CN106877629A - A kind of power supply adaptor of pin radiating - Google Patents

Abstract

This application provides a power adapter with heat dissipation through the pins, which is used to conduct part of the heat generated by the internal components to the pins through the heat conduction structure, so that this part of the heat can be dissipated through the pins, effectively reducing the temperature of the adapter shell and the internal components. temperature. The power adapter of the embodiment of the present application includes: an adapter housing, a circuit structure, pins and a heat conduction structure; the adapter housing has a cavity for accommodating the circuit structure and pin holes; the pins are set in the pin holes, and the circuit structure is set in the cavity , the circuit structure includes a printed circuit board PCB and internal devices arranged on the PCB; the heat conduction structure is connected with the internal devices and pins.

Description

A power adapter with cooling pins

technical field

The present application relates to the field of power adapters, in particular to a power adapter with pin heat dissipation.

Background technique

Power adapters are widely used in consumer electronic products such as smartphones, tablet computers, and notebook computers. With the increasing battery capacity of electronic products, consumers have higher and higher demands for fast charging. In order to shorten the charging time of such consumer electronic products, generally This is achieved by increasing the charging power of the power adapter. In recent years, the charging power of power adapters has increased significantly. Taking smartphone adapters as an example, the charging power has increased from 5W to 10W, and even as high as 20W or more. One challenge brought about by the increase in the charging power of the power adapter is the heat dissipation of the adapter. The power adapter generally uses natural heat dissipation to meet the needs of different application scenarios. Limited by the size of the adapter and the natural heat dissipation capacity, the heat dissipation problem of high-power adapters is particularly prominent. On the one hand, the inside of the adapter The high temperature of the device will affect the life of the adapter; on the other hand, the high temperature of the adapter shell will make the user's temperature experience poor, and may even cause burns.

As shown in Figure 1, it is a schematic structural diagram of a power adapter with natural heat dissipation. The heat-generating device of the adapter is directly installed in the adapter, and the heat generated by the device is directly transmitted to the adapter shell through the air, and then the adapter shell passes through natural convection and radiation. to the external environment; as shown in Figure 2, it is a schematic structural diagram of a power adapter with heat conduction and temperature equalization technology. Uniform temperature and heat dissipation, so that the heat generated by the heating device is transferred to the inside of the adapter, and then transferred to the external environment through the adapter housing; Figure 3 is a schematic structural diagram of a power adapter with glue filling heat storage technology, the inside of the adapter The device is potted as a whole or partly with a heat-conducting potting material. There is a certain gap between the potting material and the inner wall of the adapter shell to prevent the heat of the local heating device from being directly transmitted to the adapter shell through the potting heat-conducting material. When the adapter works for a short time, The heat generated by the heat-generating device can be absorbed by the thermally conductive potting material, thereby reducing the temperature of the adapter case.

However, the natural heat dissipation capability of the power adapter shown in Figure 1 is limited by the size of the adapter, so it can only be applied to power adapters with low heat dissipation density. The adapter shell is generally made of plastic, and plastic has a low thermal conductivity and a relatively low temperature uniformity. Poor, it will lead to high local hot spot temperature of the adapter shell, and because the internal components of the adapter do not conduct heat effectively, the internal component temperature is high, which affects the life of the device; the power adapter shown in Figure 2 is generally made of plastic because the adapter shell has a low thermal conductivity , the local hot spot temperature of the adapter shell has a limited temperature equalization effect, and the overall heat dissipation capacity of the adapter cannot be greatly improved; the heat dissipation function of the power adapter shown in Figure 3 is limited by the filling amount of the potting heat-conducting material and the heat capacity of the material itself. It is only suitable for power adapters with a short duration of high-power charging. For power adapters with a long time of high-power charging, it cannot effectively reduce the temperature of the adapter shell.

Contents of the invention

This application provides a power adapter with heat dissipation through the pins, which is used to conduct part of the heat generated by the internal components to the pins through the heat conduction structure, so that this part of the heat can be dissipated through the pins, effectively reducing the temperature of the adapter shell and the internal components. temperature.

