JP2020061165A - Mobile terminal, and heat release and shield structure - Google Patents

Abstract

To make a mobile terminal and a heat release and shield structure lighter and thinner.SOLUTION: This mobile terminal includes a circuit board, a heat generation element arranged on the circuit board, a shield can, and an intermediate frame. The shield can connects to the circuit board and forms a shield space together with the circuit board. The heat generation element is housed in the shield space. The circuit board is arranged on one side of the intermediate frame. The intermediate frame has a housing space. The shield can includes an upper portion and a bottom portion which are arranged to face each other. The bottom portion is configured to connect to the circuit board, and the upper portion is arranged to be above the heat generation element and extends to the housing space. Further, a heat release and shield structure is provided.SELECTED DRAWING: Figure 1

Description

  FIELD OF THE INVENTION The present invention relates to mobile terminals and, in particular, to heat dissipation and shielding structures for mobile terminals.

  As the performance of mobile terminals is constantly improving, the power consumption of mobile terminals is constantly increasing. Then, as the integration degree of the main chip is improved, the power consumption of the chip is increased and concentrated. As a result, increasing chip height has become a bottleneck that limits the overall thickness design of mobile terminals. Therefore, a shield structure is required in a mobile terminal to perform an electromagnetic shield on a main chip.

  In the conventional shield structure, the shield can cover the main chip of the circuit board, and the circuit board and the shield can then be mounted on the intermediate frame of the mobile terminal. The top of the shielding can and the middle frame are arranged in a stacked manner, and a heat conducting material is interposed between the shielding can and the middle can so that the heat released from the main chip is transferred. It is placed between the frame. Such a laminated structure is inconvenient for reducing the thickness of the mobile terminal, and is contrary to the trend toward weight reduction and thickness reduction of the mobile terminal.

  Embodiments of the present invention provide a mobile terminal and a heat dissipation and shield structure to help reduce the thickness and heat dissipation and shield structure of the mobile terminal, and to achieve a design that makes the mobile terminal lighter and thinner. To do.

  According to a first aspect, the present invention provides a mobile terminal including a circuit board, a heating element disposed on the circuit board, a shield can, and an intermediate frame. Here, the shield can is connected to the circuit board and forms a shield space together with the circuit board. The heating element is housed in the shielded space, the circuit board is arranged on one side surface of the intermediate frame, and the intermediate frame is provided with the accommodation space. The shield can includes a top portion and a bottom portion that are arranged to face each other, the bottom portion is configured to be connected to the circuit board, and the top portion is disposed above the heating element. , And extends to the accommodation space.

  Regarding the first aspect, in a first possible implementation manner, the material of the intermediate frame is a heat-conducting material, and the intermediate frame allows the heat released by the heating element to pass through the shield can and the intermediate frame. It is in direct or indirect contact with the top of the shield can so that it can be conducted.

  With respect to the first possible implementation manner according to the first aspect, in the second possible implementation manner, the intermediate frame comprises a first surface and a second surface. Here, the first surface faces the shield can, the second surface and the first surface are arranged back to back, and the second surface is provided with a groove. And the mobile terminal further includes a high thermal conductor. Here, the high thermal conductor is arranged in the groove, and the high thermal conductor is laminated on the intermediate frame.

  With respect to the second possible implementation manner according to the first aspect, in the third possible implementation manner, the accommodation space is a through hole structure, the upper portion includes an upper surface, and the intermediate frame includes a laminated surface. I'm out. The laminated surface is arranged on the bottom wall of the groove and is adjacent to the accommodation space. The high thermal conductor includes a first region and a second region, where the first region is laminated on the top surface and the second region is laminated on the lamination surface.

  With regard to the third possible implementation manner according to the first aspect, in the fourth possible implementation manner, the lamination surface is flush with the upper surface of the shield can.

  With respect to the third possible implementation manner according to the first aspect, in the fifth possible implementation manner, the high thermal conductor is a graphite sheet or a copper foil.

