KR100882581B1 - Cooler for computer parts and manufacturing method of the cooler - Google Patents

Abstract

The present invention relates to a cooling device for a computer component, in order to cool a heat generating component that generates heat during operation among components embedded in a computer, an electric heat coupled to the heat generating component to receive heat generated from the heat generating component. Block, a plurality of heat dissipation fins located on top of the heat transfer block and spaced apart from each other in one direction, at least one heat coupled to the heat transfer block and the plurality of heat dissipation fins to transfer the heat of the heat transfer block to the heat dissipation fins Comprising a pipe and at least one cooling fan disposed on the heat dissipation fins, wherein the plurality of heat dissipation fins are provided with a recess for accommodating the cooling fan, the depression is in the union of the cutouts formed on each of the plurality of heat dissipation fins The shape of which is substantially cylindrical to correspond to the shape of the received cooling fan. Characterized in that the cylindrical shape.

Description

Cooling device for computer parts and manufacturing method thereof {Cooler for computer parts and manufacturing method of the cooler}

1 is a perspective view of a cooling device for a computer component of a first embodiment according to the present invention;

2 and 3 are a plan view and a side view, respectively, assuming that the cooling fan is removed in the cooling device for computer parts of FIG. 1;

4 and 5 are views for explaining a method for manufacturing a cooling device for a computer component according to an embodiment of the present invention;

6 is a perspective view of a cooling device for computer components of a second embodiment according to the present invention;

FIG. 7 is a side view assuming that the cooling fan is removed in the cooling device for computer parts of FIG. 6;

8 is a perspective view of a cooling device for computer components of a third embodiment according to the present invention;

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for computer parts, and more particularly, in order to cool a part that generates heat during operation among various parts embedded in a computer, a plurality of heat sink fins are provided with recesses to more efficiently generate heat generating parts. The present invention relates to a cooling device for computer components capable of cooling heat.

Among the components mounted inside the computer, there are components that generate heat during operation, such as a heating component such as a chipset mounted on a substrate of a central processing unit (CPU) or a graphic adapter. In this heating part, a large amount of heat is generated during operation. If the heat is not effectively cooled, the temperature of the heating part exceeds an appropriate temperature, and the heating part may cause an operation error or may be damaged in severe cases. In addition, according to the rapid development of science and technology, various heating components installed and operated inside a computer are gradually increasing the amount of heat generated by integration and high capacity. Therefore, the heat generating component necessarily requires a cooling device capable of appropriately and effectively cooling the generated heat.

The cooling device is configured to include heat dissipation means for receiving heat from the heat generating parts to effectively transfer the heat to the heat dissipation means, and maximizing the contact area with the outside to dissipate the received heat to the outside as quickly as possible. In addition, the cooling fan is provided for effective cooling of the heat radiating means. In this case, if the wind generated by the cooling fan cools the heat dissipation means without loss as much as possible, the cooling capacity of the cooling device will be increased, and thus an improvement of the configuration for this is necessary.

An object of the present invention is to provide a cooling device for computer parts that can effectively cool the heat dissipation means by minimizing the loss of wind caused by the cooling fan by improving the configuration for accommodating the cooling fan. .

The cooling device for computer parts according to the present invention is a device for cooling a heat generating component that generates heat during operation among components embedded in a computer, and is coupled to the heat generating component to receive heat generated from the heat generating component. A heat transfer block, a plurality of heat dissipation fins disposed on the heat transfer block and spaced apart from each other along one direction, and at least one heat dissipation fin coupled to the heat dissipation fins and the heat dissipation fins to transfer heat from the heat transfer block to the heat dissipation fins; And a heat pipe and at least one cooling fan disposed on the heat dissipation fins, wherein the plurality of heat dissipation fins are provided with recesses for accommodating the cooling fans, and the recesses are associated with the cutouts formed in each of the plurality of heat dissipation fins. It is formed by the shape, the shape is substantially cylindrical or so as to correspond to the shape of the received cooling fan Characterized in that the cylindrical shape.

On the other hand, the plurality of radiating fins are disposed perpendicular to the upper surface of the heat transfer block, the cutting portion formed on each of the plurality of radiating fins, the size gradually increases from the radiating fins arranged on one side to the radiating fins arranged on the other side It is preferable to become gradually smaller again from the middle part.

