CN219997420U - Intelligent glasses - Google Patents

Abstract

The utility model relates to the field of electronic equipment heat dissipation, and provides intelligent glasses. The intelligent glasses comprise a glasses body and at least one glasses leg arranged on the glasses body, wherein a containing groove is formed in the at least one glasses leg, a circuit board assembly is arranged in the containing groove, the circuit board assembly comprises a clearance area and a non-clearance area, and an antenna unit is arranged in the clearance area. The heat radiation structure is arranged between the circuit board assembly and the inner side wall of the accommodating groove and comprises a conductive heat radiation layer and an insulating heat radiation layer, wherein the insulating heat radiation layer is arranged on at least one side of the circuit board assembly, the conductive heat radiation layer is arranged on the insulating heat radiation layer, and the region of the conductive heat radiation layer corresponding to the clearance area is removed. The insulating heat dissipation layer material can conduct good heat dissipation without avoiding a clearance area, so that the temperature distribution on the surface of the intelligent glasses is more uniform, the performance of an antenna is not affected, and the user experience is improved.

Description

smart glasses

Technical field

The present application relates to the field of heat dissipation of electronic equipment, and in particular, to smart glasses.

Background technique

With the development of computer technology, various wearable device products have emerged. Glasses such as augmented reality (AR), virtual reality (VR), and mediated reality (MR) are increasingly popular among people. s concern. However, for an all-in-one wearable device, its product form is quite special. The whole machine integrates a lot of hardware and structural properties. In such a small size, it is necessary to pack chips, cameras, optical machines, batteries and other components at the same time. , and the overall size of the machine is small, and the motherboard is also very narrow. The traditional heat dissipation mechanism can no longer meet the heat dissipation needs of the whole machine. In order to enhance the heat dissipation effect, heat dissipation materials are installed in the wearable device, which may affect the corresponding antenna in the wearable device. clearance area, thereby affecting the performance of the antenna inside the wearable device.

Utility model content

An embodiment of the present application provides smart glasses, including:

The glasses body and at least one temple provided on the glasses body, the at least one temple having an accommodating groove, and a circuit board assembly being disposed in the accommodating groove;

Wherein, the circuit board assembly includes a clearance area and a non-clearance area, and an antenna unit is provided in the clearance area;

A heat dissipation structure is provided between the circuit board assembly and the inner wall of the accommodating groove, including:

A conductive heat dissipation layer and an insulating heat dissipation layer. The insulating heat dissipation layer is provided on at least one side of the circuit board assembly. The conductive heat dissipation layer is located on the insulating heat dissipation layer. The conductive heat dissipation layer corresponds to the area of the clearance area. be removed.

According to the smart glasses provided by an embodiment of the present application, the heat dissipation structure further includes:

An adhesive layer is provided between the insulating heat dissipation layer and the circuit board assembly, and the insulating heat dissipation layer is provided on at least one side of the circuit board assembly through the adhesive layer.

According to the smart glasses provided by an embodiment of the present application, the heat dissipation structure further includes:

A protective layer, the protective layer is a plastic protective layer, and the plastic protective layer is provided on the side of the conductive heat dissipation layer facing away from the insulating heat dissipation layer.

According to the smart glasses provided in one embodiment of the present application, a portion of the insulating heat dissipation layer and/or the protective layer extends and fills the area.

According to the smart glasses provided in one embodiment of the present application, the plastic protective layer is polyethylene terephthalate plastic.

According to the smart glasses provided by an embodiment of the present application, there are a plurality of clear areas, and a plurality of the areas corresponding to the plurality of clear areas are provided on the conductive heat dissipation layer.

According to the smart glasses provided by an embodiment of the present application, the insulating heat dissipation layer is a boron nitride heat sink, and the conductive heat dissipation layer is a graphite heat sink.

According to the smart glasses provided in one embodiment of the present application, the heat dissipation structure is arranged in a U shape, and the heat dissipation structure extends from one surface of the circuit board assembly to another surface opposite to it.

