TWM654728U - Heat dissipation structure and device - Google Patents

Abstract

A heat dissipation structure and device for dissipating heat from heating components. The heat dissipation structure includes a substrate and a boiling heat dissipation structure, wherein the substrate is used for attaching to one side of the heating element, and the side of the substrate far from the heating element is provided with a groove. The boiling heat dissipation structure is housed in the groove, and is integrally formed on the substrate through etching, and is thermally connected to the substrate. The boiling heat dissipation structure is equipped with a heat dissipation channel, which provides the flow of heat dissipation fluid to make the heat dissipation fluid thermally connected to the boiling heat dissipation structure. In this way, the boiling heat dissipation structure is integrally formed on the substrate, so that there is no contact thermal resistance between the boiling heat dissipation structure and the substrate, and the heat dissipation efficiency is improved.

Description

Heat dissipation structure and heat dissipation device

This application relates to the field of heat dissipation equipment technology, specifically, heat dissipation structures and heat dissipation devices.

In the field of electronic products, boiling heat sinks are increasingly used. Generally, porous materials or metal mesh structures are made into boiling heat sinks, and then the made boiling heat sinks are fixed on the substrate by welding. The substrate is attached to the heat generating components to dissipate heat. However, this welding method not only leads to a large contact thermal resistance between the boiling heat sink and the substrate, affecting the heat dissipation performance of the boiling heat sink to the substrate, but also causes the substrate to be annealed in disguised form in the high temperature atmosphere during welding, reducing the structural strength of the substrate. How to solve the above problems, that is, to provide a heat sink structure and heat sink with good heat dissipation effect is what the technical personnel in this field need to consider.

This application provides a heat dissipation structure and a heat dissipation device to solve the above technical problems.

The embodiment of the present application is implemented as follows: a heat dissipation structure for dissipating heat from a heat generating component; the heat dissipation structure comprises: a substrate, the substrate is used to be attached to one side of the heat generating component, and a groove is provided on the side of the substrate away from the heat generating component; a boiling heat dissipation structure, the boiling heat dissipation structure is accommodated in the groove, the boiling heat dissipation structure is integrally formed on the substrate, and is thermally connected to the substrate, the boiling heat dissipation structure is provided with a heat dissipation channel, the heat dissipation channel is for the flow of heat dissipation fluid, so that the heat dissipation fluid and the boiling heat dissipation structure perform heat exchange.

In a possible implementation: the boiling heat dissipation structure includes a plurality of heat dissipation protrusions, the plurality of heat dissipation protrusions are formed by protruding from the bottom wall of the groove in a direction away from the heat generating component, and any two adjacent heat dissipation protrusions are arranged at intervals.

In a possible implementation: a plurality of the heat dissipation protrusions are arranged vertically and horizontally on the bottom wall of the groove, and the heat dissipation channel is formed between two adjacent heat dissipation protrusions.

In a possible implementation: the height of the heat dissipation protrusion in the direction away from the heat generating component is less than the depth of the groove.

In a possible implementation, the boiling heat dissipation structure is formed integrally with the substrate by laser engraving or chemical etching, and is arranged from an end of the substrate far from the heat generating component toward an end of the substrate close to the heat generating component.

In a possible implementation: the outer peripheral wall of the boiling heat dissipation structure and the inner peripheral wall of the groove are spaced apart.

In a possible implementation: the groove is formed on the end surface of the substrate away from the heat generating component or the outer peripheral surface of the substrate by laser engraving or chemical etching.

In a possible implementation: the outer peripheral wall of the boiling heat dissipation structure and the inner peripheral wall of the groove are integrally connected to the inner peripheral wall of the groove via the heat dissipation protrusion.

A heat dissipation device includes a heat dissipation box and the above-mentioned heat dissipation structure, wherein the heat dissipation box is provided with an installation cavity, the installation cavity accommodates the heat dissipation fluid, the heat dissipation component is arranged in the heat dissipation fluid, the heat dissipation structure is attached to the heat dissipation component, and the heat dissipation structure is arranged in the heat dissipation fluid.

In a possible implementation: a condenser is provided in the installation cavity, and the condenser is provided outside the heat dissipation fluid.

