1235635 五、發明說明（1) 【發明所屬之技術領域】 本發明係一種積層式散熱體之組成物，其主要係一項 將一種以上具不同功能性之物質疊置在一起形成一積層 物，以令使用時，可藉由該積層物之組成，來幫助電腦晶 片有效地將熱傳導並橫向擴散至散熱座之底座以加強散熱 及電磁干擾防制者。 【先前技術】 按，一般常見習知之散熱座，其主要係將一配合散熱 座形狀之模具加以固定後，再將原材（如：鋁·.）藉由擠 型、壓鑄或其它成型之方式，製成一散熱座本體，該散熱 座本體上並設有散熱鰭片，在使用時，將散熱座本體置放 於電腦晶片上，並藉由散熱鰭片將電腦晶片所產生之高熱 傳導出去。 惟，因該等散熱座之散熱效率除取決於散熱原材之熱 之傳導率及散熱率外，也決定於散熱座與電腦晶片接觸面 是否平整緊貼及散熱表面積，因此在電腦晶片與散熱座之 間常會塗上散熱膠（膏）以填平電腦晶片與散熱座表面來增 加緊貼效果，同時也為增加散熱效果，則會增加散熱鰭片 數量以增加散熱表面積，又，因電腦晶片之發熱源集中在 其中央突出部份，如使用鋁..等材質之散熱鰭片，雖然散 熱效果良好且價格宜，但，其導熱擴散效果並不比銅來的 好，除靠近發熱源之區域能散熱外，周邊之散熱鰭片卻無 法有效發揮散熱效果， 再者，另有一種習知散熱座，係以純銅為原材，其散1235635 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention is a composition of a laminated heat sink, which is mainly an item in which more than one substance having different functionalities are stacked together to form a laminated object. In use, the composition of the laminate can be used to help the computer chip effectively conduct heat and diffuse laterally to the base of the heat sink to enhance heat dissipation and prevent electromagnetic interference. [Previous technology] According to the commonly known heat sink, it is mainly to fix a mold that matches the shape of the heat sink, and then the original material (such as aluminum ..) is extruded, die-cast or other molding methods. A heat sink base is formed. The heat sink base is provided with heat dissipation fins. When in use, the heat sink base is placed on a computer chip, and the high heat generated by the computer chip is conducted through the heat dissipation fins. . However, because the heat dissipation efficiency of these heat sinks depends not only on the heat conductivity and heat dissipation of the heat sink material, but also on whether the contact surface of the heat sink and the computer chip is flat and close and the heat dissipation surface area, Thermal glue (paste) is often applied between the bases to fill the surface of the computer chip and the heat sink to increase the adhesion effect. At the same time, in order to increase the heat dissipation effect, the number of heat dissipation fins is increased to increase the heat dissipation surface area. The heat source is concentrated in the central protruding part. For example, heat dissipation fins such as aluminum .. are used. Although the heat dissipation effect is good and the price is good, the thermal diffusion effect is not better than that of copper. In addition to being able to dissipate heat, the surrounding fins cannot effectively dissipate the heat. In addition, there is another conventional heat sink, which uses pure copper as its raw material.
1235635 五、發明說明（2) 熱底座及散熱鰭片係以一體成形方式製作，此種裝置雖然 能將電腦晶片所產生之熱有效傳導至散熱座四周，但因銅 之價格高且重量重，又，其散熱效果不如以鋁為材質之效 果好。 又者，另有一種習知散熱座，係在鋁製之散熱座下加 一層銅片，利用銅良好之熱傳導率，快速將熱橫向擴散至 散熱座整個面，雖然此種裝置在使用時，可利用銅將熱先 橫向導熱再向上傳送，由銘散熱片散熱，增加散熱面積， 但因銅鋁之間並無法緊密結合在一起，必須藉由電焊或其 他加工方式，才能使兩者結合在一起，如此亦會造成銅、 鋁之材料間形成空隙（gap )，所以導熱之效果，亦隨之 減低。 為解決上述問題，有人在散熱座與電腦晶片之接觸面 加上散熱膏或散熱膠片，以增加接觸面間之緊貼密合效 果，惟，因該等散熱膠或散熱膏均由單一種物質製成，因 此，僅有一種功效產生，例如：由導熱性物質製成之散熱 膠或散熱膏主要將熱傳導出去，並無法使熱迅速擴散開， 而由熱擴散性物質製成之散熱膠或散熱膏僅能將熱散開， 並無法將熱迅速傳導出去，在導熱或熱擴散上效果皆不理 想。 【發明内容】 本發明乃鑑於上述以往散熱體之缺失，爰精心研究， 且不斷開發研究，終於發展出一種積層式散熱體之組成 1235635 五、發明說明（3) 物。 本發明之一目的，在提供一種積層式散熱體之組成 物，該組成物包含有一熱擴散層，該熱擴散層係為金屬片 或金屬網編織物與載體結合且經熟化之混合物，或為金屬 粉體與載體結合且經熟化之混合物，且該熱擴散層兩邊分 別貼置有一熱導層，該等熱導層係為一種或一種以上之高 導熱性物質與載體混合且經熟化之混合物，以令使用時， 可將本發明之積層物夾置在欲散熱物體與散熱座間，藉由 熱擴散層使欲散熱之發熱源其原集中在一處之熱迅速向周 邊擴散，同時，藉由熱導層使熱可由物體經導熱層迅速傳 導至散熱座，進而散發出去。 本發明之另一目的，在提供一種積層式散熱體之組成 物，該熱導層間除了可夾置一熱擴散層外，另，可夾置一 防EMI之介質層，該介質層可由高導磁物質，如錳鋅鐵淦 氧化陶瓷、鐵淦氧磁體、磁性金屬玻璃、鎳片..等或高導 電物質，如金屬銀、鋁、銅箔或..粉末等與膠體混合製 成，由於該數項物質具有高導磁性或高導電性，所以係用 來防止高低頻率之電磁干擾（Electromagnetic Interference)用 。 本發明之再一目的，在提供一種積層式散熱體之組成 物，其熱導層上之高導熱性物質包括氮化矽、氮化鋁、鑽 石粉、三氧化二鋁、氧化鋅、鎂矽氧化物陶瓷、鋁矽氧化 物陶瓷、石墨、金屬及碳…等粉體。 