KR200392785Y1 - Skived-fin annular heat sink - Google Patents

Abstract

The skive-fin annular heat sink is fabricated using the skive-fin technology and includes at least one bottom plate and a plurality of fins. At least one bottom plate is curved to form a closed shape. The pins extend outwardly from at least one bottom plate, each of the pins having a bend for connecting the bottom plate and the pins. Thus, a skive-fin annular heat sink can be applied to a chip of a PCB with an excessively limited space and used to increase the number of fins to increase the heat-dissipation area between the chip and the heat sink.

Description

SKIVED-FIN ANNULAR HEAT SINK}

FIELD OF THE INVENTION The present invention relates to a skive-fin annular heat sink, and more particularly to an upright skive-fin annular heat sink made via the skive-fin technique.

As IC density increases, a great deal of heat is generated from chip manipulation in information products. Since the temperature of a chip, such as a CPU, is generally above the allowable temperature, the chip and some components near the chip are damaged.

In order to solve the heat-dissipating problem for the chip, many users mount a heat sink with a plurality of fins on the chip. Heat sinks mainly include upright rectangular heat sinks or upright annular heat sinks. An annular heat sink is usually placed on a chip of a PCB, such as an interface card. Annular heat sinks are manufactured through extrusion, forging, stamping, machine procrss, powder formation or press formation. However, the pin density is limited by the processing method described above. This is because, according to the processing method described above, the thickness of the pin cannot be made too thin, and it is difficult to increase the number of pins (about 1000 pieces).

For example, an extruded annular heat sink is generally formed of aluminum materials. The manufacturing process of the extruded annular heat sink comprises extruding an extruded annular heat sink having the same cross-sectional shape through a molten and extruded tool of aluminum material. 1 and 2 respectively show two top views of two extruded annular heat sinks according to the prior art. The annular heat sink 9 has a circular cylinder portion 91, a plurality of fins 92 extending outwardly from the cylinder portion 91, and a row disposed at the central portion of the cylinder portion 91 to contact the chip surface. -Conducting block 93. The heat sink 9 is generally formed of a material having high thermal conductivity. Thus, when the temperature of the chip rises, the heat sink 9 absorbs heat from the chip and the heat is conducted through the fin 92 to the surrounding air.

2 discloses an annular heat sink 9a. The annular heat sink 9a has an annular cylinder portion 94 and a plurality of thick base fins 95 extending outwardly from the cylinder portion 94. Each of the base fins 95 has a pair of extension fins 96 extending therefrom to increase the number of extension fins 96 and the heat-dissipation area. However, according to the processing method mentioned above, the number of the extension pins 96 becomes about 100-120 pieces.

Another method of making an annular heat sink is to bond or weld the fins to a bottom board. While the method described above can increase the number of fins and the heat-dissipation area, the fins are not directly connected to the bottom plate. Thus, the heat dissipation efficiency of the heat sink is reduced.

The present invention provides a skive-fin annular heat sink with an increased number of fins to increase the heat-dissipation area between the chip and the heat sink. In addition, skive-pin annular heat sinks may be suitable for chips of PCBs with excessively limited space.

One feature of the present invention is a skive-fin annular heat sink. The skive-fin annular heat sink is manufactured via skive-fin technology and includes at least one bottom plate and a plurality of fins. At least one bottom plate is curved to form a closed shape, the pins extending outwardly from the at least one bottom plate, each pin having a bending portion connecting the bottom plate and the pins.

It is to be understood that the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject matter described in the claims. Other advantages and features of the present invention will become apparent from the following detailed description, drawings, and claims.

Various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the accompanying drawings.