  With regard to the third possible implementation manner according to the first aspect, in the sixth possible implementation manner, the mobile terminal further includes a heat conductive adhesive, and the heat conductive adhesive generates heat. It is located between the element and the top of the shield can.

  With respect to a third possible implementation manner according to the first aspect, in a seventh possible implementation manner, the shield can further comprises a first sidewall, a second sidewall, and a first sidewall and a second sidewall. Includes a shoulder connected between. Here, the first side wall is connected between the bottom portion and the shoulder portion, and the second side wall is connected between the shoulder portion and the upper portion, and the upper portion forms a convex structure with respect to the shoulder portion. There is.

  According to another aspect, the present invention provides a heat dissipation and shield structure. Here, the heat dissipation and shield structure includes a shield can and a heat dissipation plate. The shield can is connected to the circuit board and is configured to form a shield space together with the circuit board. The heating element is housed in the shield space, and the shield can includes a top portion and a bottom portion which are arranged to face each other. Here, the bottom part is configured to be connected to the circuit board, and the top part is arranged above the heating element. The heat sink has an accommodation space, and the upper part of the shield can can extend into the accommodation space.

  Regarding the second aspect, in a first possible implementation, the heat sink includes a first surface and a second surface. Here, the first surface faces the shield can, the second surface and the first surface are arranged back to back, and the second surface is provided with a groove. The heat dissipation and shield structure further includes a high thermal conductor. Here, the high thermal conductor is arranged in the groove, and the high thermal conductor is laminated on the heat sink.

  With respect to the first possible implementation manner according to the second aspect, in the second possible implementation manner, the accommodation space is a through hole structure, the upper portion includes an upper surface, and the intermediate frame has a laminated surface. Contains. The laminated surface is arranged on the bottom wall of the groove and is adjacent to the accommodation space. The high thermal conductor includes a first region and a second region, where the first region is laminated to the top surface and the second region is laminated to the lamination surface.

  With respect to the second possible implementation manner according to the second aspect, in the third possible implementation manner, the lamination surface is flush with the upper surface of the shield can.

  With regard to the third possible implementation manner according to the second aspect, in the fourth possible implementation manner, the high thermal conductor is a graphite sheet or a copper foil.

  With respect to the fourth possible implementation manner according to the second aspect, in the fifth possible implementation manner, the material of the heat sink is a metallic material having high thermal conductivity.

  With regard to a fourth possible implementation manner according to the second aspect, in a sixth possible implementation manner, the heat dissipation and shield structure further comprises a heat conductive adhesive, and the heat conductive adhesive is It is arranged between the heating element and the upper part of the shield can.

  With respect to a fourth possible implementation manner according to the second aspect, in a seventh possible implementation manner, the shield can further comprises a first sidewall, a second sidewall, and a first sidewall and a second sidewall. Includes a shoulder connected between. Here, the first side wall is connected between the bottom portion and the shoulder portion, the second side wall is connected between the shoulder portion and the upper portion, and the upper portion forms a convex structure with respect to the shoulder portion. There is.

  Compared with the prior art, in the mobile terminal and the heat dissipation and shielding structure provided by the present invention, the intermediate frame and the heat dissipation plate are each provided with an accommodating space, and the upper part of the shield can is accommodated. Can extend into space. This helps reduce the thickness of the mobile terminal and the heat dissipation and shield structure, and also contributes to the progress of weight reduction and thickness reduction.

To describe the technical solutions in the embodiments of the present invention more clearly, the following briefly describes the accompanying drawings required for describing the embodiments. Apparently, in the following description, the accompanying drawings illustrate some embodiments of the present invention, and a person of ordinary skill in the art will appreciate that other drawings can be extracted from these accompanying drawings without creative efforts. I could get more out.
FIG. 1 is a schematic exploded view of a mobile terminal according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a partial cross-section of a mobile terminal according to the present invention. FIG. 3 is an enlarged schematic view of a portion III in FIG. FIG. 4 is an enlarged schematic view of the IV portion of FIG. FIG. 5 is a schematic plan view of a mobile according to one embodiment of the present invention.