The first aspect of the present application provides a pin cooling power adapter, including:

Adapter housing, circuit structure, pins and heat conduction structure;

The adapter housing has a chamber and a pin hole to accommodate the circuit structure;

The pins are disposed in the pin holes, the circuit structure is disposed in the cavity, and the circuit structure includes a printed circuit board PCB and internal devices disposed on the PCB;

The heat conduction structure is connected with the internal device and the pin.

When the power adapter is charging, the pins are connected to the socket or the socket. Generally, the pins are made of copper alloy, which has good thermal conductivity. In this solution, the adapter housing of the power adapter has a circuit structure. The chamber and the pin holes, the pins are set in the pin holes, the circuit structure is set in the chamber, the circuit structure includes the PCB and the internal devices arranged on the PCB, the heat conduction structure is connected with the internal devices and the pins, when the power adapter is charging, The internal devices on the PCB will generate heat due to the power consumption during charging, and the heat intensity will increase with the increase of power consumption. In addition to natural heat dissipation, according to the heat transfer effect, the heat conduction structure is connected to the internal devices, then the internal devices Part of the heat will be conducted to the heat conduction structure, and the heat conduction structure will conduct the heat to the pins, and the pins can transfer the heat to the connected socket or row for dissipation, which is similar to the power adapter shown in Figure 1 and Figure 2 Compared with the power adapter shown in Figure 3, the heat conduction structure absorbs the internal heat due to the pins exporting part of the heat, so the heat through natural heat dissipation is reduced, so the temperature of the adapter shell and the internal components can be effectively reduced. After part of the device generates heat, it can also transfer the heat to the connected socket or socket through the pins for dissipation. In the case of high-power charging for a long time, it can effectively reduce the temperature of the adapter shell.

With reference to the first aspect of the present application, in the first embodiment of the first aspect of the present application, the heat conduction structure includes a heat conduction thin plate, a heat conduction material layer and a heat conduction insulating material layer;

The thermal conductive material layer fills and covers the internal device;

The heat conduction thin plate is arranged on the surface of the heat conduction material layer;

The thermally conductive insulating material layer is connected to the pin and the thermally conductive thin plate.

In the first aspect, the heat conduction structure is connected to internal devices and pins. If the material of the heat conduction structure may have thermal conductivity and electrical conductivity, it will affect the operation of internal devices. Therefore, in order to ensure that the pins are only connected to the internal The device is thermally connected without electrical connection. The thermally conductive structure needs to have a thermally conductive material layer, a thermally conductive thin plate, and a thermally conductive insulating material layer. The thermally conductive material layer is used to fill and cover the internal devices to ensure that the contact surface between the thermally conductive material layer and the internal devices is large enough. In order to better absorb the heat generated by the internal devices, the heat-conducting thin plate is arranged on the surface of the heat-conducting material layer, so that after the heat-conducting material layer absorbs the heat generated by the internal devices, part of the heat can be transferred to the heat-conducting thin plate through the heat transfer effect, and then the The heat-conducting insulating material layer is connected with the pin and the heat-conducting thin plate, so that the heat generated in the heat-conducting thin plate can be conducted to the pin through the heat-conducting insulating material layer, and due to the insulating properties of the heat-conducting insulating material layer, there will be no direct electrical contact between the pin and the internal device. connect.

In combination with the first embodiment of the first aspect of the present application, in the second embodiment of the first aspect of the present application, there are M pins, and the M is an integer greater than or equal to 2;

The heat-conducting thin plate has M sub-heat-conducting thin plates, and the M sub-heat-conducting thin plates are respectively arranged on part of the surface of the heat-conducting material layer;

The thermally conductive insulating material layer has M sub-thermally conductive insulating material layers;

Each sub-layer of heat-conducting insulating material is connected with one pin and one sub-heat-conducting thin plate.

