JP2015018993A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which includes a cooling structure and is easily handled.SOLUTION: An electronic device 1 includes: an electronic component 10; a heat absorption part 20; a heat transfer part 30; and a heat radiation part 40. The heat absorption part 20 is mounted on the electronic component 10. A refrigerant is sealed in the heat absorption part 20 and the heat absorption part 20 uses the refrigerant to absorb heat of the electronic component 10. The heat transfer part 30 is connected with the heat absorption part 20 and transfers the heat of the heat absorption part 20. The heat radiation part 40 is connected with the heat transfer part 30. A refrigerant flows in the heat radiation part 40 and the heat radiation part 40 uses the refrigerant to absorb and radiate the heat of the heat transfer part 30. The heat radiation part 40 has a structure that can be attached to or detached from the heat transfer part 30.

Description

  The present invention relates to an electronic device.

  There are known techniques for cooling an electronic device and electronic components included therein by air cooling and liquid cooling. There is also known a technique of cooling using a heat pipe that utilizes two-phase heat transport by evaporation and condensation of refrigerant.

Japanese Patent Laid-Open No. 08-056088 JP 09-293984 A JP 2010-205949 A

  When a cooling structure is provided in an electronic device or an electronic component included in the electronic device, the cooling structure may be complicated in order to efficiently perform cooling, and the installation of the cooling structure and subsequent maintenance may be complicated.

  According to an aspect of the present invention, an electronic component, a heat absorption part that is mounted on the electronic component, encloses a first refrigerant, and absorbs heat of the electronic component using the first refrigerant, and the heat absorption part A heat transfer unit that is connected and transfers heat from the heat absorption unit, and is detachably disposed on the heat transfer unit, the second refrigerant is circulated, and the heat of the heat transfer unit using the second refrigerant when mounted There is provided an electronic device including a heat dissipating part that absorbs heat and dissipates heat.

  According to the disclosed technique, it is possible to realize an electronic device that can suppress the complication of the cooling structure, can be easily attached and maintained, and can be efficiently cooled.

It is a figure which shows an example of the electronic device which provided the liquid cooling type cooling structure. It is a figure which shows an example of the electronic device which concerns on 1st Embodiment. It is a figure which shows an example of the electronic device which concerns on 2nd Embodiment. It is FIG. (1) which shows an example of the electronic device which concerns on 3rd Embodiment. It is FIG. (2) which shows an example of the electronic device which concerns on 3rd Embodiment. It is a figure which shows an example of the electronic device which concerns on 4th Embodiment. It is a figure which shows an example of the electronic device which concerns on 5th Embodiment. It is a figure which shows an example of the electronic device which concerns on 6th Embodiment.

First, cooling of the electronic device will be described.
One form of an electronic component included in an electronic device is a multi-chip module (MCM) in which a plurality of chip components are mounted on a wiring board and sealed. In MCM, one or a plurality of ICs (Integrated Circuits), semiconductor chips such as LSI (Large Scale Integration), memories, sensors, etc. can be housed in one package to realize a system having a desired function. . The MCM can be developed and manufactured at a low cost in a relatively short period of time as compared with a system on chip (System On Chip), and can be relatively easily reduced in size and multifunction.

  By the way, a semiconductor chip such as an LSI used for such an MCM can increase the amount of heat generated as the degree of integration increases. In order to suppress overheating of the semiconductor chip due to heat generation, the semiconductor chip is cooled. One cooling system is an air cooling system. In the air cooling method, for example, a heat conductive member such as a heat spreader or a heat sink is thermally connected to a semiconductor chip to be cooled, and the semiconductor chip is cooled using such a member. However, in the case of a semiconductor chip that generates a large amount of heat, air cooling may not be able to perform sufficient cooling.

  There is a liquid cooling method as another cooling method. In the liquid cooling method, for example, a flow path is provided in the vicinity of a semiconductor chip to be cooled, a coolant such as water is circulated there, and the semiconductor chip is cooled using the coolant. For example, water used as a refrigerant can hold heat more efficiently than air and has high heat conduction efficiency.

FIG. 1 is a view showing an example of an electronic apparatus provided with a liquid cooling type cooling structure.
An electronic device 100 illustrated in FIG. 1 includes an electronic component 110 and a cooling structure 120.
The electronic component 110 includes a wiring board and one or more semiconductor chips mounted on the wiring board. For the electronic component 110, for example, an MCM including a processor such as a CPU (Central Processing Unit) and an MPU (Micro Processing Unit) is used.

  The cooling structure 120 includes a liquid cooling part 121, a holder 122, a liquid cooling pipe (tube) 123, and a connector 124. The liquid cooling unit 121 is provided on the electronic component 110. The liquid cooling unit 121 includes one or a plurality of grooves (microchannels) 121a through which the refrigerant flows. As the liquid cooling unit 121, for example, a substrate in which a microchannel 121 a is formed on a substrate such as silicon (Si) using a MEMS (Micro Electro Mechanical Systems) technique or the like can be used. A holder 122 is attached to the liquid cooling unit 121, and a connector 124 provided at the tip of the tube 123 is attached to the holder 122 by a method such as screwing.

  The connector 124 is attached to the holder 122, and the tube 123 and the microchannel 121a of the liquid cooling unit 121 are connected to each other so that a coolant such as water is supplied from the tube 123 to the microchannel 121a. The refrigerant supplied to the microchannel 121a absorbs heat of the electronic component 110 when it flows through the microchannel 121a, thereby cooling the electronic component 110. The refrigerant that has absorbed heat flows through the microchannel 121 a and is discharged to the outside of the liquid cooling unit 121.