According to the smart glasses provided in one embodiment of the present application, the conductive heat dissipation layer on the other surface is removed in an area corresponding to the clear zone.

According to the smart glasses provided in one embodiment of the present application, a thermal conductive area is provided on the inner wall of the accommodating groove, and at least one of the conductive heat dissipation layer and the insulating heat dissipation layer extends to conflict with the heat conductive area.

Description of the drawings

In order to more clearly explain the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the heat dissipation structure composite material stacking provided by an embodiment of the present application;

Figure 2 is a schematic diagram of a circuit board assembly wrapped with a heat dissipation structure composite material provided by an embodiment of the present application;

Figure 3 is a schematic diagram of smart glasses provided by an embodiment of the present application;

Figure 4 is one of the schematic diagrams of the heat dissipation structure composite material stacking provided by an embodiment of the present application;

Figure 5 is the second schematic diagram of the heat dissipation structure composite material stacking provided by one embodiment of the present application;

Figure 6 is the third schematic diagram of the heat dissipation structure composite material stacking provided by one embodiment of the present application.

Reference signs:

10. Heat dissipation structure; 101. Conductive heat dissipation layer; 102. Insulating heat dissipation layer; 103. Adhesive layer; 104. Protective layer; 105. Avoidance groove; 20. Smart glasses; 201. Clearance area; 202. Non-clearance area; 203 , glasses body; 204, accommodation slot; 205, PCB board.

Detailed ways

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

In the description of the embodiments of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Or integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood in specific situations.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "an example," "specific examples," or "some examples" or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the embodiments of this application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.

The smart glasses described in the embodiments of this application may be Bluetooth audio glasses, AR glasses, VR glasses, MR glasses, etc. The embodiments of this application do not limit the specific types and uses of the smart glasses.

The smart glasses 20 provided by the embodiment of the present application will be described below with reference to Figures 1-6.

An embodiment of the present application provides a smart glasses 20. As shown in Figure 3, the smart glasses 20 include a glasses body 203 and at least one temple provided on the glasses body 203. A receiving groove 204 is configured in at least one of the temples. The circuit board assembly is disposed in the slot 204 . Among them, as shown in Figure 1, the circuit board assembly includes a clearance area 201 and a non-clearance area 202, and an antenna unit is provided in the clearance area 201. The heat dissipation structure 10 is provided between the circuit board assembly and the inner wall of the accommodation slot 204, and includes a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102; wherein, the clear area 201 corresponds to the insulating heat dissipation layer 102, and the non-clearance area 202 corresponds to the conductive heat dissipation layer. 101. The insulating heat dissipation layer 102 is disposed on at least one side of the circuit board assembly. In the embodiment of the present application, the insulating heat dissipation layer 102 is disposed above the circuit board assembly; the conductive heat dissipation layer 101 is located on the insulating heat dissipation layer 102 .

Specifically, the clear area 201 of the circuit board assembly is an area where the circuit board assembly is not laid, or the clear area 201 is an area on the circuit board assembly where no copper is poured. The circuit board component in this application refers to a circuit board that works in conjunction with the antenna. The circuit board component can also be called a motherboard, a system board, a logic board, etc. The circuit board component is equipped with a processor, etc. For example, the circuit board component is a printed circuit board (PCB) multilayer board, which includes multiple dielectric layers and a metal conductive layer (such as a copper foil layer) disposed between the dielectric layers. The dielectric layer is used to maintain the insulation between circuits and layers, commonly known as the base material. Lines at two or more levels are connected to each other through conductive vias. At least one of the metal conductive layers serves as the reference ground layer of the circuit board assembly. This application does not limit the specific structure and type of the circuit board assembly.