  The following clearly and completely describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some of the embodiments of the present invention rather than all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

  The present invention provides a mobile terminal and a heat dissipation and shielding structure. 1 to 5 may all be used to help explain the structure of the mobile terminal and the heat dissipation and shield structure. The heat dissipation plate in the heat dissipation and shield structure may be an intermediate frame in the mobile terminal or a part of the intermediate frame. In the description of the first embodiment (ie the mobile terminal), referring to FIGS. 1 to 5, the intermediate frame is denoted by reference numeral 102. In the description of the second embodiment (ie, heat dissipation and shield structure), referring to FIGS. 1 to 5, the heat sink is also designated by reference numeral 102. Thus, both the heat sink reference number and the intermediate frame reference number are 102. However, in the following description of the embodiments, "middle frame" and "heat dissipation board" are used respectively to distinguish the two embodiments. . The detailed description is as follows.

  One embodiment of the present invention provides a mobile terminal. And the mobile terminal may be a mobile phone or a tablet. Referring to FIGS. 1 and 2, the mobile terminal 100 includes a rear housing 101, an intermediate frame 102, a screen 103, a circuit board 104, and a battery 105. The circuit board 104 and the battery 105 are mounted on one side surface of the intermediate frame, and the screen 103 is mounted on the other side surface of the intermediate frame. The circuit board 104 and the battery 105 are housed in the rear frame 101. A heat emitting element 1042 is disposed on the circuit board 104 (as shown in FIG. 2). For example, the heating element 1042 may be the main chip of the mobile terminal 100. The main chip includes a CPU and a DDR stacked on the CPU. The heating element 1042 may also be another chip (eg, power management chip, storage chip, or radio frequency chip). The main chip is thicker than other chips because it integrates multiple functions.

  The mobile terminal 100 further includes a shield can 20. The shielding can 20 is connected to the circuit board 104, and forms a shielding space together with the circuit board 104. The heating element 1042 is housed in the shield space. A storage space 42 is provided in the intermediate frame 102. The shield can 20 includes a top 21 and a bottom 22 arranged opposite each other. The bottom portion 22 is configured to be connected to the circuit board 104, and the top portion 21 is disposed above the heating element 1042 and extends into the accommodation space 42.

  It should be noted that the maximum depth that the upper part 21 extends into the receiving space 42 is equal to the depth of the receiving space 42.

  In the present invention, the upper portion 21 of the shield can 20 of the mobile terminal 100 extends into the accommodation space 42 of the intermediate frame 102. That is, the accommodation space 42 is dug into the intermediate frame 102, and the upper portion 21 of the shield can 20 is accommodated in the accommodation space 42 during mounting. With such a configuration, mobile terminal 100 can be developed to be lighter and thinner so that both thickness and weight can be reduced.

  Specifically, the material of the intermediate frame 102 is a heat conductive material. The intermediate frame 102 is in direct or indirect contact with the upper portion 21 of the shield can 20 so that the heat emitted by the heating element can be conducted through the shield can 20 and the intermediate frame 102. This is beneficial for heat dissipation of the heating element. The shield can 20 is in direct contact with the intermediate frame 102 so that heat from the shield can 20 can be transferred directly to the intermediate frame. Alternatively, the shield can 20 may contact the intermediate frame 102 using another heat transfer medium to improve heat transfer efficiency. For example, the shield can 20 may indirectly contact the intermediate frame 102 using a heat conductive adhesive or another heat conductor.

