CN219997420U

CN219997420U - Intelligent glasses

Info

Publication number: CN219997420U
Application number: CN202320824183.3U
Authority: CN
Inventors: 胡行群; 陈欢
Original assignee: Hubei Xingji Meizu Technology Co ltd
Current assignee: Hubei Xingji Meizu Technology Co ltd
Priority date: 2023-04-12
Filing date: 2023-04-12
Publication date: 2023-11-10
Anticipated expiration: 2033-04-12

Abstract

The utility model relates to the field of electronic equipment heat dissipation, and provides intelligent glasses. The intelligent glasses comprise a glasses body and at least one glasses leg arranged on the glasses body, wherein a containing groove is formed in the at least one glasses leg, a circuit board assembly is arranged in the containing groove, the circuit board assembly comprises a clearance area and a non-clearance area, and an antenna unit is arranged in the clearance area. The heat radiation structure is arranged between the circuit board assembly and the inner side wall of the accommodating groove and comprises a conductive heat radiation layer and an insulating heat radiation layer, wherein the insulating heat radiation layer is arranged on at least one side of the circuit board assembly, the conductive heat radiation layer is arranged on the insulating heat radiation layer, and the region of the conductive heat radiation layer corresponding to the clearance area is removed. The insulating heat dissipation layer material can conduct good heat dissipation without avoiding a clearance area, so that the temperature distribution on the surface of the intelligent glasses is more uniform, the performance of an antenna is not affected, and the user experience is improved.

Description

Intelligent glasses

Technical Field

The utility model relates to the field of electronic equipment heat dissipation, in particular to intelligent glasses.

Background

With the development of computer technology, various wearable device products have been developed, and glasses such as augmented Reality (Augmented Reality, AR), virtual Reality (VR), and Mediated Reality (MR) have been attracting attention. However, for the wearable device integrated machine, the product form is special, the hardware and structural performance of the integrated machine are more, the components such as a chip, a camera, an optical machine, a battery and the like are required to be plugged at the same time under the small volume, the size and the area of the whole machine are small, the main board is also very narrow, the heat dissipation requirement of the whole machine cannot be met by utilizing the traditional heat dissipation mechanism, and in order to enhance the heat dissipation effect, the heat dissipation material is arranged in the wearable device, so that the clearance area of the corresponding antenna in the wearable device can be influenced, and the performance of the antenna inside the wearable device is influenced.

Disclosure of Invention

The embodiment of the utility model provides intelligent glasses, which comprise:

the glasses comprise a glasses body and at least one glasses leg arranged on the glasses body, wherein a containing groove is formed in the at least one glasses leg, and a circuit board assembly is arranged in the containing groove;

the circuit board assembly comprises a clearance area and a non-clearance area, and an antenna unit is arranged in the clearance area;

the heat radiation structure is arranged between the circuit board assembly and the inner side wall of the accommodating groove, and comprises:

the circuit board assembly comprises a conductive heat dissipation layer and an insulating heat dissipation layer, wherein the insulating heat dissipation layer is arranged on at least one side of the circuit board assembly, the conductive heat dissipation layer is positioned on the insulating heat dissipation layer, and the region, corresponding to the clearance region, of the conductive heat dissipation layer is removed.

According to the smart glasses provided by the embodiment of the utility model, the heat dissipation structure further comprises:

the adhesive layer is arranged between the insulating heat dissipation layer and the circuit board assembly, and the insulating heat dissipation layer is arranged on at least one side of the circuit board assembly through the adhesive layer.

the protective layer is a plastic protective layer, and the plastic protective layer is arranged on one side of the conductive heat dissipation layer, which is away from the insulating heat dissipation layer.

According to the smart glasses provided by the embodiment of the utility model, a part of the insulating heat dissipation layer and/or the protective layer extends and fills the area.

According to the intelligent glasses provided by the embodiment of the utility model, the plastic protective layer is polyethylene terephthalate plastic.

According to the intelligent glasses provided by the embodiment of the utility model, a plurality of clearance areas are arranged, and the conductive heat dissipation layer is provided with a plurality of areas corresponding to the clearance areas one by one.

According to the intelligent glasses provided by the embodiment of the utility model, the insulating heat dissipation layer is a boron nitride heat dissipation sheet, and the conductive heat dissipation layer is a graphite heat dissipation sheet.

According to the intelligent glasses provided by the embodiment of the utility model, the heat dissipation structure is arranged in a U shape, and the heat dissipation structure extends from one surface of the circuit board assembly to the other surface opposite to the one surface.