(Detailed Description of the Preferred Embodiments)

3 shows a schematic diagram of a process for manufacturing a heat sink via a skive-fin technique in accordance with the present invention. The present invention provides a skive-fin heat sink made through the skive-fin technology. Skive-Fin technology is the most advanced technology in all heat sink processes. The process for manufacturing a skive-fin heat sink comprises first providing a planar workpiece 1. Then, the workpiece 1 is fixed on the jig 2 according to the calculated predetermined angle, and the predetermined front face of the workpiece 1 is shaping of a special machine such as a punching machine, a milling machine or a CNC. It is shaped through the tool 3. The workpiece 1 is then continuously shaped to form a plurality of sheet-like pins 11 that do not deviate from the workpiece 1, wherein the sheet-like pins 11 are orthogonal to the workpiece 1. And forming a plurality of corresponding curved portions 112 through appropriate methods. Each bend 112 is connected between the corresponding sheet-like pin 11 and the workpiece 1. The pin 11 is integrated on the workpiece 1 via the corresponding bend 112, and since there is no joint between the pin 11 and the workpiece 1, the pin 11 and the workpiece ( There is no boundary or thermal resistance between 1).

4 shows another schematic diagram of a process for fabricating a skive-fin heat sink via a skive-fin technique in accordance with the present invention. There is some distance between the two sheet-like pins 11. Next, the end section 13 of the workpiece 1 is cut to form a skive-fin material with different lengths according to another embodiment. Finally, the skive-fin material is bent to form a skive-fin annular heat sink by the bending tool.

4A shows a schematic diagram of a process for fabricating a skive-fin heat sink via a skive-fin technique in accordance with another embodiment of the present invention. The workpiece 1 is fixed inclined on the jig 2. The workpiece 1 is continuously shaped to form a plurality of inclined sheet-like pins 11a on the workpiece 1. The inclination angle θ between the sheet-shaped pin 11a and the workpiece 1 is determined according to the angle θ between the workpiece 1 and the tool 2. When the workpiece 1 is connected to the tool 2 according to the angle θ, the sheet-shaped pin 11a is connected to the workpiece 1 according to the inclination angle θ. Each sheet-like pin 11a tends to incline to one side of the workpiece 1. Finally, the skive-fin material is bent by the bending tool to form a scarve-fin annular heat sink with spiral fins.

5 and 6 are, respectively, a top view of a skive-fin annular heat sink and a cross section along line 6-6 of a skive-fin annular heat sink in FIG. 5 in accordance with a preferred embodiment of the present invention. . The best embodiment of the present invention provides a heat sink 4 of closed skive-pin annular form. The skive-fin annular heat sink 4 has a plurality of sheet-like fins 44, an annular bottom plate 42, a plurality of bends 442 and a slot 46. The bottom plate 42 is an upright closed cylinder. The sheet-like pin 44 is connected to the annular bottom plate 42 via the corresponding curved portion 442. The skive-fin annular heat sink 4 of the present invention has a larger heat radiating area and excellent heat radiating effect than the prior art heat sinks 9 and 9a according to the above process. In addition, the heat-conducting block 5 is disposed at the center of the skyve-fin annular heat sink 4, and the chip for conducting heat from the chip 6 to the skyve-fin annular heat sink 4. Connected to (6).

5A is a side view of a skive-fin annular heat sink made through the process of FIG. 4A in accordance with an embodiment of the present invention. The present invention provides a skive-fin annular heat sink 4 'according to FIG. 4a. The skive-fin annular heat sink 4 'has a plurality of inclined fins 44' arranged in turn thereon. Each fin 44 'has an upward inclination angle formed at its bottom side, to provide a wider space for more smooth air flow around the chip 6 through a wider space. When the airflow blows downwardly around the chip 6 through the fan, at the same time the airflow becomes the inclined downward airflow through the inclined pin 44 '. Inclined downward airflow can enhance air traps caused by vertical airflow. Thus, the skive-fin annular heat sink 4 'according to the present invention has a good heat-dissipating effect.

FIG. 5B shows a side view of a skive-fin annular heat sink made through the process of FIG. 4A in accordance with another embodiment of the present invention. FIG. A skive-fin annular heat sink 4 "having a plurality of warp fins 44" has been disclosed. In this example, a parallelogram workpiece was provided in the process of FIG. 4A.

