M277981 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種熱管散熱裝置，特別係關於一種可冷卻電子元件之熱 管散熱裝置。 【先前技術】 隨著電子産業之迅速發展，如中央處理器等電子元件之運算速度大鳩 度提南，其産生的熱量也隨之劇增，如何將電子元件之熱量散發出去，以 保證其正常運行，-直是業界重視的問題。爲有效散發中央處理器在運行 過程令産生之熱量，業界通常在中央處理n表面加裝_散熱關助其散 熱，從而使中央處理器自身溫度維持在正常運行範圍内。 傳統散熱器係通過與電子元件接觸之金屬基座及基座上之散熱鰭片來 將電子元件産生之熱量散發出去。但由於金屬材質自身熱阻之限制，熱量 不能迅速傳至散熱鰭片頂端。散熱鰭片大部分利用率仍然較低，散熱器不 砲滿足向發熱量之要求。 目前，業界採用熱管傳導熱量之散熱裝置曰益增多，熱管係在金屬管 體内密封裝入毛細結構物（如金屬粉末燒結物、溝槽結構、絲網結構等） 及工作液體（如水、酒精等），然後抽至真空狀態，依賴工作液體受熱後 進行液氣兩相變化而吸收、釋放熱量，且由於熱管有一定長度，可將熱量 傳遞至較遠端。 大陸專利第03223425.2號，揭露了一種典型之熱管散熱裝置，請參閱 第一圖，該散熱器1〇具有第一基座12、與第一基座平行設置之第二基座 以及設於第一基座12與第二基座18之間的複數平行散熱鰭片π，第一某 M277981 -弟—基座18相同之一側面開設有複數穿 π仪双牙孔14、19,熱管2〇之兩端 插入該等穿孔14、19中。 趟雙基座之散熱H結構’由於歸傳熱快，熱量可由第-基座快速 傳至第二基座’故，散熱效果提升，但散熱器發熱量較高時，則中間利 用率低，需改進。 【新型内容】 本創作實施例熱管散熱裝置包括一第一 匕秸弟政熱益，該第一散熱器設有第 一基座及置於第一基座上之複數第一 U 弟一散熱器，該第二散熱 态設有第二基座及置於第二基座上 — 錢{，射，該第二基座 與第一物相接觸；及-侧—與第二基座之第—鮮，該熱管散熱 裝置還包括m該第屬物及第二散熱片。 該實施方式較習知技術具有如下優點：由於熱管散熱裝置之第一熱管 將第-基座及第二基座熱連接，第_基座之熱量藉由第—散鮮及第二散 熱器散發；糾，齡麵m細_輪帛二散熱片熱連 接，第-基座之部分熱量藉由第二散熱片直接散發出去，散熱效果大大提 兩。 【實施方式】 參閱第二圖及第三圖’本創作熱管散熱裝置包括第_散熱器丨，該第一 散熱器^包括與電子元件（圖中未示）接觸之第一基座12及設於第一基座 U上且相互平行之複數第—散熱片14 基座12上設有一對相互平行 之第-溝槽及-第二溝槽122 ’第—基座12之四角分別設有一扣耳 124 ’扣耳124上裝設有螺絲128及彈性元件126，其用以將第—散熱器1 M277981 固定於電子元件上。第一散熱片14朝向底座12之一側開設有與第一溝槽 120相對應之第一開槽14〇及與第一開槽140相鄰且呈方形設置之第三開槽 144第一散熱片14为向底座12之一側設有二相互平行之第二開槽μ)。 第政熱器1上a又置有弟一散熱裔2 ’彡亥第二散熱器2包括一第-其户 22及設於該第二基座22上複數相互平行之第二散熱片24，該第二丼座ρ 與第一基座12平行相對，而第一散熱片14位於第一基座12與第二美座以 間。母-第二散熱片24平行於第二基座22。第二基座22底部設有一對與 第二開槽142相對應之凹槽22〇。第二散熱片24均設有二貫穿孔挪。、 第-基座12與第二基座22間連設有呈“υ”型設置之第—熱管3、4, 該二熱管3、4包括吸熱部3G，，放熱部32、42及連接吸熱㈣、奶與 放^部32、42之連接部34、44。其中，吸熱部3〇、4〇與放熱部η、^平 ❿又置。第一熱管3、4之吸熱部30、40收容於第-基座12 120 :部Μ收容於第二基座22之凹槽22。與第一散熱片i : 共同構成之孔_。 _142 熱管錢裝置觀財將第-基座12及第二散細24 放熱部52。其中該吸熱部50收容於第一美 溝槽122與第—散 土 之第二 月又濟片14之第三開槽144共 穿設於第二散㈣， 」軸之孔_。放熱部52 、范2中之二穿孔240中。 本創作在使用主 傳導至第-散⑼H座丨2做賴元件産生之熱量，-部分直接 4 ’第-熱管3、4將熱量傳遞給第二散熱器2之第二基 8 M277981 座22，再傳導至第一散熱片丨4及第二散熱片 —一 〜斗進而向外散發；另一方 面第二熱管5將熱量直接傳遞給第二散熱器） 一 <弟二散熱片24將鈦量$ 失。第一散熱器1及第二散熱器2 —側設置 月 <紙扇6用來增強第一及第二 散熱片14、24與周圍氣體間之熱交換作用。 還可以理解地，上述實施例中的第二散熱器2可置於第一散熱器^之 一側，使第二基座22垂直於第一基座12。第二散熱片Μ亦可垂直於第二 基座22。M277981 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a kind of heat pipe heat sink, especially a heat pipe heat sink capable of cooling electronic components. [Previous technology] With the rapid development of the electronics industry, the operating speed of electronic components such as central processing units has been greatly increased, and the heat generated by them has also increased dramatically. How to radiate the heat of electronic components to ensure their Normal operation-is an issue that the industry attaches importance to. In order to effectively dissipate the heat generated by the central processing unit during operation, the industry usually installs _ heat dissipation on the surface of the central processing unit to help dissipate the heat, so that the temperature of the central processing unit itself is maintained within the normal operating range. Traditional heat sinks use a metal base in contact with electronic components and heat dissipation fins on the base to dissipate the heat generated by the electronic components. However, due to the limitation of the thermal resistance of the metal material, heat cannot be quickly transferred to the top of the heat sink fin. Most of the heat dissipation fins are still low in utilization, and the heat sink does not meet the requirements of heat generation. At present, the industry has increased the use of heat pipes to conduct heat. The heat pipes are sealed in the metal pipe with capillary structures (such as sintered metal powder, groove