The electronic device 100 employs such a liquid cooling method, whereby the electronic component 110 is efficiently cooled.
However, in the electronic device 100 provided with such a liquid cooling type cooling structure 120, the diameter, width, or depth of the microchannel 121a of the liquid cooling unit 121 is, for example, in the order of μm. On the other hand, as the tube 123 for supplying the refrigerant to the microchannel 121a, for example, a tube having a diameter of the order of mm is used. It is not always easy to form a connector 124 for connecting such a tube 123 in the order of mm to a microchannel 121a in the order of μm.

  In addition, the connector 124 may be removed after the attachment, for example, when the electronic component 110 provided with the liquid cooling unit 121 is replaced. However, the attachment / detachment of the connector 124 is not always easy. For example, when attaching or detaching, liquid leakage may occur from the connection portion between the connector 124 and the holder 122, or the liquid cooling unit 121 or the electronic component 110 provided with the liquid cooling unit 121 may be mechanically damaged.

  Further, when the electronic device 100 provided with the cooling structure 120 as described above is employed in a device such as a server or a supercomputer, the electronic device 100 may be mounted on a scale of several thousand. In a device in which a large number of electronic devices 100 are mounted in this way, there is a risk that the liquid leakage or damage as described above accompanying the attachment / detachment of the connector 124 may occur in each electronic device 100, and the number of electronic devices 100 increases. Therefore, the attaching / detaching operation of the connector 124 may be complicated.

  As another example of an electronic device provided with a liquid cooling type cooling structure, cooling is performed by three-dimensionally laminating a plurality of semiconductor chips, providing a coolant passage between the semiconductor chips, and circulating a coolant such as water there. There are also things. The technology for three-dimensional stacking of multiple semiconductor chips (three-dimensional integration technology) can reduce the area occupied by the semiconductor chip on the wiring board (mounting area), as well as speeding up, increasing the bandwidth, and wiring distance. The bus power consumption can be reduced by shortening the time. However, if a plurality of semiconductor chips are simply three-dimensionally stacked, the heat generating elements are integrated, which may increase the amount of local heat generated in the electronic device, and may reduce the heat dissipation efficiency. Therefore, as described above, a technique for improving the cooling efficiency by providing a coolant passage between three-dimensionally stacked semiconductor chips and circulating the coolant therethrough has been proposed.

  As the coolant passage provided between the semiconductor chips, the microchannel as described above can be used. An electronic device having microchannels between semiconductor chips can be obtained, for example, by forming microchannels directly on each semiconductor chip, or by providing a microchannel formed on a silicon substrate or the like between semiconductor chips. it can. However, even in the case of an electronic device provided with such a liquid cooling type cooling structure, liquid leakage and breakage due to the attachment / detachment of the connector connecting the microchannel and the liquid cooling tube, and complicated attachment / detachment work can be problematic. .

In view of the above points, here, the electronic device is configured to employ a cooling structure as described below.
First, the first embodiment will be described.

FIG. 2 is a diagram illustrating an example of an electronic device according to the first embodiment.
An electronic device 1 shown in FIG. 2A includes an electronic component 10, a heat absorbing unit 20, a heat transfer unit 30, and a heat radiating unit 40.

  The electronic component 10 is a semiconductor chip such as an LSI, a semiconductor package in which the semiconductor chip is mounted on a wiring substrate (package substrate), an MCM, or the like. The electronic component 10 has a portion (hot spot) 10h that generates heat. When the electronic component 10 is a semiconductor chip, a part of the semiconductor chip or the entire semiconductor chip can become the hot spot 10h. When the electronic component 10 is a semiconductor package, the semiconductor chip included in the electronic component 10 or the semiconductor chip and its peripheral region can be a hot spot 10h. Similarly, when the electronic component 10 is an MCM, a semiconductor chip included in the electronic component 10 or a semiconductor chip and its peripheral region can be a hot spot 10h. For example, in an MCM including a processor such as a CPU, such a processor, or a processor and a peripheral area thereof become a hot spot 10h.

  The heat absorbing unit 20 is mounted on the electronic component 10 while being thermally connected to the electronic component 10. The heat absorption part 20 absorbs the heat of the electronic component 10 using a refrigerant. As the heat absorption unit 20, a device (two-phase heat transport device) using two-phase heat transport by evaporation and condensation of the refrigerant is used. Examples of the two-phase heat transport device include a heat pipe, a micro heat pipe, a vapor chamber, and a micro vapor chamber. The heat pipe and the micro heat pipe have a closed tubular sealed space (container) in which a refrigerant (working fluid) is enclosed. The vapor chamber and the micro vapor chamber have a sealed container or a closed tubular sealed space (container) in which a refrigerant (working fluid) is sealed. A capillary structure called a wick may be provided in the sealed container (inner wall) of these two-phase heat transport devices. For the heat absorbing part 20, a heat conductive material having a heat conductivity of a certain level or more is used. For the heat absorption part 20, a metal material, a semiconductor material, a carbon material, or the like can be used. Examples of the metal material include copper (Cu), silver (Ag), and aluminum (Al). An example of the semiconductor material is silicon. Examples of the carbon material include graphite, carbon fiber, carbon composite material using carbon fiber (Carbon Fiber Reinforced Plastic, CFRP), and the like.

  The heat transfer unit 30 is thermally connected to the heat absorption unit 20 and transfers heat from the heat absorption unit 20. The heat transfer unit 30 may be thermally connected to the electronic component 10 in addition to the heat absorption unit 20. For the heat transfer section 30, a heat conductive material having a heat conductivity of a certain level or higher is used. A metal material, a semiconductor material, a carbon material, or the like can be used for the heat transfer unit 30. Examples of the metal material include copper, silver, and aluminum. An example of the semiconductor material is silicon. Examples of the carbon material include graphite, carbon fiber, and carbon composite material.