Commonly used power adapters generally have 2 or 3 pins. In order to reduce the consumption of heat-conducting thin plates and heat-conducting insulating material layers, the heat-conducting thin plates can be of a split structure, that is, multiple sub-heat-conducting thin plates, and the number of sub-heat-conducting thin plates is consistent with the number of pins. , each sub-thermal conductive sheet corresponds to a pin, and since there are multiple sub-thermal conductive sheets, the thermally conductive insulating material layer can also be a split structure, one sub-thermal conductive insulating material layer corresponds to one pin, and the sub-thermal conductive thin plates can be respectively covered on the thermally conductive material The layer corresponds to the surface of the internal device with a large heat generation, which can reduce the temperature of some areas of the power adapter as needed, and at the same time reduce resource consumption.

In combination with the first embodiment of the first aspect of the present application, in the third embodiment of the first aspect of the present application, there are M pins, and the M is an integer greater than or equal to 2;

The heat-conducting insulating material layer is connected to M-N pins and the heat-conducting thin plate, N is an integer greater than zero and less than M, and N is an integer greater than or equal to 1 and less than M.

Commonly used power adapters generally have 2 or 3 pins. The power adapter can only conduct heat through part of the pins. If a 3-pin power adapter uses 2 pins for heat conduction, then a heat-conducting insulating material layer and a heat-conducting sheet are required. It is obviously smaller than when using 3 pins for heat conduction, which can reduce the consumption of heat conduction insulating material layer and heat conduction sheet.

With reference to the first aspect of the present application, in the fourth embodiment of the first aspect of the present application, the heat conduction structure includes a heat conduction thin plate, a heat conduction material layer, and a heat conduction insulating material layer;

The thermal conductive material layer fills and covers the internal device;

The thermally conductive insulating material layer is disposed on the surface of the thermally conductive material layer;

The heat conducting thin plate is connected with the heat conducting and insulating material layer and the pins.

In the first aspect, the heat conduction structure is connected to internal devices and pins. If the material of the heat conduction structure may have thermal conductivity and electrical conductivity, it will affect the operation of internal devices. Therefore, in order to ensure that the pins are only connected to the internal The device is thermally connected without electrical connection. The thermally conductive structure needs to have a thermally conductive material layer, a thermally conductive thin plate, and a thermally conductive insulating material layer. The thermally conductive material layer is used to fill and cover the internal devices to ensure that the contact surface between the thermally conductive material layer and the internal devices is large enough. In order to better absorb the heat generated by the internal devices, the heat-conducting insulating material layer is arranged on the surface of the heat-conducting material layer, so that after the heat-conducting material layer absorbs the heat generated by the internal devices, part of the heat can be transferred to the heat-conducting insulating material through the heat transfer effect layer, and then connect the heat-conducting insulating material layer to the pins through the heat-conducting thin plate, so that the heat in the heat-conducting insulating material layer can be conducted to the pins through the heat-conducting thin plate, and due to the insulating properties of the heat-conducting insulating material layer, there will be no gap between the pins and the internal devices direct electrical connection.

In combination with the fourth embodiment of the first aspect of the present application, in the fifth embodiment of the first aspect of the present application, there are M pins, and the M is an integer greater than or equal to 2;

The heat-conducting thin plate has M sub-heat-conducting thin plates;

Each sub-heat-conducting thin plate is connected to one pin and the layer of heat-conducting insulating material.

Commonly used power adapters generally have 2 or 3 pins. In order to reduce the consumption of the heat-conducting sheet, the heat-conducting sheet can be a split structure, that is, multiple sub-heat-conducting sheets. The number of sub-heat-conducting sheets is the same as the number of pins. The thin plate corresponds to a pin, and the sub-heat-conducting thin plates can respectively cover the surfaces of internal devices with high heat generation corresponding to the heat-conducting insulating material layer, which can reduce the temperature of some areas of the power adapter as needed, and at the same time reduce resource consumption.

In combination with the fourth embodiment of the first aspect of the present application, in the sixth embodiment of the first aspect of the present application, there are M pins, and the M is an integer greater than or equal to 2;

The heat-conducting thin plate is connected to M-N pins and the heat-conducting insulating material layer, N is an integer greater than zero and less than M, and N is an integer greater than or equal to 1 and less than M.

Commonly used power adapters generally have 2 or 3 pins. The power adapter can conduct heat through only part of the pins. If a 3-pin power adapter uses 2 pins for heat conduction, then the required heat-conducting sheet is the same as using 3 pins. The pins are significantly smaller when conducting heat, which can reduce the consumption of heat-conducting thin plates.