On the other hand, the plurality of heat dissipation fins are connected to each other by a plurality of heat dissipation fins connected to each other, and one heat dissipation fin and another heat dissipation fin disposed in close proximity to each of the upper ends of the one heat dissipation fin. The other heat dissipation fins and the other heat dissipation fins disposed in close proximity to the other heat dissipation fins are preferably arranged such that their respective lower ends are connected by the other connection folding portion.

In addition, each of the plurality of heat radiation fins, it is preferable that at least one space keeping portion for maintaining the distance between the adjacent heat radiation fins is formed.

Hereinafter, with reference to the accompanying drawings, preferred embodiments will be described in detail.

1 to 3, there is shown a cooling device for a computer component of a first embodiment according to the present invention. 1 is a perspective view of a cooling device for computer parts, and FIGS. 2 and 3 are plan views seen from above and side views of the cooling device for computer parts shown in FIG. 1, assuming that the cooling fan is removed, respectively.

The cooling device 1 for the computer component is a device for cooling a heat generating component that generates heat during operation among components built into the computer. In this embodiment, the heat generating component is a chipset mounted on a graphics card of a computer.

Therefore, the cooling device 1 for the computer component of the first embodiment is for cooling the heat generated by the chipset mounted on the graphics card, the heat transfer block 10, the plurality of heat radiation fins 20, the heat pipe 30 ) And a cooling fan 40 are configured.

The heat block 10 is coupled to the heat generating parts to receive heat generated from the heat generating parts (not shown). The heat transfer block 10 includes a first member 12 and a second member 14 made of a metal such as copper or aluminum, which is relatively superior to other metals having thermal conductivity. The first member 12 is fixed in close contact with the upper surface of the heat generating part and receives heat generated from the heat generating part. A material such as a thermal grease may be applied between the first member 12 and the heat generating part to increase the heat transfer rate. The second member 14 is tightly fixed to the upper portion of the first member 12.

At this time, the 1st member 12 and the 2nd member 14 are formed in the groove part which has a semicircle cross section in each surface which mutually faces. Accordingly, when the first member 12 and the second member 14 are coupled to each other, a heat pipe coupling hole 16 is formed in which one end portion of the heat pipe 30 to be described later is fitted while the groove portion meets.

On the other hand, in the present embodiment, the second member 14 is provided with fixed legs 18 extending outward at four corners. This fixed leg 18 is a structure for fixing this computer component cooling apparatus to a board | substrate (not shown), and simultaneously fixing the heat-transfer block 10 to the upper surface of a heat generating part. The fixed leg 18 has a plurality of holes, and can be fixed to the substrate by a fastening member (not shown) such as a screw member. The fastening member may be fastened to a position suitable for a situation among the plurality of holes.

The plurality of heat dissipation fins 20 are positioned above the heat transfer block 10 and are spaced apart from each other in one direction, that is, in a straight direction. Each of the heat dissipation fins 20 is made of a thin plate of copper or aluminum that is relatively superior in thermal conductivity to other metals.

In the present embodiment, the heat dissipation fins 20 are disposed perpendicular to the upper surface of the heat transfer block 10. On the other hand, in the present embodiment, the heat dissipation fins 20 are spaced apart from the heat transfer block 10, but in another embodiment, if necessary, a portion of the lower side of the heat dissipation fins 20 is in contact with the upper surface of the heat transfer block, from the heat transfer block. It may be configured to receive heat.

The heat dissipation fins 20 are provided with recesses 22. The depression 22 is formed by combining the cutouts 21 formed on each of the heat dissipation fins 20. That is, each of the heat radiation fins 20 is formed with a rectangular cutout 21 opened upwards, so that the heat radiation fins 20 are spaced side by side in one direction, and the recesses 22 are each of the heat radiation fins 20. Cutouts 21 formed in) are formed by association with each other.

The depression 22 indicates an empty space recessed downward from the upper surface formed by the heat dissipation fins 20, and the space is in the form of a cylinder or an elliptic cylinder. This form corresponds to the cooling fan 40 accommodated in the depression 22 is installed.

That is, since the virtual space occupied by the rotation of the blades formed in the cooling fan 40 is a cylindrical shape, the recess 22 is also a cylindrical or similar elliptical cylinder shape to accommodate the cooling fan 40. However, the shape of a cylinder or elliptic cylinder does not mean having a complete form by mathematical definition, but means that the cylinder or elliptic cylinder is roughly or substantially. Due to the presence of the depression 22, the wind generated by the cooling fan 40 can be blown between the heat dissipation fins 20 without being lost to the outside of the heat dissipation fins 20.