The smart glasses 20 include a glasses body 203 and temples arranged on the glasses body. The temples are configured with accommodating grooves 204. The circuit board assembly is disposed in the accommodating groove 204. The circuit board assembly is connected to the inner wall of the accommodating groove 204. There is a heat dissipation structure 10 between them. A heat conductive area is provided on the inner wall of the accommodation groove 204, and at least one of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 extends to conflict with the heat conduction area. When the user uses the smart glasses 20, the antenna unit on the circuit board assembly emits and receives electromagnetic waves in the clearance area 201. The heat dissipation structure 10 wraps the circuit board assembly into a whole, allowing its heat to be evenly dispersed and reducing the surface temperature of the circuit board assembly. .

During the operation of the circuit board assembly provided by this application, the antenna unit emits and receives electromagnetic waves to the clearance area 201. Since the conductive heat dissipation layer 101 can conduct electricity, it will cause electromagnetic interference to the electromagnetic waves generated in the clearance area 201. Therefore, the conductive heat dissipation layer needs to be The area 101 corresponding to the clearance area 201 is removed. The removed area forms an escape groove 105 on the conductive heat dissipation layer 101, thereby reducing the impact on the antenna radiation function; and the insulating heat dissipation layer 102 is not conductive, so the antenna unit can pass through the insulation to dissipate heat. The layer 102 normally emits and receives electromagnetic waves, so that the entire smart glasses 20 can dissipate heat of the circuit board assembly without affecting the performance of the circuit board assembly.

The smart glasses 20 provided by this application are provided with a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102. The insulating heat dissipation layer 102 is provided on at least one side of the circuit board assembly. The conductive heat dissipation layer 101 is located on the insulating heat dissipation layer 102. The conductive heat dissipation layer 101 corresponds to the clearance. Area 201 is removed. The ductility and foldability of the materials of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 are utilized to increase the heat dissipation area, realize rapid heat dissipation of the smart glasses 20, and reduce the temperature of the smart glasses 20 when working. On the other hand, the insulating heat dissipation layer 102 The material does not need to avoid the clearance area 201 to dissipate heat well, making the temperature distribution on the surface of the smart glasses 20 more uniform without affecting the antenna performance and improving the user experience.

According to the smart glasses 20 provided by an embodiment of the present application, as shown in Figure 1, the heat dissipation structure 10 also includes an adhesive layer 103. The adhesive layer 103 is disposed between the insulating heat dissipation layer 102 and the circuit board assembly. The insulating heat dissipation layer 102 passes through The adhesive layer 103 is disposed on at least one side of the circuit board assembly. In the embodiment of the present application, the insulating heat dissipation layer 102 is disposed above the circuit board assembly through the adhesive layer 103. The adhesive layer 103 is used to connect the insulating heat dissipation layer 102 with the circuit. board components are connected. The adhesive layer 103 in the embodiment of the present application is specifically a polyethylene terephthalate (PET) double-sided tape, which has the characteristics of high temperature resistance, light weight, corrosion resistance, and strong adhesion.

In the embodiment provided by this application, due to the existence of internal resistance during the operation of the circuit board assembly, part of the electrical energy is converted into internal energy and dissipated in the form of heat. Since the smart glasses 20 usually need to fit the user's skin for wearing use, therefore the heat dissipation capability of the smart glasses 20 affects the user's comfort and usage time. In order to improve its use performance, the insulating heat dissipation layer 102 is pasted on the circuit board assembly through the adhesive layer 103, and the conductive heat dissipation layer 101 is provided on the insulating heat dissipation layer 102; utilizing the ductility and ductility of the materials of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 Foldability can increase the heat dissipation area, realize rapid heat dissipation of circuit board components, and reduce the temperature of circuit board components during operation.

According to the smart glasses 20 provided by an embodiment of the present application, as shown in Figure 1, the heat dissipation structure 10 also includes a protective layer 104. The protective layer 104 in the embodiment of the present application is a plastic protective layer 104. The plastic protective layer 104 is disposed on a conductive heat dissipation surface. The side of the layer 101 facing away from the insulating heat dissipation layer 102. In the embodiment of the present application, the protective layer 104 is disposed above the conductive heat dissipation layer 101 to insulate the conductive heat dissipation layer 101. The plastic protective layer 104 can be a high-density polyethylene material or a polypropylene material. For example, the plastic protective layer 104 is polyethylene terephthalate plastic.