The heat dissipation structure of the present application is formed integrally by directly forming the boiling heat dissipation structure on the substrate. Compared with the method of welding the boiling heat dissipation structure to the substrate, the boiling heat dissipation structure of the present application is integrally connected to the substrate, and there is no contact thermal resistance between the two. The heat dissipation efficiency is high, and the uniformity of the connection between the boiling heat dissipation structure and the substrate is better, making the heat dissipation effect of the entire heat dissipation structure more stable.

200: Heat dissipation device

100: Heat dissipation structure

Z: First direction

X: Second direction

Y: Third direction

10: Substrate

101: Groove

20: Boiling heat dissipation structure

21: Heat dissipation bulge

22: Heat dissipation channel

30: Heat generating components

40: Heat sink

41: Installation cavity

42: Heat dissipation fluid

50: Condenser

In order to more clearly illustrate the technical solution of the embodiment of this application, the drawings in the embodiment will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative labor.

Figure 1 is a schematic diagram of the structure of the heat dissipation device of the present application in one embodiment.

Figure 2 is a three-dimensional schematic diagram of the heat dissipation structure of the present application in one embodiment.

Figure 3 is a partial enlarged schematic diagram of the heat dissipation structure corresponding to area A in Figure 2.

The following will combine the attached figures in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them.

It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. When an element is considered to be "set on" another element, it may be directly set on the other element or there may be a central element at the same time. The terms "left", "right" and similar expressions used in this article are for illustrative purposes only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the field of this application. The terms used herein in the specification of this application are only for the purpose of describing specific implementation methods and are not intended to limit this application. The term "or/and" used herein includes any and all combinations of one or more related listed items.

Some implementation methods of this application are described in detail. In the absence of conflict, the following implementation methods and features in the implementation methods can be combined with each other.

Please refer to FIG. 1 . The heat dissipation device 200 of the present application is used to dissipate heat from the heat generating component 30 by boiling heat dissipation. The heat dissipation device 200 includes a heat dissipation box 40 and a heat dissipation structure 100. The heat dissipation box 40 is provided with an installation cavity 41, and the installation cavity 41 accommodates a heat dissipation fluid 42. The heat dissipation structure 100 is attached to the heat generating component 30, and the heat dissipation structure 100 is provided in the heat dissipation fluid 42.

In one embodiment, the heat dissipation structure 100 includes a substrate 10 and a boiling heat dissipation structure 20 connected to each other. The heat generating component 30 is fixed to the bottom wall of the mounting cavity 41, and the substrate 10 is made of a material with good thermal conductivity, such as copper or aluminum. The substrate 10 is attached to one end of the heat generating component 30 away from the bottom wall of the mounting cavity 41, and the heat generated by the heat generating component 30 during operation can be directly transferred to the substrate 10 in contact therewith. Of course, the substrate 10 can also be attached to the side wall of the heat generating component 30. The heat of the heat generating component 30 is transferred to the substrate 10, and the substrate 10 then transfers the heat to the boiling heat dissipation structure 20, and then the boiling heat dissipation structure 20 is heat-dissipated after heat exchange with the heat dissipation fluid 42.

The heat-generating component 30 and the heat-dissipating structure 100 are both placed in the heat-dissipating fluid 42, which is an insulating immersion cooling medium (such as FC-72). When the heat-dissipating fluid 42 contacts the surface of the boiling heat-dissipating structure 20, the heat-dissipating fluid 42 absorbs the heat of the boiling heat-dissipating structure 20 and then boils and vaporizes, thereby taking away the heat of the boiling heat-dissipating structure 20 and completing the heat dissipation of the boiling heat-dissipating structure 20.

Please refer to Figure 1 again. A condenser 50 is provided in the installation cavity 41, and the condenser 50 is provided outside the heat dissipation fluid 42. In one embodiment, the condenser 50 is installed on the top wall of the installation cavity 41. The condenser 50 can receive the gas after the heat dissipation fluid 42 is vaporized, and the gas is re-condensed into liquid and then introduced into the heat dissipation fluid 42. Not only can the heat dissipation fluid 42 be reused, but the condensed heat dissipation fluid 42 can also cool down the heat dissipation fluid 42 that has not yet vaporized.