On the other hand, in the present embodiment, the cutout portion 21 formed on each of the plurality of heat sink fins 20, the size gradually increases from the heat sink fins arranged on one side to the heat sink fins arranged on the other side, gradually smaller again from the middle portion It is meant to be built.

That is, referring to FIG. 1, the heat dissipation fins 20 are spaced apart from each other in a straight line from one side to the other side. The size of the cutout portion 21 formed on each of the heat sink fins 20 is the smallest on the heat sink fins 20 disposed on one side, and is gradually larger toward the other side, the largest in the middle portion, and gradually smaller toward the other side. And the one formed on the heat dissipation fin 20 disposed on the other side is the smallest. That is, the cutouts 21 on both sides of the intermediate portion are symmetrical with each other.

As the sizes of the cutouts 21 formed on each of the heat sink fins 20 are different from each other, and each of the heat sink fins 20 is disposed in one direction, the cutouts 21 are gathered to form a recess 22 in the form of a circular column or an elliptical column. To form. However, the shape of the depression 22 may be variously modified as necessary in addition to a circular pillar or an elliptical pillar, a rectangular pillar, a rhombus pillar or a specific desired shape.

On the other hand, in the present embodiment, the plurality of heat dissipation fins 20 are arranged to be connected by the connection folding portion 24 for interconnecting the neighboring heat dissipation fins.

The connection folding portion 24 connects the neighboring heat dissipation fins 20. Referring to FIG. 3, the connection folding portion 24 has a narrow band shape and is alternately formed at an upper end portion and a lower end portion of a neighboring heat dissipation fin 20.

Heat dissipation fins 20 of the present embodiment, after pressing the punching process to form a metal plate material as shown in Figure 4, it is made by folding in a zigzag form. In this embodiment, immediately after the metal plate is pressed, the connection folding portion 24 plays a role of interconnecting the respective heat radiation fins 20. In addition, since the heat dissipation fins 20 are connected by the connection folding unit 24, it is possible to fold the heat dissipation fins 20 in a zigzag form based on the connection folding unit 24.

In addition, the heat dissipation fins 20 of the present embodiment are arranged in a state of being connected by the connection folding parts 24. Referring to FIG. 3 and described in detail, one heat dissipation fin 202 is disposed in close proximity thereto. The other heat dissipation fin 204 has its upper end connected by one connection member 242. In addition, the other heat dissipation fin 204 and another heat dissipation fin 206 disposed in close proximity to each other are connected to each other by the other end of the connection portion 244. The heat dissipation fins 20 arranged in series are repeatedly arranged in this manner.

The heat dissipation fins 20 are formed with a through hole 28 for penetrating and coupling the heat pipe 30 to be described later. The through hole 28 is provided with a burr 29 which protrudes along the outer circumferential surface thereof. The burr 29 is formed together when the through hole 28 is formed in the metal plate. The burr 29 increases the contact portion between the heat pipe 30 and each of the heat dissipation fins 20 so that heat transfer can occur effectively. In addition, the burr 29 also serves to uniformly space the heat dissipation fins 20.

The heat pipe 30 is coupled to the heat transfer block 10 and the plurality of heat dissipation fins 20 to serve to transfer the heat of the heat transfer block 10 to the heat dissipation fins 20. In this embodiment, one end of the heat pipe 30 is coupled to the coupling hole 16 formed in the heat transfer block 10 and the other end is coupled to the through hole 28 formed in the heat dissipation fins 20. It is preferable that the other end of the heat pipe 30 does not penetrate the recess 22 of the heat dissipation fin 20 in which the cooling fan 40 to be described later is disposed. The heat pipe 30 quickly transfers the heat of the heat transfer block 10 to the heat dissipation fins 20.

In the present embodiment, two heat pipes 30 are both provided, but may be further provided as necessary, and the bent shape may be variously modified.

In addition, in this embodiment, one end of the heat pipe 20 is coupled to the heat transfer block 10, the other end is coupled to the heat dissipation fins 20, but in another embodiment, one end of the heat pipe is heat transfer A portion of the middle portion of the portion that is coupled to the block and extends from one end may be coupled to the heat dissipation fins, and then the other end may be coupled to the heat transfer block.

