CN219919561U - Heat radiation structure and heat radiation device - Google Patents

Abstract

The utility model provides a heat radiation structure and a heat radiation device, wherein the heat radiation structure is used for radiating heat of heating components; the heat dissipation structure comprises a substrate and a boiling heat dissipation structure, wherein the substrate is used for being attached to one side of the heating element, and a groove is formed in one side, away from the heating element, of the substrate; the boiling heat dissipation structure is accommodated in the groove, integrally formed on the substrate in an etching mode and in heat conduction connection with the substrate, and is provided with a heat dissipation channel for heat dissipation fluid to flow so that the heat dissipation fluid is in heat conduction connection with the boiling heat dissipation structure. Therefore, the boiling heat dissipation structure is integrally formed on the substrate, so that no contact thermal resistance exists between the boiling heat dissipation structure and the substrate, and the heat dissipation efficiency is improved.

Description

Heat radiation structure and heat radiation device

Technical Field

The present utility model relates to heat dissipation devices, and particularly to a heat dissipation structure and a heat dissipation device.

Background

In the field of electronic products, the application of a boiling heat dissipation device is becoming wider and wider, the boiling heat dissipation device is generally made of porous materials or metal net structures, and then the made boiling heat dissipation structure is fixed on a substrate in a welding mode, and the substrate is attached to a heating element to dissipate heat of the heating element. However, the welding mode not only causes large contact thermal resistance between the boiling heat dissipation structure and the substrate and influences the heat dissipation performance of the boiling heat dissipation structure on the substrate, but also causes the substrate to be subjected to phase change annealing treatment in a high-temperature atmosphere during welding, thereby reducing the structural strength of the substrate.

How to solve the above-mentioned problems, namely providing a heat dissipation structure and a heat dissipation device with good heat dissipation effect is needed to be considered by those skilled in the art.

Disclosure of Invention

The embodiment of the utility model provides a heat dissipation structure which is used for dissipating heat of a heating element; the heat dissipation structure includes:

the substrate is used for being attached to one side of the heating element, and a groove is formed in one side, away from the heating element, of the substrate;

the boiling heat dissipation structure is accommodated in the groove, integrally formed on the base plate and in heat conduction connection with the base plate, and is provided with a heat dissipation channel for heat dissipation fluid to flow so that the heat dissipation fluid exchanges heat with the boiling heat dissipation structure.

Further, the boiling heat dissipation structure comprises a plurality of heat dissipation protrusions, the heat dissipation protrusions are formed after protruding from the bottom wall of the groove towards the direction away from the heating element, and any two adjacent heat dissipation protrusions are arranged at intervals.

Further, the plurality of heat dissipation protrusions are longitudinally and transversely arranged on the bottom wall of the groove, and the heat dissipation channels are formed between two adjacent heat dissipation protrusions.

Further, the height of the heat dissipation protrusion along the direction away from the heating element is smaller than the groove depth of the groove.

Further, the boiling heat dissipation structure is integrally formed with the substrate in a laser engraving or chemical etching mode, and is arranged from one end of the substrate far away from the heating element to one end of the substrate close to the heating element.

Further, the outer peripheral wall of the boiling heat dissipation structure is arranged at intervals with the inner peripheral wall of the groove.

Further, the grooves are formed on the end face of the substrate far away from the heating element or the peripheral surface of the substrate in a laser engraving or chemical etching mode.

Further, the outer peripheral wall of the boiling heat dissipation structure is integrally connected with the inner peripheral wall of the groove through the heat dissipation protrusions.

The embodiment of the utility model also provides a heat dissipating device, which comprises a heat dissipating box and the heat dissipating structure, wherein the heat dissipating box is provided with an installation cavity, the installation cavity accommodates the heat dissipating fluid, the heating element is arranged in the heat dissipating fluid, the heat dissipating structure is attached to the heating element, and the heat dissipating structure is arranged in the heat dissipating fluid.

Further, a condenser is arranged in the mounting cavity, and the condenser is arranged outside the heat dissipation fluid.

