片上方空間受心式環形;熱器特別適用於 於介面十通常乃相鄰地並排數片,:::::之晶片,由 常有限,此種剷削式環形$ ,/、曰曰片上方之空間乃非 加上風肩更是能有致將埶;;;;可將熱往側邊傳導,若再 综上所述’本創作;ρ ί開。 出申請。惟以上所揭露者已型專利之要件,依法提 ^僅為本創作較佳實施例而? ----_Case No. 93207199 IV. Creative Instructions (6) The spade ring heat sink 4 a has a bottom edge 5 2 plate 4 2 a extending outwards, thereby increasing the area of the heat sink 4 a. The production process of this creation is not limited to copper alloys. In this preferred form, of course, it is also possible to scrape the ring-shaped heat sink 4 a with different shapes of fins connected to the base plate 4 and different cross-sectional shapes. For example, the material of the ring radiator is made of a material or an alloy, and the heat dissipation fin is limited to a rectangle in the embodiment. As in the second embodiment of the seventh device, a bottom plate 4 2 a and a complex 2 a are viewed. This is more advantageous as long as the cutting process, for example, cutting a longitudinally-shaped trapezoidal fin 4 may be fan-shaped, Or the arc shape, because the shape of copper or 4 4 is conveniently shown by the use of a shovel, which is shown in the moment diagram. This is the original drawing. The shovel-type annular number of trapezoidal fins 4 4 emits heat. As mentioned above, the workpiece 1 is first cut into a two-dimensional material, and then reaches 4a. So its shape and so on. The middle heat-conducting block 5 a may also be a, which is abutting on the radiator, and the bottom block 5 a is conducted to the spade ring. Refer to the top plan view. Bend to form one or two phases. This is based on the combined title of the two original creations. The circular cutter is made of a closed piece that can be bent. In this case, the cutting process can be cut in two and a half. The solid ring is surrounded by two bottom hot fins. In the case of a ring-shaped work piece, the heater 4 b and the plate 4 2 b 4 4b in the embodiment of the circular spade type can also be used. . From the above, the third heater which is bent by the connection group 1 is shown by two pieces of annular heat sinks, which are assembled by heat dissipation. Each base plate and the pair of base plates 4 are learned. And M257092, creation description (7) piece 1 is connected to each other and then can be easily connected by connecting parts, for example, a connecting piece 7 b with a clamping function can be set at the connecting seam 4 6 b to join two semicircles Shovel 丨 丨 Rong Shehua ίβ β, mountain. ~ Π,, work with each other, > —— " shame ~ 仟 set 疋 丫 b at the connection seam 4 0 D / yes, to sandwich two f circles The tail end of the spade ring radiator 4b can be fixed; or it can be combined by riveting the heat sink fins; or it can be combined by welding. Example Referring again to the ninth figure, it is a plan view of the fourth example f of the spade ring radiator of the present invention. The spade ring radiator of this creation may not be limited to a circular spheroid, or a rectangular ring radiator. As shown in the figure, the spade ring radiator 4 c in the embodiment has a closed rectangle. The base plate 42 includes a plurality of heat dissipation fins 44 C extending outward from the base plate 42. :: It is also easier to bend the workpiece, and the middle guide 5c also saves area when the Japanese and Japanese films are in full contact. The creative characteristics and characteristics of this creation] Therefore, the use of this creation & amp 4 The achievement of this creation "; = the features and functions are organized as follows: no one is strong and strong, and the open-air heating device has more ultra-thin fins and gilts; the clothes and boards are different from previous ones. The ring radiator adds more heat dissipation area and has good heat conduction. Adding the scooping ring of this creation to 埒 f: effect. Gold, copper or copper alloys. The invention can be easily applied to the space above the aluminum or aluminum alloy chip. The heat sink is especially suitable for the interface. Usually, there are several pieces next to each other. ::::: This type of spade ring $, /, the space above the film is not only coupled with the wind shoulders, but also can lead to 埶; ;; can transfer heat to the side, if you summarize the above 'this creation; ρ ί 开. Apply. However, the requirements of the patents disclosed above are mentioned in accordance with the law. ^ Is this only the preferred embodiment of the creation? ----

M257092 _案號932Q7199_年月曰 修正_ 四、創作說明(8) 自不能以此限定本創作之權利範圍,因此依本創作申請範 圍所做之均等變化或修飾,仍屬本創作所涵蓋之範圍。尚 請審查委員撥冗細審,並盼早日准予專利以勵創作,實感 德便。M257092 _Case No. 932Q7199_ Year Month Amendment_ IV. Creation Instructions (8) Since this cannot be used to limit the scope of the right to this creation, the equal changes or modifications made in accordance with the scope of this creation application are still covered by this creation range. The reviewers are requested to take time to review and look forward to granting patents as soon as possible to encourage creativity.