The cooling fan 40 is accommodated in the recess 22 provided in the heat dissipation fins 20 and fixed. The method in which the cooling fan 40 is accommodated in the recess 22 and fixed, or the method in which the cooling fan 40 is powered or controlled is generally used in the art.

Meanwhile, a corresponding portion of the heat dissipation fins may be formed at the lower side of the rotation center portion in which the wing portion is coupled to the cooling fan to provide an empty space. That is, since no wind is generated by the cooling fan at the lower side of the rotation center of the cooling fan, the heat dissipation fins of the portion can be removed, thereby saving material.

The operation and effects of the cooling device 1 for the computer component of the embodiment according to the present invention having the configuration as described above will be described.

The cooling device 1 for a computer component may include a heat pipe 30 to quickly transfer heat from the heat transfer block 10 to the heat dissipation fins 20. In addition, since the cooling fan 40 is provided in the recess 22 provided in the heat dissipation fins 20, there is an advantage that the wind generated from the cooling fan 40 can be efficiently used for cooling.

In the related art, since the cooling fan is disposed on the heat dissipation fins, some of the wind generated by the cooling fan may not be blown between the heat dissipation fins, but are lost to the outside of the heat dissipation fins.

However, according to the cooling device of the present invention, since the cooling fan 40 is accommodated in the recess 22 provided in the heat dissipation fins 20, most of the wind by the cooling fan 40 blows between the heat dissipation fins 20. It can enter and improves cooling performance. In the cooling device of the type that cools the radiating fins by the wind by the cooling fan, using the wind for cooling without loss is one of the most important factors to determine the cooling performance.

On the other hand, in the case of the present embodiment, the heat radiation fins 20 are connected by the connection folding portion 24, it is possible to produce by folding the zigzag after pressing a single metal plate has the effect of improving productivity. However, in the present embodiment, for example, the heat dissipation fins 20 are connected by the connection folding portion 24, but the present invention is not limited thereto, provided that only the recessed portion that can accommodate the cooling fan is provided. In addition, the heat dissipation fins may be separated from each other. In this case, the heat radiating fins are inserted into the heat pipes to be spaced apart from each other.

In addition, by removing the material required for the heat dissipation fin 20 of the portion corresponding to the depression 22 for the cooling fan 40, there is an effect that it is possible to reduce the material required for the heat dissipation fin 30.

Meanwhile, FIGS. 6 to 8 illustrate two embodiments in which a plurality of heat dissipation fins are provided as separate members and inserted into a heat pipe to form depressions.

6 to 7, there is shown a cooling device 1a for a computer component of a second embodiment according to the present invention.

The cooling device 1a for computer parts of this embodiment is comprised including the heat-transfer block 10a, the heat radiation fin 20a, the heat pipe 30a, and the cooling fan 40. As shown in FIG.

The heat dissipation fins 20a are provided with recesses 22a to accommodate the cooling fan 40. The recesses 22a are formed by the union of the cutouts 21a formed in each of the heat dissipation fins 20a.

The difference between the present embodiment and the first embodiment is that the heat dissipation fins 20a are formed as separate members. In other words, they are not connected to each other by the connecting member and are separate members. The following description will focus on the differences between the two embodiments, and the descriptions of the omitted portions are appropriately modified and applied to the description of the first embodiment.

In the present embodiment, since the heat dissipation fins 20a are not connected to each other by the same configuration as the connection folding part as in the case of the first embodiment, they are each provided as separate members and aligned and fixed by an assembly jig or the like. And, it is fitted to be spaced apart from each other in the through hole of the heat pipe (30a). Since the heat dissipation fins are provided with cutouts 21a having different sizes, the present embodiment arranges the cutouts 21a according to their sizes so that the cutouts 21a can form recesses of a desired shape. Will be fitted.

Referring to FIG. 6, each of the plurality of heat dissipation fins 20a has at least one space keeping portion 26 for maintaining a distance between the heat dissipation fins adjacent to each other.

In the present embodiment, the space keeping unit 26 is a burr formed by protruding the metal heat radiation fins 20a to one side by a punching method or the like. In addition to these methods, a portion of the heat dissipation fin may be incised and then folded up to form a space keeping part.