Compared with the prior art, the boiling heat radiation structure is integrally formed on the substrate directly, and compared with the mode of welding the boiling heat radiation structure on the substrate, the boiling heat radiation structure is integrally connected with the substrate, and the boiling heat radiation structure and the substrate are free of contact thermal resistance, high in heat radiation efficiency, better in uniformity of connection of the boiling heat radiation structure and the substrate, and more stable in heat radiation effect.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipating device according to an embodiment of the utility model.

Fig. 2 is a schematic perspective view of a heat dissipation structure according to an embodiment of the utility model.

Fig. 3 is an enlarged partial schematic view of a corresponding area a of the heat dissipating structure in fig. 2.

Description of main reference numerals:

heat dissipating device 200

Heat dissipation structure 100

First direction Z

Second direction X

Third direction Y

Substrate 10

Groove 101

Boiling heat radiation structure 20

Radiating boss 21

Radiating passage 22

Heating element 30

Radiating box 40

Mounting cavity 41

Radiator fluid 42

Condenser 50

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

The following description will make reference to the accompanying drawings to more fully describe the utility model. Exemplary embodiments of the present utility model are illustrated in the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. Like reference numerals designate identical or similar components.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, as used herein, "comprises" and/or "comprising" and/or "having," integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. Furthermore, unless the context clearly defines otherwise, terms such as those defined in a general dictionary should be construed to have meanings consistent with their meanings in the relevant art and the present disclosure, and should not be construed as idealized or overly formal meanings.

The following describes in further detail the embodiments of the present utility model with reference to the accompanying drawings.

Referring to fig. 1, a heat dissipating device 200 of the present utility model is used for dissipating heat from a heat generating component 30 by boiling heat dissipation. The heat dissipating device 200 includes the heat dissipating case 40 and the heat dissipating structure 100. The heat dissipation case 40 is provided with a mounting cavity 41, the mounting cavity 41 accommodates a heat dissipation fluid 42, and the heat generating component 30 is provided in the heat dissipation fluid 42. The heat dissipation structure 100 is attached to the heat generating component 30, and the heat dissipation structure 100 is disposed in the heat dissipation fluid 42.

In one embodiment, the heat dissipating structure 100 includes a substrate 10 and a boiling heat dissipating structure 20 connected to each other. The heat generating component 30 is fixed to the bottom wall of the mounting chamber 41, and the substrate 10 is made of a material having good heat conduction properties, for example, a metal having good heat conduction properties such as copper or aluminum. The substrate 10 is attached to one end of the heat generating component 30 away from the bottom wall of the mounting cavity 41, and heat generated during operation of the heat generating component 30 can be directly transferred to the substrate 10 in contact therewith. Of course, the substrate 10 may be attached to the side wall of the heat generating component 30. The heat of the heating element 30 is transferred to the substrate 10, and the substrate 10 transfers the heat to the boiling heat dissipation structure 20, so that the boiling heat dissipation structure 20 dissipates heat after heat exchange between the boiling heat dissipation structure 20 and the heat dissipation fluid 42.

Both the heat-generating component 30 and the heat-dissipating structure 100 are disposed within a heat-dissipating fluid 42, the heat-dissipating fluid 42 being an insulating, submerged cooling medium (e.g., FC-72). When the heat dissipation fluid 42 contacts with the surface of the boiling heat dissipation structure 20, the heat dissipation fluid 42 absorbs the heat of the boiling heat dissipation structure 20 and then boils and vaporizes, so as to take away the heat of the boiling heat dissipation structure 20 and dissipate the heat of the boiling heat dissipation structure 20.

Referring to fig. 1 again, a condenser 50 is disposed in the mounting cavity 41, and the condenser 50 is disposed outside the heat dissipating fluid 42. In an embodiment, the condenser 50 is installed on the top wall of the installation cavity 41, and the condenser 50 can receive the gas vaporized by the heat dissipation fluid 42, and re-condense the gas into liquid and then collect the liquid into the heat dissipation fluid 42, so that not only the heat dissipation fluid 42 can be reused, but also the condensed heat dissipation fluid 42 can cool the heat dissipation fluid 42 which is not vaporized yet.