The boiling heat dissipation structure 20 is integrally formed on the substrate 10 and is thermally connected to the substrate 10. The boiling heat dissipation structure 20 extends outward along the first direction Z from the end surface of the substrate 10 away from the heat generating component 30. The boiling heat dissipation structure 20 is provided with a heat dissipation channel 22, and the heat dissipation channel 22 is for the heat dissipation fluid 42 to flow, so that the heat dissipation fluid 42 and the boiling heat dissipation structure 20 perform heat exchange.

In one embodiment, the substrate 10 is arranged in a flat plate structure, which can increase the contact area between the substrate 10 and the heating element 30 and improve the heat transfer efficiency between the heating element 30 and the substrate 10.

The extension direction of the heat dissipation channel 22 is one or more of the second direction X and the third direction Y, which can improve the distribution rate of the heat dissipation channel 22 compared to the boiling heat dissipation structure 20, increase the contact area between the heat dissipation fluid 42 and the boiling heat dissipation structure 20, and improve the boiling heat dissipation effect.

It can be understood that the first direction Z, the second direction X and the third direction Y can be three non-parallel straight line directions in space; further, the first direction Z, the second direction X and the third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (three-dimensional Cartesian coordinate system). In the subsequent embodiments, the first direction Z is the Z axis direction of the coordinate axis of the three-dimensional coordinate system, the second direction X is the X axis direction of the coordinate axis of the three-dimensional coordinate system, and the third direction Y is the Y axis direction of the coordinate axis of the three-dimensional coordinate system.

Thus, the heat dissipation structure 100 of the present application is formed integrally by directly forming the boiling heat dissipation structure 20 on the substrate 10. Compared with the method of welding the boiling heat dissipation structure 20 to the substrate 10, the boiling heat dissipation structure 20 of the present application is integrally connected with the substrate 10, and there is no contact thermal resistance between the two, the heat dissipation efficiency is high, and the connection uniformity between the boiling heat dissipation structure 20 and the substrate 10 is better, so that the heat dissipation effect of the entire heat dissipation structure 100 is more stable.

Please refer to Figure 1 and Figure 2 again. The boiling heat dissipation structure 20 is formed integrally with the substrate 10 by laser engraving or chemical etching, and is set from the end of the substrate 10 far from the heat generating component 30 to the end of the substrate 10 close to the heat generating component 30. Compared with the welding method, the substrate 10 does not need to be affected by the high temperature environment and annealed in disguise, ensuring that the strength of the substrate 10 will not be reduced.

It is worth noting that, according to the above method, when the substrate 10 is processed by laser engraving or chemical etching, a groove 101 is formed after the end of the substrate 10 away from the heat generating component 30 is recessed inward. The boiling heat dissipation structure 20 after processing is completely located in the groove 101, so that the boiling heat dissipation structure 20 will not be exposed outside the groove 101, which can play a good protective role on the boiling heat dissipation structure 20 and prevent the boiling heat dissipation structure 20 from being damaged after contact with foreign objects. In addition, the boiling heat dissipation structure 20 is formed in the groove 101, which can utilize the internal space of the substrate 10. The formation of the boiling heat dissipation structure 20 will not increase the thickness of the substrate 10, thereby making the thickness of the entire substrate 10 lower and not increasing the assembly space required for the substrate 10.

In particular, the shape of the boiling heat dissipation structure 20 after forming can be adjusted according to actual design requirements, and the height of the boiling heat dissipation structure 20 along the first direction Z is less than the height of the substrate 10 along the first direction Z, so as to ensure that the boiling heat dissipation structure 20 will not directly contact the heat generating component 30 after passing through the substrate 10. When the boiling heat dissipation structure 20 is cut off by the plane where the second direction X and the third direction Y are located, the cross section of the boiling heat dissipation structure 20 is less than or equal to the cross section of the substrate 10.

It is understandable that in another embodiment, the boiling heat dissipation structure 20 can also be formed after being processed inward from the side surface of the substrate 10. At this time, the groove 101 is formed after being recessed inward from the side surface of the substrate 10, and the boiling heat dissipation structure 20 is completely contained in the groove 101.