第12頁 M257092 _案號93207199_年月日__ 圖式簡單說明 【圖式簡單說明】 第一圖:係為一種習知技術之擠形環形散熱器之俯視圖。 第二圖:係為另一種習知技術之擠形環形散熱器之俯視 圖。 第三圖:係為本創作中藉由剷削技術製造散熱鰭片之過程 示意圖。 第四圖:係為本創作中應用剷削技術製成散熱鰭片之示意 - 圖。 第四A圖:為本創作之工件剷削過程另一種實施例的俯視 圖。 第五圖··係為本創作之剷削式環形散熱器較佳實施例之俯 視圖。 第五A圖:為本創作根據第四A圖所得之剷削環形散熱器 側視圖。 第五B圖:為本創作根據第四A圖所得之產1削環形散熱器 另一實施例的側視圖。 第六圖:係為本創作之剷削式環形散熱器較佳實施例之剖 視圖。 第六A圖:為本創作之剷削式環形散熱器與導熱塊組合之 另一實施例的剖視圖。 第七圖··係為本創作之剷削式環形散熱器第二實施例之剖 視圖。 第八圖:係為本創作之剷削式環形散熱器第三實施例之俯 視圖。Page 12 M257092 _Case No. 93207199_Year Month and Day__ Brief Description of the Drawings [Simplified Description of the Drawings] The first picture is a top view of an extruded ring radiator of a conventional technology. The second figure is a top view of an extruded ring radiator of another conventional technique. The third picture: This is a schematic diagram of the process of manufacturing heat dissipation fins by cutting technology in this creation. The fourth picture: is a schematic diagram of the heat sink fins made by applying cutting technology in this creation. Figure 4A: A top view of another embodiment of the work cutting process of this creation. The fifth figure is a plan view of a preferred embodiment of the spade ring radiator of the present invention. Fifth A: A side view of the scraped ring radiator obtained from Figure 4A for this creation. Fifth B: A side view of another embodiment of the 1-ring ring radiator produced in accordance with the fourth A in this creation. Fig. 6 is a sectional view of a preferred embodiment of the spade ring radiator of the present invention. FIG. 6A is a cross-sectional view of another embodiment of the combination of a spade ring radiator and a heat conduction block. The seventh figure is a cross-sectional view of the second embodiment of the spade ring radiator of the present invention. Figure 8: A top view of the third embodiment of the spade ring radiator of the present invention.

第13頁 M257092 案號 93207199 年 月 曰 修正 圖式簡單說明 第九圖··係為本創作之剷削式環形散熱器第四實施例之俯 視圖。 圖式中之參照號數】 習知〕 環形散熱器9 、9 a 9 1 、9 4 筒狀部 91 導熱塊 93 延伸鰭片 96 〔本創作〕 工件 1 鰭片 11 尾段 13 治具 2 剷刀 3 散熱鰭片 根部鰭片 2 a 彎曲部 削 式 環 形散熱 器 4、 4,、 4 n、 4 a 、 底 板 42 42M ' ' 4 2a^ 42b、 42c 散 熱 鰭 片 44 44, 、44丨丨、 44a、 44b、 連 接 缝 4 6 、4 6 b 彎 曲 部 4 4 2 熱 塊 5、 5 ? Λ [ 5a、 5 c 底 緣 5 2 a 4 b 44c 4 c 晶片 連接件 6 7 bPage 13 M257092 Case No. 93207199 Modification Brief Description of the Drawings Figure 9 is a top view of the fourth embodiment of the spade ring radiator of this creation. Reference number in the drawing] Known] Ring heat sink 9, 9 a 9 1, 9 4 Cylindrical part 91 Heat conducting block 93 Extending fin 96 [This creation] Work piece 1 Fin 11 Tail section 13 Fixture 2 Shovel Knife 3 Radiating fins Root fins 2 a Curved ring-shaped ring radiators 4, 4, 4, 4 n, 4 a, Base plate 42 42M '' 4 2a ^ 42b, 42c Radiating fins 44 44,, 44 丨, 44a, 44b, joints 4 6, 4 6 b Bend 4 4 2 Heat block 5, 5? Λ [5a, 5 c Bottom edge 5 2 a 4 b 44c 4 c Wafer connector 6 7 b