  Referring to FIG. 3, the intermediate frame 102 includes a first surface 41 and a second surface 43. The first surface 41 faces the shield can. The second surface 43 and the first surface 41 are arranged in a back to back manner. The second surface 43 is provided with a groove (not shown). That is, the intermediate frame 102 is provided with the groove. Grooves are formed in the second surface 43. That is, a groove is dug in the second surface 43. The mobile terminal 100 further includes a high thermal conductor 60. The high thermal conductor 60 is arranged in the groove, and the high thermal conductor 60 is laminated to the intermediate frame 102. Using such a structure corresponds to embedding the high thermal conductor 60 into the intermediate frame 102, and thus a better heat dissipation effect can be achieved.

  In one embodiment, the high thermal conductor 60 is a graphite sheet or copper foil.

  In one embodiment, referring to FIGS. 2 and 3, the accommodating space 42 is a through-hole structure. The upper portion 21 includes an upper surface 212. The intermediate frame 102 includes a laminated surface 44. The high thermal conductor 60 includes a first region 62 and a second region 64. The first region 62 is laminated to the top surface 212 and the second region 64 is laminated to the lamination surface 44. The accommodation space 42 is located in the bottom wall of the groove on the second surface and is in communication with the groove. The laminated surface 44 is located at the bottom wall of the groove and is adjacent to the receiving space 42.

  Further, the laminating surface 44 is coplanar with the top surface 212 of the shield can. The high thermal conductor 60 is mounted in the groove, and the surface of the high thermal conductor 60 has an intermediate frame so that a better heat dissipation effect can be achieved when the total thickness of the mobile terminal does not change. It is flush with the surface of 102. In addition, the coplanar structure makes the entire intermediate frame 102 flat so that the mounting gap in the assembly process of the mobile terminal can be reduced. As a result, the overall thickness of the mobile terminal 100 can be reduced.

  In one embodiment, the high thermal conductor 60 is characterized by being bendable. In the high thermal conductor 60, a part of the high thermal conductor 60 present on one side surface of the accommodation space 42 is laminated on the upper surface 212 of the shield can 20, and the high thermal conductivity present on the other side surface of the accommodation space 42. A part of the body 60 passes through the accommodation space 42 so as to be stacked on the surface of the intermediate frame 102 and the surface facing the circuit board 104. That is, a part of the high thermal conductor 60 is arranged on one side surface of the intermediate frame 102, and a part of the high thermal conductor 60 is arranged on the other side surface of the intermediate frame 102. It passes through the accommodation space 42 (the accommodation space 42 has a through hole structure).

  In another embodiment, the accommodation space 42 may be a blind hole (or groove) structure. That is, a part of the intermediate frame 102 is secured to form the bottom wall in the accommodation space 42, and the bottom wall is in contact with the upper portion 21 of the shield can 20.

  If the mobile terminal uses one shield can 20 to cover one or more heating elements 1042 on the circuit board 104, one accommodation space 42 can be designed in the intermediate frame 102 (shield). It should be noted that the height of the can is related to the maximum height of the heating elements covered), and the size of the receiving space 42 matches the size of the upper part 21 of the shield can 20. When the mobile terminal uses a plurality of shield cans 20 to cover a plurality of heating elements on the circuit board 104, a plurality of accommodation spaces 42 with different depths depending on the shield cans 20 with different heights. May be designed in the intermediate frame 102 (the height of the shielding can is related to the maximum height of the heating elements covered), and the size of the plurality of accommodation spaces 42 is the size of the plurality of shielding cans 20. Match. In this way, the intermediate frame, the shield can, and the circuit board can be well buckled together when the mobile terminal is assembled.

  Referring to FIGS. 2 and 3, the mobile terminal 100 further includes a heat conductive adhesive 80, and the heat conductive adhesive 80 is disposed between the heating element 1042 and the upper portion 21 of the shield can 20. Has been done.

  Referring to FIG. 2, the shield can 20 further includes a first side wall 23, a second side wall 24, and a shoulder 25. The first side wall 23 is connected between the bottom portion 22 and the shoulder portion 25, and the second side wall 24 is connected between the shoulder portion 25 and the upper portion 21. The shield can 20 forms a convex structure. Such a convex structure of the shield can 20 allows the shield can 20 to shield chips with different heights.