The boiling heat dissipation structure 20 is integrally formed on the substrate 10 and is in heat conduction connection with the substrate 10. The boiling heat radiation structure 20 extends outward along the first direction Z from the end surface of the substrate 10 away from the heat generating component 30. The boiling heat dissipation structure 20 is provided with a heat dissipation channel 22, and the heat dissipation channel 22 is used for flowing the heat dissipation fluid 42 so as to enable the heat dissipation fluid 42 to exchange heat with the boiling heat dissipation structure 20.

In an embodiment, the substrate 10 is disposed in a flat plate structure, so that the contact area between the substrate 10 and the heat generating component 30 can be increased, and the heat transfer efficiency between the heat generating component 30 and the substrate 10 can be improved.

The extending direction of the heat dissipation channel 22 is one or more of the second direction X and the third direction Y, which can increase the distribution ratio of the heat dissipation channel 22 compared with the boiling heat dissipation structure 20, increase the contact area between the heat dissipation fluid 42 and the boiling heat dissipation structure 20, and increase the boiling heat dissipation effect.

It can be understood that the first direction Z, the second direction X, and the third direction Y may be three non-parallel straight directions in space; further, the first direction Z, the second direction X, and the third direction Y may be three directions perpendicular to each other in a three-dimensional coordinate system (three-dimensional cartesian coordinate system). In the following embodiments, a description will be given taking, as an example, a Z-axis direction in which the first direction Z is a coordinate axis of the three-dimensional coordinate system, an X-axis direction in which the second direction X is a coordinate axis of the three-dimensional coordinate system, and a Y-axis direction in which the third direction Y is a coordinate axis of the three-dimensional coordinate system.

In this way, in the heat dissipation structure 100 of the present utility model, by integrally forming the boiling heat dissipation structure 20 directly on the substrate 10, compared with the manner of welding the boiling heat dissipation structure 20 to the substrate 10, the boiling heat dissipation structure 20 of the present utility model is integrally connected with the substrate 10 without contact thermal resistance therebetween, so that the heat dissipation efficiency is high, and the uniformity of connection between the boiling heat dissipation structure 20 and the substrate 10 is better, so that the heat dissipation effect of the whole heat dissipation structure 100 is more stable.

Referring to fig. 1 and 2, the boiling heat dissipation structure 20 is integrally formed with the substrate 10 by laser engraving or chemical etching, and is disposed from one end of the substrate 10 away from the heat generating component 30 toward one end of the substrate 10 near the heat generating component 30. Compared with the welding mode, the laser engraving and chemical etching modes are adopted, and compared with the welding mode, the substrate 10 does not need to be subjected to high-temperature environment to be subjected to phase change annealing treatment, so that the strength of the substrate 10 is ensured not to be reduced.

It should be noted that, in the above manner, when the substrate 10 is processed by laser engraving or chemical etching, the groove 101 is formed after the end of the substrate 10 away from the heat generating component 30 is recessed. The boiling heat radiation structure 20 after processing and forming is completely positioned in the groove 101, so that the boiling heat radiation structure 20 can not be exposed out of the groove 101, and the boiling heat radiation structure 20 can be well protected, and the boiling heat radiation structure 20 is prevented from being damaged after being contacted with foreign objects. In addition, the boiling heat radiation structure 20 is formed in the groove 101, and the internal space of the substrate 10 can be utilized, and the formation of the boiling heat radiation structure 20 does not cause an increase in the thickness of the substrate 10, so that the thickness of the entire substrate 10 is low, and the assembly space required for the substrate 10 is not increased.

In particular, the shape of the formed boiling heat dissipation structure 20 can be adjusted according to the actual design requirement, and the height of the boiling heat dissipation structure 20 along the first direction Z is smaller than the height of the substrate 10 along the first direction Z, so as to ensure that the boiling heat dissipation structure 20 does not directly contact with the heat generating component 30 after passing through the substrate 10. When the boiling heat radiation structure 20 is cut off by the plane of the second direction X and the third direction Y, the cross section of the boiling heat radiation structure 20 is smaller than or equal to the cross section of the substrate 10.

It will be appreciated that in another embodiment, the boiling heat dissipation structure 20 may also be formed by machining from the side of the substrate 10. At this time, the groove 101 is formed by recessing inward from the side surface of the substrate 10, and the boiling heat dissipation structure 20 is completely accommodated in the groove 101.