6A illustrates a cross-sectional view of a skive-fin annular heat sink coupled with a heat-conducting block according to another embodiment of the present invention. In this embodiment, the present invention provides a tapered heat-conducting block 5 'and a skive-fin heat sink 4 "and a tapered bottom plate 42 having a plurality of fins 44". In addition, the skive-fin heat sink 4 "has an accommodating space formed at the center thereof to accommodate the tapered heat-conducting block 5 '.

Since the skive-fin heat sink is manufactured by a skive-fin process, the skive-fin heat sink can be made of aluminum, aluminum alloy, copper or copper alloy. In the best mold, the skive-fin heat sink 44 is rectangular. However, the shape is not used to limit the present invention. 7 shows a cross-sectional view of a skive-fin annular heat sink according to a second embodiment of the invention. The skive-fin heat sink 4a has a bottom plate 42a and a plurality of trapezoidal fins 44a connected to the bottom plate 42a to increase the heat-dissipating effect. The pin may be in any shape. For example, if both ends of the workpiece are cut, a trapezoidal pin 44a can be obtained. Thus, the shape of the pin may be fan-shaped or arc-shaped according to other cutting methods.

The heat-conducting block 5a is housed in the center of the skive-fin heat sink 4a. The heat-conducting block 5a has an exposed bottom edge 52a extending outward of the skive-fin heat sink 4a so as to contact the bottom side of the bottom plate 42a. Thus, the exposed bottom edge 52a can provide a wider heat-conducting area to enhance the heat-dissipation effect between the heat block 5a and the skive-fin heat sink 4a.

8 shows a top view of a skive-fin annular heat sink according to a third embodiment of the present invention. The present invention provides a process for manufacturing a semicircular skive-fin heat sink 4b. The semicircular skive-fin heat sink 4b has two sides that are each connected with two sides of the other semicircular skive-fin heat sink 4b. Each semicircular skive-fin heat sink 4b has a bottom plate 42b and a plurality of fins 44b. Every two bottom plates 42b can be assembled together to form a closed shape. Thus, the present invention can form a skive-fin annular heat sink using two semicircular skive-fin heat sinks 4b or two or more fan-shaped skive-fin heat sinks 4b assembled together. . The third embodiment of the present invention can alleviate the difficulty of bending the workpiece 1 and can provide a connection element disposed between two adjacent sides of the skive-fin heat sink. For example, two connecting elements 7b with clamping functions are arranged in the slot 46b to connect and secure two adjacent end sides of the semicircular skive-fin heat sink 4b. In addition, the two semicircular skive-fin heat sinks 4b may be assembled together via welding or rivet joints.

9 shows a top view of a skive-fin annular heat sink according to a fourth embodiment of the present invention. In this embodiment, the present invention is a rectangular skive-fin annular heat sink 4c having a vertically closed rectangular bottom plate 42c and a plurality of fins 44c extending outwardly from the bottom plate 42c. To provide. In addition, the rectangular skive-pin annular heat sink 4c is easier to manufacture than the circular skive-pin annular heat sink, and the heat-conducting block 5c has the same contact area as the top surface of the chip in order to increase the effective heat dissipation area. Have

Conclusion: The invention has several advantages:

1. The skive-fin annular heat sink of the present invention has a plurality of sheet-like fins more than those of the prior art, and a bottom plate connected to the center portion to further increase the heat dissipation area and to improve the heat dissipation effect;

2. The skive-fin annular heat sink can be easily made of aluminum material, aluminum alloy, copper or copper alloy;

3. The skive-pin annular heat sink can be adapted to chips of PCBs with excessively limited space, such as chips on interface cards.

Although the present invention has been described with reference to the preferred embodiments, it will be understood that the present invention is not limited to the detailed description. Various substitutions and variations are proposed in the foregoing description, and other variations will occur to those skilled in the art. Accordingly, all such substitutions and variations are intended to be included within the scope of the present invention as defined in the appended claims.

