TWI358632B - Heat dissipation structure of chassis for industry - Google Patents

Description

1358632 /, the invention description: [Technical field of the invention] β A heat dissipation structure of the casing and a manufacturing method thereof, in particular, the welding of the heat conducting component to the machine: forming the heat conducting component and the casing into a body The heat dissipation structure of the casing and its manufacturing method. [Prior Art] Zhuang Ik is advancing with technology, and the performance of electronic devices is increasing. However, since the electronic clothes are operated, the heat will be generated. If these heats are not properly dissipated, the electronic device will have a low effect. Even more, the electronic device is burned, so the heat dissipation structure has become one of the indispensable devices in today's electronic devices. The heat dissipation structure is designed for individual heating elements, and the heat is generated at a lower working frequency. The heat generation of the δ 'heating element can be easily used to meet the demand for rapid heat dissipation. For example, the "figure map" is shown as "Xi": the thermal structure side shed. In the "figure map", the south heat transfer coefficient fins 63 are provided with a plurality of healthy sheets, and the heat generating elements 62 are attached to the printed circuit board & It is absorbed by heat conduction, and the heat-dissipating area which is in contact with the air by the plurality of heat-dissipating fins 63 is transmitted through the natural convection method, so that the high-heat-conducting heat dissipates the cold air, and the heat is generated. The generated heat energy is dissipated, thereby achieving the effect of heat dissipation. However, many electronic products are now being designed to meet the needs of light, short, fast, 2 functional and high-frequency. The industrial computer is also required to work in a computer environment. Exquisite and compact. Therefore, the above-mentioned heat dissipation structure of 'f(4) is improved to meet the (4) short 3 1358632 design purpose, and please refer to "2A" and "2B", and "2A" is a known industrial computer. The three-dimensional exploded view of the heat dissipation structure; "2B" is not a side view of the heat dissipation structure of the conventional industrial computer.

The heat dissipation structure of the conventional industrial computer is configured such that at least one circuit board 72 having at least one heat generating component 721 is disposed in the casing 71, and a corresponding first thermal pad 731 ′ is disposed on each of the heat generating components 721 in the first thermal pad 731. The heat conducting component 74 is disposed on the corresponding heat conducting component 74. The heat conducting component 74 is fixed to the corresponding circuit board 72 through the fixing component 75, and the corresponding second thermal pad is disposed on the heat conducting component%, and finally passes through the first thermal pad. The 732 is attached to the casing 71, and the heat energy generated by the heating element 721 is conducted and dissipated through the casing 71 by the above-mentioned (4) structure. It can be clearly seen in the "2nd drawing" that the heat dissipation structure proposed by the prior art is the heat generated by the heat generating member 721, and the heat conducting member 721 can be passed through the first thermal conductive pad 74 and the second thermal conductive pad 732. The generated thermal energy is conducted to the casing 71 and is purely dissipated. 'The thermal energy transfer between the different components will exist.

