200825688 .九、發明說明： :【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種冷卻電子元 件之熱管散熱裝置。 【先前技術】 隨著電子產業不斷發展，中央處理器等電子元件之運 行速度和整體性能不斷提升，其發熱量隨之增加，另一方 ，面，電子元件之集成度日益深化，體積越來越小，故其發 熱問題也就更加突出，使得業界單純使用金屬實體散熱之 散熱裝置無法滿足高端電子元件之散熱需求。 爲此，業界開始使用帶有熱管之散熱裝置。熱管係主 要由真空密封之管形殼體、殼體内壁上設置之毛細結構（如 粉末燒結物、溝槽結構、絲網結構等）及其裝入殼體内之 適量工作液體（如水、酒精、丙酮等）組成。熱管係通過 (工作液體受熱、冷卻進行氣、液兩相變化而吸、放熱量而 達到傳熱目的，由於熱管之傳熱速度快且傳熱距離長而得 到廣泛應用。 系用之熱管散熱裝置包括用於接觸發熱電子元件之一 底座、與該底座接觸之兩熱管及設於該底座上之複數散熱 鰭^。該底座上設有凹槽，該複數散熱鰭片設有穿孔，該 ^ S包括蒸發部、平行於該蒸發部之冷凝部及連接該蒸發 /矛冷凝部之連接部，該蒸發部、冷凝部皆爲直線形，該 蒸發部結合至底座之凹槽内，冷凝部結合至散熱鰭片之穿 7 200825688 孔内。工作時，該底座吸收發熱電子元件產生之熱，其中 部分熱量直接由該底座傳遞至散熱鰭片而散發至'周圍空 •間，另一部分熱量經由熱管之蒸發部從該底座傳遞至散熱 鰭片之離基座較遠之部分進而散發至缺 用^熱管無論彎折多少次，其均於同一平面延伸^結二 熱管不能得到靈活應用：要麼兩熱管相距較遠，使得墓發 部離熱源中心較遠’不利於熱量之吸收；要麼兩熱管相^ 很^，使得冷凝部太集中，不利於熱量之散發。總之，採 用凡王於同平面延伸之熱管不能同時使熱管之蒸發部集 中於底座t部’熱管之冷凝部恰當間隔使熱量均勾分佈於 政熱片上。因此’散熱裝置之散熱性能得不到最大之提昇。 【發明内容】 有鑒於此，有必要提供一種能同時使熱管之蒸發部集 中於底座中口 [5 ’而熱官之冷凝部恰當間隔使熱量均勻分佈 於散熱片上之熱管散熱裝置。 —種熱管散熱裝置，包括—底座、複數散熱轉片及連 接該底座與散熱韓片之第一、二熱管，每一熱管均包括吸 f部及放熱部’該第—熱管之吸熱部彎曲並與該底座結 :放熱β由吸熱部兩端延伸而出並穿過散熱轉片，該 f二熱f之吸熱部連接該底座而位於該第-熱管彎曲狀之 σ .、、、-p之内側而其放熱部由其吸熱部兩端 過散熱鰭片，該第一 _ 弟熱^之至少一放熱部設置於該第二埶 官之放熱部之間。 ’ 200825688 與習知技術相比，該熱管散熱裝置中由於至少一敎管 :彎曲不㉔共面之限制，因此可以作靈活性彎曲，從^ 1管可穿設於散熱鰭片之中部及兩端部，使集中於該底: 中权熱量傳遞到散熱鰭片之中部及兩端部，進而將孰量 均句地分佈於整個散熱韓片上有效地向外散發，該孰；散 熱裝置之散熱能力得以較大之提昇。 政 【實施方式】 . 〜…、&政熱裝置用來安裝於電路板 ㈤不）上以對其上之中央處理器（圖未示）等發 子元件上進行散熱。該熱管散熱裝置包括一底座1〇、㈣ 土二之散熱鰭片組合2〇、貼設於該底座10與該散 Γ:人Γ〇:方之第—和第二熱管30、40及插設至該散熱鰭 風扇固定架50與風扇6〇。該熱管繼置 兮二政rσ於該底座1。上用以協助固定該熱管散熱裝置到 該電路板上之兩扣臂70。 該底座10爲-高導熱性金屬板體，其大致呈方形。該 底座=具有用於接觸電子元件之下表面及與該下表面相對 之上表面。該底座10上部順次開設有用以容置熱管％、4〇 Π:行溝槽12、14。其中兩平行溝槽12位於底座10上 :嫌致爲溝…，由該底座,。一端部二: 底座κ)兩側向外水平延伸出一對厚度小於該底座ι〇 之厚度、用以與扣臂70配合之定位部16，每_定位部耻 200825688 設有兩通孔160。 ； 該散熱鰭片組合20中每一散熱鰭片均由金屬薄片製 /成，其包括由金屬薄片連續彎折形成垂直於該底座10之散 熱件220和設置於散熱件220上方之平行於底座10之散熱鰭 片組240，且該散熱件220垂直於該散熱鰭片組240。該散熱 鰭片組240前方兩側邊設有插槽242，且該散熱鰭片組240設 有供熱管30、40穿入之通孔244。該散熱鰭片組240之最外 側鰭片垂直向下延伸至底座10邊緣形成二擋板246，每一擋 板246與該散熱件220之間形成供風扇60吹出之氣流通過之 一通風道248。該散熱鰭片組240之後侧向底座10方向傾斜 延伸出一導風板249，該導風板249引導經過通風道248之氣 流吹向底座10 (如圖4所示）。 該第一熱管30包括大體呈η形之吸熱部32、從吸熱部32 兩端垂直向上延伸之一對放熱部34。該吸熱部32包括容納 於其中之一溝槽12内之第一吸熱段320與容納於溝槽14内 ^ 之第二吸熱段322。該第二吸熱段322之長度小於第一吸熱 段320之長度且二者相互平行分佈。該第一熱管30之每一放 熱部34與該放熱部32所於之平面成一定角度，本實施例中 每一放熱部34垂直於該放熱部32所於之平面。該放熱部34 穿設於散熱鰭片組240之通孔244内。 該第二熱管40大體呈U形，包括吸熱部42、從吸熱部42 兩端垂直向上延伸之一對放熱部44。該吸熱部42容置於另 一溝槽12内，夾置於該第一熱管30之第一吸熱段320與第二 吸熱段322之間。該放熱部44穿設於散熱鰭片組240之通孔 200825688 244 内。 ； 該扣臂70包括可置於底座定位部16内之定位桿72及從 /定位桿72兩端呈一定角度向外延伸之扣合桿74。該定位桿 72上設有孔洞76，通過螺釘或鉚釘90等穿過該定位部16之 通孔160及定位桿72上之孔洞76將扣臂70固定到底座10下 部。該扣合桿74上設有通孔（圖未示），方便螺釘或鉚釘 90等穿過從而將該熱管散熱裝置固定到電路板上。 該風扇固定架50包括細長本體510、由本體510兩側相 " 對延伸出之面板520與定位片530。該面板520下端部設有螺 孔 525。 該風扇60包括方形框體62,該框體62四角設有穿孔（圖 未示），螺釘或鉚釘80等穿過穿孔與風扇固定架50上之螺 孔525配合將該風扇60固定到風扇固定架50上。 請同時參看圖2和圖3，該底座定位部16貼設於扣臂70 之定位桿72上。該第一熱管30之吸熱部32、第二熱管40之 、吸熱部42 (圖未示）分別熱接觸之容納於底座10上之溝槽 12、14 (圖未示）内。該第一熱管30之放熱部34豎直地穿 入散熱鰭片組240之通孔244内並設置於散熱鰭片組240之 中部及端部。該第二熱管40之吸熱部42豎直地穿入散熱鰭 片組240之通孔244内並設置於散熱鰭片組240之兩端部。該 散熱件220之折邊還分別與底座10之上表面及散熱鰭片組 240之下表面熱接觸。該風扇60通過螺釘或鉚釘80定位於風 扇固定架50上。該風扇固定架50之定位片530插設於散熱鰭 11 200825688 片組240兩側之插槽242内，將該風扇固定架50固定於該散 熱鰭片組240前方。 請同時參看圖3與圖4,該第一熱管30之放熱部34位於 散熱鰭片組240之中部及一端部；該第二熱管40之放熱部44 分別位於散熱鰭片組240之兩端部，兩熱管30、40之放熱部 34、44大致將散熱鰭片組240於其長度方向分爲三個區域。 兩熱管30、40將積聚於底座10中部之熱量傳送到散熱鰭片 組240中部及兩端部，使其均勻分佈於整個散熱鰭片組合20 上，便於該散熱鰭片組240均勻地將其上熱量向外散發。 除本實施例外，該第一熱管30之第一、二吸熱段320、 322也可設置爲長度相等之兩部分，此時第一熱管30之兩放 熱部34同時設置於第二熱管40之兩放熱部44之間。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明熱管散熱裝置之立體分解圖。 