According to the smart glasses 20 provided by an embodiment of the present application, as shown in FIG. 1 , a portion of the insulating heat dissipation layer 102 and/or the protective layer 104 extends and fills the area.

In the embodiment provided by this application, as shown in FIG. 4 , a portion of the insulating heat dissipation layer 102 extends and is filled into this area, that is, filled into the avoidance groove 105 . During the operation of the antenna unit on the circuit board assembly, the antenna unit emits and receives electromagnetic waves in the clearance area 201. Since the conductive heat dissipation layer 101 can conduct electricity, it will cause electromagnetic interference to the electromagnetic waves generated in the clearance area 201. Therefore, the conductive heat dissipation layer needs to be The area of 101 corresponding to the clearance area 201 is removed, and a part of the insulating heat dissipation layer 102 is filled into the clearance area 201. On the basis of ensuring the rapid heat dissipation of the circuit board assembly, the electromagnetic waves can pass smoothly without affecting the antenna performance of the clearance area 201. .

In some embodiments, as shown in FIG. 5 , a portion of the protective layer 104 can also be extended and filled into this area, that is, a portion of the protective layer 104 is filled into the relief groove 105 . When the circuit board assembly is working, the antenna unit emits and receives electromagnetic waves in the clearance area 201. Since the conductive heat dissipation layer 101 can conduct electricity, it will cause electromagnetic interference to the electromagnetic waves generated in the clearance area 201. It is necessary to connect the conductive heat dissipation layer 101 to the clearance area 201. Remove the area, and fill part of the protective layer 104 into the clear area 201. The protective layer 104 is made of polyethylene terephthalate plastic, which is non-conductive, so it can allow electromagnetic waves to pass smoothly without affecting the clear area 201. Antenna performance, protecting circuit board components.

In other embodiments, as shown in FIG. 6 , the insulating heat dissipation layer 102 and the parts on the protective layer 104 can also be extended together and filled into the area, that is, filled into the avoidance groove 105 together. During the operation of the circuit board assembly, the antenna unit emits and receives electromagnetic waves in the clearance area 201. Since the insulating heat dissipation layer 102 and the protective layer 104 are both insulating materials, the insulating heat dissipation layer 102 and the protective layer 104 are filled together into the avoidance groove 105. On the basis of ensuring rapid heat dissipation of the circuit board assembly, the electromagnetic waves can pass smoothly without affecting the antenna performance in the clearance area 201, and it can also protect the circuit board assembly.

According to the smart glasses 20 provided in an embodiment of the present application, there are multiple clear areas 201 , and the conductive heat dissipation layer 101 is provided with a plurality of the above-mentioned areas corresponding to the multiple clear areas 201 one-to-one. The areas in the embodiment of the present application are Multiple escape grooves 105 may be provided. Among them, in a specific embodiment, two avoidance slots 105 can be provided. When the circuit board assembly is working, the antenna unit emits corresponding electromagnetic waves in the clearance area 201, and the electromagnetic waves in the clearance area 201 dissipate heat through the insulation in the heat dissipation structure 10. The layer 102 or the protective layer 104 plays its corresponding role.

