1263475 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板，尤指—種具言、首 板’能快速排除電子元件所產生的熱，確保元：¥熱性電路 【先前技術】 的可靠性。 大部份電子元件，特別是積體電路元件 :會將晶片載放於-電路板上，再配合適當的？裝時， 段’將晶片的接點連接至該電路板上，:、电連接手 上線路或接點相 為避免電路板 仰立座生電紐路，通常芸 (Insulation Layer、π π 兩 现—層絕緣層 y )以卩网、纟巴電路板中的線路或 一般稱此絕緣層ΛU的接觸， 尽马黏者層（Adhesive LayerV，Η、 路與基板。 用以黏著裸電 目前對於裡+ 兒路板所使用的絕緣層材質， 玻璃纖維·環氧樹旨 、早功是使用 傳導性極差，使彳胃 ’此一材料的埶 使传晶片工作時產生的熱傳導5、 … 後，即因為玻璃雜 、、至裸電路板 禹纖I環氧樹脂材料的包霜而^ 板 地向外排❺，進而影響 …、法將熱有效 廠商採用氧化鉈環日:·。疋以，目前有部份 又 Μ脂材料（ep〇Xy_Al 〇 、 的絕緣層，因為含 2 3 )作為電路板 ’氧化ί呂的絕綾展動；由志 材料具有較高的埶 θ 离、截維-環氧樹脂 4至 …專導係數’能夠增加裸電踗虹Μ , 效率。 电路板排出熱的 由於積體電路沾 熱會增加，而如發=路佈局密度愈高，其工作時產生的 生高熱，因此，h ~極體兀件也是容易在發光狀態下產 以等易生高熱的電子元件桿接至電路板 1263475 上’縱使使用氧介4 為其間存在轨傳導2氧樹脂材料作為絕緣層，但仍舊因 法有效獲得改善。不高的絕緣層’而使得散熱效率無 請參閱第五圖所 、 件（5 0 )結構說明、’以下“乂 一種既有發光二極體元 含有： 。月目前常見散熱結構的設計，其主要包 0 一基板 有 一線路（6 1、 u ；，其黏著於該基板（6 0 )卜 晶塾（611) κ 〕及至少一焊墊（612);及 包含 曰曰 上 晶座（…，係設置於該線路（6 1)的晶墊（6 上，其上係供至少一裸晶 0 )接點則進一牛^ w 又u，而裸 步打線連接至對應的焊墊（6丄2 ) 上述線路（6 1 )的下端面塗佈有絕緣層（ 从黏貼至該基板（6 〇 ) 4 )， 間的空隙則進一步充埴i 而其中線路（6!) 工丨糸⑴退步充填有防焊層（ 六圖所示，當晶座（62m '配合茶閱第 埶日士“ （ 6 2 )上的稞晶（8 〇 )發光而產生 Ο , / c 6 2 )、線路（6 1 )、防焊層（6 d )、絕緣層（6 4 )月其知；,。 穿罢…、 及基板（6 〇)而將熱導至該散南 、置（7 0 ) ’由散熱裝置（7 目的。 （U」對汗I政，達到散卖 ^由前揭發光二極體元件（5 〇 )的散熱結構可知，| 削大多廠商直接使用散熱裝置（7 〇 )黏合於電路板 板（6 0 )上’以提供散熱的途經，惟其散熱效率仍非: 1263475 途徑中的防谭層（…及絕緣層（64) 4)， ：不尚’故熱點（90)會集中在絕緣層（6 …、决有效地對外傳導，因此， 良好的散熱H h 彳U此雖然扠置散熱效果 r 〇 )，其整體散熱效率仍不佳。 [發明内容】 電路板，A:t:的主要發明目的係提供-種具高導熱性 板進-步加裝：：：：的熱能夠快速散逸，如此，當電路 裴置，由散^裝=力、、衣置時’熱即能夠迅速地被導至散熱 保電子元件良好\^^熱的導出’讓散熱效果更顯著，確 性。 好工作特性及延長使用期限，提高元件可靠 欲達上述目的Μ # m ,, 斤使用的主要技術手段传八Y百一 性電路板主要於電路板中的基㈣路；“仏導熱 石微粉的絕緣層，由於…， 路間加入-層含有鑽 導電的特性，故可使卜" 有问熱得導係數以及不 及不導電的特性；如此，告：一有円熱傳導係數以 時，電路板能快速傳導所载電子元件產生熱 4择V熱至外界空氣中· 裝設有一散敎裝置日士 琶路板進一步 ,、，、衣置4，則部份熱會傳導至 夕 放熱裝置加速熱的笋 兩 月’、'、衣置中，由 顯。 …元件的散熱效果更為明 、…本《明— 人目的係提供一種具有高導 光二極體元件，通常恭 ^防焊層的發 电路板除了覆蓋有絕绥思， 笔路板線路之間的空 、'、€外，還會於 1糸中充增一防焊層， 有鑽石微粉的防焊層， 夯明係採用含 “防斤層具有高導熱/無導電的 263475 寸性，增加線路與外界接觸的散熱面積，而裸電路板上電 …凡件產生的熱以熱傳導、熱對流與輻射放熱等散熱方式 對外界快速發散。 【實施方式]1263475 IX. Description of the invention: [Technical field of the invention] The present invention relates to a circuit board, in particular, a type, a first board, which can quickly eliminate the heat generated by an electronic component, and ensures that the element: a thermal circuit [previous technology] 】 Reliability. Most of the electronic components, especially the integrated circuit components: will the chip be placed on the - circuit board, with appropriate? When installed, the segment 'connects the contacts of the wafer to the circuit board, and: the electrical connection between the line or the contact is to prevent the circuit board from standing up, usually 芸 (Insulation Layer, π π —Layer insulation layer y ) is used to connect the wires in the 卩 纟 , 纟 电路 电路 或 或 或 或 或 或 , , , , , Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad Ad + The material of the insulating layer used in the children's circuit board, the glass fiber, the epoxy resin, and the early work are extremely poor in conductivity, so that the heat transfer of the material is caused by the heat transfer 5, ... That is to say, because of the glass miscellaneous, the frosting of the epoxy resin material to the bare circuit board, the board is outwardly drained, thereby affecting the heat exchangers, and the heat-effective manufacturers adopt the ruthenium oxide ring day: Some of the resin materials (ep〇Xy_Al 〇, the insulation layer, because of the inclusion of 2 3 ) as the circuit board 'oxidation ί ü 绫 