圖2係圖1之部分組裝圖。 圖3係圖1之組裝圖。 圖4係圖3之侧視圖。 12 200825688 【主要元件符號說明】 . 底座 10 " 定位部 16 散熱鰭片組合 20 散熱鰭片組 240 風道 248 第一熱管 30 ， 放熱部 34、44 第二吸熱段 322 風扇固定架 50 面板 520 螺孔 525 框體 62 定位桿 72 ^ 孔洞 76 擋板 246 溝槽 12、 14 通孔 160 、244 散熱件 220 插槽 242 導風板 249 吸熱部 32、 42 第一吸熱段 320 第二熱管 40 本體 510 定位片 530 風扇 60 扣臂 70 扣合桿 74 螺釘 80、 90 13200825688. IX. INSTRUCTIONS: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat pipe heat dissipating device for cooling an electronic component. [Prior Art] With the continuous development of the electronics industry, the operating speed and overall performance of electronic components such as central processing units continue to increase, and the amount of heat generated by them increases. On the other hand, the integration of electronic components is deepening and the volume is becoming more and more Small, so the problem of heat is more prominent, making the industry simply use the heat dissipation device of the metal body to meet the heat dissipation requirements of high-end electronic components. To this end, the industry has begun to use heat sinks with heat pipes. The heat pipe system is mainly composed of a vacuum-sealed tubular shell, a capillary structure (such as a powder sintered product, a groove structure, a wire mesh structure, etc.) disposed on the inner wall of the casing and an appropriate amount of working liquid (such as water and alcohol) installed in the casing. , acetone, etc.) composition. The heat pipe system is used for heat transfer by the work liquid being heated and cooled by gas and liquid two-phase change, and the heat transfer is fast, and the heat transfer distance is long, and the heat pipe is widely used. The utility model comprises a heat pipe for contacting one of the heat-generating electronic components, two heat pipes contacting the base, and a plurality of heat-dissipating fins disposed on the base. The base is provided with a groove, and the plurality of heat-dissipating fins are provided with perforations, and the plurality of heat-dissipating fins are provided with perforations. The evaporation portion, the condensation portion parallel to the evaporation portion, and the connection portion connecting the evaporation/spear condensation portion, the evaporation portion and the condensation portion are all linear, and the evaporation portion is coupled into the groove of the base, and the condensation portion is coupled to The fins are worn 7 200825688 Holes. During operation, the base absorbs the heat generated by the heat-generating electronic components, and some of the heat is directly transmitted from the base to the heat-dissipating fins and is radiated to the space around the space, and the other part of the heat passes through the heat pipes. The evaporation portion is transmitted from the base to a portion of the heat dissipation fin that is farther away from the base, and then is emitted to the missing heat pipe. Can be used flexibly: either the two heat pipes are far apart, so that the tomb is far from the center of the heat source, which is not conducive to the absorption of heat; or the two heat pipes are very close, so that the condensation is too concentrated, which is not conducive to heat dissipation. In short, The heat pipe extending from the same plane can not be