JP3606150B2 - Housing structure for information processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation countermeasure housing structure of an information processing apparatus.
[0002]
[Prior art]
In recent years, as the processing speed of information processing devices has increased dramatically, the amount of heat generated in the device housing has also increased, and how effectively this heat is released to the outside air to improve the quality of the information processing device. It is important to guarantee. The heat dissipation measures that have been taken so far include holes in the case, natural air cooling, forced air cooling with a fan, etc., and a heat generating body and the case connected by a metal plate with good heat conduction. There is heat dissipation from the body surface, but in order to achieve effective natural air cooling, it is necessary to make large ventilation holes on the top and bottom of the casing to allow smooth air circulation, in which case There is a risk that metal foreign objects, etc. that have fallen may enter the housing through the ventilation hole and cause an electrical short circuit. Therefore, the hole diameter of the ventilation hole must be reduced, and the desired heat dissipation effect It was hard to get. When using a fan, in addition to noise, problems such as maintenance and service life of rotating parts occurred. In addition, the case itself has to be enlarged in a structure in which heat is released from the case surface by simple heat conduction.
[0003]
[Problems to be solved by the invention]
Recently, in addition to being fanless in order to eliminate the troublesome maintenance and management, there is a strong demand for customers to have a housing structure that does not interfere with the heat dissipation effect even with a four-stage stack, for example. The object of the present invention is to allow the heat generated in the housing to be efficiently released to the outside air even in the case of natural air cooling without using a fan, and there is no problem in terms of heat dissipation even when a plurality of housings are stacked. It is to provide a housing structure.
[0004]
[Means for Solving the Problems]
In the housing structure for an information processing device according to the first aspect of the present invention, the heat dissipating fin unit, the printed wiring board having the heat generating component attached thereto, and the heat generating component are in surface contact with each other inside the metal housing. In the housing structure for an information processing apparatus provided with a heat conducting plate connected to the radiating fin unit at the end, the fin side of the radiating fin unit and both inner side surfaces of the casing are arranged to face each other. , each longitudinal gap portion and the printed wiring board side between the fins are separated by a base of heat radiation fin unit, the upper and lower surfaces of the housing top and bottom surfaces of the void portion is opposed, the flow path is throttled A vent hole in which an air flow passage extending from the lower surface side to the upper surface side is formed, and a vent hole is provided on the side surface of the housing opposite to the side surface of the gap portion to communicate with the outside. Metal legs on the bottom of the The heat transfer solid print portion is formed by forming a heat transfer solid print portion at a back contact portion of the printed wiring board that is worn and received by the metal leg. And through the metal legs, the bottom surface of the housing and the radiating fin unit fixed to the housing with a small thermal resistance are used.
[0005]
According to a second aspect of the present invention, spring presses having heads are provided upright on both sides of the heat generating component, and the heat conducting plate is slidably mounted on the spring presser, and the spring presser is provided. It is characterized in that it is pressed by a spring that is received at one end by the head.
[0006]
According to a third aspect of the present invention, the spring retainer has an annular ridge formed on the neck, and one end side of the spring is locked between the head of the spring retainer and the annular ridge. It is characterized in that the spring retainer and the spring are integrated.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1 which is a perspective view in an exploded state and FIG. 2 which is a sectional view for explanation in an assembled state. A casing 1 that forms a flat square box shape by a metal plate has an upper case 2 that releases the lower surface side and one side surface, and an upper surface side and three side surfaces that are open, and both ends and side surfaces 3b of the bottom surface 3a. The lower case 3 is formed by bending the three end portions thereof to form the contact piece 4. The contact piece 4 of the lower case 3 serves as a guide at the time of assembly, and serves to impart necessary rigidity to the housing 1 after the assembly.
[0009]
A well-known heat dissipation fin unit 5 made of aluminum in which a large number of fins 5b, 5b,... Are arranged at appropriate intervals on the base 5a, with the fins 5b facing the inner side surfaces of the housing 1, and on both sides inside the housing 1. Arranged. The radiating fin unit 5 shown in FIG. 1 is drawn with a thick fin 5b and a low radiating fin unit 5. However, the actual fin 5b is thinner and has a larger number of fins. The heat dissipating surface area is much larger, and the height of the heat dissipating fin unit 5 is substantially equal to the internal height of the housing 1 (see FIG. 2). By installing the radiation fin units 5 and 5 as described above, the vertically long gaps 5c, 5c... Formed between the fins 5b and 5b are separated from the side mounted with the printed wiring board 7 inside the base 5a. Therefore, even if a metal foreign object falls into the vertically long gap portion 5c and cannot enter the printed wiring board 7 side.
