TWM624077U - Heat-dissipation device with patterned surface layer for vehicle - Google Patents

Abstract

A heat-dissipation device with a patterned surface layer for a vehicle is provided. The heat-dissipation device includes a metal heat-dissipation device and a sputtered layer. The sputtered layer with a predetermined pattern is partially formed on a top surface of the metal heat-dissipation device by sputtering. The thickness of the sputtered layer is between 1[mu]m and 3[mu]m, and the coverage area of the sputtered layer is smaller than 90% of the total area of the top surface of the metal heat-dissipation device.

Description

A vehicle cooling device with surface patterned coating

The new model relates to a vehicle heat dissipation device, in particular to a vehicle heat dissipation device with a surface patterned coating.

Current automotive electronic component modules, such as automotive IGBT modules or automotive ADAS modules, may deteriorate in performance and even be damaged as long as the temperature exceeds the allowable temperature.

The current automotive electronic component modules use metal heat sinks to dissipate heat. However, with the rapid development of modern industry, higher requirements have been placed on the functionality of metal heat sinks, such as corrosion resistance or bonding. Metal heat sinks cannot meet higher requirements.

The technical problem to be solved by the present invention is to provide a vehicle heat dissipation device with a surface patterned coating in view of the deficiencies of the prior art.

The embodiment of the present invention discloses a vehicle heat dissipation device with a surface patterned coating layer, including: a metal heat dissipation device; and a sputtered metal layer partially formed on the upper surface of the metal heat dissipation device by sputtering, thereby The sputtered metal layer is patterned, the thickness of the sputtered metal layer is between 1 μm and 3 μm, and the coverage area of the sputtered metal layer is less than 90% of the upper surface area of the metal heat sink.

In a preferred embodiment, the sputtered metal layer is formed in a vacuum environment with a vacuum degree of less than 10 ^-2 mbar.

In a preferred embodiment, the sputtered metal layer is formed at a sputtering rate of 1000 watts or more.

In a preferred embodiment, a fin structure is provided inside the metal heat sink.

In a preferred embodiment, the metal heat sink is a water-cooled or air-cooled metal heat sink.

In a preferred embodiment, the metal heat sink is a closed or semi-open metal heat sink.

In a preferred embodiment, the metal heat sink is formed of at least one of aluminum, aluminum alloy, copper, and copper alloy.

In a preferred embodiment, the sputtered metal layer is formed of one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy.

The beneficial effect of the present invention is at least that, the vehicle heat dissipation device with surface patterned coating provided by the present invention can be locally formed on the metal heat dissipation device by means of "metal heat dissipation device" and "sputtered metal layer" by sputtering. On the upper surface of the sputtered metal layer, the sputtered metal layer is patterned, the thickness of the sputtered metal layer is between 1 μm and 3 μm, and the coverage area of the sputtered metal layer is smaller than the metal heat sink 90 % of the upper surface area”, so that a patterned functional area is formed on the upper surface of the metal heat sink, which can effectively improve the soldering function, corrosion resistance function of the metal heat sink, or The functionality of sintering.

For a further understanding of the features and technical contents of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the related embodiments disclosed by the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Please refer to FIG. 1 to FIG. 2 , an embodiment of the present invention provides a method for fabricating a surface patterned plating layer of a vehicle heat sink, which mainly includes the following steps.

First, (a) a metal heat sink 10 is provided. Further, in this embodiment, the metal heat sink 10 is provided with a fin structure 101, which may be a sheet-like fin structure or a pin-fin type structure, and Not limited to the above. Moreover, the metal heat sink 10 may be a water-cooled or air-cooled metal heat sink, or a closed or semi-open metal heat sink. Furthermore, the metal heat sink 10 may be made of at least one of aluminum, aluminum alloy, copper, and copper alloy.

Next, (b) a patterned sputtered metal layer 20 is formed on the upper surface 11 of the metal heat sink 10 by sputtering. Further, it can be masked by masking means, such as masking jig, ink, and anti-plating tape, so as to form at least one masking area 90 on the upper surface 11 of the metal heat sink 10, so that the masking area 90 is not formed. There is a metal layer, so that the patterned sputtered metal layer 20 is formed on the upper surface 11 of the metal heat sink 10 .

In one embodiment, the sputtered metal layer 20 may be formed by sputtering a single metal. Also, the single metal may be nickel, copper, or silver. Therefore, the sputtered metal layer 20 may be a sputtered nickel layer, a sputtered copper layer, or a sputtered silver layer.