used to concentrate the evaporation part of the heat pipe at the same time as the condensation part of the heat pipe of the base t part, so that the heat is evenly distributed on the political heat sheet. Therefore, the heat dissipation performance of the heat sink is not maximized. [Invention] In view of the above, it is necessary to provide a heat pipe heat dissipating device capable of simultaneously concentrating the evaporation portion of the heat pipe in the center of the base [5' and the heat condensing portion is appropriately spaced to distribute the heat evenly on the heat sink. The heat pipe heat dissipating device comprises: a base, a plurality of heat dissipating fins, and first and second heat pipes connecting the base and the heat dissipating piece, each heat pipe comprises a suction part and a heat release part, wherein the heat absorption part of the first heat pipe is bent and The base junction: the heat release β extends from both ends of the heat absorption portion and passes through the heat dissipation fin, and the heat absorption portion of the f heat f is connected to the base to be located at the first heat pipe The inner side of σ., , and -p and the heat radiating portion pass through the heat radiating fin at both ends of the heat absorbing portion, and at least one heat releasing portion of the first heat source is disposed between the heat radiating portions of the second sergeant. '200825688 Compared with the conventional technology, the heat pipe heat sink has at least one manifold: the bending is not limited by the 24 coplanar, so it can be flexibly bent, and the tube can be worn in the middle of the heat sink fin and two The end portion is concentrated on the bottom: the heat of the medium is transmitted to the middle portion and the two end portions of the heat dissipation fin, and the heat is distributed to the entire heat dissipation film to effectively radiate outward, and the heat dissipation device dissipates heat. The ability can be greatly improved. Administration [Implementation] . ~..., & political heating device is used to install on the circuit board (5) not to perform on the sub-components such as the central processing unit (not shown) Cooling. The heat pipe heat dissipating device comprises a base 1 〇, (4) a heat sink fin combination 2 土, a affixed to the base 10 and the enthalpy: a human Γ〇: a square first and a second heat pipe 30, 40 and a plug To the heat sink fin mount 50 and the fan 6〇. The heat pipe is relayed to the base 1. The two snap arms 70 are used to assist in fixing the heat pipe heat sink to the circuit board. The base 10 is a high thermal conductivity metal plate body which is substantially square. The base = has a surface for contacting the lower surface of the electronic component and opposite the lower surface. The upper portion of the base 10 is sequentially opened for accommodating the heat pipes %, 4 〇 行: the rows of grooves 12, 14. Two of the parallel grooves 12 are located on the base 10: it is a ditch... by the base. One end portion 2: The base κ) horizontally extends outwardly from a pair of positioning portions 16 having a thickness smaller than the thickness of the base ι, for engaging with the buckle arm 70, and each of the positioning portions shame 200825688 is provided