Please refer to Figure 3 again. The boiling heat dissipation structure 20 includes a plurality of heat dissipation protrusions 21. The heat dissipation protrusions 21 protrude outward from the bottom wall of the groove 101 in a direction away from the heat-generating component 30, and the heat dissipation protrusions 21 are arranged in a polyhedron structure such as a quadrangular prism. The heat dissipation protrusions 21 have a plurality of contact surfaces to increase the contact area between the heat dissipation protrusions 21 and the heat dissipation fluid 42 and improve the heat dissipation efficiency. Any two adjacent heat dissipation protrusions 21 are arranged at intervals so that the contact area between the heat dissipation protrusions 21 and the heat dissipation fluid 42 will not be reduced due to contact between the heat dissipation protrusions 21.

Furthermore, the bottom end of the heat dissipation protrusion 21 is directly connected to the bottom wall of the groove 101 in an integral manner, so that the heat dissipation protrusion 21 and the substrate 10 are integrally formed.

In some implementations, the outer peripheral wall of the boiling heat dissipation structure 20 is spaced from the inner peripheral wall of the groove 101, that is, the heat dissipation protrusion 21 located closest to the inner peripheral wall of the groove 101 is spaced from the inner peripheral wall of the groove 101, so that a gap for the heat dissipation fluid 42 to flow is formed between the boiling heat dissipation structure 20 and the inner peripheral wall of the groove 101, so that the heat dissipation fluid 42 directly dissipates the inner peripheral wall of the groove 101. When other embodiments are adopted, the outer peripheral wall of the boiling heat dissipation structure 20 is integrally connected to the inner peripheral wall of the groove 101 through the heat dissipation protrusion 21, that is, the side wall of the heat dissipation protrusion 21 located closest to the inner peripheral wall of the groove 101 facing the inner peripheral wall of the groove 101 is integrally connected to the inner peripheral wall of the groove 101, so that the heat dissipation protrusion 21 connected to the inner peripheral wall of the groove 101 is used to dissipate heat from the inner peripheral wall of the groove 101, thereby improving the heat dissipation effect of the inner peripheral wall of the groove 101, thereby improving the heat dissipation effect of the entire substrate 10.

It is understandable that the groove 101 can be arranged on the end surface of the substrate 10 far away from the heat generating component 30, or the groove 101 can be arranged on the outer peripheral surface of the substrate 10. Since most of the substrate 10 is a flat plate structure, when considering the opening position of the groove 101, it should be given priority to opening it at the end surface of the substrate 10 far away from the heat generating component 30. However, for some substrates 10 with a larger thickness and a smaller cross-sectional size, it is more appropriate to open the groove 101 on the outer peripheral surface of the substrate 10.

Please refer to Figure 3 again. Multiple heat dissipation protrusions 21 are arranged vertically and horizontally to form heat dissipation channels 22, so that when the heat dissipation fluid 42 flows in the heat dissipation channel 22, the heat dissipation fluid 42 contacts the side wall of the heat dissipation protrusion 21, and the heat dissipation fluid 42 dissipates heat from the heat dissipation protrusion 21, thereby realizing centralized heat dissipation of the substrate 10.

In one embodiment, the heat dissipation protrusions 21 are arranged in an array along the second direction X and the third direction Y on the bottom wall of the groove 101 to form a heat dissipation channel 22 extending along the second direction X or the third direction Y, so that the heat dissipation fluid 42 flowing through the heat dissipation channel 22 can flow into the boiling heat dissipation structure 20 from at least two directions and contact the heat dissipation protrusions 21 to dissipate heat from the heat dissipation protrusions 21, thereby dissipating heat from the substrate 10 thermally connected to the heat dissipation protrusions 21. The height of the heat dissipation protrusions 21 along the first direction Z is less than the depth of the groove 101 along the first direction Z to ensure that the end of the heat dissipation protrusion 21 away from the bottom wall of the groove 101 will not be exposed to the groove 101 and easily damaged.

In addition, the heat dissipation channel 22 extending along the second direction X and the heat dissipation channel 22 extending along the third direction Y are connected to each other in a cross-shaped manner, thereby increasing the contact area between the heat dissipation fluid 42 and the boiling heat dissipation structure 20, improving the heat dissipation effect of the heat dissipation fluid 42 on the boiling heat dissipation structure 20, and further improving the heat dissipation effect of the boiling heat dissipation structure 20 on the substrate 10.