According to the smart glasses provided by the embodiment of the utility model, the area of the conductive heat dissipation layer on the other surface corresponding to the clearance area is removed.

According to the intelligent glasses provided by the embodiment of the utility model, the inner side wall of the accommodating groove is provided with the heat conducting area, and at least one of the electric conduction heat dissipation layer and the insulating heat dissipation layer extends to be in contact with the heat conducting area.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic illustration of a heat dissipating structure composite laminate according to one embodiment of the present utility model;

FIG. 2 is a schematic illustration of a heat dissipation structure composite material encapsulated circuit board assembly according to one embodiment of the present utility model;

FIG. 3 is a schematic diagram of smart glasses according to an embodiment of the present utility model;

FIG. 4 is a schematic illustration of a heat dissipating structure composite laminate according to one embodiment of the present utility model;

FIG. 5 is a second schematic illustration of a heat dissipating structure composite laminate according to one embodiment of the present utility model;

FIG. 6 is a third schematic illustration of a heat dissipating structure composite laminate according to one embodiment of the present utility model.

Reference numerals:

10. a heat dissipation structure; 101. a conductive heat dissipation layer; 102. an insulating heat dissipation layer; 103. an adhesive layer; 104. a protective layer; 105. an avoidance groove; 20. an intelligent glasses; 201. a clearance area; 202. a non-headroom region; 203. a glasses body; 204. a receiving groove; 205. and a PCB board.

Detailed Description

Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The intelligent glasses described in the embodiment of the utility model can be Bluetooth audio glasses, AR glasses, VR glasses, MR glasses and the like, and the specific type and application of the intelligent glasses are not limited in the embodiment of the utility model.

The following describes smart glasses 20 provided in an embodiment of the present utility model with reference to fig. 1 to 6.

The embodiment of the utility model provides an intelligent glasses 20, as shown in fig. 3, the intelligent glasses 20 include a glasses body 203 and at least one glasses leg disposed on the glasses body 203, wherein a containing groove 204 is configured in the at least one glasses leg, and a circuit board assembly is disposed in the containing groove 204. As shown in fig. 1, the circuit board assembly includes a clearance area 201 and a non-clearance area 202, and an antenna unit is disposed in the clearance area 201. The heat dissipation structure 10 is disposed between the circuit board assembly and the inner sidewall of the accommodating groove 204, and comprises a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102; the headroom region 201 corresponds to the insulating heat dissipation layer 102, and the non-headroom region 202 corresponds to the conductive heat dissipation layer 101. The insulating heat dissipation layer 102 is disposed on at least one side of the circuit board assembly, and in the embodiment of the utility model, the insulating heat dissipation layer 102 is disposed above the circuit board assembly; the conductive heat sink layer 101 is located on the insulating heat sink layer 102.

Specifically, the clearance area 201 of the circuit board assembly is an area where the circuit board assembly is not laid out, or the clearance area 201 is an area where the circuit board assembly is not covered with copper. The circuit board assembly in the utility model refers to a circuit board which works together with the antenna, the circuit board assembly can also be called a motherboard, a system board, a logic board and the like, and a processor and the like are arranged on the circuit board assembly. For example, the circuit board assembly is a printed circuit board (Printed Circuit Board, PCB) multilayer board comprising a plurality of dielectric layers and a metallic conductive layer (e.g., a copper foil layer) disposed between the dielectric layers. The dielectric layer is used to maintain the insulation between the circuit and the layers, and is commonly referred to as a substrate. The lines of more than two layers are conducted with each other through the conductive via holes. At least one of the metal conductive layers serves as a reference stratum for the circuit board assembly, and the specific structure and type of the circuit board assembly are not limited by the utility model.

The intelligent glasses 20 comprise a glasses body 203 and glasses legs arranged on the glasses body, wherein accommodating grooves 204 are formed in the glasses legs, circuit board assemblies are arranged in the accommodating grooves 204, and a heat dissipation structure 10 is arranged between the circuit board assemblies and the inner side walls of the accommodating grooves 204. The inner sidewall of the accommodating groove 204 is provided with a heat conducting area, and at least one of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 extends to abut against the heat conducting area. When a user uses the smart glasses 20, the antenna unit on the circuit board assembly transmits and receives electromagnetic waves in the clearance area 201, and the heat dissipation structure 10 wraps the circuit board assembly into a whole, so that heat of the circuit board assembly is uniformly dispersed, and the surface temperature of the circuit board assembly is reduced.