with two through holes 160. Each of the heat dissipation fins 20 is made of a metal foil, and includes a heat sink 220 that is continuously bent by the metal foil and perpendicular to the base 10 and a parallel to the base disposed above the heat sink 220. The heat dissipation fin set 240 is perpendicular to the heat dissipation fin set 240. A slot 242 is defined in the front side of the heat dissipation fin set 240, and the heat dissipation fin set 240 is provided with a through hole 244 through which the heat pipes 30 and 40 are inserted. The outermost fins of the heat dissipating fin set 240 extend vertically downward to the edge of the base 10 to form two baffles 246. Each baffle 246 and the heat dissipating member 220 form an airflow for blowing by the fan 60 through one of the air passages 248. . The heat dissipating fin group 240 is inclined to the side of the base 10 to extend a wind deflecting plate 249, and the air guiding plate 249 guides the airflow passing through the air passage 248 to the base 10 (as shown in FIG. 4). The first heat pipe 30 includes a substantially n-shaped heat absorbing portion 32 and a pair of heat radiating portions 34 extending vertically upward from both ends of the heat absorbing portion 32. The heat absorbing portion 32 includes a first heat absorbing section 320 housed in one of the grooves 12 and a second heat absorbing section 322 housed in the groove 14. The length of the second heat absorption section 322 is smaller than the length of the first heat absorption section 320 and the two are distributed in parallel with each other. Each of the heat radiating portions 34 of the first heat pipe 30 is at an angle to the plane of the heat radiating portion 32. In this embodiment, each heat radiating portion 34 is perpendicular to the plane of the heat radiating portion 32. The heat radiation portion 34 is disposed in the through hole 244 of the heat dissipation fin group 240. The second heat pipe 40 is substantially U-shaped and includes a heat absorbing portion 42 and a pair of heat radiating portions 44 extending vertically upward from both ends of the heat absorbing portion 42. The heat absorbing portion 42 is received in the other groove 12 and sandwiched between the first heat absorbing section 320 and the second heat absorbing section 322 of the first heat pipe 30. The heat radiation portion 44 is disposed in the through hole 200825688 244 of the heat dissipation fin group 240. The buckle arm 70 includes a positioning rod 72 that can be placed in the base positioning portion 16 and a fastening rod 74 that extends outwardly at an angle from both ends of the / positioning rod 72. The positioning rod 72 is provided with a hole 76, and the buckle arm 70 is fixed to the lower portion of the base 10 through a through hole 160 of the positioning portion 16 and a hole 76 in the positioning rod 72 by screws or rivets 90 or the like. The fastening rod 74 is provided with a through hole (not shown) for facilitating the passage of the screw or the rivet 90 to fix the heat pipe heat sink to the circuit board. The fan holder 50 includes an elongated body 510, and a 520 and a positioning piece 530 extending from opposite sides of the body 510. A screw hole 525 is provided at a lower end portion of the panel 520. The