In particular, the heat dissipation channel 22 extending along the second direction X is the first channel, and the heat dissipation channel 22 extending along the third direction Y is the second channel.

In this way, the first channel and the second channel are connected to each other, so that the heat dissipation fluid 42 can not only flow into the boiling heat dissipation structure 20 from multiple directions, but also flow out of the boiling heat dissipation structure 20 after passing through different heat dissipation protrusions 21 from multiple directions, thereby accelerating the inflow and outflow speeds of the heat dissipation fluid 42 and improving the heat dissipation efficiency. At the same time, the gas vaporized after the heat dissipation fluid 42 exchanges heat with the boiling heat dissipation structure 20 can also be discharged from the first channel or the second channel, thereby accelerating the outflow speed of the vaporized high-temperature gas and improving the heat dissipation efficiency.

The above implementations are only used to illustrate the technical solution of this application and are not intended to limit it. Although this application is described in detail with reference to the above preferred implementations, ordinary technicians in this field should understand that the technical solution of this application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of this application.

200: Heat dissipation device

100: Heat dissipation structure

10: Substrate

20: Boiling heat dissipation structure

30: Heat generating components

40: Heat sink

41: Installation cavity

42: Heat dissipation fluid

50: Condenser

Claims (10)

A heat dissipation structure is used to dissipate heat from a heat generating component; the improvement is that the heat dissipation structure comprises: a substrate, the substrate is used to be attached to one side of the heat generating component, and a groove is provided on the side of the substrate away from the heat generating component; a boiling heat dissipation structure, the boiling heat dissipation structure is accommodated in the groove, the boiling heat dissipation structure is integrally formed on the substrate and is thermally connected to the substrate, and the boiling heat dissipation structure is provided with a heat dissipation channel, the heat dissipation channel is for the flow of heat dissipation fluid, so that the heat dissipation fluid and the boiling heat dissipation structure perform heat exchange. The heat dissipation structure as described in claim 1, wherein: the boiling heat dissipation structure includes a plurality of heat dissipation protrusions, the plurality of heat dissipation protrusions are formed by protruding from the bottom wall of the groove in a direction away from the heat generating component, and any two adjacent heat dissipation protrusions are arranged at intervals. The heat dissipation structure as described in claim 2, wherein: a plurality of the heat dissipation protrusions are arranged vertically and horizontally on the bottom wall of the groove, and the heat dissipation channel is formed between two adjacent heat dissipation protrusions. A heat dissipation structure as described in claim 2, wherein: the height of the heat dissipation protrusion in the direction away from the heat generating component is less than the depth of the groove. The heat dissipation structure as described in claim 1, wherein: The boiling heat dissipation structure is formed integrally with the substrate by laser engraving or chemical etching, and is arranged from an end of the substrate far from the heat generating component toward an end of the substrate close to the heat generating component. The heat dissipation structure as described in claim 1, wherein: the outer peripheral wall of the boiling heat dissipation structure and the inner peripheral wall of the groove are spaced apart. The heat dissipation structure as described in claim 1, wherein: the groove is formed on the end surface of the substrate away from the heat generating component or the outer peripheral surface of the substrate by laser engraving or chemical etching. The heat dissipation structure as described in claim 2, wherein: the outer peripheral wall of the boiling heat dissipation structure and the inner peripheral wall of the groove are integrally connected via the heat dissipation protrusion and the inner peripheral wall of the groove. A heat dissipation device, the improvement of which is that it includes a heat dissipation box and a heat dissipation structure as described in any one of claims 1 to 8, the heat dissipation box is provided with an installation cavity, the installation cavity accommodates the heat dissipation fluid, the heat dissipation component is arranged in the heat dissipation fluid, the heat dissipation structure is attached to the heat dissipation component, and the heat dissipation structure is arranged in the heat dissipation fluid. The heat dissipation device as described in claim 9, wherein: a condenser is provided in the installation cavity, and the condenser is provided outside the heat dissipation fluid.