In combination with the first aspect of the present application, the first embodiment of the first aspect, the second embodiment of the first aspect, the third embodiment of the first aspect, the fourth embodiment of the first aspect, the fifth embodiment of the first aspect or the first aspect The sixth embodiment, in the seventh embodiment of the first aspect of the present application,

The thermally conductive sheet is a sheet material with a thermal conductivity greater than 100W/(m·K);

The heat-conducting material layer is a heat-conducting material with flexibility, elasticity and thermal conductivity;

The thermally conductive and insulating material layer is a thermally conductive and insulating material with thermal conductivity and electrical insulation.

The thermally conductive thin plate is a sheet-like material with a thermal conductivity greater than 100W/(m·K). Specifically, it can be a thermally conductive graphite sheet with a high thermal conductivity of about 1200W/(m·K), or an aluminum foil with a thermal conductivity of 200W/(m·K). The thermal conductivity of about K) can also be copper foil, which has a thermal conductivity of about 400W/(m·K). In addition, it can also be other materials, but the thermal conductivity is required to be greater than 100W/(m·K) , and is a solid sheet structure. The thermally conductive material layer may be a material with flexibility, elasticity and thermal conductivity such as a thermally conductive gasket, thermally conductive gel, or potting compound. The material of the thermally conductive insulating material layer has good thermal conductivity and electrical insulation, and may be a thermally conductive insulating film, an insulating film, or a ceramic sheet.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the drawings required for the embodiments and the description of the prior art.

FIG. 1 is a schematic structural diagram of a natural heat dissipation power adapter;

FIG. 2 is a schematic structural diagram of a power adapter with heat conduction and temperature equalization technology;

Fig. 3 is a structural schematic diagram of a power adapter with glue filling heat storage technology;

FIG. 4 is a schematic structural diagram of an embodiment of a power adapter with pin heat dissipation provided by the present application;

Fig. 5a and Fig. 5b are schematic structural diagrams of another embodiment of the power adapter with heat dissipation through the pins provided by the present application;

FIG. 6 is a schematic structural diagram of another embodiment of a power adapter with heat dissipation through pins provided by the present application;

FIG. 7 is a schematic structural diagram of another embodiment of a power adapter with heat dissipation through pins provided by the present application;

Fig. 8a and Fig. 8b are schematic structural diagrams of another embodiment of the power adapter with pin heat dissipation provided by the present application;

FIG. 9 is a schematic structural diagram of another embodiment of a power adapter with heat dissipation through pins provided by the present application;

FIG. 10 is a schematic structural diagram of another embodiment of the power adapter with heat dissipation through the pins provided by the present application.

detailed description

This application provides a power adapter with heat dissipation through the pins, which is used to conduct part of the heat generated by the internal components to the pins through the heat conduction structure, so that this part of the heat can be dissipated through the pins, effectively reducing the temperature of the adapter shell and the internal components. temperature.

The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings in this application.

Please refer to Fig. 4, the embodiment of the present application provides a power adapter with pin heat dissipation, including:

Adapter housing 401, circuit structure 402, pin 403 and heat conduction structure 404;

The adapter housing 401 has a cavity 4011 for accommodating the circuit structure and pin holes;

The pin 404 is set in the pin hole, the circuit structure 402 is set in the cavity, and the circuit structure 402 includes a PCB4021 and an internal device 4022 set on the PCB4021;

The heat conducting structure 404 is connected with the internal device 4022 and the pin 403 .