  The heat radiating part 40 is detachable from the heat transfer part 30. The heat radiating part 40 is thermally connected to the heat transfer part 30 by being attached to the heat transfer part 30 as shown in FIG. The heat radiating unit 40 thermally connected to the heat transfer unit 30 absorbs the heat of the heat transfer unit 30 using a liquid refrigerant such as water and radiates the heat to the outside of the electronic device 1. For the heat radiating unit 40, for example, a structure in which a liquid cooling tube through which a refrigerant is circulated is built in or externally attached to a heat conducting member can be used. For the liquid cooling tube and the heat conducting member, a heat conducting material having a heat conductivity of a certain level or more, for example, a metal material, a semiconductor material, a carbon material, or the like is used. Examples of the metal material include copper, silver, aluminum, iron (Fe), and the like. An example of the semiconductor material is silicon. Examples of the carbon material include graphite, carbon fiber, and carbon composite material. A flexible thing can also be used for a liquid cooling tube and a heat conduction member. For example, a metal sheet, a polymer sheet such as polyimide, a sheet having a space between the pair of flexible sheets, such as a graphite sheet, or a flexible tube that serves as a refrigerant flow path. Can be used.

  In the electronic device 1, the heat of the hot spot 10 h of the electronic component 10 is transferred (absorbed) to the heat absorbing unit 20 (shown by a thick arrow in FIG. 2A), and the heat spot of the heat absorbing unit 20 is generated by the heat. The refrigerant that is the working fluid in the portion corresponding to 10 h evaporates. This evaporation (heat of vaporization) removes the heat of the hot spot 10h, and the hot spot 10h and the electronic component 10 where the hot spot 10h exists are cooled.

  The refrigerant evaporated in the heat absorbing unit 20 condenses at a part of the heat absorbing part 20 at a temperature lower than the hot spot 10 h, for example, a part away from the hot spot 10 h or a part connected to the heat transfer part 30. The condensed refrigerant moves to a portion of the heat absorbing unit 20 corresponding to the hot spot 10h, and again takes heat from the hot spot 10h and evaporates. Heat (condensation heat) generated by the condensation of the refrigerant in the heat absorbing unit 20 is transferred to the heat transfer unit 30 (illustrated by a thick arrow in FIG. 2A).

In FIG. 2 (A), the flow of the refrigerant accompanying evaporation and condensation in the heat absorbing section 20 is schematically shown by dotted arrows.
When the electronic component 10 (hot spot 10h) is cooled, the heat radiating unit 40 is thermally connected to the heat transfer unit 30. A liquid refrigerant is circulated through the heat radiating section 40 (illustrated by a dotted arrow in FIG. 2A). The heat transferred from the heat absorbing unit 20 to the heat transfer unit 30 is absorbed by the heat radiating unit 40 (shown by a thick arrow in FIG. 2A), and is transferred to the refrigerant flowing through the heat radiating unit 40, so that the electronic device 1 is transported (heat radiation) to the outside. The heat absorbed by the heat radiating unit 40 can be radiated from the heat radiating unit 40 to the outside of the electronic device 1 by air cooling.

In the electronic device 1, the electronic component 10 is cooled in such a cycle.
As described above, in the electronic device 1, the heat radiating unit 40 can be attached to and detached from the heat transfer unit 30. In the heat radiating unit 40 and the heat transfer unit 30, for example, a fitting part is provided in the heat radiating unit 40, and a fitted part to be fitted to the fitting unit is provided in the heat transfer unit 30. For example, a convex portion such as a pin shape or a line shape is provided as the fitting portion, and a concave portion such as a pin shape, a hole shape, or a line shape is provided as the fitted portion so that the convex portion is fitted. Mounting the heat radiating part 40 to the heat transfer part 30 as shown in FIG. 2A by providing a fitting part and a fitted part in the heat radiating part 40 and the heat transfer part 30, respectively, FIG. Removal from the heat transfer section 30 as shown in Fig. 5 can be easily and repeatedly performed.

  In the electronic device 1, the heat dissipating unit 40 can be attached to and detached from the heat transfer unit 30, and the heat dissipating unit 40 that circulates the liquid refrigerant is connected to the heat absorbing unit 20 disposed on the electronic component 10 and the heat transfer unit 30. Although they are connected thermally, they are separated without being connected directly. That is, the electronic component 10 (hot spot 10h) can be efficiently cooled using the refrigerants while separating the refrigerants of the heat absorbing unit 20 and the heat radiating unit 40.

  The heat absorbing unit 20 is a micro heat pipe, a micro vapor chamber, or the like, and is enclosed in a space in which the refrigerant is closed, and does not require a work for connecting a tube and a connector for supplying the refrigerant from the outside. Leakage of refrigerant is suppressed. The heat radiating part 40 is detachably attached to the heat transfer part 30 that is thermally connected to the heat absorbing part 20. By attaching the heat radiating part 40 to the heat transfer part 30 (FIG. 2A) and circulating the refrigerant through the heat radiating part 40, the heat of the heat absorbing part 20 can be radiated to the outside of the electronic device 1.

  The heat radiating section 40 can be removed from the heat transfer section 30 when necessary, for example, during maintenance such as replacing the electronic component 10 (FIG. 2B), and then can be attached to the heat transfer section 30 again. (FIG. 2 (A)). Such attachment and removal of the heat radiating part 40 can be easily performed by providing the fitting part and the fitted part respectively in the heat radiating part 40 and the heat transfer part 30 as described above, for example. When attaching and detaching the heat radiating portion 40, it is possible to suppress an excessive external force from being applied to the electronic component 10, and thereby it is possible to suppress the electronic component 10 from being damaged.

  According to the electronic device 1 as described above, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, and the assembly of the electronic device 1, the attachment of the cooling structure, and the maintenance after the attachment are facilitated. Can be achieved.