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Oxygen Resin 4 to...Special Coefficient 'can increase bare 踗 rainbow trout, efficiency The heat of the circuit board is increased due to the heat of the integrated circuit, and the higher the layout density of the circuit, the higher the heat generated during operation, so the h ~ pole element is also easy to produce in the light state. The high-heating electronic component rod is connected to the circuit board 1263475 'even if the oxygen-based dielectric 4 is used as the insulating layer for the conduction of the 2 oxy-resin material, but it is still effectively improved by the method. The low-insulation layer makes the heat dissipation efficiency unnecessary. Please refer to the fifth figure, the structure (5 0) structure description, 'below' 乂 an existing light-emitting diode element contains: . The current common heat-dissipation structure design, the main package 0 a substrate has a line (6 1, u;, which adheres to the substrate (60), and at least one pad (612); and a crystal on which the upper crystal holder (... is disposed on the line (6 1) The pad (6 on which the at least one die 0 is attached) contacts a hole ^ w and u, and the bare step wire is connected to the corresponding pad (6丄2). The lower end of the above line (6 1 ) is coated. The cloth has an insulating layer (from the paste to the substrate (6 〇) 4 ), the space between Then further fill the i and the line (6!) worker (1) is stepped back and filled with a solder mask (six shown in the figure, when the crystal seat (62m 'cooperate with the tea on the Dijon" (6 2) (8 〇) illuminates to produce Ο, / c 6 2 ), line (6 1 ), solder resist layer (6 d ), insulating layer (6 4 ) months know;, wear and tear..., and substrate (6 〇 ) and the heat is led to the south, set (7 0 ) 'by the heat sink (7 purpose. (U" on the sweat I policy, to reach the sale ^ by the front of the light-emitting diode component (5 〇) heat dissipation structure It can be seen that most manufacturers use heat sinks (7 〇) directly on the board (60) to provide heat dissipation, but the heat dissipation efficiency is still not: 1263475 The anti-tank layer (... and insulation layer ( 64) 4), : not yet 'the hot spot (90) will concentrate on the insulation layer (6 ..., effectively radiate externally, therefore, good heat dissipation H h 彳U although the fork heat dissipation effect r 〇), its overall The heat dissipation efficiency is still not good. [Summary of the Invention] The main purpose of the circuit board, A:t: is to provide a high thermal conductivity plate. The heat of the step:::: can be quickly dissipated, so when the circuit is placed, it is installed. = force, when the clothes are placed, 'heat can be quickly guided to the heat dissipation and the electronic components are good. ^^^ Heat export' makes the heat dissipation effect more significant and reliable. Good working characteristics and extended use period, improve the reliability of components to achieve the above purposes Μ # m , , The main technical means of using the jin Y Y yi circuit board is mainly in the circuit board in the base (four) road; "仏 thermal stone powder Insulation layer, due to..., the inter-channel addition-layer contains the characteristics of drill-conducting, so it can be used to ask for thermal conductivity coefficient and less than non-conducting characteristics; thus, a