structure, wire mesh structure, etc.) and working fluids (such as water, alcohol). Etc.), and then evacuated to a vacuum state. It absorbs and releases heat by relying on liquid-gas two-phase change after the working liquid is heated, and because the heat pipe has a certain length, it can transfer heat to the far end. Continental Patent No. 03223425.2 discloses a typical heat pipe heat sink device. Please refer to the first figure. The heat sink 10 has a first base 12, a second base disposed parallel to the first base, and a first base The plurality of parallel radiating fins π between the base 12 and the second base 18, the first M277981-brother-the same side of the base 18 is provided with a plurality of double-piston holes 14, 19, and a heat pipe 20 Both ends are inserted into these perforations 14,19. The heat dissipation H structure of the double base is 'because the heat transfer is fast and the heat can be quickly transferred from the first base to the second base'. Therefore, the heat dissipation effect is improved. Need improvement. [New content] The heat pipe cooling device of this creative embodiment includes a first heat sink, a first heat sink, a first base, and a plurality of first U heat sinks placed on the first base. The second heat-dissipating state is provided with a second base and placed on the second base—qian {, shoot, the second base is in contact with the first object; and-side—the first and second base— The heat pipe heat dissipation device further includes the first attribute and the second heat sink. This embodiment has the following advantages over the conventional technology: Since the first heat pipe of the heat pipe heat dissipating device thermally connects the first base and the second base, the heat of the first base is dissipated through the first and second radiators. Correction, the age surface m is thin. The second heat sink is thermally connected. Part of the heat of the first base is directly dissipated through the second heat sink, which greatly improves the heat dissipation effect. [Embodiment] Referring to the second and third figures, the heat pipe radiating device of the present invention includes a first heat sink, which includes a first base 12 and a device in contact with an electronic component (not shown). On the first base U, a plurality of parallel-numbered heat sinks 14 are provided on the base 12 and a pair of mutually parallel first-grooves and -second grooves 122 are provided on the four corners of the first-base 12 respectively. The ears 124 'are provided with screws 128 and elastic elements 126, which are used to fix the first heat sink 1 M277981 to the electronic components. The first heat sink 14 is provided with a first slot 14 corresponding to the first groove 120 and a third slot 144 adjacent to the first slot 140 and arranged in a square. The sheet 14 is provided with two mutually parallel second slots μ) on one side of the base 12. The second heat radiator 1 is provided with a heat sink 2 ′, and the second heat sink 2 includes a first-family member 22 and a plurality of second heat sinks 24 provided on the second base 22 in parallel with each other. The second base ρ is parallel to the first base 12, and the first heat sink 14 is located between the first base 12 and the second base. The female-second heat sink 24 is parallel to the second base 22. The bottom of the second base 22 is provided with a pair of grooves 22 corresponding to the second slot 142. The second heat sink 24 is provided with two through holes. The first heat pipes 3 and 4 are arranged