[0010]
The heat conduction plate 8 that transfers heat generated by the heat generating component 6 attached to the printed wiring board 7 to the heat radiating fin unit 5 includes a horizontal plate-like portion 8 a that is in surface contact with the surface of the heat generating component 6, and the base of the radiator 5. It consists of a vertical plate-like portion 8b attached to 5a, and is made of an aluminum plate or the like having excellent thermal conductivity. When designing the printed wiring board 7, it is advisable to devise a method of shortening the length of the horizontal plate-like portion 8 b by bringing the mounting position of the heat generating component 6 as close as possible to the radiating fin unit 5 side. The upper and lower surfaces and side surfaces of the casing 1 where the upper and lower surfaces and the side surfaces of the vertically-spaced fins 5 face each other are substantially the same as the shapes of the upper and lower surfaces and side surfaces of the vertically-spaced spaces 5c and 5c. The vent holes 9a, 9c and 9b having the same shape are formed. The air flow path from the bottom vent hole 9c through the vertically long gap 5c to the top vent hole 9a is not restricted by the vent holes 9c, 9a, so that the flow resistance can be reduced. Therefore, heat radiation by convection can be effectively performed. On the other hand, there is an increased risk of falling metal foreign objects entering the housing 1 from the air holes 9a. As described above, the vertical gaps 5c, 5c... Since it is separated from the plate 7 side and the metal foreign matter in the vertically long gap 5c cannot move to the printed wiring board 7 side, there is no fear of an electrical short circuit accident due to the metal foreign matter.
[0011]
The radiating fin unit 5 and the heat conducting plate 8 are preferably connected by a small screw (not shown) or the like that can be removed at any time, rather than fixing that cannot be separated by an adhesive or welding. In this case, it is difficult to push the upper surface of the heat generating component 6 with a desired appropriate pressing force by the horizontal plate-like portion 8a of the heat conducting plate 8 just by attaching the heat conducting plate 8 to the heat radiating fin unit 5. The pressure bonding is too strong, causing excessive stress to the heat generating component 6, and conversely, the surface contact with the heat generating component 6 is poor due to being too weak. In the present invention, a spring retainer 10 having a head portion 10a is erected at a horizontal plate-like portion 8a that contacts both sides of the heat generating component 6, and a hole 11 into which the spring retainer 10 is slidably fitted into the heat conducting plate 8. And the heat conducting plate 8 is pressed by the spring 12 received at one end by the head portion 10a of the spring retainer 10 to obtain an appropriate pressure-bonded state. In this state, the vertical plate-like portion 8b of the heat conducting plate 8 and the base 5a of the heat dissipating fin unit 5 are combined with each other in a desired good pressure-bonded state while maintaining an appropriate pressure-bonded state.
[0012]
The vertical plate-like portion 8b of the heat conducting plate 8 is provided with a holding plate (not shown) to be in close contact with the base 5a of the radiating fin unit 5, and the holding plate, the vertical plate-like portion 8b, It is preferable to connect three of the radiator 5 and the base 5a with a small screw or the like.
[0013]
On the bottom surface 3 a of the lower case 3, metal legs 13, 13 having a U-shaped cross section on the left and right sides, and a plurality of metal legs 13, 13 having the same height as the metal legs 13 are disposed between the metal legs 13, 13. Are provided with short cylindrical metal legs 14, 14. The printed wiring board 7 is received by both metal legs 13 and 13 on both sides thereof, and is fastened with a small screw (not shown) or the like. The substrate 5a of the radiating fin unit 5 is also fixed to the metal legs 13, 13 with a small screw (not shown) or the like.
[0014]
The plurality of metal legs 14, 14... That receive the intermediate portion of the printed wiring board 7 serve as a base for erecting the spring presser 10 described above. A screw hole 14a is formed in the metal leg 14, and a small diameter screw portion 10c provided at the tip of the spring retainer 10 shown in FIG. Alternatively, a mounting hole (not shown) is formed into which the small-diameter locking portion 10d having a split structure shown in FIG. On the other hand, the printed wiring board 7 is provided with a hole connected to the screw hole 14a or the like so that the small diameter screw portion 10c or the small diameter locking portion 10d can be inserted. When the spring retainer 10 is of the type shown in FIG. 3A, it is possible to adjust the pressing force of the spring 12 within a certain range by adjusting the screwing, but the screwing work takes time. On the other hand, in the type shown in FIG. 3B, the pressing force of the spring 12 cannot be adjusted. However, the attachment is easy if the small-diameter engaging portion 10d is pushed into the attachment hole, and the operation is simple.