In the embodiment of the present application, when the power adapter is charging, the pin 403 is connected to the socket or the socket. Generally, the material of the pin 403 is copper alloy, which has good thermal conductivity. The adapter housing 401 of the power adapter It has a cavity 4011 and a pin hole for accommodating the circuit structure, the pin 404 is set in the pin hole, the circuit structure 402 is set in the cavity 4011, the circuit structure 402 includes a PCB 4021 and an internal device 4022 set on the PCB 4021, the heat conducting structure 404 and the internal device 4022 and pin 403 are connected. When the power adapter is charging, the internal device 4022 on the PCB 4021 will generate heat due to the power consumption during charging, and the heating intensity will increase with the increase of power consumption. In addition to natural heat dissipation, According to the heat transfer effect, the heat conducting structure 404 is connected to the internal device 4022, then part of the heat generated by the internal device 4022 will be conducted to the heat conducting structure 404, and the heat conducting structure 404 will conduct the heat to the pin 403, and the pin 403 can transfer the heat to The connected sockets or sockets dissipate heat. Compared with the power adapter shown in Figure 1 and Figure 2, since the pin 403 conducts part of the heat, the heat through natural heat dissipation is reduced, so the adapter shell can be effectively reduced. Body temperature and internal device temperature, compared with the power adapter shown in Figure 3, after the heat conduction structure 404 absorbs part of the heat generated by the internal device 4022, it can also transfer the heat to the connected socket or row socket through the pin 403 for dissipation. , the temperature of the adapter housing 401 can be effectively reduced in the case of high-power charging for a long time.

It should be noted that the thermally conductive thin plate 501 is a sheet material with a thermal conductivity greater than 100W/(m·K), specifically a thermally conductive graphite sheet with a high thermal conductivity of about 1200W/(m·K), or an aluminum foil. It has a thermal conductivity of about 200W/(m K), and it can also be copper foil, which has a thermal conductivity of about 400W/(m K). In addition, it can also be other materials, but the thermal conductivity is required to be greater than 100W /(m·K), and is a solid sheet structure. The thermally conductive material layer 502 may be a material with flexibility, elasticity and thermal conductivity such as a thermally conductive gasket, thermally conductive gel, or potting compound. The material of the thermally conductive insulating material layer 503 has good thermal conductivity and electrical insulation, and may be a thermally conductive insulating film, an insulating film, or a ceramic sheet.

It should be noted that the most commonly used material for the adapter housing 401 of the power adapter is plastic, and the internal components 4022 in FIG. The pin 403 of the large internal component 4022 is fixed at a fixed position of the adapter housing 401, and the number of the pin 403 is generally 2 or 3, and the possibility of more than 3 is not ruled out.

Optionally, as shown in Figure 5a and Figure 5b, in some embodiments of the present application, the heat conduction structure 404 includes a heat conduction thin plate 501, a heat conduction material layer 502 and a heat conduction insulation material layer 503;

The thermally conductive material layer 502 fills and covers the internal device 4022;

The heat conduction thin plate 501 is arranged on the surface of the heat conduction material layer 502;

The thermally conductive insulating material layer 503 is connected to the pin 403 and the thermally conductive thin plate 501 .

In the embodiment of the present application, in order to ensure that the pin 403 is only thermally connected to the internal device 4022 and has no electrical connection, the thermally conductive structure 404 needs to have a thermally conductive material layer 502, a thermally conductive thin plate 501, and a thermally conductive insulating material layer 503, as shown in Figures 5a and 5b. 5a is a schematic diagram of the side structure of the power adapter, and FIG. 5b is a schematic diagram of the bottom structure of the power adapter shown in FIG. The contact surface of the 4022 is large enough to better absorb the heat generated by the internal device 4022. The heat conduction thin plate 501 is arranged on the surface of the heat conduction material layer 502, so that the heat conduction material layer 502 can absorb the heat generated by the internal device 4022 and then transfer heat The effect conducts part of the heat to the heat-conducting thin plate 501, and then connects the heat-conducting insulating material layer 503 with the pin 403 and the heat-conducting thin plate 501, so that the heat generated in the heat-conducting thin plate 501 can be conducted to the pin 403 through the heat-conducting insulating material layer 503, and due to heat conduction Due to the insulating properties of the insulating material layer 503 , there will be no direct electrical connection between the pin 403 and the internal device 4022 . It should be noted that the number of pins 403 in Fig. 5b is 2, but it may also be 3 or more in practice.