In one embodiment, the sputtered metal layer 20 may be formed by sputtered alloy metal. Also, the alloy metal may be a nickel alloy, a copper alloy, or a silver alloy. Therefore, the sputtered metal layer 20 may also be a nickel alloy sputtered layer, a copper alloy sputtered layer, or a silver alloy sputtered layer.

It is worth mentioning that the thickness of the sputtered metal surface layer 20 is preferably between 1 μm and 3 μm, and the coverage area of the sputtered metal layer 20 is less than 90% of the upper surface area of the metal heat sink 10 . .

Furthermore, the sputtered metal layer 20 is formed in a vacuum environment with a vacuum degree of 10 ⁻² mbar or less. In addition, the sputtered metal layer 20 is formed under the condition that the sputtering rate is 1000 watts or more, so that the sputtered film has high purity, good density and good molding uniformity .

Therefore, by forming the patterned sputtered metal layer 20 on the upper surface 11 of the metal heat dissipation device 10 , so that patterned functional areas are formed on the upper surface 11 of the metal heat dissipation device 10 , it is possible to effectively The function of soldering, the function of anti-corrosion, or the function of sintering of the metal heat sink 10 is improved.

Furthermore, according to the above, the novel embodiment also provides a vehicle heat dissipation device with a surface patterned coating layer, which has a metal heat dissipation device 10 and a sputtered metal layer 20 . Further, the sputtered metal layer 20 is partially formed on the upper surface 11 of the metal heat sink 10 by sputtering, so that the sputtered metal layer 20 is patterned, and the sputtered metal The thickness of the layer 20 is between 1 μm and 3 μm, and the coverage area of the sputtered metal layer 20 is less than 90% of the upper surface area of the metal heat sink 10 .

In one embodiment, a fin structure 101 may be disposed inside the metal heat dissipation device 10 . The metal heat sink 10 may be a water-cooled or air-cooled metal heat sink. The metal heat sink 10 may be a closed or semi-open metal heat sink. Moreover, the metal heat sink 10 may be formed of at least one of aluminum, aluminum alloy, copper, and copper alloy.

In one embodiment, the sputtered metal layer 20 may be formed of one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy.

Based on the above, the vehicle heat dissipation device with surface patterned coating provided by the present invention can be locally formed on the upper surface of the metal heat dissipation device by means of "metal heat dissipation device" and "sputtered metal layer" by sputtering. so that the sputtered metal layer is patterned, and the thickness of the sputtered metal layer is between 1 μm and 3 μm, and the coverage area of the sputtered metal layer is less than 90% of the upper surface of the metal heat sink The technical solution of "surface area", so that patterned functional areas are formed on the upper surface of the metal heat sink, which can effectively improve the function of soldering, corrosion resistance, or sintering of the metal heat sink. sex.

The contents disclosed above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Metal heat sink 11: Upper surface 101: Fin structure 20: Sputtering metal layer 90: Shaded area

FIG. 1 is a schematic side view of a metal heat dissipation device in a new embodiment.

FIG. 2 is a schematic side view of a patterned sputtered metal layer formed on the upper surface of the metal heat dissipation device in the novel embodiment.

10: Metal heat sink

101: Fin structure

20: Sputtering metal layer

90: Shaded area

Claims (8)

A vehicle heat sink with surface patterned coating, comprising: a metal heat sink; and A sputtered metal layer is partially formed on the upper surface of the metal heat sink by sputtering, so that the sputtered metal layer is patterned, and the thickness of the sputtered metal layer is between 1 μm and 3 μm and the coverage area of the sputtered metal layer is less than 90% of the upper surface area of the metal heat sink. The vehicle heat sink with a surface patterned coating according to claim 1, wherein the sputtered metal layer is formed under a vacuum environment with a vacuum degree of 10 ⁻² mbar or less. The vehicle heat sink with a surface patterned plating layer according to claim 2, wherein the sputtered metal layer is formed under the condition of a sputtering rate of 1000 watts or more. The vehicle heat dissipation device with surface patterned coating according to claim 1, wherein a fin structure is provided inside the metal heat dissipation device. The vehicle heat-dissipating device with surface patterned coating according to claim 4, wherein the metal heat-dissipating device is a water-cooling or air-cooling metal heat-dissipating device. The vehicle heat dissipation device with surface patterned coating according to claim 4, wherein the metal heat dissipation device is a closed or semi-open metal heat dissipation device. The vehicle heat dissipation device with a surface patterned plating layer according to claim 4, wherein the metal heat dissipation device is formed of at least one of aluminum, aluminum alloy, copper, and copper alloy. The vehicle heat sink with surface patterned plating layer according to claim 1, wherein the sputtered metal layer is formed by one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy.

Images