[0015]
3A and 3B, an annular protrusion 10b is formed at the neck, and one end of the spring 12 is engaged between the head 10a of the spring retainer 10 and the annular protrusion 10b. This prevents the spring 12 from falling off the spring retainer 10. For this reason, handling of the spring 12 is not troublesome when the spring retainer 10 is attached.
[0016]
As shown in FIG. 1, copper solid pattern portions 15, 16 are formed at the back contact portion of the printed wiring board 7 received by the metal legs 13, 14. In FIG. 4, the solid pattern portion 16 formed on the back surface of the printed wiring board 7 in contact with the metal leg 14 is shown in an enlarged manner. The solid pattern portion 16 has a size of about 10 mm square, for example, while the outer diameter of the metal leg 14 is 6 mm. The heat of the printed wiring board 7 escapes to the lower case 3 and the radiating fin unit 5 through the solid pattern portions 15 and 16 and the metal legs 13 and 14.
[0017]
【The invention's effect】
According to the first aspect of the present invention, the metal foreign matter that has fallen to the side of each vertically long gap between the heat dissipating fins of the heat dissipating fin unit cannot be moved to the printed wiring board side by the dividing action by the base of the heat dissipating fin unit. Therefore, it becomes possible to enlarge the vent hole, and when heated air flows upward in each of the vertically long gaps by convection, the resistance at the vent hole portion can be reduced. Even when a plurality of, for example, about four are stacked, good natural air cooling by convection is achieved.
In addition, since the heat of the printed wiring board passes through the heat transfer solid print part and the metal legs, it is released to the heat sink fin unit side fixed to the housing with the bottom of the housing and a small thermal resistance. The heat stored in the printed wiring board can be efficiently transferred to the bottom of the case and the radiating fin unit to dissipate it, so that the heat from the printed wiring board can stay inside the case and prevent the temperature inside the case from rising. .
[0018]
In the invention according to claim 2, by pressing the heat conductive plate with the force of the spring, it is possible to mount the heat conductive plate in a state of being suppressed with a uniform pressure without applying stress to the heat-generating component. Become.
[0019]
In particular, in the invention described in claim 3, since the spring does not fall off from the spring presser, it is not necessary to hold the vine spring with one hand at the time of screwing work, which contributes to improvement of work efficiency. it can.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a housing structure according to the present invention. FIG. 2 is an explanatory sectional view of the assembled state of FIG. 1. FIG. 3A is a spring in which a small-diameter screw portion is formed at the tip. Side view of the presser, (B) is a side view of a spring presser that has a split-diametered small-diameter locking part at the tip. [Fig. 4] Enlarges the solid pattern part formed on the back side of the printed wiring board. It is the perspective view shown.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing | casing 5 Radiation fin unit 5a Base 5b Fin 5c Vertically long gap part 6 Heating component 7 Printed wiring board 8 Heat conduction board 9a-9c Vent hole 10 Spring presser 10a Head part 10b Annular protrusion 11 Hole 12 Spring 13, 14 Metal Legs 15 and 16 Solid pattern part

Claims (3)

Inside the metal casing, a heat radiating fin unit, a printed wiring board to which a heat generating component was attached, and a heat conductive plate in surface contact with the heat generating component and connected to the heat radiating fin unit at the other end were provided. In the housing structure for information processing devices,
The fin side of the heat radiating fin unit and both inner side surfaces of the housing are arranged to face each other, and each vertically long gap between the fins and the printed wiring board side are separated by the base of the heat radiating fin unit. A vent hole is formed in the upper and lower surfaces of the casing facing the upper and lower surfaces of the gap portion so that an air flow passage is formed from the lower surface side to the upper surface side without restricting the flow path; The printed wiring board is provided with a vent hole on a side surface of the housing facing the outside and communicating with the outside, and a metal leg is fixed to the bottom surface of the housing and is received by the metal leg. By forming a heat transfer solid print portion at the back contact portion, the heat of the printed wiring board passes through the heat transfer solid print portion and the metal leg, and the case bottom and a small thermal resistance to the case. Fixed heat dissipating fin unit The information processing apparatus casing structure characterized in that as that escape to the up side. A spring retainer having a head is provided on both sides of the heat generating component, and the heat conduction plate is slidably mounted on the spring retainer, and one end is received by the head of the spring retainer. The housing structure for an information processing device according to claim 1, wherein the housing structure is pressed by a spring. The spring retainer has an annular ridge formed on the neck, and one end of the spring is locked between the head of the spring retainer and the annular ridge so that the spring retainer and the spring are integrated. The housing structure for an information processing device according to claim 2 , wherein the housing structure is an information processing device.

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