  Referring to FIG. 5, FIG. 5 is a schematic plan view of a mobile terminal according to one embodiment of the present invention (only the portion relating to the shield can 20 and the intermediate frame 102 is shown). In FIG. 5, the upper portion 21 of the shield can 20 extends into the accommodation space 42 of the intermediate frame 102. The high thermal conductor 60 is housed in the groove of the intermediate frame 102, and the high thermal conductor 60 and the intermediate frame 102 form an integral part having a flat surface. The upper portion 21 of the shield can 20 extends into the accommodation space 42 so that the shield can 20 and the intermediate frame 102 have a region where they overlap in the thickness direction. The size of the overlap region is H, so that the upper portion 21 of the shield can 20 extends into the accommodation space 42 in the thickness direction. That is, the height H of the accommodation space 42. In this way, the overall thickness of the mobile terminal can be reduced, and the weight and thickness of the mobile terminal can be reduced.

  The present invention further provides a heat dissipation and shield structure. The heat dissipation and shield structure may be applied in the mobile terminal 100, or the heat dissipation and shield structure may be applied in other electronic products, such as consumer electronics, or machine room electronics such as set top boxes or routers. You may The heat dissipation and shield structure provided in the present invention may be used in any electronic product having a chip that requires an electromagnetic shield. The following description of the heat dissipation and shield structure also corresponds to FIGS. However, the intermediate frame 102 in the mobile terminal has been renamed to the heat sink 102. For heat dissipation and shielding structures, the name "heat dissipation board" is more appropriate. This is because the heat sink can exist independently of the intermediate frame or can be a part of the intermediate frame. In mobile terminals, the intermediate frame can also be considered as a heat sink, and although the names are different, their meanings are not inconsistent.

  Referring to FIGS. 1 to 4, the heat dissipation and shield structure includes a shield can 20, a heat dissipation plate 102, and a high thermal conductor 60.

  Referring to FIGS. 1 and 2, the shield can 20 is configured to be connected to the circuit board 104 and to form a shield space together with the circuit board 104. The heating element 1042 on the circuit board 104 is housed in the shield space. The shield can 20 includes a top portion 21 and a bottom portion 22 which are arranged to face each other. The bottom portion 22 is connected to the circuit board 104, and the top portion 21 is disposed above the heating element 1042. The bottom 22 of the shield can 20 may be fastened to the circuit board 104 by welding or may be fastened by buckling. For example, a buckle is located on the bottom 22 of the shield can 20 and a buckle hole is provided on the circuit board 104. The fitting between the buckles and the buckle holes secures the shield can 20 on the circuit board 104.

  In this embodiment, when the heat dissipation and shield structure is applied to the mobile terminal 100, the entire heat dissipation plate 102 is integrally formed in the intermediate frame 102 of the mobile terminal 100. That is, the heat dissipation plate 102 is a part of the intermediate frame 102. In another embodiment, the heat sink 102 may be separated from the intermediate frame 102, and the heat sink 102 is fastened to the intermediate frame 102 by gluing or screwing. The overall heat dissipation performance can be improved by selecting different materials for the heat sink 102 and the intermediate frame 102. It seems that the heat dissipation plate 102 is made of a high heat conductive material having a relatively high cost but good heat dissipation performance, and the intermediate frame 102 is made of a normal metal material. Since the heat sink 102 is close to the heat generating element 1042, the heat from the heat generating element 1042 is transferred quickly to the intermediate frame 102 by relying on the high heat conducting performance of the heat sink, and then the heat Are dissipated through the intermediate frame 102.