第14頁Page 14

Claims (1)

M257092 _案號93207199_年月日 修正_ 五、申請專利範圍 器,其中該底板中間乃設有一導熱塊。 1 1 、如申請專利範圍第1 0項所述之剷削式環形散熱 器,其中該導熱塊係具有一略呈梯形的剖面。 1 2 、如申請專利範圍第1項所述之剷削式環形散熱 器,其中該環形散熱器具有與底板斜向排列的散熱鰭片, 並且該散熱鰭片乃具有一向上傾斜的角度。 ' 1 3 、如申請專利範圍第1項所述之剷削式環形散熱 器,其中該環形散熱器具有螺旋狀排列的散熱鰭片。M257092 _Case No. 93207199_ Year Month Date Amendment _ V. Patent application device, in which the bottom plate is provided with a thermally conductive block. 11. The spade ring heat sink according to item 10 of the scope of patent application, wherein the heat conducting block has a slightly trapezoidal cross section. 12. The spade ring heat sink according to item 1 of the scope of patent application, wherein the ring heat sink has heat dissipation fins arranged obliquely to the bottom plate, and the heat dissipation fins have an upwardly inclined angle. '1 3. The spade ring heat sink as described in item 1 of the scope of the patent application, wherein the ring heat sink has spirally arranged heat radiation fins. 第16頁Page 16
TW093207199U 2004-05-07 2004-05-07 Skived-fin type heat radiator TWM257092U (en)

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TW093207199U TWM257092U (en) 2004-05-07 2004-05-07 Skived-fin type heat radiator
US11/122,029 US20050257914A1 (en) 2004-05-07 2005-05-05 Skived-fin annular heat sink
DE202005007230U DE202005007230U1 (en) 2004-05-07 2005-05-06 Spare ribs Ring heatsink
JP2005003040U JP3112376U (en) 2004-05-07 2005-05-09 Skive fin type ring radiator

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070261242A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Method for manufacturing phase change type heat sink
US9383089B2 (en) 2008-06-24 2016-07-05 Hongwu Yang Heat radiation device for a lighting device
TWM363020U (en) * 2009-04-23 2009-08-11 chong-xian Huang Heat sink with radial heat dissipation fins
BE1018825A3 (en) 2009-07-14 2011-09-06 Daniel Verplaetse THERMAL DISSIPATOR FOR AN ELECTRONIC OR ELECTRICAL COMPONENT.
US8397797B2 (en) 2010-03-31 2013-03-19 Denso International America, Inc. Low thermal strain multi-cooler
CN102847843A (en) * 2011-07-01 2013-01-02 善品科技股份有限公司 Manufacturing method for radiating devices of lamps
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
FI130775B1 (en) 2020-11-13 2024-03-12 Thermal Channel Tech Oy Heat sink as well as apparatus and method of producing the same
DE102021111606A1 (en) 2021-05-05 2022-11-10 Diehl Metall Stiftung & Co. Kg Heat sink for making a ring cooler

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2289984A (en) * 1940-07-12 1942-07-14 Westinghouse Electric & Mfg Co Air cooler for power tubes
US2337294A (en) * 1942-02-18 1943-12-21 Taylor Winfield Corp Fabrication method
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
GB2323434B (en) * 1997-03-22 2000-09-20 Imi Marston Ltd Heat sink
TW539393U (en) * 2000-03-15 2003-06-21 Tw 089204149
US6769175B2 (en) * 2001-05-01 2004-08-03 Agilent Technologies, Inc. Heat sink device manufacture
US6479895B1 (en) * 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
ATE304222T1 (en) * 2001-06-05 2005-09-15 Heat Technology Inc HEAT SINK ARRANGEMENT AND ITS MANUFACTURING METHOD
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6657865B1 (en) * 2002-12-12 2003-12-02 Wuh Chuong Indutrial Co., Ltd. Heat dissipating structure
US20040118552A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating device
TWM246683U (en) * 2003-08-13 2004-10-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
TWM246687U (en) * 2003-10-28 2004-10-11 Hon Hai Prec Ind Co Ltd Heat dissipation device
CN100377341C (en) * 2004-08-13 2008-03-26 鸿富锦精密工业(深圳)有限公司 Heat radiator and manufacturing method thereof

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