Next, a second embodiment will be described.
FIG. 3 is a diagram illustrating an example of an electronic apparatus according to the second embodiment.
The electronic device 1a shown in FIG. 3 includes an electronic component 10, a micro heat pipe unit 50, and a liquid cold tube unit 60.

The electronic component 10 is a semiconductor chip such as an LSI, a semiconductor package including the semiconductor chip, MCM, or the like, and has a hot spot.
The micro heat pipe unit 50 includes a main body 51 and a micro heat pipe 52 provided in the main body 51.

  For the main body 51 of the micro heat pipe unit 50, a heat conductive material having a heat conductivity of a certain level or more, for example, a metal material such as copper or silver, a semiconductor material such as silicon, or a carbon material such as graphite is used. The micro heat pipe 52 has one continuous or a plurality of micro channels 52 a formed in the main body 51. The micro heat pipe unit 50 is bonded onto the electronic component 10 with the arrangement surface side of the micro channel 52a of the micro heat pipe 52 facing the electronic component 10 side.

  The micro heat pipe unit 50 and the electronic component 10 can be directly joined. In addition, the micro heat pipe unit 50 and the electronic component 10 are a thermal interface member (Thermal Interface Material, TIM) having a thermal conductivity equal to or higher than a certain level, similar to that of the main body 51, and a thermal conductive polymer. It is also possible to join via the like.

  The inner wall of the micro channel 52a of the micro heat pipe unit 50 may be subjected to a surface treatment for forming a layer containing a silanol group (Si—OH). FIG. 3 illustrates a case where the silanol group-containing layer 52b is formed on the inner wall of the microchannel 52a by such surface treatment.

  In the micro heat pipe 52, whether the inner wall of the micro channel 52a is hydrophilic or hydrophobic with respect to the refrigerant to be sealed affects the resistance when the refrigerant moves in the micro channel 52a.

  For example, when the micro heat pipe unit 50 in which the silanol group-containing layer 52b as described above is not provided in the micro channel 52a is made of carbon, that is, when the inner wall of the micro channel 52a is carbon, if water is used as the refrigerant, And the contact angle of water is about 60 °. When the micro heat pipe unit 50 not provided with the silanol group-containing layer 52b is made of silicon and the inner wall of the micro channel 52a is silicon, the contact angle between silicon and water (refrigerant) is about 90 °.

On the other hand, when a surface treatment for forming silicon oxide (SiO ₂ ) is performed on the inner wall of the microchannel 52a, a silicon oxide layer having a surface silanol group is formed. Since this silicon oxide layer has a surface silanol group, it easily adsorbs water molecules and becomes hydrophilic. The contact angle between the silicon oxide layer having a surface silanol group and water (refrigerant) is less than 5 °. Similarly, when a surface treatment for forming, for example, silicon carbide (SiC) is performed on the inner wall of the microchannel 52a, a hydrophilic silicon carbide layer having a surface silanol group is formed, and the silicon carbide layer and water (refrigerant) are formed. The contact angle is less than 4 °.

  By forming such a silicon oxide layer or silicon carbide layer having a surface silanol group on the inner wall of the microchannel 52a as the silanol group-containing layer 52b, the contact angle of the refrigerant moving in the microchannel 52a is reduced. . Thereby, the resistance of the refrigerant moving in the microchannel 52a can be reduced. Furthermore, it is possible to suppress the generation of bubbles when the heat is absorbed from the electronic component 10 and the refrigerant evaporates, and the clogging (blocking) of the microchannel 52a due to the generated bubbles.

Note that, depending on the type of refrigerant sealed in the microchannel 52a, the above-described silanol group-containing layer 52b can be omitted.
An uneven portion 53 is provided on the surface of the micro heat pipe unit 50 provided with the micro heat pipe 52 as described above on the side opposite to the joint surface with the electronic component 10 (the surface on which the micro heat pipe 52 is disposed). The concavo-convex portion 53 can be provided by, for example, forming island-shaped and line-shaped concave portions in the main body portion 51. The uneven portion 53 is used for joining the micro heat pipe unit 50 and the liquid cooling tube unit 60.

  The liquid cooling tube unit 60 includes a main body portion 61 and a liquid cooling tube 62 built in the main body portion 61. The main body 61 and the liquid cooling tube 62 of the liquid cooling pipe unit 60 are made of a heat conductive material having a thermal conductivity of a certain level or more, for example, a metal material such as copper, silver or iron, a semiconductor material such as silicon, graphite or the like. A carbon material is used. In the liquid cooling tube unit 60, a coolant such as water is circulated in a liquid cooling tube 62 built in the main body 61.

  The liquid cooling tube unit 60 has a concavo-convex portion 63 on the joint surface with the micro heat pipe unit 50. The concavo-convex portion 63 can be provided by, for example, forming an island-shaped or line-shaped concave portion in the main body portion 61 corresponding to the convex portion of the concavo-convex portion 53 of the micro heat pipe unit 50. The uneven portion 63 of the liquid cooling tube unit 60 becomes a fitting portion, the uneven portion 53 of the micro heat pipe unit 50 becomes a fitted portion, and the uneven portion 63 is fitted to the uneven portion 53. The fitting and removal of the concave and convex portions 63 and the concave and convex portions 53 enables the liquid cooling tube unit 60 to be attached to and detached from the micro heat pipe unit 50.

  By providing the liquid cooling tube unit 60 and the micro heat pipe unit 50 with the concave and convex portion 63 and the concave and convex portion 53, respectively, and fitting them together, the bonding area of the liquid cooling tube unit 60 and the micro heat pipe unit 50 is increased. And heat transfer efficiency can be improved.