本發明又一目的，在提供一種積層式散熱體之組成1235635 V. Description of the invention (2) The thermal base and the radiating fins are made in one piece. Although this device can effectively conduct the heat generated by the computer chip to the periphery of the radiating base, but because of the high price and heavy weight of copper, In addition, its heat dissipation effect is not as good as that of aluminum. Also, there is another conventional heat sink, which is a layer of copper under the aluminum heat sink, which uses the good thermal conductivity of copper to quickly spread heat across the entire surface of the heat sink. Although this device is in use, You can use copper to transfer the heat first and then transfer it upwards. The heat is dissipated by the Ming heat sink, which increases the heat dissipation area. However, because copper and aluminum cannot be tightly connected, you must use welding or other processing methods to combine the two. Together, this will also cause gaps between the copper and aluminum materials, so the effect of heat conduction will be reduced accordingly. In order to solve the above problems, some people add a thermal paste or a thermal film to the contact surface of the heat sink and the computer chip to increase the close contact between the contact surfaces. However, because these thermal pastes or thermal pastes are made of a single substance Therefore, only one kind of effect is produced. For example, a heat sink or a heat sink made of a thermally conductive substance mainly conducts heat and cannot quickly spread the heat. A heat sink made of a heat diffusive substance or The thermal paste can only dissipate the heat, and it cannot conduct heat quickly, and it is not ideal in terms of heat conduction or heat diffusion. [Summary of the Invention] The present invention is based on the lack of the above-mentioned conventional heat sinks. Through careful research and continuous development and research, the composition of a laminated heat sink has finally been developed. 1235635 V. Invention Description (3). An object of the present invention is to provide a composition of a laminated heat sink, the composition comprising a heat diffusion layer, the heat diffusion layer is a mixture of a metal sheet or a metal mesh braid and a carrier and is matured, or A matured mixture of metal powder and carrier combined with a thermally conductive layer on each side of the heat diffusion layer. These thermally conductive layers are a mixture of one or more highly thermally conductive substances mixed with the carrier and matured. In order to use, the laminated material of the present invention can be sandwiched between the object to be radiated and the heat sink, and the heat source to be radiated by the heat diffusion layer can be quickly diffused to the surrounding heat, and at the same time, the The heat-conducting layer allows heat to be quickly conducted from the object to the heat sink through the heat-conducting layer, and then emitted. Another object of the present invention is to provide a composition of a laminated heat sink, in addition to sandwiching a heat diffusion layer between the heat conducting layers, and interposing an EMI-resistant dielectric layer. Magnetic substances, such as manganese-zinc-iron-oxide ceramics, ferrite magnets, magnetic metallic glass, nickel flakes, etc., or highly conductive substances, such as metallic silver, aluminum, copper foil, or powder, are mixed with colloids because These substances have high magnetic permeability or high conductivity, so they are used to prevent electromagnetic interference at high and low frequencies (Electromagnetic Interference). Still another object of the present invention is to provide a composition of a laminated heat sink. The highly thermally conductive substance on the thermal conductive layer includes silicon nitride, aluminum nitride, diamond powder, alumina, zinc oxide, and magnesium silicon. Powders such as oxide ceramics, alumina-silicon oxide ceramics, graphite, metals and carbon. Another object of the present invention is to provide a composition of a laminated heat sink