Combining the embodiments shown in FIG. 5a and FIG. 5b, optionally, as shown in FIG. 6, in some embodiments of the present application, there are M pins 403, and M is 2;

The heat-conducting thin plate 501 has M sub-heat-conducting thin plates, and the M sub-heat-conducting thin plates are respectively arranged on part of the surface of the heat-conducting material layer;

The thermally conductive insulating material layer has M sub-thermally conductive insulating material layers;

Each sub-layer of heat-conducting insulating material is connected to one pin 403 and one sub-thermal-conducting thin plate 501 .

In the embodiment of the present application, there are 2 pins 403 in FIG. 6 , and commonly used power adapters generally have 2 or 3 pins. In order to reduce the consumption of the heat-conducting thin plate 501 and the heat-conducting insulating material layer, the heat-conducting thin plate 501 can be a split structure. That is, there are multiple sub-heat conduction sheets 601, the number of sub-heat conduction sheets 601 is consistent with the number of pins 403, and each sub-heat conduction sheet 601 corresponds to a pin 403, and since there are multiple sub-heat conduction sheets 601, the heat-conducting insulating material layer can also be divided Body structure, one sub-layer of heat-conducting insulating material corresponds to one pin 403, and the sub-heat-conducting thin plate 601 can cover the surface of the internal device with a large heat generation corresponding to the heat-conducting material layer, which can reduce the temperature of some areas of the power adapter as needed, and at the same time It can also reduce resource consumption.

With reference to the embodiments shown in FIG. 5a and FIG. 5b, optionally, as shown in FIG. 7, in some embodiments of the present application, there are M pins 403, M is 2, and N is 1;

The thermally conductive insulating material layer 503 is connected to the M-N pins 403 and the thermally conductive thin plate 501 .

In the embodiment of the present application, there are 2 pins 403 in FIG. The thermally conductive insulating material layer 503 shown in 5b is obviously smaller than that, which reduces the consumption of the thermally conductive insulating material layer 503 .

Optionally, as shown in FIG. 8 , in some embodiments of the present application, the heat conduction structure 404 includes a heat conduction thin plate 801 , a heat conduction material layer 802 and a heat conduction insulating material layer 803 ;

The thermally conductive material layer 802 fills and covers the internal device 4022;

The thermally conductive insulating material layer 4022 is disposed on the surface of the thermally conductive material layer 802;

The thermally conductive thin plate 801 is connected to the thermally conductive insulating material layer 802 and the pin 403 .

In the embodiment of the present application, in order to ensure that the pin 403 is only thermally connected to the internal device 4022 and has no electrical connection, the thermally conductive structure 404 needs to have a thermally conductive material layer 802, a thermally conductive thin plate 801, and a thermally conductive insulating material layer 803, as shown in Figures 8a and 8b. 8a is a schematic diagram of the side structure of the power adapter, and FIG. 8b is a schematic diagram of the bottom surface of the power adapter shown in FIG. The contact surface is large enough to better absorb the heat generated by the internal device 4022. The heat-conducting insulating material layer 803 is arranged on the surface of the heat-conducting material layer 802, so that after the heat-conducting material layer 802 absorbs the heat generated by the internal device 4022, it can pass heat The effect conducts part of the heat to the thermally conductive insulating material layer 803, and then connects the thermally conductive insulating material layer 803 to the pin 403 through the thermally conductive thin plate 801, so that the heat in the thermally conductive insulating material layer 803 can be conducted to the pin 403 through the thermally conductive thin plate 801, and due to Due to the insulating properties of the thermally conductive insulating material layer 803, there will be no direct electrical connection between the pins and internal devices.

Combining the embodiments shown in FIG. 8a and FIG. 8b, optionally, as shown in FIG. 9, in some embodiments of the present application, there are M pins, and M is 2;

The heat-conducting thin plate has M sub-heat-conducting thin plates 901;

Each sub-thermal conduction thin plate 901 is connected to a pin 403 and a heat conduction insulating material layer.