  In addition, if the uneven | corrugated | grooved part 63 and the uneven | corrugated | grooved part 53 are island-shaped, the liquid cooling pipe unit 60 can be attached to the micro heat pipe unit 50 by pushing the liquid cooling pipe unit 60 from the upper direction of the micro heat pipe unit 50. . The attached liquid cooling tube unit 60 can be removed from the micro heat pipe unit 50 by pulling it out above the micro heat pipe unit 50. Moreover, if the uneven | corrugated | grooved part 63 and the uneven | corrugated | grooved part 53 are a line shape, the liquid cooling tube unit 60 is microheated by sliding the liquid cooling tube unit 60 from the side of the micro heat pipe unit 50 in the uneven | corrugated line direction. It can be attached to the pipe unit 50. The attached liquid-cooled tube unit 60 can be detached from the micro heat pipe unit 50 by sliding it in the uneven line direction and pulling it out.

  The ease of attachment and detachment of the liquid cooling tube unit 60 to and from the micro heat pipe unit 50 can vary depending on the materials used for them. For example, when copper is used for both the liquid cooling tube unit 60 and the micro heat pipe unit 50, the friction coefficient (μ) between copper and copper is 1.4. When silicon is used for both the liquid cooling tube unit 60 and the micro heat pipe unit 50, the friction coefficient between silicon and silicon is 0.9. When iron is used for the liquid cooling tube unit 60 and copper is used for the micro heat pipe unit 50, the friction coefficient between iron and copper is 0.54. When iron is used for the liquid-cooled tube unit 60 and carbon is used for the micro heat pipe unit 50, the coefficient of friction between iron and carbon is 0.15. When carbon is used for the micro heat pipe unit 50, even if a relatively inexpensive metal material such as iron or copper is used for the liquid cooling pipe unit 60, the attachment and detachment can be performed with a relatively small force. Therefore, attachment and removal of the liquid cooling pipe unit 60 can be facilitated, and damage to the electronic component 10 and the micro heat pipe unit 50 during attachment and removal can be suppressed.

  In the electronic device 1a having the above-described configuration, the heat of the electronic component 10 (hot spot) is absorbed by the micro heat pipe unit 50, and the micro heat pipe 52 corresponding to the hot spot is heated by the heat. The refrigerant in the channel 52a evaporates. The electronic component 10 is cooled by this evaporation (heat of vaporization). The evaporated refrigerant condenses at a lower temperature part such as in the microchannel 52a at a part away from the hot spot. The condensed refrigerant moves in the microchannel 52a to a site corresponding to the hot spot, and again takes away the heat of the hot spot and evaporates. Heat (condensation heat) generated by the condensation of the refrigerant in the microchannel 52 a is transferred through the main body 51. The heat of the main body 51 is absorbed by the liquid-cooled tube unit 60 attached to the micro heat pipe unit 50, transferred to the refrigerant circulated through the heat radiating unit 40, and transported (heat radiated) to the outside of the electronic device 1a. . In the electronic device 1a, the electronic component 10 is cooled in such a cycle.

  In the electronic device 1a, the micro heat pipe unit 50 functions as a heat absorption part and a heat transfer part, and the liquid cooling tube unit 60 functions as a heat dissipation part. In the electronic device 1a, the liquid cooling tube unit 60 and the micro heat pipe unit 50 are separated from each other, and the electronic components 10 can be efficiently cooled using the respective refrigerants. In the micro heat pipe unit 50, leakage of the refrigerant is suppressed. The liquid-cooled tube unit 60 can be easily detached from the micro heat pipe unit 50 during maintenance such as replacement of the electronic component 10, and then can be easily attached to the micro heat pipe unit 50 again. When attaching and detaching, it is possible to suppress an excessive external force from being applied to the electronic component 10 and the like, and to prevent the electronic component 10 and the like from being damaged.

  According to the electronic device 1a as described above, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, and the assembly of the electronic device 1a, the attachment of the cooling structure, and the maintenance after the attachment are facilitated. Can be achieved.

  As an example, a semiconductor package in which a CMOS logic device with power consumption of 80 W is mounted on a package substrate is used as the electronic component 10 of the electronic apparatus 1a, and a carbon micro heat pipe unit 50 is provided thereon. The micro heat pipe unit 50 is provided with a micro channel 52a having a cross-sectional size of 500 μm in length and 500 μm in width so as to be drawn around the electronic component 10 as a whole. Enclose water as. An uneven portion 53 having a height (depth) of 1.5 mm × width of 1.5 mm is provided on the upper portion of the micro heat pipe unit 50, and a height at which the uneven portion 53 is fitted on the lower portion of the liquid cooling tube unit 60. An uneven portion 63 having a depth (depth) of 1.5 mm and a width of 1.5 mm is provided. The liquid cooling tube unit 60 is fitted to the micro heat pipe unit 50 using the uneven portion 63 and the uneven portion 53. When the electronic device 1a configured as described above is operated and cooled, the operating temperature of the CMOS logic device becomes 35 ° C. For comparison, when an electronic device in which an air-cooling unit is joined to the electronic component 10 via a TIM is prepared and the electronic component 10 is operated and cooled, the operating temperature of the CMOS logic device becomes 60 ° C. According to the electronic device 1a, the electronic component 10 can be efficiently cooled.

Next, a third embodiment will be described.
4 and 5 are diagrams illustrating an example of an electronic apparatus according to the third embodiment. FIG. 4 is a schematic perspective view of an example of an electronic apparatus according to the third embodiment, and FIG. 5 is a schematic cross-sectional view of an example of the electronic apparatus according to the third embodiment.

