1291849 九、發明說明： 【發明所屬之技術領域】 許多3C產品為求運算更快速或者影音晝面更華麗的同 時，也使得3C產品本身運轉時所產生之熱量也大量增加， 熱量一旦增加對於產品的運作穩定性就會影響，因此為了 能夠有效且順利的將熱量移除，相關散熱元件勢必須具有 更高的散熱功能性，因此利用本發明一種多孔形銅散熱片 之製造方法所生產之銅散熱片，具有優於現有散熱元件同 型設計之散熱產品。 【先前技術】 現今一般既有之習知散熱片之製造方法不外乎擠型鋁 合金、切削加工銘或銅合金，又或者是以衝壓或焊接銅合 金方式成形散熱片，外觀型態大致為鰭片式，而且只能加 工成形為單一方向與片狀式之散熱產品。 再者，鋁合金之熱傳專性能比銅合金差，對於一般形 狀利用播型或切削加工方式大致皆可使之成形，但是如為 複雜形狀之散熱產品則無法完成其所需，因此即使可利用 切削加工方式完成所需散熱產品，其成本卻也頗高。再加 上習知技術產品，並無法有效增多散熱表面積以提昇散熱 需求。 由此可見，有效率及快速的散熱對於現今3C產品極為 重要。因此，若能提供一種方法係可製造出一散熱元件， 其較習知散熱元件增加許多散熱表面積，且更能有效提昇 散熱之需求，以及不受複雜形狀所限和節省成本，定對各 種需散熱的產品相當有幫助，使其運作更穩定。 【發明内容】 鑑於以上習知技術的缺失，本發明之主要目的在於提 供一種多孔形銅散熱片之製造方法，用以解決利用傳統技 術所製造之散熱片無法符合現今3C產品的散熱需求。 為達上述之目的，本發明之一種多孔形銅散熱片之製 1291849 配合發泡成If程二金取代傳統叙合金為散熱基材， 於陽極之銅金‘ 芯型，透過電鎊成形製程將置 —立體多孔形銅散二積二置於陰極之發泡芯型上而成 作一接合製程，成I二將该銅散熱芯型與一銅底板 包含一種以多孔步钔今敎t夕孔形銅散熱片立·本發明係還 熱片。 t銅放熱片之製造方法製作之多孔型銅散 鑄液以：鑄必須將陽極物與陰極物置於電 該發泡J型;:Ϊ;Ϊ:為硫酸銅。 一者。 材貝係可璉用自卯及PVC材質中之至少 该立體多孔形銅散孰 理，係塗覆-抗氧于後續防氧化表面處 上，用以防止該立I#多4 夕孔形銅散熱片之表面 【實施方式】 夕孔形銅散熱片表面氧化。 目别咼發熱元件主要是利 低使用溫度，其中，絕大片和熱擴散片等來降 卻及增加熱傳面積等方法，^ S二兀件仍以空氣強制冷 卻能力。 于1較低的熱阻及較高的冷 本發明係一種多別花；&也 般習知製造散熱產品之技彳^放;;^之製造方法，有別於一 製作發泡芯型，並經過導電 ，用發泡成形製程完成 板與該立體多孔形鋼散；；===型，並將-銅底 形銅散熱片。此一方法由於結合電鎊二二=，成為一多孔 到一立體多孔形銅散熱片， 裎式衣作，不但可得— 以下為本發明較佳實施例之制二i f的效果及效率。 詳細說明。 衣枉方法，茲配合圖式做 請見第1圖，本發明係一種夕 法100，係包含有發泡成形製程散熱片之製造方 10、導電處理製程 1291849 步驟120 、電鎮告】 多種製程。 〆衣私乂驟130及接合製程步驟140等 其主要實施步驟續#1291849 IX. Invention: [Technical field of invention] Many 3C products are more computationally fast or more gorgeous in audio and video. At the same time, the heat generated by the 3C product itself is also greatly increased. The operational stability will be affected. Therefore, in order to effectively and smoothly remove the heat, the relevant heat dissipating component must have higher heat dissipation functionality, and thus the copper produced by the manufacturing method of the porous copper heat sink of the present invention is utilized. The heat sink has a heat sink that is superior to the existing heat sink components. [Prior Art] Conventionally, the conventional heat sink is manufactured by a method similar to an extruded aluminum alloy, a cutting alloy or a copper alloy, or a heat sink formed by stamping or welding a copper alloy. Fin type, and can only be processed into a single direction and sheet type heat sink products. Furthermore, the heat transfer performance of the aluminum alloy is inferior to that of the copper alloy, and the general shape can be formed by using the sowing type or the cutting method, but the heat sink product of a complicated shape cannot be completed, so even if it is The cost of using the cutting method to complete the required heat dissipation products is also high. Coupled with conventional technology products, it is not possible to effectively increase the heat dissipation surface area to increase the heat dissipation requirements. This shows that efficient and fast heat dissipation is extremely important for today's 3C products. Therefore, if a method can be provided to manufacture a heat dissipating component, the conventional heat dissipating component can increase the heat dissipating surface area, and can effectively improve the heat dissipating requirement, and is not limited by complicated shapes and cost-saving. Cooling products are quite helpful, making them more stable. SUMMARY OF THE INVENTION In view of the above-mentioned deficiencies of the prior art, the main object of the present invention is to provide a method for manufacturing a porous copper heat sink to solve the problem that the heat sink manufactured by the conventional technology cannot meet the heat dissipation requirements of today's 3C products. In order to achieve the