1235635 五、發明說明（4) 物，其載體具有在低溫即會產生相變化，以及熱膨脹係數 低之特性，而令該組成物使用時，可藉由載體之相變化， 迅速吸熱並濕潤介面，使散熱座與發熱源之間更為緊貼密 合，而讓熱更易擴散或傳導出去。 【實施方式】 本發明係一種積層式散熱體之組成物，本發明係一種 固態且為積層式之組成物1 0，請參照第1圖所示，且該組 成物1 0包含有一熱擴散層1 1，該熱擴散層1 1兩邊分別貼置 有一熱導層12。 其中，該熱擴散層11可由一種或一種以上之金屬物質 與一載體100混合而成，該金屬物質可為促進熱擴散之金 屬粉體，例如：銅之粉體，亦可由金屬片或金屬網編織物 與載體1 0 0結合而成，例如：銅之編織物或銅之薄片，而 熱導層12則可由一種或一種以上之高導熱性物質與載體 1 0 0混合而成，該高導熱性物質可為為氮化矽、氮化鋁、 鑽石粉、三氧化二鋁、氧化辞、鎂矽氧化物陶瓷、鋁矽氧 化物陶瓷、石墨、金屬及碳…·等物質粉末；另，載體1 0 0 則可為膠體或石臘，以令使用時，藉由載體其可具有在低 溫即會產生相變化、柔軟彈性及熱膨脹係數低之特性，使 散熱座與發熱源之間更為緊貼密合，而讓熱更易擴散或傳 導出去。 本發明組成物之製造方法，請參照第3圖所示，首 先，將定量之高導熱性物質，以下稱為主劑，並標示符號1235635 V. Description of the invention (4) The carrier has the characteristics of phase change at low temperature and low coefficient of thermal expansion. When the composition is used, the carrier can quickly absorb heat and wet the interface through the phase change of the carrier. Make the heat sink and the heat source closer to each other, and make it easier for the heat to spread or conduct. [Embodiment] The present invention is a laminated heat sink composition, the present invention is a solid and laminated constitution 10, please refer to FIG. 1, and the composition 10 includes a heat diffusion layer 1 1. A heat conducting layer 12 is attached to each side of the heat diffusion layer 1 1. The thermal diffusion layer 11 may be formed by mixing one or more metal substances with a carrier 100. The metal substance may be a metal powder that promotes thermal diffusion, such as a copper powder, or a metal sheet or a metal mesh. The braid is combined with a carrier 100, for example, a copper braid or a copper sheet, and the thermally conductive layer 12 may be a mixture of one or more highly thermally conductive substances and the carrier 100, which has high thermal conductivity. The sexual substance can be silicon nitride, aluminum nitride, diamond powder, alumina, oxide, magnesium silicon oxide ceramic, aluminum silicon oxide ceramic, graphite, metal, carbon, etc .; and other powder; 1 0 0 can be colloid or paraffin, so that when used, the carrier can have characteristics such as phase change at low temperature, soft elasticity and low coefficient of thermal expansion, which makes the heat sink and heat source tighter. It fits tightly, making it easier for heat to spread or conduct. For the method of manufacturing the composition of the present invention, please refer to FIG. 3. First, a quantitative amount of a highly thermally conductive substance is hereinafter referred to as a main agent, and is marked with a symbol.
第7頁 1235635 五、發明說明（5) 為2 0 0，再將載體1 0 0與主劑混合均勻後，藉由網版印刷方 式，將該混合物製成非常細薄之片狀物，再將定量之金屬 物質，以下稱為主劑，並標示符號為2 0 0，再將載體1 0 0與 主劑混合均勻後，藉由網版印刷方式，將該混合物製成非 常細薄之片狀物，並壓合在由高導熱性物質製成之片狀物 上，再將定量之高導熱性物質，以下稱為主劑，並標示符 號為2 0 0，再將載體1 0 0與主劑混合均勻後，藉由網版印刷 方式，將該混合物製成非常細薄之片狀物，並壓合在由金 屬物質製成之片狀物上，最後，再將該積層式之組成物10 與一離型紙貼靠在一起，即得到成品。 再者，請參照第2圖所示，該組成物1 0之熱導層1 2間 除了可夾置一熱擴散層11外，另，可夾置一防EMI之介質 層13，該介質層13可由具高導磁物質，如錳鋅鐵淦氧化陶 瓷、鐵淦氧磁體、或磁性金屬玻璃、鎳片..等物質或具高 導電物質，如金屬銀、鋁、銅箔或粉末..等，再與膠體混 合製成，由於該數項物質具有高導磁性或高導電性，所以 該介質層係用來防電磁干擾（Electromagnetic Interference)用 。 以令使用時，可將離型紙撕離組成物1 0，再將該組成 物10埋置在一散熱座20之凹槽21中（如第4圖所示），或貼 靠在散熱座20表面上（如第5圖所示），再將欲散熱之發熱 源3 0擱置其下，例如··中央處理器（CPU )、電子零件、電 腦週邊設備..