The resistance and the heat resistance can make the wire transfer difficult, and the increase in the number of the parts will result in an increase of 4, which is also a disadvantage of the conventional heat dissipation structure. According to the above description, it has been known in the prior art that there has been a problem that the thermal element causes excessive thermal resistance and the manufacturing cost is increased for a long time, and an improved technical means is provided to solve the problem. And the problem that the heat-dissipating section of the heat-dissipating department causes excessive heat resistance to increase the cost of the garment, and the structure of the invention and the method of manufacturing the same, wherein: the heat of the casing of the industrial computer of the road type is disclosed in the invention The computer case heat dissipation structure includes: at least one 4 1358632 heat conducting component and a casing. Wherein, a first heat conducting layer is electrically applied to the first heat conducting surface and the second heat conducting surface of each of the heat conducting elements; and each circuit board is disposed in the casing, and at least the inner surface of the casing is plated Coating a layer of a second heat conducting layer, and applying low temperature tin to the at least one soldering region of the second heat conducting layer to form a solder paste layer 'welding the heat conducting elements to the soldering region through the low temperature soldering method, the first heat conducting layer The second heat conducting layer is fixedly integrated into a heat conducting layer through the solder paste layer', and each of the heat conducting elements is integrally formed with the casing shape. The above low temperature soldering method comprises the following steps: first, applying pressure to each of the heat conducting elements such that the first heat conducting layer of the first heat conducting surface of the heat conducting element is attached to the solder paste on the soldering area corresponding to the heat conductive element Finally, the solder paste layer is heated at a low temperature, so that the contact surface of the solder layer and the first heat conductive layer and the second heat conductive layer is melted into a liquid state, and the first heat conductive layer and the second heat conductive layer are made after the low temperature heating and cooling The solder paste layer is fixed to the solder joint, and the heat conductive element can be soldered to the soldering area, and the first heat conductive layer and the first heat conductive layer are integrated into a layer heat conductive layer to form the heat conductive element and the body. The method for manufacturing a heat dissipation structure of an industrial computer disclosed in the present invention comprises the following steps: First, at least the first heat conduction surface and the second heat conduction surface of the heat conduction element are coated by an electric ore-layer-heat conduction a layer; then, at least the inner surface of the casing is coated by electro-minening - a second heat conducting layer; then, a domain temperature solder paste is applied to at least the soldering region of the second heat conducting layer to form a solder paste layer; Next, each of the guiding elements is applied with Lili so that the first heat conducting layer of the first heat conducting surface of the guiding member is attached to the tin layer of the soldering area of the respective heat conducting elements Na Ying; The solder paste layer is such that the contact surface scale of the first heat conductive layer and the second heat conductive layer of the solder paste is liquid, and the first heat conductive layer and the second heat conductive layer are fixed to the solder paste layer after the low temperature heating and cooling are stopped. The first heat conducting layer and the second heat conducting layer are integrated into a heat conducting layer, and the heat conducting elements are integrally formed with the casing. The structure and structure process disclosed in the present invention is as above, and the difference from the prior art is that the present invention electroplating a heat conductive layer on the heat conductive element and the casing and soldering the heat conductive element to the casing through low temperature welding. In order to reduce the thermal resistance, the manufacturing cost can also be reduced. Through the above technical means, the present invention can achieve the technical effect of reducing the heat dissipation resistance and reducing the manufacturing cost. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings and embodiments, and thus the implementation of the present invention to solve the technical problems and achieve the technical effects can be fully understood and implemented. First, the method for manufacturing the heat dissipation structure of the casing of the industrial computer disclosed in the present invention is described. Please refer to FIG. 3A, and FIG. 3A is a heat conduction element of the heat dissipation structure of the casing of the industrial computer of the present invention. The stereoscopic exploded view of the casing. As shown in FIG. 3A, the heat dissipation structure of the casing of the industrial computer disclosed in the present invention is formed by at least the heat conducting component 10 and the casing 2G being welded, whereby the heat conducting component 10 and the casing 20 can be formed. One piece. The position where the heat conducting element 10 and the casing 20 are disposed is set according to the position of the heat generating component existing in the industrial computer. Next, please refer to "3B" and "3C". The "figure diagram" is a side view of the heat dissipation structure of the industrial computer of the present invention; "3C" 1358632 The schematic diagram is as shown in "Fig. 3B", and the first conductive layer _12 of the at least one heat conducting element ι is coated by electroplating - the first heat conducting layer 5 is "see

The north heat-transfer surface 12 is located on the first heat-conducting surface, and the H-heat layer 51 is a metal material having good thermal conductivity, for example, copper, silver, and ", etc." The first heat conducting layer is formed on the first heat conducting surface 11 and the second heat conducting surface I2 of the heat conducting element 1G through the chained copper and the silvered silver 'mineralized scale method>, which is merely an example, and is not Limit the application of the invention. Connecting at least one inner surface 21 of the casing 20 (the drawing only uses a single inner surface as a schematic 'not the application of the invention) to apply a second thermal conductive layer 52 in an electric ore manner (please Referring to "3C", the same second heat conducting layer 52 is made of a metal material having good thermal conductivity, such as copper, silver, nickel, etc., that is, through the copper, silver, and twilight. Yes, the surface of the shell 20 is formed

