CN214672599U

CN214672599U - Novel heat-conductive copper foil

Info

Publication number: CN214672599U
Application number: CN202121316329.0U
Authority: CN
Inventors: 倪旭冬
Original assignee: Shenzhen Hangbang Xinsiyang New Material Co ltd
Current assignee: Shenzhen Hangbang Xinsiyang New Material Co ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2021-11-09
Anticipated expiration: 2031-06-11

Abstract

The utility model discloses a novel heat conduction electric copper foil, which comprises a copper substrate, a heat conduction adhesive layer, a release layer and a shielding layer, wherein the heat conduction adhesive layer and the shielding layer are respectively arranged at two sides of the copper substrate, the shielding layer is attached at one side of the heat conduction adhesive layer away from the copper substrate, the copper substrate is attached on an IC through the heat conduction adhesive layer, and part of heat generated during the operation of the IC can be transmitted to the copper substrate through the heat conduction adhesive layer to dissipate the heat of the IC; and a shielding layer is arranged on the other side of the copper substrate and used for shielding electromagnetic interference.

Description

Novel heat-conductive copper foil

Technical Field

The utility model relates to a copper foil technical field especially relates to a novel heat conduction electric copper foil.

Background

An IC chip is a chip formed by placing an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate. The IC needs to be attached with a corresponding copper foil in the processing process, and the electric conduction is realized through the copper foil. The existing IC can generate a large amount of heat in the working process, and the work of the IC is easily influenced when the temperature of the IC is higher and electromagnetic interference exists outside.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses a novel heat conduction electric copper foil can transmit the heat on the IC to can shield the IC.

The utility model discloses a novel heat-conducting and electric-conducting copper foil, which comprises a copper substrate, a heat-conducting adhesive layer, a release layer and a shielding layer, wherein,

the heat-conducting adhesive layer and the shielding layer are respectively arranged on two sides of the copper base material;

the shielding layer is attached to one side, far away from the copper base material, of the heat-conducting adhesive layer.

Furthermore, a first insulating layer is arranged between the copper base material and the heat conducting adhesive layer, and a second insulating layer is arranged between the copper base material and the shielding layer.

Further, the first insulating layer and the second insulating layer are both polyimide resin layers.

Furthermore, a plurality of heat conducting pieces are arranged on the copper foil, one end of each heat conducting piece is in contact with the copper base material, and the other end of each heat conducting piece penetrates through the second insulating layer and the shielding layer.

Furthermore, the shielding layer comprises a shielding coating and a metal shielding layer, the metal shielding layer is located on one side, away from the copper substrate, of the second insulating layer, and the shielding coating is coated on the outer side of the metal shielding layer.

Further, a graphene radiation layer is arranged on the outer side of the shielding coating and is in contact with the heat conducting piece.

Furthermore, be provided with from the type arch from the type layer with the side that the heat conduction glue layer contacted, pass through from the type layer attached from the type arch the heat conduction glue layer.

The technical scheme of the utility model, compared with the prior art, beneficial effect is:

the copper base material is attached to the IC through the heat-conducting adhesive layer, and part of heat generated by the IC during working can be transferred to the copper base material through the heat-conducting adhesive layer to dissipate heat of the IC; and a shielding layer is arranged on the other side of the copper substrate and used for shielding electromagnetic interference.

Drawings

FIG. 1 is an exploded view of a copper foil;

FIG. 2 is a schematic view of a copper foil provided with a first insulating layer and a second insulating layer;

fig. 3 is a schematic view of a copper foil provided with a thermal conductor and a graphene radiation layer;

description of the figures

100. Copper foil; 10. a copper base material; 20. a heat-conducting adhesive layer; 30. a release layer; 31. a release protrusion; 40. a shielding layer; 41. a metal shielding layer; 42. a barrier coating; 50. a first insulating layer; 60. a second insulating layer; 70. a heat conductive member; 80. a graphene radiation layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it should be noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or intervening components may exist. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; either mechanically or electrically, and may be internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

It should be further noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 1, the utility model discloses a novel heat conductive copper foil 100, attached on the IC, electrically connected with the IC through a conductive bus for conducting electricity.