According to the smart glasses 20 provided by an embodiment of the present application, as shown in FIG. 1 , the insulating heat dissipation layer 102 is a boron nitride heat sink, and the conductive heat dissipation layer 101 is a graphite heat sink. In the embodiment of the present application, the conductive heat dissipation layer 101 is specifically graphene. Graphene is a heat-conducting and heat-dissipating material. It has a unique grain orientation, conducts heat uniformly in two directions, and has a lamellar structure that can adapt to different surfaces. The performance of smart glasses 20 is improved while shielding heat sources and components. The insulating heat dissipation layer 102 is hexagonal boron nitride, which has high heat resistance, low expansion coefficient, excellent electrical insulation and good corrosion resistance. The hexagonal boron nitride is placed above the circuit board component, and the graphite sheet is placed above On hexagonal boron nitride, when the user uses the smart glasses 20, the clear area 201 on the circuit board assembly emits electromagnetic waves during operation. Hexagonal boron nitride is not conductive, so it can completely cover the clear area 201; because graphite sheets can conduct electricity, It will cause electromagnetic interference to the electromagnetic waves generated in the clearance area 201, so the graphite sheets need to be kept away from the clearance area 201 to reduce the impact on the antenna function.

According to the smart glasses 20 provided by an embodiment of the present application, as shown in FIG. 2 , the heat dissipation structure 10 is arranged in a U shape, and the heat dissipation structure 10 extends from one surface of the circuit board assembly to the other surface opposite to it. The heat dissipation structure 10 in the embodiment of the present application includes a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102. The insulating heat dissipation layer 102 is disposed above the circuit board assembly, the conductive heat dissipation layer 101 is disposed on the insulating heat dissipation layer 102, and the insulating heat dissipation layer 102 is disposed below. The adhesive layer 103 is used to connect the insulating heat dissipation layer 102 with the circuit board assembly. The heat dissipation structure 10 also includes a protective layer 104. The protective layer 104 is located above the conductive heat dissipation layer 101 and is used to insulate the conductive heat dissipation layer 101.

In a specific embodiment, as shown in Figure 2, two clearance areas 201 can be provided between the heat dissipation structure 10 and the PCB board 205, one of which is located on the left side of the PCB board 205 in the circuit board assembly, and the other is A clearance area 201 is provided to the right of the PCB board 205 in the circuit board assembly. The U-shaped heat dissipation structure 10 and the PCB board 205 in the circuit board assembly are regarded as a whole, and the heat generated by the PCB board 205 during the working process is evenly dispersed, so that the temperature of the entire circuit board assembly is reduced.

In another specific embodiment, as shown in FIG. 1 , the heat dissipation structure 10 is composed of four parts: a protective layer 104 , a conductive heat dissipation layer 101 , an insulating heat dissipation layer 102 and an adhesive layer 103 . Among them, the thickness of the protective layer 104 is set to 0.05mm, the thickness of the conductive heat dissipation layer 101 is set to 0.05~0.2mm, the thickness of the insulating heat dissipation layer 102 is set to 0.05~0.2mm, and the thickness of the adhesive layer 103 is set to 0.05~0.25mm. . The thickness of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 can be set according to the specific space size of the circuit board assembly. The conductive heat dissipation layer 101 needs to avoid the antenna clearance area 201, and the insulating heat dissipation layer 102 can completely cover the antenna clearance area 201. The heat dissipation structure 10 is made of partially unequal thickness, and the lateral thermal conductivity of the insulating heat dissipation layer 102 is used to evenly dissipate heat in the motherboard area, thereby reducing the surface temperature of the circuit board assembly.

According to the smart glasses 20 provided in an embodiment of the present application, the area of the conductive heat dissipation layer 101 on the other surface corresponding to the clearance area 201 is removed, and the removed area forms an avoidance groove 105 on the conductive heat dissipation layer 101 to reduce the impact on the smart glasses 20 influence on the antenna radiation function.

In some embodiments, since the smart glasses 20 are equipped with many circuit board components, they will generate a large amount of heat during operation. In addition, other electronic components, such as power supply components, will also generate a certain amount of heat. Therefore, the conductive heat dissipation layer 101 is extended to conflict with the heat conduction area. The conductive heat dissipation layer 101 is made of graphene material. Graphene material is the material with the highest thermal conductivity at present. Its thermal conductivity coefficient is much greater than the thermal conductivity coefficient of air. The conductive heat dissipation layer 101 and The heat-conducting areas are in contact to achieve rapid heat conduction in the motherboard area of the circuit board assembly, reducing the working temperature of the smart glasses 20 and improving the user experience.