  Referring to FIGS. 2 and 3, the heat dissipation plate 102 is provided with the accommodation space 42. The upper portion 21 of the shield can 20 extends into the receiving space 42, and the upper portion 21 includes the upper surface 212. The upper surface is arranged on the side of the upper portion 21 of the shield can 20, at a position apart from the heating element 1042. That is, the upper surface is a part of the outer surface of the shield can 20. The heat sink 102 includes a lamination surface 44. The high thermal conductor 60 includes a first region 62 and a second region 64. The first region 62 is laminated to the top surface 212 of the shield can 20, and the second region 64 is laminated to the lamination surface 44. In this way, the shield can 20 is connected to the heat sink 102 by using the high thermal conductor 60, the high thermal conductor 60 is a graphite sheet or copper foil, and The high thermal conductor 60 is connected to the shield can 20 and the heat dissipation plate 102 by using the conductive adhesive 80. In this embodiment, the heat dissipation plate 102 has a plate shape, and the high thermal conductor 60 has a sheet shape.

  In the heat dissipation and shield structure provided in the present invention, the heat dissipation plate 102 is provided with the accommodation space 42, and the upper portion 21 of the shield can 20 extends into the accommodation space 42. This helps reduce the size of the heat dissipation and shield structure, and promotes the progress of weight reduction and thickness reduction of the mobile terminal 100.

  In one embodiment, referring to FIG. 1, the heat sink 102 includes a first surface 41 and a second surface 43. The first surface 41 faces the shield can 20. The second surface 43 and the first surface 41 are arranged back to back. The heat sink 102 is provided with a groove (not shown), and the groove is formed on the second surface 43. That is, the groove is dug in the second surface 43. Laminated surface 44 is located on the bottom wall of the groove. The high heat conductor 60 is housed in the groove so that the high heat conductor 60 is flush with the heat sink 102 after the high heat conductor 60 is coupled to the heat sink 102. That is, the size of the high thermal conductor 60 matches the size of the groove in the heat dissipation plate 102.

  In one embodiment, the accommodation space 42 has a through-hole structure, and the accommodation space 42 communicates with the groove. In a particular manufacturing process, a through hole is punched at a location on the bottom wall of the groove to form the receiving space 42. The high thermal conductor 60 is a connection piece between the shield can 20 and the heat dissipation plate 102. That is, the shield can 20 and the heat dissipation plate 102 are in indirect contact with each other by using the high thermal conductor 60. The high thermal conductor 60 is configured to conduct heat between the shield can 20 and the heat dissipation plate 102.

  In another embodiment, the receiving space 42 may be designed to be a blind-hole structure or a groove structure. In this case, the heat dissipation plate 102 may directly contact the shield can 20 without using the high thermal conductor 60. Alternatively, the high thermal conductor 60 may be attached to the surface of the heat sink 102 such that the high thermal conductor 60 and the shield can 20 are placed on both sides of the heat sink 102, respectively.

  In one embodiment, the high thermal conductor 60 is characterized by being bendable. In the high thermal conductor 60, a part of the high thermal conductor 60 present on one side surface of the accommodation space 42 is laminated on the upper surface 212 of the shield can 20, and the high thermal conductivity present on the other side surface of the accommodation space 42. A part of the body 60 passes through the accommodation space 42 so as to be stacked on the surface of the heat dissipation plate 102 and the surface facing the circuit board 104. That is, a part of the high thermal conductor 60 is arranged on one side surface of the heat dissipation plate 102, and a part of the high thermal conductor 60 is arranged on the other side surface of the heat dissipation plate 102. It passes through the accommodation space 42 (the accommodation space 42 has a through hole structure).

  The high thermal conductor 60 has an upper portion of the shield can 20 so that the heat emitted from the heating element 1042 on the circuit board 104 is conducted to the heat dissipation plate 102 and the heat dissipation and the shield structure have good heat dissipation performance. 21 and the heat dissipation plate 102 are laminated on the laminated surface 44.

  In order to improve the heat dissipation and the heat dissipation performance of the shield structure, a metal material having high thermal conductivity may be selected as the material of the heat dissipation plate 102.