above purpose, a porous copper heat sink of the present invention, 1291849, is foamed into a If-Gold, which replaces the conventional alloy as a heat-dissipating substrate, and the copper-gold core of the anode is placed through the electric pound forming process. The three-dimensional porous copper dispersion is placed on the foamed core of the cathode to form a bonding process, and the copper heat-dissipating core type and the copper base plate comprise a porous step. Heat sinks · The present invention is also a hot sheet. The porous copper dispersion liquid produced by the method for producing a copper heat release sheet: the anode and the cathode are required to be electrically cast. The foamed J type; Ϊ; Ϊ: copper sulphate. One. The shellfish can be used for at least the three-dimensional porous copper dispersion treatment of the self-twisting and PVC material, and is coated and anti-oxidized on the subsequent anti-oxidation surface to prevent the vertical I# multi-four-hole copper Surface of the heat sink [Embodiment] The surface of the copper-shaped heat sink is oxidized. The heat-generating components are mainly used to reduce the operating temperature. Among them, the large-sized pieces and the heat-dissipating sheets are used to reduce the heat transfer area, and the heat-cooling capacity is still strong. The invention has a lower thermal resistance and a higher cold. The invention is a multi-flowering; & is also conventionally known to manufacture a heat-dissipating product; the manufacturing method of the method is different from that of a foaming core type. And through the conductive, the foam forming process completes the plate and the three-dimensional porous steel is scattered;; === type, and - copper bottom shaped copper heat sink. This method is not only available due to the combination of the electric pounds and the two-dimensional porous copper heat sink, but also the effect and efficiency of the second embodiment of the preferred embodiment of the present invention. Detailed description. The method of garnishing, as shown in Fig. 1, together with the drawing, the present invention is a method 100, which comprises a manufacturer of a foam forming process heat sink 10, a conductive processing process 1291849, a step 120, and a plurality of processes. . 〆 乂 130 130 and joining process step 140, etc. Main implementation steps continued #
圖所示，以—非導命2A至弟2E圖所示，首先如第2A 驟11〇製作成—非^1性2材料’經由發泡成形製程步 多孔網狀形式之發如第2β圖所示，其係為- -導電處理製程步驟；〇伤，再將該發泡芯型1〇經 型ΗΓ之上，以僮接千*係上復一導電層於發泡芯 再見第_，以成形製程步謂的處理。請 芯型ΗΓ經一電鎊ff二程後便可再將該已導電之發泡 芯型ΗΓ置放於^極/衣私步驟130 ，係將被電鑄物發泡 應此一散熱基材C二;屬i1則置放於陽極端，因 經由陽極銅金屬21電铃、、1_^以延用硫酸銅為電鑄液， 上，而成-含^以：陰極端之發泡芯型1。，之 芯型20係為一多孔網狀者。體銅散熱芯型20，該銅散熱 一銅底板30與該銅散熱#二‘，p40 ，如弟2E圖所示，將 合，主要係將銅金屬2、丨、j利用電鑄技術使二者接 邊狀似半月形弧，二者_J之週邊，其連接週 熱片1。在使用上，公成後便成一立體多孔形銅散 將發熱產品之熱量吸收，再：：：係附於發熱產品之上並 别將熱量結合冷卻機：作；體。形銅散熱芯型 果。 有文之輸出，以達到散熱的效 有關本發明上述發舍―、 材質中之至少—者，再者二。係可選用自PU及pvc 再進行後續防氧化表面處理散熱片’更可 ;;面塗覆-抗氧化層，用以防ί;ίΐ;::形銅散熱片 表面氧化。 立體夕孔形銅散熱片 π另外，利用此一發明所製作之立W2 不僅可以提高散埶表面_，肢夕孔形散熱月， 、表面和進而增加散熱能力，更能有 1291849 效降低元件之勒 速增加時，缺a I自有傳統鰭片式散熱片，& 部分的風旦：：片上十所形成的邊界層亦變得更薄片尬當風 1 ^風里無法茶與熱交換之缺點。更/專，使得大 本每明係有闕於一種多 其可不受芯型形狀尺寸之限制广對=二片，製造方法， :發明也不被侷限且 …口：雜之工件成 明也不加以揭限；泡：:二 之限制，當然本^ =係揭示於以銅金 [ΐίί以散熱率為考量所選用但熱 上（丁、不文基材材料 疋本♦明在使用 所使用之材料。、义，所以，本發明也不加以侷限 本發明係還包合_ #、，々 作之多孔型銅散熱片1種以夕孔形銅散熱片之製造方法製 雖然本發明以較每# 限定本發明，任何只也{彳，路於上，然其並非用以 精神和範圍内，♦:自^項技蟄者’在不脫離本發明之 之保護範圍當視；二,午之更動與潤飾，因此本發明 見後附之申請範圍所界定者為準。 