In the embodiment of the present application, there are 2 pins 403 in FIG. 9 , and commonly used power adapters generally have 2 or 3 pins. In order to reduce the consumption of the heat-conducting sheet, the heat-conducting sheet can be a split structure, that is, multiple sub-heat-conducting sheets 901 , the number of sub-heat conduction thin plates 901 is consistent with the number of pins 403, there are 2 pieces in Figure 9, each sub-heat conduction thin plate 901 corresponds to a pin 403, and the sub-heat conduction thin plates 901 can be respectively covered on the heat-conducting insulating material layer corresponding to a larger heat generation The surface of the internal device can reduce the temperature of some areas of the power adapter as needed, and at the same time reduce resource consumption.

Combining the embodiments shown in FIG. 8a and FIG. 8b, optionally, as shown in FIG. 10, in some embodiments of the present application, there are M pins, M is 2, and N is 1;

The thermally conductive thin plate 801 is connected to the M-N pins 403 and the thermally conductive insulating material layer.

In the embodiment of the present application, Fig. 10 includes 2 pins 403, commonly used power adapters generally have 2 or 3 pins, and the power adapter only uses 1 pin 403 to conduct heat, then the thermally conductive thin plate 801 and the one shown in Fig. 8b are required. The thermally conductive sheet 801 shown is significantly smaller.

The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still apply to the foregoing embodiments Modifications are made to the recorded technical solutions, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of each embodiment of the application.

Claims (10)

1. the power supply adaptor that a kind of pin radiates, it is characterised in that including：

Adapter housing, circuit structure, pin and conductive structure；

The adapter housing has the chamber and pin holes for accommodating the circuit structure；

The pin is arranged at the pin holes, and the circuit structure is arranged in the chamber, and the circuit structure includes print Printed circuit board PCB and the internal components being arranged on the PCB；

The conductive structure is connected with the internal components and the pin.

2. power supply adaptor according to claim 1, it is characterised in that the conductive structure includes heat conduction thin plate, heat conduction Material layer and heat-conducting insulation material layer；

The thermal conductive material layer filling covering internal components；

The heat conduction thin plate is arranged at the surface of the thermal conductive material layer；

The heat-conducting insulation material layer is connected with the pin and the heat conduction thin plate.

3. power supply adaptor according to claim 2, it is characterised in that the pin has M, the M be more than etc. In 2 integer；

The heat conduction thin plate has M block heat conduction thin plates, and the M blocks heat conduction thin plate is respectively arranged at the thermal conductive material layer Part surface；

The heat-conducting insulation material layer has M sub- heat-conducting insulation material layer；

Each sub- heat-conducting insulation material layer is connected with 1 pin and 1 piece of sub- heat conduction thin plate.

4. power supply adaptor according to claim 2, it is characterised in that the pin has M, the M be more than etc. In 2 integer；

The heat-conducting insulation material layer is connected with M-N pin and the heat conduction thin plate, and N is the integer less than M more than zero, and N is Integer more than or equal to 1 less than M.

5. power supply adaptor according to claim 1, it is characterised in that the conductive structure includes heat conduction thin plate, heat conduction Material layer and heat-conducting insulation material layer；

The thermal conductive material layer filling covering internal components；

The heat-conducting insulation material layer is arranged at the surface of the thermal conductive material layer；

The heat conduction thin plate is connected with heat-conducting insulation material layer and the pin.

6. power supply adaptor according to claim 5, it is characterised in that the pin has M, the M be more than etc. In 2 integer；

The heat conduction thin plate has M block heat conduction thin plates；

Each sub- heat conduction thin plate is connected with 1 pin and heat-conducting insulation material layer.

7. power supply adaptor according to claim 5, it is characterised in that the pin has M, the M be more than etc. In 2 integer；

The heat conduction thin plate is connected with the M-N pin and heat-conducting insulation material layer, and N is the integer less than M more than zero, N is the integer less than M more than or equal to 1.

8. the power supply adaptor according to any one of claim 1-7, it is characterised in that

The heat conduction thin plate is flaky material of the thermal conductivity factor more than 100W/ (mK).

9. the power supply adaptor according to any one of claim 1-7, it is characterised in that

The thermal conductive material layer is the Heat Conduction Material with flexible, elasticity and heat conductivity.

10. the power supply adaptor according to any one of claim 1-7, it is characterised in that

The heat-conducting insulation material layer is the heat-conducting insulation material with heat conductivity and electric insulating quality.