  The heat dissipation and shield structure in this embodiment of the present invention further includes a thermally conductive adhesive 80. The heat conductive adhesive 80 is disposed between the heating element 1042 and the upper portion 21 of the shield can 20, and the heat conductive adhesive 80 transfers the heat released by the heat generating element 1042 to the shield can 20. It is configured to communicate with each other. The shield can 20 may be made of a metal conductive material so as to improve the heat dissipation ability.

  Referring to FIG. 2, the shield can 20 further includes a first side wall 23, a second side wall 24, and a shoulder 25. The first side wall 23 is connected between the bottom portion 22 and the shoulder portion 25, and the second side wall 24 is connected between the shoulder portion 25 and the upper portion 21. The shield can 20 has a convex structure with respect to the shoulder portion 25. Such a convex structure of the shield can 20 allows the shield can 20 to shield chips with different heights.

  When the mobile terminal uses one shield can 20 to cover one or more heating elements 1042 on the circuit board 104, one accommodation space 42 can be designed in the heat sink 102 (shield). It should be noted that the height of the can is related to the maximum height of the heating elements covered), and the size of the receiving space 42 matches the size of the upper part 21 of the shield can 20. When the mobile terminal uses a plurality of shield cans 20 to cover a plurality of heating elements on the circuit board 104, a plurality of accommodation spaces 42 with different depths depending on the shield cans 20 with different heights. May be designed in the heat sink 102 (the height of the shield can is related to the maximum height of the heating elements covered), and the size of the plurality of accommodating spaces 42 is the upper portion 21 of the plurality of shield cans 20. Match the size of. In this way, the heat sink 102, the shield can 20, and the circuit board 102 can be satisfactorily fastened together.

  The heat dissipation and shield structure can be directly applied in the mobile terminal. When the heat dissipation and shield structure is applied in the mobile terminal, the heat dissipation plate is directly used as a part of the intermediate frame, that is, as the heat dissipation plate, and dissipates heat for the heat generation chip. In this way, the functionality of the intermediate frame is enhanced. That is, a heat dissipation function is added based on the original mounting positioning function. In addition, the thickness of the mobile terminal is reduced. Referring to FIG. 5, FIG. 5 is a schematic plan view of a mobile terminal according to an embodiment of the present invention. In FIG. 5, the upper portion 21 of the shield can 20 extends into the accommodation space 42 of the heat dissipation plate 102. The high thermal conductor 60 is housed in the groove of the heat sink 102, and the high thermal conductor 60 and the heat sink 102 form an integrated part having a flat surface. The upper portion 21 of the shield can 20 extends into the accommodation space 42 so as to have a region where the shield can 20 and the heat dissipation plate 102 overlap in the thickness direction. The size of the overlap region is H, so that the upper portion 21 of the shield can 20 extends into the accommodation space 42 in the thickness direction. That is, the height H of the accommodation space 42. In this way, the overall thickness of the mobile terminal can be reduced, and the weight and thickness of the mobile terminal can be reduced.

  The above describes the heat dissipation and shield structure and the mobile terminal provided in the embodiments of the present invention in detail. And, the principles and practices of the present invention are described herein using specific examples. The above description of embodiments is merely to aid in understanding the method and core ideas of the present invention. Changes in the particular implementation and its scope of application can be made by those skilled in the art in accordance with the ideas of the present invention. Based on the above, the content of this specification should not be understood as limiting the scope of the present invention.

Claims (18)