In the working process of the circuit board assembly provided by the utility model, the antenna unit transmits and receives electromagnetic waves to the clearance area 201, and because the conductive heat dissipation layer 101 can conduct electricity, electromagnetic interference can be generated on the electromagnetic waves generated in the clearance area 201, the area of the conductive heat dissipation layer 101 corresponding to the clearance area 201 needs to be removed, and the removed area forms the avoidance groove 105 on the conductive heat dissipation layer 101, so that the influence on the antenna radiation function is reduced; the insulating heat dissipation layer 102 is not conductive, so that the antenna unit can normally emit and receive electromagnetic waves through the insulating heat dissipation layer 102, and the performance of the circuit board assembly is not affected while the whole intelligent glasses 20 are used for dissipating heat of the circuit board assembly.

According to the intelligent glasses 20 provided by the utility model, the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 are arranged, the insulating heat dissipation layer 102 is arranged on at least one side of the circuit board assembly, the conductive heat dissipation layer 101 is positioned on the insulating heat dissipation layer 102, and the area of the conductive heat dissipation layer 101 corresponding to the clearance area 201 is removed. Utilize the ductility and the foldability of electrically conductive heat dissipation layer 101 and insulating heat dissipation layer 102 material, realize heat radiating area's increase, realize intelligent glasses 20's quick heat dissipation, reduce intelligent glasses 20 during operation's temperature, on the other hand, insulating heat dissipation layer 102 material need not avoid clearance area 201 just can carry out fine heat dissipation, lets intelligent glasses 20 surface's temperature distribution more even, can not influence antenna performance simultaneously, promotes user experience.

According to the smart glasses 20 provided in one embodiment of the present utility model, as shown in fig. 1, the heat dissipation structure 10 further includes an adhesive layer 103, the adhesive layer 103 is disposed between the insulating heat dissipation layer 102 and the circuit board assembly, the insulating heat dissipation layer 102 is disposed on at least one side of the circuit board assembly through the adhesive layer 103, in the embodiment of the present utility model, the insulating heat dissipation layer 102 is disposed above the circuit board assembly through the adhesive layer 103, and the adhesive layer 103 is used for connecting the insulating heat dissipation layer 102 and the circuit board assembly. The adhesive layer 103 in the embodiment of the utility model is specifically a polyethylene terephthalate (Polyethylene terephthalate, PET) double-sided adhesive tape, which has the characteristics of high temperature resistance, light weight, corrosion resistance and strong adhesive force.

In the embodiment provided by the utility model, a part of electric energy is converted into internal energy and emitted in a heat mode due to the existence of internal resistance in the working process of the circuit board assembly, and the intelligent glasses 20 are usually required to be worn by being attached to the skin of a user, so that the heat dissipation capacity of the intelligent glasses 20 influences the comfort and the service time of the user. In order to improve the service performance, the insulating heat dissipation layer 102 is adhered to the circuit board assembly through the adhesive layer 103, and the conductive heat dissipation layer 101 is arranged on the insulating heat dissipation layer 102; by utilizing the ductility and the foldability of the materials of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102, the heat dissipation area is increased, the rapid heat dissipation of the circuit board assembly is realized, and the temperature of the circuit board assembly during operation is reduced.

According to the smart glasses 20 provided in one embodiment of the present utility model, as shown in fig. 1, the heat dissipation structure 10 further includes a protective layer 104, the protective layer 104 in the embodiment of the present utility model is a plastic protective layer 104, the plastic protective layer 104 is disposed on a side of the conductive heat dissipation layer 101 facing away from the insulating heat dissipation layer 102, and in the embodiment of the present utility model, the protective layer 104 is disposed above the conductive heat dissipation layer 101 and is used for insulating the conductive heat dissipation layer 101. The plastic protective layer 104 may be a high density polyethylene material or a polypropylene material, and the plastic protective layer 104 is illustratively polyethylene terephthalate plastic.

According to one embodiment of the present utility model, a portion of the smart glasses 20 provided on the insulating heat sink layer 102 and/or the protective layer 104 extends and fills the area as shown in fig. 1.

In the embodiment provided in the present utility model, as shown in fig. 4, a portion of the insulating heat dissipation layer 102 extends and fills in the region, that is, the relief groove 105. In the working process, the antenna unit on the circuit board assembly emits and receives electromagnetic waves in the clearance area 201, and electromagnetic interference can be generated on the electromagnetic waves generated in the clearance area 201 due to the fact that the conductive heat dissipation layer 101 can conduct electricity, so that the area, corresponding to the clearance area 201, of the conductive heat dissipation layer 101 is required to be removed, part of the insulating heat dissipation layer 102 is filled into the clearance area 201, and on the basis of guaranteeing quick heat dissipation of the circuit board assembly, the electromagnetic waves can smoothly pass through without affecting the antenna performance of the clearance area 201.