Copper foil 100 includes copper substrate 10, heat-conducting adhesive layer 20, leaves type layer 30 and shielding layer 40, the both sides of copper substrate 10 are connected respectively heat-conducting adhesive layer 20 with shielding layer 30, heat-conducting adhesive layer 20 is kept away from one side of copper substrate 10 is attached with from type layer 30, when tearing away during from type layer 30, copper substrate 10 passes through heat-conducting adhesive layer 20 is attached on the IC, the heat accessible that the IC during operation produced heat-conducting adhesive layer 20 transmits on the copper substrate 10, the realization is right the heat transfer of IC. The shielding layer 40 is attached to one side of the copper substrate 10 far away from the heat-conducting adhesive layer 20, so that electromagnetic interference is shielded.

As shown in fig. 2, a first insulating layer 50 is disposed between the copper substrate 10 and the thermal conductive adhesive layer 20, a second insulating layer 60 is disposed between the copper substrate 10 and the shielding layer 40, and a conductive bus is connected to the copper substrate 10, so that the copper foil is electrically connected to other components through the conductive bus.

In the present embodiment, the first insulating layer 50 and the second insulating layer 60 are both polyimide resin layers.

As shown in fig. 3, the release layer 30 is close to a side of the thermal conductive adhesive layer 20 is provided with a plurality of release protrusions 31, and the release layer 30 is attached to the thermal conductive adhesive layer 20 through the release protrusions 31, which is convenient for the release layer 30 to separate from the thermal conductive adhesive layer 20.

Specifically, the release layer 30 is formed by processing release paper, and the release protrusion 31 is a bump arranged on the release paper.

The copper foil 100 is provided with a plurality of heat conductive members 70, one end of each heat conductive member 70 contacts the copper substrate 10, and the other end thereof passes through the second insulating layer 60 and the shielding layer 40. The heat of the copper substrate 10 can be transferred to the heat-conducting member 70, and the heat of the copper foil is dissipated through the heat-conducting member 70. The heat conducting member 70 may be made of graphite material, and a shielding adhesive is disposed at a contact position of the heat conducting member 70 and the copper substrate 10.

The shielding layer 40 is provided with a graphene radiation layer 80 on the outer side, and the graphene radiation layer 80 is in contact with the heat conducting member 70. The copper substrate 10 can transfer heat on the IC, and then the heat dissipation of the copper substrate 10 is achieved through the thermal conductive member 70 and the graphene radiation layer 80.

The shielding layer 40 comprises a shielding coating 42 and a metal shielding layer 41, the metal shielding layer 41 is located on one side of the second insulating layer 60 far away from the copper base material 10, and the shielding coating 42 is coated on the outer side of the metal shielding layer 41.

In this embodiment, the thickness of the copper substrate 10 is 10 to 15 um; the thickness of the heat-conducting adhesive layer 20 is 5-8 um; the thickness of graphene radiation layer 80 is 5-8 um.

The present invention can be designed in various embodiments and modifications without departing from the spirit and scope of the present invention in its broadest sense, and the above-described embodiments are intended to illustrate the present invention, but not to limit the scope of the present invention.

Claims

1. A novel heat-conducting and electric-conducting copper foil is characterized by comprising a copper substrate, a heat-conducting adhesive layer, a release layer and a shielding layer, wherein,

2. The novel thermally conductive copper foil as claimed in claim 1, wherein a first insulating layer is disposed between said copper substrate and said thermally conductive adhesive layer, and a second insulating layer is disposed between said copper substrate and said shielding layer.

3. The novel thermally conductive and electrically conductive copper foil as claimed in claim 2, wherein said first insulating layer and said second insulating layer are each a polyimide resin layer.

4. The novel thermally conductive copper foil as claimed in claim 2, wherein said copper foil is provided with a plurality of thermally conductive members, one end of said thermally conductive members contacting said copper substrate and the other end passing through said second insulating layer and said shielding layer.

5. The novel thermally conductive copper foil as claimed in claim 4, wherein said shielding layer comprises a shielding coating layer and a metallic shielding layer, said metallic shielding layer is located on the side of said second insulating layer away from said copper substrate, and said shielding coating layer is coated on the outside of said metallic shielding layer.

6. The novel thermally conductive copper foil as claimed in claim 5, wherein a graphene radiation layer is disposed on an outer side of said shielding coating layer, said graphene radiation layer being in contact with said thermal conductive member.

7. The novel heat conductive and electrically conductive copper foil as claimed in claim 1, wherein a release protrusion is disposed on a side of the release layer in contact with the heat conductive adhesive layer, and the release layer is attached to the heat conductive adhesive layer through the release protrusion.