On the other hand, in this second embodiment, through holes are formed in each of the heat radiation fins 20a, as in the case of the first embodiment, and protruding burrs 29a are formed on the outer circumferential surface of the through holes. The burr 29a also serves as a space keeping unit in addition to increasing the coupling area with the heat pipe 30a.

8 shows a cooling device 1b for computer components of the third embodiment.

The present embodiment includes a heat transfer block 10b, a cooling fin 20b, a heat pipe 30b, and a cooling fan 40, and compared with the first and second embodiments, the depression 22b. The difference is that the fan 40 is provided with two each. Like the second embodiment, the plurality of heat dissipation fins 20b are formed as separate members, and each of the heat dissipation fins 20b is provided with two cutting portions 21b and two space keeping portions 26.

According to the second and third embodiments, similarly to the first embodiment, the recessed portions 22a and 22b of the shape corresponding to the cooling fan 40 are provided on the heat dissipation fins 20a and 20b, and the cooling fan 40 is provided. Since it is accommodated in the depression, the wind by the cooling fan can be blown in between the radiating fins (20a, 20b) without loss, there is an advantage that the efficient cooling is made.

The present invention also relates to a method for manufacturing a cooling device for computer parts.

4 and 5, a method of manufacturing a cooling device for a computer component according to an embodiment of the present invention will be described. The method for manufacturing a component cooling device of the present embodiment, like the cooling device for the computer part 1 of the first embodiment described above, has a cooling device for computer parts having heat dissipation fins 20 connected to each other by a connection part 24. It is suitable to prepare.

The method of manufacturing a cooling device for a computer component is a device for cooling a heat generating component that generates heat during operation among components embedded in a computer, and an electric heat coupled to the heat generating component to receive heat generated from the heat generating component. Block, the heat transfer block receives a heat and comprises a plurality of heat dissipation fins spaced apart from each other along one direction and the cooling fan disposed on the heat dissipation fins, the plurality of heat dissipation fins are provided with a recess for accommodating the cooling fan The recess is formed by the combination of cutouts formed on each of the plurality of heat dissipation fins, the shape of which is substantially cylindrical or elliptical, so as to correspond to the shape of the received cooling fan, wherein the plurality of heat dissipation fins are adjacent heat dissipation fins. They are arranged connected by the connecting folding parts interconnecting them, one heat sink fin and The other heat dissipation fin disposed in close proximity to the upper end thereof is connected by the one connecting end portion, and the other heat dissipation fin and the other heat dissipation fin disposed close thereto have their respective lower end portions separated from each other. It is a method of manufacturing a cooling device for a computer component arranged so that the manner of connection by another connection folding part is repeated.

The manufacturing method includes a metal plate preparation step of preparing a metal plate; A pressing step in which the plurality of heat dissipation fins are continuously formed in one direction on the metal plate, and the plurality of heat dissipation fins are connected by a connection folding part and a cutting portion is formed on each heat dissipation fin; And folding the metal plate subjected to the pressing step in a zigzag form around the connection folding part, so that the plurality of heat dissipating fins form a spaced apart structure interconnected by the connection folding part.

The metal plate preparation step is to prepare a metal plate in the form of a thin plate of a metal material such as aluminum or copper. Since the metal plate is to be processed into a shape as shown in FIG. 4, it must have an area that can include at least the shape shown in FIG. 4. It is also possible for the metal plate to be prepared so that the shape shown in FIG. 4 has an area in which two or more can be processed.

In the pressing step, the prepared metal plate is punched by a press, and a plurality of heat dissipation fins 20 are continuously formed in one direction, and the plurality of heat dissipation fins 20 are connected by a connection folding portion 24, and each heat dissipation fin is cut off. Step 21 is formed. It is a processing method that removes the remaining part of the wide metal sheet, leaving only the desired shape.

On the other hand, since the depressions 22 (see FIG. 1) provided in the heat dissipation fins 20 of the cooling device manufactured according to the present embodiment are in the form of cylinders or ellipsoidal columns, they are formed in the heat dissipation fins 20 in the pressing step. The cutting portion 21 to be formed, from the heat radiation fin disposed on one side to the heat radiation fin disposed on the other side, the size is gradually increased and is formed to gradually become smaller at the middle portion again.

In the present embodiment, the heat dissipation fins 20 are processed to be interconnected in the width direction. Alternatively, the heat dissipation fins 20 may be processed to be interconnected in the longitudinal direction.