The layer second heat conducting layer 52' is merely illustrative here and is not intended to be used in this invention. The first heat conducting layer 51 of the first heat conducting surface u and the second heat conducting surface 12 of each of the heat conducting elements 10, and the second heat conducting layer 52 of each inner surface 21 of the casing 20 (refer to "3A") are completed. After the Wei process, next, at least one soldering zone 22 is planned on the second heat conducting layer 52 of each inner surface 21 of the casing 2 (refer to FIG. 3A), and each soldering zone 22 is respectively connected to the circuit. The heat generating members 31 on the board 3 correspond to each other, and a low-temperature solder paste is applied to the bonding pads 22 to form a solder paste layer 53 (refer to "3C"). Then, pressure is applied to the second heat conducting surface 12 of each of the heat conducting elements 10, respectively, so that the first heat conducting layer 5i of the hot surface u of each of the heat conducting elements 1GH is attached to the land 22 corresponding to each of the heat conducting elements 10. Solder paste layer 53. Next, each of the heat conducting elements 10 and the casing 10 is heated by a low temperature heating method (that is, heating the tin layer 53), that is, the contact surface 54 where the solder paste layer 53 and the first heat conducting layer Μ are in contact with each other, and The solder paste of the contact surface 54 where the solder paste layer 53 and the second heat conductive layer 52 are in contact with each other is converted into a liquid state, for example, at a low temperature of about 170 degrees Celsius, and the heating time is about % minutes.

After the above process is completed, the above-mentioned low-temperature heating temperature and heating time are exemplified as an example, and are not intended to limit the scope of application of the present invention. Finally, after the navigation components 1G of the navigation device 1G are stopped at a low temperature and cooled, the first conductive layer 51 and the second derivative layer 52 can be shaped and fixed by the solder paste layer 53, so that each heat conduction can be performed. The component 1 is connected to the soldering region u and the first heat conducting layer 51 and the second heat conducting layer 52 are integrated into a layer of heat conductive layer ^, and each of the heat conducting materials 1G and the chassis 2G are formed into a thin body. Refer to "No.