A mobile terminal comprising a circuit board, a heating element arranged on the circuit board, a shield can, and an intermediate frame,
The shield can is connected to the circuit board, and forms a shield space together with the circuit board,
The heating element is housed in the shielded space,
The circuit board is arranged on one side surface of the intermediate frame,
The intermediate frame has a storage space, and the storage space has a through-hole structure,
The shield can includes a top portion and a bottom portion that are arranged to face each other,
The bottom portion is configured to be connected to the circuit board, and
The upper portion is disposed above the heating element and extends into the accommodation space,
The mobile terminal further includes a heat conductor, and the upper portion includes an upper surface,
The intermediate frame includes a laminated surface,
The heat conductor includes a first region and a second region,
The first region is stacked on the upper surface,
The second region is laminated on the laminated surface,
The shield can further includes
A first sidewall, a second sidewall, and a shoulder connected between the first sidewall and the second sidewall,
The first side wall is connected between the bottom and the shoulder,
The second sidewall is connected between the shoulder and the upper portion, and
The shoulder does not extend into the receiving space,
mobile computer. The material of the intermediate frame is a heat conductive material, and
The intermediate frame is in direct or indirect contact with the upper part of the shield can so that the heat emitted by the heating element can be conducted through the shield can and the intermediate frame;
The mobile terminal according to claim 1. The laminated surface is a surface of the intermediate frame remote from the circuit board,
The mobile terminal according to claim 1 or 2. The laminated surface is coplanar with the upper surface of the shield can,
The mobile terminal according to claim 1 or 2.   The mobile terminal according to claim 1, wherein the heat conductor is a graphite sheet or a copper foil. The size of the accommodation space matches the size of the upper surface of the shield can,
The mobile terminal according to any one of claims 1 to 5. The upper portion extends into the accommodation space by a depth equal to the accommodation space,
The mobile terminal according to any one of claims 1 to 6. The shield can is in contact with the intermediate frame using a heat transfer medium,
The mobile terminal according to any one of claims 1 to 7. The heat conductor has a characteristic of being bendable,
The mobile terminal according to any one of claims 1 to 8. The heating element includes a main chip, a power management chip, a storage chip, or a radio frequency chip,
The main chip includes a CPU and DDR,
The mobile terminal according to any one of claims 1 to 9. A heat dissipation and shield structure including a shield can and a heat sink,
The shield can is connected to a circuit board, and is configured to form a shield space together with the circuit board,
A heating element is arranged in the shield space,
The shield can includes a top portion and a bottom portion that are arranged to face each other,
The bottom portion is configured to be connected to the circuit board, and the upper portion is disposed above the heating element,
The heat sink has a housing space, and
The upper portion of the shield can extends into the storage space,
The accommodation space has a through-hole structure,
The heat dissipation and shield structure further includes a heat conductor, and the upper portion includes an upper surface,
The heat sink includes a laminated surface,
The heat conductor includes a first region and a second region,
The first region is stacked on the upper surface,
The second region is laminated on the laminated surface,
The shield can further includes
A first sidewall, a second sidewall, and a shoulder connected between the first sidewall and the second sidewall,
The first side wall is connected between the bottom and the shoulder,
The second sidewall is connected between the shoulder and the upper portion, and
The shoulder does not extend into the receiving space,
Heat dissipation and shield structure. The laminated surface is coplanar with the upper surface of the shield can,
The heat dissipation and shield structure according to claim 11. The heat conductor is a graphite sheet or a copper foil,
The heat dissipation and shield structure according to claim 11. The material of the heat dissipation plate is a metal material having high thermal conductivity,
The heat dissipation and shield structure according to any one of claims 11 to 13. The heat dissipation and shield structure further includes a heat conductive adhesive, and
The heat conductive adhesive is disposed between the heating element and the upper portion of the shield can,
The heat dissipation and shield structure according to any one of claims 11 to 14. The material of the heat dissipation plate is a heat conductive material, and
The heat dissipation plate is in direct or indirect contact with the upper part of the shield can so that the heat emitted by the heat generating element can be conducted through the shield can and the heat dissipation plate.
The heat dissipation and shield structure according to any one of claims 11 to 15. The size of the accommodation space matches the size of the upper surface of the shield can,
The heat dissipation and shield structure according to any one of claims 11 to 16. There are a plurality of shield cans for covering the plurality of heating elements on the circuit board, and the size of the plurality of accommodation spaces is the same as the size of the plurality of shield cans,
The heat dissipation and shield structure according to any one of claims 11 to 17.

Images