The electronic device 1b shown in FIGS. 4 and 5 includes an electronic component 10, a micro vapor chamber 70, a heat transfer unit 80, and a liquid cold tube unit 90.
Here, as an example of the electronic component 10, a semiconductor package in which a semiconductor chip 13 such as an LSI is mounted on a package substrate 11 using bumps 12 such as solder balls is illustrated. Although not shown here, the package substrate 11 may be provided with bumps such as solder balls, metal pins, and the like as external connection terminals on the surface opposite to the mounting surface of the semiconductor chip 13. In such an electronic component 10 (semiconductor package), for example, a hot spot exists in a semiconductor chip. The electronic component 10 may be a semiconductor chip, MCM, or the like.

  The micro vapor chamber 70 is provided with a micro channel inside the container, and a coolant such as water is sealed therein. Such a micro vapor chamber 70 is joined to the electronic component 10 directly or via a heat conduction member having a thermal conductivity of a certain level or more, TIM, or the like. For the micro vapor chamber 70, for example, one having a plane size larger than the plane size of the electronic component 10 is used.

  The heat transfer unit 80 is provided so as to be thermally connected to the microvapor chamber 70. In this example, the heat transfer unit 80 is provided around the electronic component 10 and joined to the lower surface of the portion of the microvapor chamber 70 that protrudes outside the electronic component 10. The heat transfer unit 80 is joined to the micro vapor chamber 70 directly or via a heat conductive member, TIM, or the like having a certain thermal conductivity. The heat transfer unit 80 is made of a heat conductive material having a heat conductivity of a certain level, for example, a metal material such as copper or silver, a semiconductor material such as silicon, or a carbon material such as graphite.

  The heat transfer unit 80 is provided with a plurality of pin-shaped protrusions 83 in a lattice shape. The convex portion 83 has, for example, a cylindrical shape. The convex portion 83 is used for joining the heat transfer unit 80 and the liquid cooling tube unit 90.

  The liquid cooling tube unit 90 includes a heat conducting member 91 and a liquid cooling tube 92 provided on the heat conducting member 91. For the heat conducting member 91 and the liquid cooling tube 92, a heat conducting material having a heat conductivity of a certain level or more, for example, a metal material such as copper, silver, or iron is used. The liquid cooling tube 92 is joined to the heat conducting member 91 by a method such as welding. The liquid cooling tube unit 90 is thermally connected to the heat transfer unit 80, and a coolant such as water is circulated through the liquid cooling tube 62. When a metal material is used for the liquid cooling tube 92, it can be fixed to the heat conducting member 91 with an appropriate fixing jig in addition to welding. The liquid cooling tube 92 may be a flexible tube having a thermal conductivity of a certain level or more. Such a flexible tube can be bonded to the heat conducting member 91 or can be fixed with an appropriate fixing jig, for example.

  The heat conduction member 91 of the liquid-cooled tube unit 90 has a plurality of pin-like protrusions on the connection surface with the heat transfer unit 80, shifted from the plurality of protrusions 83 provided on the heat transfer unit 80. 93 are provided in a grid pattern. The convex portion 93 is, for example, a columnar shape. The interval between the adjacent convex portions 93 of the liquid cooling tube unit 90 is approximately the same as the interval between the adjacent convex portions 83 of the heat transfer unit 80. When the liquid cooling tube unit 90 is attached to the heat transfer unit 80, each convex portion 93 of the liquid cooling tube unit 90 is fitted to the central portion of the convex portion 83 group of the heat transfer unit 80 surrounding the corresponding position. The As described above, the convex portion 93 of the liquid-cooled tube unit 90 becomes a fitting portion, and the convex portion 83 of the heat transfer unit 80 at a position surrounding the convex portion 93 becomes a fitted portion. Attachment to the heat unit 80 is possible, and removal is also possible. By using the convex portion 93 and the convex portion 83, the liquid cooling tube unit 90 can be easily attached and detached.

  If a metal material such as copper or iron is used for the heat conduction member 91 of the liquid-cooled tube unit 90 and a carbon material is used for the heat transfer unit 80, the friction coefficient of both becomes small. Can be easy to remove. Further, it is possible to suppress damage to the electronic component 10, the microvapor chamber 70, and the heat transfer unit 80 when the liquid cooling tube unit 90 is attached or detached.

  In addition, here, the liquid cooling tube unit 90 in which the liquid cooling tube 92 is mounted on the heat conducting member 91 is illustrated, but the liquid cooling tube unit 90 has the liquid cooling tube 92 passed through the inside of the heat conducting member 91. A built-in structure can also be used.

  In the electronic device 1b having the above-described configuration, the heat of the electronic component 10 (hot spot) is absorbed by the micro vapor chamber 70, and the heat causes the refrigerant in the micro vapor chamber 70 corresponding to the hot spot to be absorbed. Evaporate. The electronic component 10 is cooled by this evaporation (heat of vaporization). The evaporated refrigerant is condensed at a lower temperature part such as a connection part of the micro vapor chamber 70 with the heat transfer unit 80 away from the hot spot. The condensed refrigerant moves in the micro vapor chamber 70 to a portion corresponding to the hot spot, and again takes the heat of the hot spot and evaporates. Heat (condensation heat) generated by the condensation of the refrigerant in the micro vapor chamber 70 is transferred to the heat transfer unit 80. The heat of the heat transfer unit 80 is absorbed by the heat conducting member 91 of the liquid cooling tube unit 90, transferred to the refrigerant flowing through the liquid cooling tube 92 attached thereto, and transported to the outside of the electronic device 1b (heat dissipation). ) In the electronic device 1b, the electronic component 10 is cooled in such a cycle.

  In the electronic device 1b, the micro vapor chamber 70 functions as a heat absorption unit, the heat transfer unit 80 functions as a heat transfer unit, and the liquid cooling tube unit 90 functions as a heat dissipation unit. In the electronic device 1b, the refrigerant of the liquid cooling tube unit 90 and the micro vapor chamber 70 are separated from each other, and the electronic component 10 can be efficiently cooled using the respective refrigerants. In the micro vapor chamber 70, leakage of the refrigerant is suppressed. The liquid-cooled tube unit 90 can be easily removed from the heat transfer unit 80 during maintenance such as replacement of the electronic component 10, and then can be easily attached to the heat transfer unit 80 again. When attaching and detaching, it is possible to suppress an excessive external force from being applied to the electronic component 10 and the like, and to prevent the electronic component 10 and the like from being damaged.