【圖式簡單說明】 第1圖·係本發明之 第2A、2B、2C、2D = 驟流程圖 此圖：係本發明之製作過程示意圖 【主要元件符號說明】 步驟110 步驟120 步驟130 步驟140 叙泡成形製程步驟 處理製程步驟 電鑄成形製程步驟 接合製程步驟 ⑽：Γ=ϊ散熱片之製造方* 銅散熱片 1291849 ίο :發泡芯型 10':塗覆導電層之發泡芯型As shown in the figure, as shown in Fig. 2A to Fig. 2E, first, as in the case of the second step 11A, the material is formed into a porous network form as in the second step. As shown, it is - - conductive processing process step; bruises, and then the foamed core type 1 〇 ΗΓ ΗΓ , , , , , , 童 童 , , , , , , , , , , , , , , , , , , , , , The processing of the forming process step. After the core type is passed through a second pound of volts, the conductive foamed core can be placed in the step/clothing step 130, which is to be foamed by the electroformed material. C2; i1 is placed at the anode end, because the copper metal 21 through the anode copper, 1_^ to extend the use of copper sulphate as an electroforming liquid, on the -including: to the cathode end of the foam core 1. The core type 20 is a porous mesh. Body copper heat-dissipating core type 20, the copper heat-dissipating copper base plate 30 and the copper heat-dissipating #二', p40, as shown in the figure 2E, will be combined, mainly copper metal 2, 丨, j using electroforming technology to make two The edge is like a half moon arc, and the periphery of the two _J is connected to the hot sheet 1 . In use, after the male is formed into a three-dimensional porous copper powder, the heat of the heat-generating product is absorbed, and then::: attached to the heat-generating product and not combined with the heat: the body; Shaped copper heat sink type. There is a text output to achieve the effect of heat dissipation. According to the invention, at least one of the above-mentioned materials, and the second one. It can be selected from PU and pvc for subsequent anti-oxidation surface treatment of heat sinks. It can be coated with anti-oxidation layer to prevent ;; ΐ; Stereo-shaped copper-shaped heat sink π In addition, the vertical W2 made by this invention can not only improve the surface of the heat-dissipating surface, but also increase the heat-dissipating ability of the surface and the heat-dissipating capacity, and can further reduce the components by the 1291849 effect. When the speed is increased, the lack of a I has its own traditional finned heat sink, & part of the wind:: the boundary layer formed by the ten on the film has become more thin. When the wind 1 ^ wind can not be tea and heat exchange Disadvantages. More / special, so that each of the big ones is different from the ones, which are not limited by the size of the core shape = two pieces, the manufacturing method, the invention is not limited and the mouth: the miscellaneous workpiece is not clear The limit of the bubble:: two, of course, this ^ = is revealed in the copper gold [ΐίί based on the heat dissipation rate of the selected but hot (Ding, not the substrate material ♦ ♦ use in use The present invention is not limited thereto. The present invention is also a method for manufacturing a porous copper heat sink of the same type, which is made of a copper-shaped heat sink. # 限定本发明,任何任何的的, 路,在上上,其其其其的范围内, ♦:自^技技的''''''' The invention is modified and retouched, so the invention is defined by the scope of the appended application. [Simplified description of the drawings] Fig. 1 is the 2A, 2B, 2C, 2D of the present invention. Schematic diagram of the manufacturing process of the invention [Key element symbol description] Step 110 Step 120 Step 130 Step 140 Syrian foam forming process step treatment process step of electroforming shape processing steps process step of bonding ⑽: Γ = ϊ producing fins of * copper heatsink 1291849 ίο: foamed core 10 ': foam core coated with a conductive layer of
1Γ :導電層 20 : 銅散熱芯型 21 ： 銅金屬 30 ·· 銅底板 91Γ : Conductive layer 20 : Copper heat sink core 21 : Copper metal 30 ·· Copper base plate 9