The radiating fin folding step is a step of folding a metal plate having a shape as shown in FIG. 4 into a shape as shown in FIG. 5. That is, the step of folding the metal plate subjected to the pressing step in a zigzag form around the connection folding portion, so that the plurality of heat dissipation fins form a spaced structure interconnected by the connection folding portion.

That is, when the metal plate formed with the heat dissipation fin shown in FIG. 4 is folded up once and then folded down, then folded up again and folded down in a zigzag form, the heat dissipation fin structure spaced apart as shown in FIG. 5 is completed. . At this time, the shape of the ablation portion gradually increases and becomes smaller again. When the metal plate is folded, the ablation portions form a cylindrical depression. On the other hand, the number of the radiating fins shown in Figures 4 and 5 does not match each other, because these figures are only schematically shown to explain the manufacturing method.

In the heat radiation fin folding step, since the heat radiation fins 20 are connected by the connection folding portion 24, a metal plate such as the state shown in FIG. Processing in the state as shown can be done conveniently.

On the other hand, in the present embodiment, the cooling device for the computer component, one end is coupled to the heat transfer block and the other end is coupled to pass through the plurality of heat radiation fins so as to transfer the heat of the heat transfer block to the plurality of heat radiation fins. At least one heat pipe is further provided.

Therefore, in order to manufacture such a cooling device for computer components, the manufacturing method of the present embodiment includes the step of punching through-holes through which the heat pipe penetrates through each of the heat dissipation fins. An assembly jig step of biting a plurality of heat dissipation fins into an assembly jig, a heat pipe bending step of bending the heat pipe into a predetermined shape, and a heat pipe assembling step of inserting the banded heat pipe into a through hole of the heat dissipation fin bitten by the assembly jig. It is further provided.

The assembly jig step is a step of snapping the heat dissipation fins 20 of the type as shown in Figure 5 to the assembly jig. The heat pipe bending step is a step of bending a straight heat pipe into the shape of a heat pipe shown in FIGS. 1 to 3.

The heat pipe assembling step is a step of inserting the banded heat pipe into the through holes 28 of the heat dissipation fins bited by the assembly jig. After the other end of the heat pipe 30 is coupled with the heat dissipation fins 20, one end of the heat pipe 30 is coupled to the heat transfer block 10, and the cooling fan 40 is recessed of the heat dissipation fin 20. (22), to complete the manufacture of a cooling device for computer components.

On the other hand, in the case of the present embodiment, the pressing step is drilled to form a burr protruding along the outer periphery of the through hole, and the burr is drilled to alternately protrude in one direction and the other direction on each of the continuous radiating fins.

4 and 5, by the pressing step, a plurality of heat dissipation fins 20 and a through hole 28 are formed in each heat dissipation fin 20 in the metal plate, and protrudes in the outer circumference of each through hole 28. The burrs 29 are formed.

In addition, the burr 29 is formed to protrude downward from the ground in the through hole 282 of the continuous radiating fin, for example, the first radiating fin 202 of FIG. 4, and the through hole 284 of the second radiating fin 204. Is formed to protrude above the ground, the through hole 286 of the third heat radiation fin 206 is formed to protrude again below the ground. Since the burrs 29 are formed by repeating this method, when the radiating fins 20 are folded in a zigzag manner, the burrs 29 may be oriented in one direction.

According to the above-described method for manufacturing a cooling device for computer parts, since a plurality of heat dissipation fins are formed on a metal plate by a press step and folded in a zigzag form, the heat dissipation fins are spaced apart from each other. There is an advantage that it can.

In the pressing step, by adjusting the shape of the punch to be punched and the shape of the die on which the metal plate is placed, there is an advantage that the metal plate can be efficiently processed into a desired shape with only one process.

On the other hand, even if the cooling device further includes a heat pipe, the through-holes may be formed together in the pressing step, and the burr 29 formed on the outer circumferential surface of the through-holes may also be formed together in the pressing step.

According to the cooling device for computer components of the present invention, since the heat sink fin is provided with a recess for accommodating the cooling fan, the wind of the cooling fan can be used for cooling without loss.