Referring to fig. 3 again, the boiling heat dissipation structure 20 includes a plurality of heat dissipation protrusions 21. The heat dissipation protrusions 21 protrude outward from the bottom wall of the groove 101 in a direction away from the heat generating component 30, and the heat dissipation protrusions 21 are arranged in a polyhedral structure such as a quadrangular prism. The heat dissipating bump 21 has a plurality of contact surfaces to increase the contact area between the heat dissipating bump 21 and the heat dissipating fluid 42, thereby improving heat dissipating efficiency. Any two adjacent heat dissipation bulges 21 are arranged at intervals, so that the contact area between each heat dissipation bulge 21 and the heat dissipation fluid 42 is not reduced due to contact between each heat dissipation bulge 21.

Further, the bottom end of the heat dissipating bump 21 is directly integrally connected to the bottom wall of the recess 101, so that the heat dissipating bump 21 and the substrate 10 are integrally formed.

When some embodiments are adopted, the outer peripheral wall of the boiling heat dissipation structure 20 is spaced from the inner peripheral wall of the groove 101, that is, the heat dissipation protrusion 21 located closest to the inner peripheral wall of the groove 101 is spaced from the inner peripheral wall of the groove 101, so that a gap for the heat dissipation fluid 42 to flow is formed between the boiling heat dissipation structure 20 and the inner peripheral wall of the groove 101, and heat dissipation is directly performed on the inner peripheral wall of the groove 101 through the heat dissipation fluid 42. When other embodiments are adopted, the outer peripheral wall of the boiling heat dissipation structure 20 is integrally connected with the inner peripheral wall of the groove 101 through the heat dissipation protrusions 21, that is, the side wall of the heat dissipation protrusion 21 located closest to the inner peripheral wall of the groove 101 facing the inner peripheral wall of the groove 101 is integrally connected with the inner peripheral wall of the groove 101, so that heat dissipation is performed on the inner peripheral wall of the groove 101 through the heat dissipation protrusion 21 connected with the inner peripheral wall of the groove 101, the heat dissipation effect of the inner peripheral wall of the groove 101 is improved, and the heat dissipation effect of the whole substrate 10 is further improved.

It is understood that the groove 101 may be disposed on an end surface of the substrate 10 away from the heat generating component 30, and the groove 101 may be disposed on an outer peripheral surface of the substrate 10. Since the substrate 10 is mostly in a plate-like structure, when considering the opening position of the groove 101, it is preferable to open the groove at the end surface of the substrate 10 at the end far from the heat generating component 30. However, for some substrates 10 having a larger thickness and a smaller cross-sectional size, it is more preferable to provide the grooves 101 on the outer peripheral surface of the substrate 10.

Referring to fig. 3, the heat dissipation protrusions 21 are arranged in a longitudinal and transverse manner to form the heat dissipation channels 22, so that when the heat dissipation fluid 42 flows in the heat dissipation channels 22, the heat dissipation fluid 42 contacts with the side walls of the heat dissipation protrusions 21, and the heat dissipation fluid 42 dissipates the heat dissipation protrusions 21, thereby realizing concentrated heat dissipation of the substrate 10.

In an embodiment, the heat dissipation protrusions 21 are arranged on the bottom wall of the groove 101 along the second direction X and the third direction Y in an array manner to form the heat dissipation channels 22 extending along the second direction X or the third direction Y, so that the heat dissipation fluid 42 flowing through the heat dissipation channels 22 can flow into the boiling heat dissipation structure 20 from at least two directions to be in contact with the heat dissipation protrusions 21 and then dissipate heat of the heat dissipation protrusions 21, and further dissipate heat of the substrate 10 thermally connected to the heat dissipation protrusions 21. The height of the heat dissipating bump 21 along the first direction Z is smaller than the depth of the groove 101 along the first direction Z, so as to ensure that the end of the heat dissipating bump 21 away from the bottom wall of the groove 101 is not exposed to the groove 101 and is easily damaged.