In some embodiments, as shown in fig. 5, a portion of the protective layer 104 may also be extended and filled into the region, even if a portion of the protective layer 104 is filled into the relief groove 105. When the circuit board assembly works, the antenna unit emits and receives electromagnetic waves in the clearance area 201, electromagnetic interference can be generated on the electromagnetic waves generated in the clearance area 201 due to the fact that the conductive heat dissipation layer 101 can conduct electricity, the area, corresponding to the clearance area 201, of the conductive heat dissipation layer 101 is required to be removed, part of the protection layer 104 is filled into the clearance area 201, the protection layer 104 is made of polyethylene terephthalate plastics, and the protection layer 104 is nonconductive, so that the electromagnetic waves can smoothly pass through without affecting the antenna performance of the clearance area 201, and a protection effect is achieved on the circuit board assembly.

In other embodiments, as shown in fig. 6, the insulating heat dissipation layer 102 and the portion on the protection layer 104 may also be extended together and filled into the region, that is, the relief groove 105 together. In the working process of the circuit board assembly, the antenna unit emits and receives electromagnetic waves in the clearance area 201, and the insulating heat dissipation layer 102 and the protective layer 104 are made of insulating materials, so that the insulating heat dissipation layer 102 and the protective layer 104 are filled into the avoidance groove 105 together, and on the basis of guaranteeing the rapid heat dissipation of the circuit board assembly, the electromagnetic waves smoothly pass through without affecting the antenna performance of the clearance area 201, and the protection effect on the circuit board assembly can be achieved.

According to the smart glasses 20 provided by the embodiment of the present utility model, the clearance area 201 is provided with a plurality of areas, and the conductive heat dissipation layer 101 is provided with a plurality of areas corresponding to the plurality of clearance areas 201 one by one. In a specific embodiment, two avoidance grooves 105 may be provided, and when the circuit board assembly works, the antenna unit emits corresponding electromagnetic waves in the clearance area 201, and the electromagnetic waves in the clearance area 201 play a corresponding role through the insulating heat dissipation layer 102 or the protection layer 104 in the heat dissipation structure 10.

According to one embodiment of the present utility model, as shown in fig. 1, the insulating heat dissipation layer 102 is a boron nitride heat dissipation plate, and the conductive heat dissipation layer 101 is a graphite heat dissipation plate. In the embodiment of the present utility model, the conductive heat dissipation layer 101 is specifically graphene, which is a heat conduction and dissipation material with unique grain orientation, and uniformly conducts heat along two directions, so that the lamellar structure can adapt to different surfaces, and the performance of the smart glasses 20 is improved while shielding heat sources and components. The insulating heat dissipation layer 102 is hexagonal boron nitride, which has high heat resistance, low expansion coefficient, excellent electrical insulation and good corrosion resistance, the hexagonal boron nitride is arranged above the circuit board assembly, the graphite sheet is arranged on the hexagonal boron nitride, when the intelligent glasses 20 are used by users, the clearance area 201 on the circuit board assembly emits electromagnetic waves in the working process, and the hexagonal boron nitride is not conductive, so that the clearance area 201 can be completely covered; since the graphite sheet can conduct electricity and electromagnetic interference is generated to electromagnetic waves generated in the clearance area 201, the graphite sheet needs to avoid the clearance area 201, and the influence on the antenna function is reduced.

According to the smart glasses 20 provided in one embodiment of the present utility model, as shown in fig. 2, the heat dissipation structure 10 is disposed in a U shape, and the heat dissipation structure 10 extends from one surface of the circuit board assembly to the other surface opposite to the one surface. The heat dissipation structure 10 in the embodiment of the utility model includes a conductive heat dissipation layer 101 and an insulating heat dissipation layer 102, the insulating heat dissipation layer 102 is disposed above the circuit board assembly, the conductive heat dissipation layer 101 is disposed on the insulating heat dissipation layer 102, an adhesive layer 103 is disposed below the insulating heat dissipation layer 102, and the adhesive layer 103 is used for connecting the insulating heat dissipation layer 102 with the circuit board assembly. The heat dissipation structure 10 further includes a protection layer 104, where the protection layer 104 is located above the conductive heat dissipation layer 101 and is used for insulating the conductive heat dissipation layer 101.