The "Fig. 3D" diagram shows the three-dimensional combination of the heat-conducting components and the casing of the industrial computer casing of the present invention. The above is the heat dissipation structure of the casing of the industrial computer disclosed in the present invention, and the structure of the industrial electric silent casing of the syllabus of the syllabus of the syllabus, and the wire 4 4" The edge is shown as an exploded view of the heat release structure of the casing of the industrial computer of the present invention. As shown in the "f 4 diagram", the heat dissipation junction of the casing of the industrial computer disclosed in the present invention has been at least 3. the heat conduction member 10 and the casing 20. The heat conduction member 1G can be welded to the casing 20. 9, the heat generating element 10 and the casing 2G are formed in a body, and in the casing 20, 8 1358632 may be provided with at least one plate 3q having at least the heating element 31, and each of the heat conducting elements (4) is divided on the circuit board 3G. The heat generating elements 31 correspond to each other. In general, the heat generating element is a wafer having an operation Wei, for example, a Central Processing Unit (CPU), which limits the application of the present invention. Each of the heat-generating elements 31 on the board 30 can be attached with a corresponding at least heat-dissipating heat-conducting 40, and the body-shaped heat-conducting elements 1 and the casing can pass through the second heat-conducting surface of each of the heat-generating elements 1G (Fig. It is not shown in the figure) and is attached to the corresponding guide 4G and can fix the heat-conducting element 1() on the corresponding circuit board 30, respectively, so that the effect can be achieved, and the guide can be provided. The component 2, the thermal pad 40, and the heating element 31 are more closely attached. Add heat transfer efficiency. As shown in Fig. 4, 'the heat conducting element 2〇, the thermal pad 4〇 and the heating element 31 are fixed to the circuit board 3〇 through the fixing element 24, and the figure is only an example. Without limiting the scope of the invention, any technical means for attaching the thermally conductive element 10 to the circuit board 30 should be included in the present invention. Thereby, each of the heat generating components 31 on the circuit board 30 can pass through the corresponding thermal pad 40, and the heat conducting component 1 贴 which is in contact with the thermal pad 40, and the heat generating component 31 on the circuit board 3 is generated. The thermal energy is transmitted to the casing 2 through the thermal pad 4 and the conduction of the heat conducting element 10, and the thermal energy is dissipated through the casing 20. The thermal pad 40 is made of a semiconductor material having good thermal conductivity and good thermal conductivity, and the casing 20 and the heat conducting element 1 are also made of a material having good thermal conductivity, such as aluminum, iron, etc. For the sake of exemplification, the application of the present invention is not limited thereto, so that the thermal pad 40 can be respectively attached to the heat generating member 9 and the heat conducting member 1 〇, and has good thermal conductivity. It is worth noting that, because the circuit board 3 can be configured according to the different combinations of the electronic components and the electronic components having the computing functions to achieve different functions, the circuit boards of different functional circuits are arranged in the industrial computer. At 1 ,, the versatility of the industrial computer can be expanded. Therefore, the thermal insulation element 10 soldered by the different inner surface 21 of the casing 20 can be disposed in the casing 2〇, That is, the heat energy of the heat generating element 31 disposed on the different circuit boards 3A in the casing 2 can be dissipated. Moreover, a plurality of heat dissipation fins (not shown) may be disposed on the outer surface 23 of the casing 20, thereby increasing the heat dissipation area to accelerate the heat dissipation efficiency of the casing 2, in addition, In order to save material cost, a plurality of heat dissipating fins may be disposed directly on the outer surface 23 of the heat conducting component 10 corresponding to the casing 2, thereby saving material cost and enhancing local heat dissipation efficiency. Although the heat-conducting element 10 and the machine can be directly integrated in the aluminum casing type (herein, by way of example only, and not limited to the invention) The case 20, however, will not be suitable for the one-piece forming of the heat-conducting element 10 and the casing 20 in one-time construction of the circuit board 30 having a relatively complicated design, and the heat-conducting element 1 and the casing 2 may cause manufacturing interference. Therefore, through the manner proposed by the present invention, the design of the soldering region 22 can be efficiently performed corresponding to different circuit boards to avoid manufacturing interference. At the same time, through the heat dissipation structure of the present invention, the thermal resistance between the heat conduction element 10 and the casing 20 can be effectively reduced, and the heat conduction element 10 and the casing can be prevented due to the electric energy process of the heat conduction element 1 and the casing 2 The surface of the 2 氧化 is oxidized, and the 1356632 has the functions of enhancing hardness and anti-corrosion, and at the same time reducing the use of the thermal pad 40, further saving cost. In summary, it can be seen that the difference between the present invention and the prior art is that the present invention vertically welds the heat conductive element to the casing on the heat conducting element and the casing by means of a low temperature welding method. The use of heat-dissipating components can be reduced, and the thermal resistance can be effectively reduced. At the same time, the manufacturing cost can be reduced, and the problem of excessive heat resistance and increased manufacturing cost caused by excessive use of heat-dissipating components can be effectively improved. Although the embodiments disclosed in the present invention are as above, the contents are not intended to directly limit the invention of the invention. Anyone who has the usual knowledge in the field of bribery technology can make some changes in the style and details of the threats without the spirit and fineness of the uncovering. The scope of the invention is to be determined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a conventional heat dissipation structure. The second drawing shows a three-dimensional exploded view of the heat dissipation structure of the conventional industrial computer. Figure 2 is a side view showing the heat dissipation structure of a conventional industrial computer. Fig. 3 is a perspective exploded view showing the heat conduction element and the casing of the heat dissipation structure of the casing of the industrial computer of the present invention. The third drawing shows a side view of the heat dissipation structure of the case of the worker Lei Xing from the work of the present invention. 3C is a schematic view showing the heat conduction layer of the heat dissipation structure of the casing of the industrial computer of the present invention. FIG. 3D is a schematic diagram showing the three-dimensional combination of the heat conducting component 1358632 and the casing of the heat dissipation structure of the computer of the invention. Fig. 4 is a perspective exploded view showing the heat dissipation structure of the casing of the industrial computer of the present invention. [Main component symbol description]