circuit board with a heat transfer coefficient It can quickly conduct the contained electronic components to generate heat, and select V heat to the outside air. • Install a diverging device, the Japanese stone board, and further, the clothing will be transferred to the evening heat release device to accelerate the heat. The bamboo shoots in February, ', and the clothes are in the middle. The heat dissipation effect of the components is more clear.... This "Ming-People's purpose provides a high-light-conducting diode component, usually the welding layer. In addition to the cover of the circuit board, the space between the pen and board lines, ', and €, will also add a solder mask to the 1糸, a solder resist layer with diamond powder, and the use of the system is included. The puncture layer has high thermal conductivity / no conductivity 263475 , Increasing the cooling area contact with the outside circuit, the electric circuit board and the bare ... Where the heat generating member to the heat conduction, convection and radiation heat to the outside world like cooling mode quickly diverge. [Embodiment]
首先請參閱第一圖所示，係為本發明的第一較佳實施 :彳’本發明的電路板係包含有—基板（10)、—形：： 反二1 0)上的線路（1 1)，以及供基板（1 〇)與線 。口且3有鑽石微粉的絕緣層（1 2 )，其中該線路（1 ^ )之間的空隙再充填有防焊層（1 3 )，而該絕緣層（i •)係可直接將黏著齊丨（Ep〇xy)混合鑽石微粉而製成。 子_ 1 )係七、電子元件（2 0 )連接，而電 牛（2 0 )可為南密度電路佈局之積體電路元件、 功率晶片或發光二極體曰 ^ 月且曰日片寺易生高熱的電子元件。 靖配合參閱第二m 一 ^ — 一圖所不，上述絕緣層係係為本發明另 一較佳實施例，該基板 t r.,, 板（1〇)之下端面再設有一散熱裝 使得電子元件（20)於運轉時所產生之教 可更有效地傳遞至外界。 …、 又’請參閱第二圖所干，佐&丄、 即於該基板"0)上=為本發明再一較佳實施例’ 係加入一含有 （1 1 )之間的間隙（！丄！） 有錶石讀的防焊層（1 3 a )。 由於鑽石微粉具有高埶 门…、得寺係數以及不導 故可使得該絕緣層（〕9、 汉个V兒的特性 、 Z )及防焊層（1 S 、F1 #目右 高熱傳導係數以及高 ）同彳水/、 本發明的㈣⑻It叫）㈣性，如此， 曰曰加，％配合參閱第四圖所 6 1263475 3 〇 )，即，該線路（工丄） 產生熱時，熱會被傳導至線 2 )及防焊層（1 3 a )快 示為此一結構的熱流方向 上所載放的電子元件（2 〇 路（1 1)，再由絕緣層（ 速地散逸到外界空氣中。 而广如第三圖所示，若該基板（1 0)進-步設有一 ,熱裝置（1 4 ) _ ’則基板（i 〇 )部份熱傳導至散熱 裝置（1 4 )，由散熱裝置（丄4 )快速將熱導出，加速 熱的發散，使得電+开杜< n、 — 甩子兀件（2 〇)的整體散熱效果更為顯 著。 上述防少干層（1 3 a )係於防焊油墨（熱傳導係 數1 v/m-k)中加入鑽石微粉（熱傳導係數議〜2〇〇〇 W/m-k)，且該鑽石微粉的體積比可以在Μ%。之 間’而顆粒尺寸則小於油墨塗層的厚度（1〜5〇〇微米）。 而本發明防焊層（丄3 a )因直 ^ 且较接觸外界空間，故而增 加電路板的散熱面積，藉以轨僂道 4 一』 檟错以熱傳導、熱對流與輻射放熱等 散熱方式將熱自電路板發散至外 效。 達到良好的散熱功 經上述說明可知，本發明確f “％心" “改善既有電路板散熱差 ,^ . 牛方；工作時產生的執， 能確貫有效地快速發散，確保電子元件的言 " 【圖式簡單說明】 °罪社First, please refer to the first figure, which is a first preferred embodiment of the present invention: 彳 'The circuit board of the present invention includes a circuit on a substrate (10), a shape: a reverse two 10) (1) 1), as well as for the substrate (1 〇) and the line. And the insulating layer (1 2 ) of the diamond micropowder, wherein the gap between the lines (1 ^ ) is filled with a solder resist layer (1 3 ), and the insulating layer (i •) can be directly adhered丨 (Ep〇xy) is made by mixing diamond powder. Sub_1) is the seventh, the electronic component (20) is connected, and the electric cow (20) can be the integrated circuit component of the south density circuit layout, the power chip or the light-emitting diode 曰^月High-heat electronic components. The above-mentioned insulating layer is another preferred embodiment of the present invention. The substrate t r., the lower end surface of the board (1〇) is further provided with a heat dissipating device. The teachings produced by the electronic component (20) during operation can be more efficiently transmitted to the outside world. ..., and 'Please refer to the second figure, Zuo & 丄, that is, on the substrate "0) = a further preferred embodiment of the present invention is added to a gap containing (1 1 ) !