  According to the electronic device 1b as described above, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, and the assembly of the electronic device 1b, the attachment of the cooling structure, and the maintenance after the attachment are facilitated. Can be achieved.

Next, a fourth embodiment will be described.
FIG. 6 is a diagram illustrating an example of an electronic apparatus according to the fourth embodiment. FIG. 6 is a schematic perspective view of an example of an electronic device according to the fourth embodiment.

  The electronic device 1c shown in FIG. 6 is provided with a plurality of line-shaped convex portions 93c serving as fitting portions in the liquid cooling tube unit 90, and a plurality of line-shaped convex portions 83c serving as fitted portions in the heat transfer unit 80. It differs from the electronic device 1b according to the third embodiment in that it has a structure provided with the above.

  In the electronic device 1 c, the liquid cooling tube unit 90 is attached to the heat transfer unit 80 by sliding the liquid cooling tube unit 90 from the side of the heat transfer unit 80 in the uneven line direction and pushing it in. The attached liquid-cooled tube unit 60 is detached from the heat transfer unit 80 by sliding it in the uneven line direction and pulling it out.

  Even in such an electronic device 1c, as in the case of the electronic device 1b, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, the electronic device 1c is assembled, the cooling structure is attached, and thereafter This makes it possible to facilitate the maintenance.

Next, a fifth embodiment will be described.
FIG. 7 is a diagram illustrating an example of an electronic apparatus according to the fifth embodiment. FIG. 7 is a schematic perspective view of an example of an electronic device according to the fifth embodiment.

  The electronic device 1d shown in FIG. 7 is an electronic device according to the third embodiment in that a flexible sheet member 92a containing a liquid cooling tube 92aa is attached to the heat conducting member 91 of the liquid cooling tube unit 90. It differs from the device 1b.

  The flexible sheet member 92a is, for example, a liquid cooling tube 92aa provided with a space serving as a refrigerant flow path in a pair of flexible sheets 92ab having a predetermined or higher thermal conductivity, or a flexible sheet serving as a refrigerant flow path. A sandwiched tube can be used. For the flexible sheet 92ab and the liquid cooling tube 92aa, a metal such as copper, a polymer such as silicone, or a heat conductive material such as graphite can be used.

  Even in such an electronic device 1d, as in the case of the electronic device 1b, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, and the assembly of the electronic device 1d, the attachment of the cooling structure, and the attachment are performed. It becomes possible to facilitate later maintenance.

  In the electronic device 1d, the liquid cooling tube unit 90 (heat conducting member 91) and the heat transfer unit 80 are attached and detached by sliding, similarly to the electronic device 1c according to the fourth embodiment. Possible line-shaped protrusions 93c and protrusions 83c can also be provided.

Next, a sixth embodiment will be described.
FIG. 8 is a diagram illustrating an example of an electronic device according to the sixth embodiment. FIG. 8 is a schematic cross-sectional view of an example of an electronic device according to the sixth embodiment.

The electronic device 1e shown in FIG. 8 includes an electronic component 10, a micro vapor chamber 70, a heat transfer unit 80, and a liquid cold tube unit 90.
The electronic component 10 includes a semiconductor device 10e mounted on a package substrate 10a including a bump 10aa via an interposer 10c formed with a via 10b as a heat conducting member and the bump 10d. The semiconductor device 10e includes a semiconductor chip 10ea such as a microprocessor, and a group of semiconductor chips 10ec such as memory stacked on the semiconductor chip 10ea via bumps 10eb.

  The micro vapor chamber 70 has, for example, a micro channel inside, and is provided between the package substrate 10a and the interposer 10c. The via 10b is provided so as to penetrate the micro vapor chamber 70 so as to avoid the formation region of the micro channel, and the package substrate 10a and the electronic component 10 are electrically and thermally connected via the via 10b. .

  The heat transfer unit 80 includes a graphite sheet 80a and a heat conduction member 80b. The micro vapor chamber 70 is thermally connected to the heat conducting member 80b through a graphite sheet 80a bonded to a part of the upper surface thereof. The micro vapor chamber 70 may be joined to the heat conducting member 80b together with the graphite sheet 80a.

  The liquid cooling tube unit 90 includes a heat conducting member 91 and a liquid cooling tube 92 provided on the heat conducting member 91. Here, as the heat conductive member 91, for example, a low-tack adhesive is used. By using such a low-tack adhesive for the heat conduction member 91, the liquid cooling tube unit 90 can be attached to and detached from the heat transfer unit 80.

Such an electronic device 1e can be mounted on another wiring substrate such as a mother board using the bumps 10aa of the package substrate 10a.
In the electronic device 1e, the heat of the electronic component 10 is transferred to the via 10b, and the heat transferred to the via 10b is absorbed into the micro vapor chamber 70, and a part of the refrigerant in the micro vapor chamber 70 is absorbed by the heat. Evaporate. The electronic component 10 is cooled by this evaporation (heat of vaporization). The evaporated refrigerant condenses at a lower temperature part such as a part away from the via 10b of the micro vapor chamber 70. The condensed refrigerant moves in the micro vapor chamber 70 to a portion around the via 10b, and evaporates by taking heat transferred from the electronic component 10 to the via 10b. Heat (condensation heat) generated by the condensation of the refrigerant in the micro vapor chamber 70 is transferred to the graphite sheet 80a and the heat conduction member 80b of the heat transfer unit 80. The heat of the heat transfer unit 80 is transferred to the refrigerant flowing through the liquid cooling tube 92 of the liquid cooling tube unit 90 via the heat conducting member 91 of the liquid cooling tube unit 90, and is transported outside the electronic device 1e ( Heat dissipation). In the electronic apparatus 1e, the electronic component 10 is cooled in such a cycle.