1 is a plan view of an extruded annular heat sink of the prior art;

2 is a plan view of another extruded annular heat sink of the prior art;

3 is a schematic diagram of a method of manufacturing a skive-fin heat sink via a skived-fin technique according to the present invention;

4 is another schematic diagram of a method for manufacturing a skive-fin heat sink via the skive-fin technology according to the present invention;

4A is a schematic diagram of a method of manufacturing a skive-fin heat sink via a skive-fin technology according to another embodiment of the present invention;

5 is a top view of a skive-fin annular heat sink according to a best embodiment of the present invention;

5A is a side view of a skive-fin annular heat sink manufactured via the method of FIG. 4A in accordance with an embodiment of the present invention;

FIG. 5B is a side view of a skive-fin annular heat sink manufactured via the method of FIG. 4A in accordance with another embodiment of the present invention; FIG.

FIG. 6 is a cross-sectional view taken along line 6-6 of the skive-fin annular heat sink of FIG. 5; FIG.

6A is a cross-sectional view of a skive-fin annular heat sink coupled with a heat-conducting block according to another embodiment of the present invention;

7 is a cross-sectional view of a skive-fin annular heat sink according to a second embodiment of the present invention;

8 is a plan view of a skive-fin annular heat sink according to a third embodiment of the present invention;

9 is a plan view of a skive-fin annular heat sink according to a fourth embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

(Prior art)

9, 9a: annular heat sink 91, 94: cylinder portion

92: pin 93: heat-conductive block

95: base pin 96: extension pin

(Invention)

1: Workpiece 11, 11a: Pin

112: curved portion 13: rear

2: tool 3: shaping tool

4, 4 ', 4 ", 4a, 4b, 4c: Skype-fin annular heat sink

42, 42 ", 42a, 42b, 42c: bottom plate

44, 44 ', 44 ", 44a, 44b, 44c: pin

46, 46b: slot 442: bend

5, 5 ', 5a, 5c: thermally-conductive block 52a: bottom edge

6: chip 7b: connection element

Claims (13)

A skive-fin annular heat sink manufactured using skived-fin technology, At least one bottom board curved to form a closed shape; And A plurality of pins extending outwardly from the at least one bottom plate, each of the pins having the plurality of pins having a bending portion for connecting the pin and the bottom plate Heat sink. The skive-fin annular heat sink of claim 1, wherein the bottom plate and the fins are made of copper or copper alloy materials. The skive-fin annular heat sink of claim 1, wherein the bottom plate and the fins are made of aluminum material or aluminum alloy materials. 2. The skive-fin annular heat sink of claim 1, wherein the closed bottom plate is formed of two semicircular bottom plates or a plurality of fan-shaped bottom plates assembled together. 5. The skive-fin annular heat sink of claim 4, further comprising at least one connecting element connecting two adjacent semicircular bottom plates or fan-shaped bottom plates. The skive-fin annular heat sink of claim 1, wherein the at least one bottom plate is curved to form the closed shape through welding. The skive-fin annular heat sink of claim 1, wherein the bottom plate is an upright closed cylinder. 2. The skive-fin annular heat sink of claim 1, wherein the bottom plate is an upright closed rectangle. 2. The skive-fin annular heat sink of claim 1, wherein the fins are arranged to form a rectangular or trapezoidal shape. 2. The skive-fin annular heat sink of claim 1, further comprising a heat-conducting block disposed at the center of the bottom plate. 11. The skive-fin annular heat sink of claim 10, wherein the heat-conducting block has a trapezoidal cross section. 2. The skive-fin annular heat sink of claim 1, wherein the fins are arranged obliquely on the bottom plate, each of the fins having an upwardly oblique angle formed on the bottom side of the bottom plate. The skive-fin annular heat sink of claim 1, wherein the fins are arranged spirally on the bottom plate.