10 heat conducting element 11 first heat conducting surface 12 second heat conducting surface 20 casing 21 inner surface 22 soldering zone 23 outer surface 24 fixing component 30 circuit board 31 heating element 40 thermal pad 51 first heat conducting layer 52 second heat conducting layer 53 solder paste Layer 54 Thermal Conductive Layer 61 Printed Circuit Board 62 Heating Element 63 Heat Sink 71 Housing 72 Circuit Board 721 Heating Element 12 1358632 731 First Thermal Pad 732 Second Thermal Pad 74 Thermal Conductor 75 Fixed Element

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Claims (1)

1358632 VII. Patent application scope: 1. A heat dissipation structure for a casing of an industrial computer, comprising: at least a heat conduction element, wherein the first heat conduction surface and the second heat conduction surface of the heat conduction element are coated with a first heat conduction layer by electroplating; And the first device is disposed in the casing, and at least the inner surface of the casing is called a coating-layer second heat conducting layer, and a low-temperature solder paste is applied to the second heat conducting layer. At least a soldering region of the layer to form a solder paste layer, the heat conducting component is soldered to the soldering region by low temperature soldering, and the first heat conducting layer and the second heat conducting layer are fixedly integrated through the solder paste layer- a layer of thermal conductive layer, the second two: forming an integral with the casing. 2.' 2. For the heat dissipation structure of the industrial computer case as described in item i of the patent application, wherein the heat transfer layer and the second heat conductive layer are metals with good thermal conductivity. 3. The reading of the computer case is performed, and the plating method is nickel plating. # 4. As described in the scope of the patent application, the heat dissipation of the casing is located on the first heat conducting surface. The back side.... /, 5. The heat dissipation of the casing of the industrial computer as described in the scope of application of the patent scope is provided with a plurality of fins on the outer surface of the casing. /, 6. If the application is detailed, please refer to the item The work described in (4) The brain and the casing correspond to the outer surface of the _ is further provided with a plurality of scattered ^ which = please patent fine item! The industrial computer case; piece. The case is heat conduction Good metal material. , , , , , , ° , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The heat dissipation of the casing of the industrial computer described in the first application of the patent scope includes at least a heat conduction 塾 attached to the second guide The first heat-conducting layer of the surface is bonded. 匕10. The heat-dissipating structure of the industrial computer case according to claim 9 further comprising at least one circuit board having at least a heating element, and the heat conduction. The heat-dissipating components of the industrial computer, as described in the patent scope of item i, the heat-conducting components of the beans are respectively fixed on the corresponding circuit boards. A method for manufacturing a heat dissipation structure of an industrial computer casing, comprising the following + step. = at least - a heat conducting surface of the heat conducting component and a second heat conducting surface ς a coating method of applying a first heat conducting layer; At least - the inner surface is coated by electro-minening - a second heat-conducting layer, - tin 3 is applied to at least the weld zone of the second heat-conducting layer to form a 埶 table: two-conductor = piece of knowledge - force ' The heat conduction of the first heat conducting surface of the heat conducting elements is lightly coupled to the solder paste layer on the heat conducting regions; and the conductive layer is configured to make the solder paste layer and the first heat conducting layer and the first Two-==r=' and soldering the first element to the low temperature heating and cooling The welding zone s and the = taste layer are fixedly connected to integrate the heat conduction heat conduction layer, the material element and the second guide scale into one, and the industrial computer case heat dissipation structure process 15 method The step of coating a layer of the first heat conducting layer and applying a layer of the second heat conducting layer by electroplating is a step of coating a layer of the first heat conducting layer with nickel plating and coating a layer of the second heat conducting layer with the forged nickel. The method for manufacturing a heat dissipation structure of a casing of an industrial computer according to claim 12, wherein the method further comprises the step of setting a plurality of heat dissipation fins on the outer surface of the casing. I, as claimed in claim I. The method for manufacturing a heat dissipation structure of a computer case according to the invention, wherein the method further comprises the step of setting a plurality of heat dissipation fins_the casing corresponding to the outer surfaces of the welding zones. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The method of claim 1, wherein the method further comprises the step of bonding the heat conduction to at least one of the heat generating components on the at least one circuit board. 18. The method according to claim 12, wherein the method further comprises the step of sealing the heat conducting component firmware to the corresponding ones of the electric towers. .