In one embodiment, as shown in fig. 2, two clearance areas 201 may be disposed between the heat dissipation structure 10 and the PCB 205, where one clearance area 201 is disposed on the left side of the PCB 205 in the circuit board assembly, and the other clearance area 201 is disposed on the right side of the PCB 205 in the circuit board assembly. The U-shaped heat dissipation structure 10 and the PCB 205 in the circuit board assembly are taken as a whole, and heat generated by the PCB 205 in the working process is uniformly dispersed, so that the temperature of the whole circuit board assembly is reduced.

In another specific embodiment, as shown in fig. 1, the heat dissipation structure 10 is composed of four parts, namely, a protection layer 104, a conductive heat dissipation layer 101, an insulating heat dissipation layer 102, and an adhesive layer 103. Wherein, the thickness of the protective layer 104 is set to 0.05mm, the thickness of the conductive heat dissipation layer 101 is set to 0.05-0.2 mm, the thickness of the insulating heat dissipation layer 102 is set to 0.05-0.2 mm, and the thickness of the adhesive layer 103 is set to 0.05-0.25 mm. The thicknesses of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 can be set according to the specific space size of the circuit board assembly, the conductive heat dissipation layer 101 needs to avoid the antenna clearance area 201, the insulating heat dissipation layer 102 can completely cover the antenna clearance area 201, the heat dissipation structure 10 is made to be partially different in thickness, and the heat of the main board area is uniformly dispersed by utilizing the transverse heat conductivity coefficient of the insulating heat dissipation layer 102, so that the surface temperature of the circuit board assembly is reduced.

According to the smart glasses 20 provided by the embodiment of the utility model, the area of the conductive heat dissipation layer 101 on the other surface corresponding to the clearance area 201 is removed, and the removed area forms the avoidance groove 105 on the conductive heat dissipation layer 101, so that the influence on the antenna radiation function on the smart glasses 20 is reduced.

In some embodiments, since many circuit board components are disposed in the smart glasses 20, a lot of heat is generated during operation, and other electronic components, such as a power supply component, may also generate a certain amount of heat. Therefore, the conductive heat dissipation layer 101 extends to be in conflict with the heat conduction area, the graphene material is selected as the conductive heat dissipation layer 101, the graphene material is the material with the highest heat conduction coefficient at present, the heat conduction coefficient is far greater than that of air, the conductive heat dissipation layer 101 is contacted with the heat conduction area to realize quick heat conduction of the circuit board assembly main board area, the working temperature of the intelligent glasses 20 is reduced, and the experience of a user is improved.

In other embodiments, since the insulating heat dissipation layer 102 is hexagonal boron nitride, the thermal conductivity coefficient of the hexagonal boron nitride is greater than that of air, the insulating heat dissipation layer 102 is in contact with the thermal conductive area, so that the rapid thermal conduction of the circuit board assembly main board area can be realized, the working temperature of the intelligent glasses 20 is reduced, and the experience of the user is improved. The heat dissipation area is increased by utilizing the ductility and foldability of the conductive heat dissipation layer 101 and the insulating heat dissipation layer 102 to further extend the material.

The above embodiments are only for illustrating the present utility model, and are not limiting of the present utility model. While the utility model has been described in detail with reference to the embodiments, those skilled in the art will appreciate that various combinations, modifications, or equivalent substitutions can be made to the technical solutions of the present utility model without departing from the spirit and scope of the technical solutions of the present utility model, and it is intended to be covered by the scope of the claims of the present utility model. Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. An intelligent eyeglass, comprising:

2. The smart glasses according to claim 1, wherein the heat dissipation structure further comprises:

3. The smart glasses according to claim 2, wherein the heat dissipation structure further comprises:

4. A pair of smart glasses according to claim 3, wherein a portion of the insulating heat sink layer and/or the protective layer extends and fills into the region.

5. The smart glasses according to claim 3, wherein the plastic protective layer is polyethylene terephthalate plastic.

6. The intelligent glasses according to claim 1, wherein a plurality of clearance areas are provided, and a plurality of areas corresponding to the clearance areas are provided on the conductive heat dissipation layer.

7. The smart glasses according to any one of claims 1-6, wherein the insulating heat dissipation layer is a boron nitride heat sink and the conductive heat dissipation layer is a graphite heat sink.

8. The smart glasses according to any one of claims 1-6, wherein the heat dissipating structure is provided in a U-shape, the heat dissipating structure extending from one surface of the circuit board assembly to another surface opposite thereto.

9. The smart glasses according to claim 8, wherein a region of the other surface of the conductive heat sink layer corresponding to the headroom region is removed.

10. The pair of smart glasses according to claim 1, wherein a heat conducting area is provided on an inner side wall of the accommodating groove, and at least one of the conductive heat dissipation layer and the insulating heat dissipation layer extends to abut against the heat conducting area.