  In the electronic device 1e including the electronic component 10 including the semiconductor chip group stacked in this way, the micro vapor chamber 70 functions as a heat absorption unit, the heat transfer unit 80 functions as a heat transfer unit, The tube unit 90 functions as a heat radiating unit. In the electronic device 1e, the cooling of the electronic component 10 is enabled using the refrigerants of the liquid cooling tube unit 90 and the micro vapor chamber 70 while separating the refrigerants. In the micro vapor chamber 70, leakage of the refrigerant is suppressed, and the liquid-cooled tube unit 90 can be easily removed from the heat transfer unit 80 during maintenance such as replacement of the electronic component 10, and then again to the heat transfer unit 80. Easy to install. When attaching and detaching, it is possible to suppress an excessive external force from being applied to the electronic component 10 and the like, and to prevent the electronic component 10 and the like from being damaged.

  According to the electronic device 1e as described above, the complexity of the cooling structure for efficiently cooling the electronic component 10 is suppressed, and the assembly of the electronic device 1e, the attachment of the cooling structure, and the maintenance after the attachment are facilitated. Can be achieved.

Regarding the embodiment described above, the following additional notes are further disclosed.
(Appendix 1) Electronic components,
Mounted on the electronic component, in which a first refrigerant is sealed, and a heat absorbing portion that absorbs heat of the electronic component using the first refrigerant;
A heat transfer section connected to the heat absorption section and transferring heat of the heat absorption section;
An electronic device comprising: a heat dissipating part that is detachably disposed in the heat transfer part, and in which a second refrigerant is circulated, and that absorbs heat from the heat transfer part and dissipates heat using the second refrigerant when attached. .

(Additional remark 2) The said thermal radiation part is equipped with a fitting part,
The electronic device according to appendix 1, wherein the heat transfer unit includes a fitted portion into which the fitting portion is fitted.

(Additional remark 3) The said fitting part has a some 1st pin,
The electronic device according to appendix 2, wherein the fitted portion has a plurality of second pins provided so that the plurality of first pins are fitted.

(Additional remark 4) The said fitting part has a convex part extended in a 1st direction,
The electronic device according to appendix 2, wherein the fitted portion has a concave portion that extends in the first direction and into which the convex portion is fitted.

(Supplementary note 5) The electronic device according to any one of supplementary notes 1 to 4, wherein a carbon material is used for at least one of the heat transfer part and the heat dissipation part.
(Supplementary Note 6) The endothermic part is
A substrate,
The electronic device according to any one of appendices 1 to 5, further comprising: a groove formed in the substrate and enclosing the first refrigerant.

(Appendix 7) The endothermic part is
A substrate,
A groove formed in the substrate and enclosing the first refrigerant,
6. The electronic device according to any one of appendices 1 to 5, wherein a layer containing a silanol group is provided on an inner surface of the groove.

(Supplementary note 8) The electronic device according to any one of supplementary notes 1 to 7, wherein the heat dissipation portion is flexible.
(Additional remark 9) The said heat-transfer part is provided in the side surface of the said electronic component,
The heat absorption part is provided in the first part of the upper surface of the heat transfer part from the upper surface of the electronic component,
The electronic device according to any one of appendices 1 to 8, wherein the heat dissipating part is provided on a second part different from the first part on an upper surface of the heat transfer part.

  (Supplementary Note 10) The electronic device according to any one of Supplementary Notes 1 to 8, wherein the electronic component includes a heat conductive member that penetrates the heat absorbing portion.

1, 1a, 1b, 1c, 1d, 1e, 100 Electronic device 10, 110 Electronic component 10a, 11 Package substrate 10aa, 10d, 10eb, 12 Bump 10b Via 10c Interposer 10e Semiconductor device 10ea, 10ec, 13 Semiconductor chip 10h Hot spot 20 heat-absorbing part 30 heat-transfer part 40 heat-radiating part 50 micro heat pipe unit 51, 61 main body part 52 micro heat pipe 52a, 121a micro channel 52b silanol group-containing layer 53, 63 uneven part 60, 90 liquid cold pipe unit 62, 92, 92aa Liquid cooling tube 70 Micro vapor chamber 80 Heat transfer unit 80a Graphite sheet 80b, 91 Heat conduction member 83, 83c, 93, 93c Projection 92a Flexible sheet member 92ab Flexible system DOO 120 cooling structure 121 liquid cooling unit 122 holder 123 a tube 124 connector

Claims (5)

Electronic components,
Mounted on the electronic component, in which a first refrigerant is sealed, and a heat absorbing portion that absorbs heat of the electronic component using the first refrigerant;
A heat transfer section connected to the heat absorption section and transferring heat of the heat absorption section;
An electronic device comprising: a heat dissipating part that is detachably disposed in the heat transfer part, and in which a second refrigerant is circulated, and that absorbs heat from the heat transfer part and dissipates heat using the second refrigerant when attached. . The heat dissipation portion includes a fitting portion,
The electronic device according to claim 1, wherein the heat transfer portion includes a fitted portion into which the fitting portion is fitted.   The electronic device according to claim 1, wherein a carbon material is used for at least one of the heat transfer unit and the heat dissipation unit. The endothermic part is
A substrate,
A groove formed in the substrate and enclosing the first refrigerant,
The electronic device according to claim 1, wherein a layer containing a silanol group is provided on an inner surface of the groove.   The electronic device according to claim 1, wherein the heat dissipation portion is flexible.

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