In addition, the heat dissipation channels 22 extending along the second direction X and the heat dissipation channels 22 extending along the third direction Y are communicated with each other in a crisscross manner, so that the contact area between the heat dissipation fluid 42 and the boiling heat dissipation structure 20 is increased, the heat dissipation effect of the heat dissipation fluid 42 on the boiling heat dissipation structure 20 is improved, and the heat dissipation effect of the boiling heat dissipation structure 20 on the substrate 10 is further improved.

Specifically, the heat dissipation channel 22 extending in the second direction X is a first channel, and the heat dissipation channel 22 extending in the third direction Y is a second channel.

Thus, the first channel and the second channel are mutually communicated, so that the heat dissipation fluid 42 can flow into the boiling heat dissipation structure 20 from multiple directions, the heat dissipation fluid 42 flowing into the boiling heat dissipation structure 20 can flow out of the boiling heat dissipation structure 20 after flowing through different heat dissipation protrusions 21 from multiple directions, the inflow speed and the outflow speed of the heat dissipation fluid 42 are increased, and the heat dissipation efficiency is improved. Meanwhile, the gas formed by vaporization after heat exchange between the heat dissipation fluid 42 and the boiling heat dissipation structure 20 can be discharged from the first channel or the second channel, so that the outflow speed of the high-temperature gas formed by vaporization is accelerated, and the heat dissipation efficiency is improved.

Hereinabove, the specific embodiments of the present utility model are described with reference to the accompanying drawings. However, those of ordinary skill in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the utility model without departing from the scope thereof. Such modifications and substitutions are intended to be included within the scope of the present utility model.

Claims (10)

1. The heat dissipation structure is used for dissipating heat of the heating components; the heat dissipation structure is characterized by comprising:

the substrate is used for being attached to one side of the heating element, and a groove is formed in one side, away from the heating element, of the substrate;

the boiling heat dissipation structure is accommodated in the groove, integrally formed on the base plate and in heat conduction connection with the base plate, and is provided with a heat dissipation channel for heat dissipation fluid to flow so that the heat dissipation fluid exchanges heat with the boiling heat dissipation structure.

2. The heat dissipation structure as defined in claim 1, wherein the boiling heat dissipation structure comprises a plurality of heat dissipation protrusions, the plurality of heat dissipation protrusions are formed by protruding from the bottom wall of the groove in a direction away from the heat generating component, and any two adjacent heat dissipation protrusions are arranged at intervals.

3. The heat dissipating structure of claim 2, wherein a plurality of said heat dissipating protrusions are arranged longitudinally and transversely on the bottom wall of said recess, and said heat dissipating channels are formed between two adjacent heat dissipating protrusions.

4. The heat dissipating structure of claim 2, wherein a height of the heat dissipating protrusion in a direction thereof away from the heat generating component is smaller than a depth of the recess.

5. The heat dissipating structure of claim 1, wherein the boiling heat dissipating structure is integrally formed with the substrate by laser engraving or chemical etching, and is disposed from an end of the substrate away from the heat generating component toward an end of the substrate near the heat generating component.

6. The heat dissipating structure of claim 1, wherein an outer peripheral wall of said boiling heat dissipating structure is spaced from an inner peripheral wall of said groove.

7. The heat dissipating structure of claim 1, wherein the groove is formed on an end surface of the substrate away from the heat generating component or an outer peripheral surface of the substrate by laser engraving or chemical etching.

8. The heat dissipating structure of claim 2, wherein the outer peripheral wall of the boiling heat dissipating structure and the inner peripheral wall of the groove are integrally connected with the inner peripheral wall of the groove through the heat dissipating protrusion.

9. A heat dissipating device, comprising a heat dissipating box and a heat dissipating structure as set forth in any one of claims 1 to 8, wherein the heat dissipating box is provided with an installation cavity, the installation cavity accommodates the heat dissipating fluid, the heat generating component is disposed in the heat dissipating fluid, the heat dissipating structure is attached to the heat generating component, and the heat dissipating structure is disposed in the heat dissipating fluid.

10. The heat dissipating device of claim 9, wherein a condenser is disposed within said mounting cavity, said condenser being disposed outside said heat dissipating fluid.