Claims (8)

delete delete A device for cooling a heat generating component that generates heat during operation among components built into a computer, Heat dissipation fins coupled to the heat dissipation part to receive heat generated by the heat dissipation part, a plurality of heat dissipation fins disposed on the heat dissipation block and spaced apart from each other along one direction, and heat dissipation fins of the heat dissipation block. At least one heat pipe coupled to the heat transfer block and the plurality of heat dissipation fins and at least one cooling fan disposed at the heat dissipation fins so as to be transferred to the heat transfer block, The plurality of heat dissipation fins are provided with recesses for accommodating the cooling fans, and the recesses are formed by a combination of cutouts formed in each of the plurality of heat dissipation fins, the shape of which is substantially cylindrical to correspond to the shape of the cooling fan accommodated. Or elliptic cylinder, The plurality of heat dissipation fins are disposed perpendicular to the upper surface of the heat transfer block, The ablation portion formed on each of the plurality of heat dissipation fins is gradually increased in size from the heat dissipation fin disposed on one side to the heat dissipation fin disposed on the other side, and gradually decreases from the middle portion again. Each of the plurality of heat sink fins, at least one space keeping portion for maintaining the distance between the adjacent heat sink fins is formed, Through holes are formed in each of the plurality of heat dissipation fins, and the heat pipes are fitted into the through holes formed in the heat dissipation fins. The plurality of heat dissipation fins are arranged to be connected by connection folding parts for interconnecting neighboring heat dissipation fins, One heat dissipation fin and another heat dissipation fin disposed close thereto have their respective upper ends connected by the one connecting contact portion, and the other heat dissipation fin and another heat dissipation fin disposed close thereto are respectively Cooling device for a computer component, characterized in that arranged so that the lower end of the connection is connected by the other one of the connecting folding portion. delete A device for cooling a heat generating component that generates heat during operation among components built into a computer, It includes a heat transfer block coupled to the heat generating component to receive the heat generated by the heat generating component, a plurality of heat dissipation fins received heat from the heat transfer block and spaced apart from each other along one direction and a cooling fan disposed on the heat dissipation fins. Done by The plurality of heat dissipation fins are provided with recesses for accommodating the cooling fans, and the recesses are formed by a combination of cutouts formed in each of the plurality of heat dissipation fins, and the shape thereof substantially corresponds to the shape of the cooling fan accommodated. In the form of a cylinder or ellipse cylinder, The plurality of heat dissipation fins may be connected to each other by connecting connection parts interconnecting neighboring heat dissipation fins, and one heat dissipation fin and another heat dissipation fin disposed close to each other may be formed by the one end of the heat dissipation fin. And another heat dissipation fin disposed in close proximity to the other heat dissipation fin and to produce a cooling device for computer components arranged such that the manner in which each lower end thereof is connected by the other connection folding portion is repeated. As a way to, A metal plate preparation step of preparing a metal plate; A pressing step in which the plurality of heat dissipation fins are continuously formed in one direction on the metal plate, and the plurality of heat dissipation fins are connected by a connection folding part and a cutting portion is formed on each of the heat dissipation fins; And Folding the metal plate subjected to the pressing step in a zigzag form around the connection folding portion, the heat radiation fin folding step to form a spaced structure in which the plurality of heat radiation fins are interconnected by the connection folding portion; Cooling device manufacturing method. The method of claim 5, The cooling device for computer components may include at least one heat pipe having one end coupled to the heat transfer block and the other end passing through the plurality of heat radiation fins so as to transfer heat from the heat transfer block to the plurality of heat dissipation fins. More equipped, The pressing step includes drilling a through hole through which the heat pipe passes through each of the heat dissipation fins, An assembly jig step of snapping a plurality of heat dissipation fins passed through the heat dissipation fin folding step into assembly jig; A heat pipe bending step of bending the heat pipe into a predetermined shape; And And a heat pipe assembly step of inserting the banded heat pipe into the through hole of the heat dissipation fin bitten by the assembly jig. The method of claim 6, The pressing step is a perforated to form a burr protruding along the outer periphery of the through hole, the burr is perforated so as to protrude alternately in one direction and the other direction to each of the continuous heat radiation fins. Cooling device manufacturing method. The method of claim 7, The pressing step, the method of manufacturing a cooling device for a computer component, characterized in that the cutting portion is formed so that the size gradually increases from the heat radiation fin disposed on one side to the heat radiation fin disposed on the other side gradually decreases again in the middle portion.

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