In other embodiments, since the insulating heat dissipation layer 102 is made of hexagonal boron nitride and its thermal conductivity is greater than the thermal conductivity of air, contacting the insulating heat dissipation layer 102 with the heat conduction area can also achieve rapid heat conduction in the motherboard area of the circuit board assembly, reducing the The working temperature of the smart glasses 20 improves the user experience. At the same time, the ductility and foldability of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 can be further extended to increase the heat dissipation area.

The smart glasses 20 provided by this application are provided with a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102. The insulating heat dissipation layer 102 is provided on at least one side of the circuit board assembly. The conductive heat dissipation layer 101 is located on the insulating heat dissipation layer 102. The conductive heat dissipation layer 101 corresponds to the clearance. Area 201 is removed. The ductility and foldability of the materials of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 are utilized to increase the heat dissipation area, realize rapid heat dissipation of the smart glasses 20, and reduce the temperature of the smart glasses 20 when working. On the other hand, the insulating heat dissipation layer 102 The material does not need to avoid the clearance area 201 to dissipate heat well, making the temperature distribution on the surface of the smart glasses 20 more uniform without affecting the antenna performance and improving the user experience.

The above embodiments are only used to illustrate the present application, but not to limit the present application. Although the present application has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application and should all be covered within the scope of the claims of this application. Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the spirit of the technical solutions of the various embodiments of the present invention. and scope.

Claims (10)

1. A kind of smart glasses, characterized by including: The glasses body and at least one temple provided on the glasses body, the at least one temple having an accommodating groove, and the accommodating groove being provided with a circuit board assembly; Wherein, the circuit board assembly includes a clearance area and a non-clearance area, and an antenna unit is provided in the clearance area; A heat dissipation structure is provided between the circuit board assembly and the inner wall of the accommodating groove, including: A conductive heat dissipation layer and an insulating heat dissipation layer. The insulating heat dissipation layer is provided on at least one side of the circuit board assembly. The conductive heat dissipation layer is located on the insulating heat dissipation layer. The conductive heat dissipation layer corresponds to the area of the clearance area. be removed. 2. Smart glasses according to claim 1, characterized in that the heat dissipation structure further includes: An adhesive layer is provided between the insulating heat dissipation layer and the circuit board assembly, and the insulating heat dissipation layer is provided on at least one side of the circuit board assembly through the adhesive layer. 3. Smart glasses according to claim 2, characterized in that the heat dissipation structure further includes: A protective layer, the protective layer is a plastic protective layer, and the plastic protective layer is provided on the side of the conductive heat dissipation layer facing away from the insulating heat dissipation layer. 4. The smart glasses according to claim 3, wherein a portion of the insulating heat dissipation layer and/or the protective layer extends and fills the area. 5. The smart glasses according to claim 3, wherein the plastic protective layer is polyethylene terephthalate plastic. 6. The smart glasses according to claim 1, wherein there are a plurality of clear areas, and a plurality of areas corresponding to a plurality of the clear areas are provided on the conductive heat dissipation layer. 7. The smart glasses according to any one of claims 1 to 6, wherein the insulating heat dissipation layer is a boron nitride heat sink, and the conductive heat dissipation layer is a graphite heat sink. 8. The smart glasses according to any one of claims 1 to 6, characterized in that the heat dissipation structure is arranged in a U shape, and the heat dissipation structure extends from one surface of the circuit board assembly to an opposite surface thereof. Another surface. 9. The smart glasses according to claim 8, wherein the conductive heat dissipation layer on the other surface is removed in an area corresponding to the clear zone. 10. The smart glasses according to claim 1, wherein a thermal conductive area is provided on the inner wall of the accommodating groove, and at least one of the conductive heat dissipation layer and the insulating heat dissipation layer extends to the The thermal conduction area conflicts.