丄!) There is a solder resist layer (1 3 a ). Because the diamond micropowder has a high threshold..., the coefficient of the temple and the non-deformation can make the insulation layer (] 9, the characteristics of the Han V, Z) and the solder mask (1 S, F1 #目右高热热系数 and High) with the water /, the (four) (8) It is called (four) of the invention, so, 曰曰, % with reference to the fourth figure 6 1263475 3 〇), that is, when the line (work) generates heat, the heat will be Conducted to the wire 2) and the solder mask (1 3 a ) is shown as the electronic component carried in the direction of the heat flow of the structure (2 〇 (1 1), and then by the insulating layer (slowly dissipated to the outside air As shown in the third figure, if the substrate (10) is provided with one step, the heat device (1 4 ) _ 'the substrate (i 〇) is partially thermally conducted to the heat sink (1 4 ), The heat sink (丄4) quickly heats out and accelerates the heat divergence, making the overall heat dissipation effect of the electric + 杜 & n n 2 2 2 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 a) adding diamond powder (heat transfer coefficient ~2〇〇〇W/mk) to the solder resist ink (heat transfer coefficient 1 v/mk), and the diamond powder The volume ratio may be between Μ% and 'the particle size is smaller than the thickness of the ink coating (1~5〇〇 microns). However, the solder resist layer (丄3 a ) of the present invention is straight and more in contact with the external space. Therefore, the heat dissipation area of the circuit board is increased, so that the heat dissipation from the circuit board is radiated to the external effect by the heat dissipation method such as heat conduction, heat convection, and radiation heat release. The good heat dissipation work is achieved. Clear f "% heart" "Improve the heat dissipation of the existing circuit board, ^. Niu Fang; the work generated during the work, can effectively and effectively spread quickly, to ensure that the electronic components of the words" [schematic description] ° Society
弟一圖·係本發明一較彳-I 户、^例的部份判石回 第二圓：係本發明另一較佳 J面0。 篦- P) ·筏士 ϋ G列的部份剖面圖。 弟二0·係本發明再一較佳 i 7 °卩份剖面圖。 1263475 第四圖：係第三圖標示有熱傳導路徑示意圖。 第五圖：係既有發光二極體元件的剖面圖。 第六圖：係第三圖標示有熱傳導路徑示意圖。 【主要元件符號說明】 (10)基板 (1 1 1 )間隙 (13)防焊層 (1 4 )散熱裝置 (3 0 )熱流方向 (6 0 )基板 (6 1 1 )晶整 (6 2 )晶座 (6 4 )絕緣層 (1 1 )線路 (12)絕緣層 (1 3 a )防焊層 (2 0 )電子元件 (5 0 )發光二極體元件 (6 1 )線路 (6 1 2 )焊墊 (6 3 )防焊層 (7〇）散熱裝置The figure of the younger one is a part of the invention. The second circle is another preferred aspect of the present invention.篦- P) · Gentleman ϋ Partial sectional view of column G. The second embodiment of the present invention is a further sectional view of the present invention. 1263475 Figure 4: The third icon shows a schematic diagram of the heat conduction path. Figure 5: A cross-sectional view of an existing LED component. Figure 6: The third icon shows a schematic diagram of the heat conduction path. [Main component symbol description] (10) Substrate (1 1 1) gap (13) solder mask (1 4) heat sink (30) heat flow direction (60) substrate (6 1 1) crystal (6 2 ) Crystal holder (6 4 ) Insulation layer (1 1 ) Line (12) Insulation layer (1 3 a ) Solder mask (20) Electronic component (5 0 ) Light-emitting diode element (6 1 ) Line (6 1 2 Solder pad (6 3 ) solder mask (7〇) heat sink