between the first base 12 and the second base 22 in a “υ” shape. The two heat pipes 3 and 4 include a heat absorption portion 3G, a heat radiation portion 32, 42 and a connection heat absorption. The connecting portions 34, 44 of the urn, milk and the receiving portions 32, 42. Among them, the heat absorbing portions 30 and 40 and the heat radiating portions η and 平 are disposed again. The heat absorbing portions 30 and 40 of the first heat pipes 3 and 4 are received in the first base 12 120: the portion M is received in the groove 22 of the second base 22. And the first heat sink i: a hole formed together. _142 The heat pipe money device Guancai will release the first base 12 and the second diffuser 24 to the heat releasing portion 52. The heat absorbing portion 50 is accommodated in the first beautiful groove 122 and the third slot 144 of the second piece of loose soil and the second slot 14 of the first piece 14 are both penetrated and arranged in the second loose hole. The exothermic part 52 and two of Fan 2 are perforated 240. In this creation, the heat generated by the main conduction to the second-H-block H is used as the component, and some of the heat is directly transmitted to the second base 8 M277981 block 22 of the second heat-sink 3, 4. It is then conducted to the first heat sink 丨 4 and the second heat sink—one to the bucket and then radiated outward; on the other hand, the second heat pipe 5 directly transfers heat to the second heat sink)-< The second heat sink 24 is titanium The amount is missing. The first radiator 1 and the second radiator 2 are arranged on one side. ≪ Paper fan 6 is used to enhance the heat exchange effect between the first and second heat sinks 14, 24 and the surrounding gas. It can also be understood that the second heat sink 2 in the above embodiment can be placed on one side of the first heat sink 2 such that the second base 22 is perpendicular to the first base 12. The second heat sink M may also be perpendicular to the second base 22.
綜上所述，本創作符合新型專利要件，爰依法提出專利申請。惟，以 上所述者僅為本創作之健實關，舉凡熟悉本案技藝之人士，在爱依本 創作精神所作之等效修料變化，賴涵蓋於町之巾請專觀圍内。 【圖式簡單說明】 第-圖係習知技術中大陸專利第助34252號揭露之散熱器之立體圖。 第二圖係本創作熱管散熱裝置之立體分解示意圖。 第二圖係弟二圖之組裝立體圖。 【主要元件符號說明】 第一散熱器 1 第一基座 12 第一溝槽 120 第二溝槽 122 扣耳 124 彈性元件 126 螺絲 128 第一散熱片 14 第一開槽 140 第二開槽 142 第三開槽 144 第二散熱器 2 第二基座 22 凹槽 220 第二散熱片 24 貫穿孔 240 9 M277981 第一熱管 3, 4 吸熱部 30, 40, 50 放熱部 32, 42, 52 連接部 34, 44 第二熱管 5 風扇 6In summary, this creation complies with the requirements for new patents, and a patent application is filed in accordance with the law. However, those mentioned above are only the key to this creation. For those who are familiar with the skills of this case, the equivalent repair changes made in the spirit of Aiben's creation are covered by the town's towel. [Brief description of the drawings] Figure-Figure is a perspective view of the radiator disclosed in Continental Patent No. 34252 in the conventional technology. The second figure is a three-dimensional exploded view of the heat pipe cooling device of this creation. The second picture is an assembled perspective view of the second picture. [Description of main component symbols] First heat sink 1 First base 12 First groove 120 Second groove 122 Buckle ear 124 Elastic element 126 Screw 128 First heat sink 14 First slot 140 Second slot 142 Three slotted 144 Second heat sink 2 Second base 22 Groove 220 Second heat sink 24 Through hole 240 9 M277981 First heat pipe 3, 4 Heat sink 30, 40, 50 Heat sink 32, 42, 52 Connection 34 , 44 second heat pipe 5 fan 6
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