等等，藉由熱擴散層11使欲散熱物體集中在 一處之熱迅速向周邊擴散出去，再藉由熱導層12，使熱可Page 7 1235635 V. Description of the invention (5) is 200, then the carrier 100 is mixed with the main agent uniformly, and the mixture is made into a very thin sheet by screen printing, and then A quantitative amount of metal substance is hereinafter referred to as the main agent, and the symbol is 2000. After the carrier 100 and the main agent are mixed uniformly, the mixture is made into a very thin sheet by screen printing. Material and pressed on a sheet made of a highly thermally conductive substance, and then a quantitative amount of the highly thermally conductive substance is hereinafter referred to as a main agent, and the symbol is 2 0 0, and the carrier 1 0 0 and After the main agent is evenly mixed, the mixture is made into a very thin sheet by screen printing, and then pressed onto a sheet made of a metal substance. Finally, the laminated composition The object 10 is abutted against a release paper to obtain a finished product. Further, referring to FIG. 2, in addition to a heat diffusion layer 11, the heat conductive layer 12 of the composition 10 can be sandwiched with a dielectric layer 13 for preventing EMI. 13 Can be made of materials with high magnetic permeability, such as manganese-zinc-iron oxide ceramics, ferrite magnets, or magnetic metallic glass, nickel flakes, etc., or materials with high conductivity, such as metallic silver, aluminum, copper foil, or powder .. It is then mixed with colloids. Because these materials have high magnetic permeability or high conductivity, the dielectric layer is used to prevent electromagnetic interference (Electromagnetic Interference). In order to use it, the release paper can be torn off the composition 10, and then the composition 10 is buried in the groove 21 of the heat sink 20 (as shown in FIG. 4), or it can be abutted against the heat sink 20 On the surface (as shown in Figure 5), the heat source 30 for heat dissipation is set aside, such as central processing unit (CPU), electronic parts, computer peripherals, etc., by means of a heat diffusion layer 11 Make the heat to be concentrated in one place quickly diffuse to the surrounding area, and then use the thermal conductive layer 12 to make the heat
1235635 五、發明說明（6) 由物體經導熱層12迅速傳導至散熱座20，進而散發出 去。 〇 綜上所述，本發明顯具有增進習知者之使用功效，而 具產業上之利用價值；又，本案在提出申請前未有相同或 近似之技術公開使用或見於刊物，因而本案應同時具有其 「新穎性」。本案申請人爰依專利法第十九條之規定，向 鈞局提出發明專利申請，並懇請准予專利，至感德便。 本案上述實施例，僅用以舉例說明本發明之一可行實 施例，對於熟悉該項技藝之人員，當可對其進行各種等效 之變化例，惟此等變化例，均應包括在本發明之精神及範 圍内。1235635 V. Description of the invention (6) The object is quickly conducted to the heat sink 20 through the heat conducting layer 12 and then emitted. 〇In summary, the present invention obviously has the effect of improving the use of the learner, and has industrial utility value; Also, before the application was filed, the same or similar technology was not publicly used or seen in the publication, so the case should be at the same time Has its "newness". The applicant of this case made an application for an invention patent to the Jun Bureau in accordance with the provisions of Article 19 of the Patent Law, and pleaded for the patent to be granted. The above embodiment in this case is only used to illustrate one feasible embodiment of the present invention. For those skilled in the art, various equivalent variations can be made to it, but these variations should be included in the present invention. Within the spirit and scope.
第9頁 1235635__ 圖式簡單說明 圖式之簡單說明： 第1圖為本發明之組成斷面示意圖。 第2圖為本發明之另一實施例之組成斷面示意圖。 第3圖本發明製造流程之示意圖。 第4圖為本發明實施時之斷面示意圖。 第5圖為本發明另一實施例之斷面示意圖。 主要元件圖號說明：Page 9 1235635__ Brief description of the drawings Brief description of the drawings: Figure 1 is a schematic sectional view of the composition of the present invention. FIG. 2 is a schematic sectional view of a composition according to another embodiment of the present invention. FIG. 3 is a schematic diagram of the manufacturing process of the present invention. Fig. 4 is a schematic sectional view when the present invention is implemented. FIG. 5 is a schematic sectional view of another embodiment of the present invention. Description of main component drawing numbers:
第10頁 組成物 10 熱擴散層 11 熱導層 12 介質層 13 散熱座 20 凹槽 21 發熱源 30 載體 100 主劑 200Page 10 Composition 10 Thermal diffusion layer 11 Thermal conductivity layer 12 Dielectric layer 13 Heat sink 20 Groove 21 Heating source 30 Carrier 100 Main agent 200