fan 60 includes a square frame 62. The frame body 62 is provided with perforations (not shown) at four corners. The screws or rivets 80 are inserted through the through holes and the screw holes 525 of the fan holder 50 to fix the fan 60 to the fan. On the shelf 50. Referring to FIG. 2 and FIG. 3 simultaneously, the base positioning portion 16 is attached to the positioning rod 72 of the buckle arm 70. The heat absorbing portion 32 of the first heat pipe 30, the heat absorbing portion 42 (not shown) of the second heat pipe 40, and the heat absorbing portion 42 (not shown) are respectively in thermal contact and are accommodated in the grooves 12, 14 (not shown) on the base 10. The heat radiating portion 34 of the first heat pipe 30 vertically penetrates into the through hole 244 of the heat radiating fin group 240 and is disposed at a middle portion and an end portion of the heat radiating fin group 240. The heat absorbing portion 42 of the second heat pipe 40 vertically penetrates into the through hole 244 of the heat dissipation fin group 240 and is disposed at both ends of the heat dissipation fin group 240. The flanges of the heat sink 220 are also in thermal contact with the upper surface of the base 10 and the lower surface of the heat sink fin set 240, respectively. The fan 60 is positioned on the fan mount 50 by screws or rivets 80. The positioning piece 530 of the fan holder 50 is inserted into the slot 242 on both sides of the heat dissipation fin 11 200825688 chip set 240, and the fan holder 50 is fixed in front of the heat dissipation fin set 240. Referring to FIG. 3 and FIG. 4 , the heat releasing portion 34 of the first heat pipe 30 is located at an inner portion and an end portion of the heat dissipation fin group 240 . The heat releasing portions 44 of the second heat pipe 40 are respectively located at two ends of the heat dissipation fin group 240 . The heat radiating portions 34 and 44 of the two heat pipes 30 and 40 substantially divide the heat radiating fin group 240 into three regions in the longitudinal direction thereof. The heat pipes 30 and 40 transfer heat accumulated in the middle of the base 10 to the middle and both ends of the heat dissipation fin set 240 to be evenly distributed on the entire heat dissipation fin assembly 20, so that the heat dissipation fin group 240 uniformly distributes the heat dissipation fins 240. The heat is radiated outward. In addition to the present embodiment, the first and second heat absorption sections 320 and 322 of the first heat pipe 30 can also be disposed in two equal lengths. At this time, the two heat releasing portions 34 of the first heat pipe 30 are simultaneously disposed on the second heat pipe 40. Between the heat radiating portions 44. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat pipe heat dissipating device of the present invention. Figure 2 is a partial assembled view of Figure 1. Figure 3 is an assembled view of Figure 1. Figure 4 is a side view of Figure 3. 12 200825688 [Description of main component symbols] . Base 10 " Positioning section 16 Heat sink fin combination 20 Heat sink fin set 240 Air duct 248 First heat pipe 30, Heat release part 34, 44 Second heat absorption section 322 Fan holder 50 Panel 520 Screw hole 525 Frame 62 Positioning rod 72 ^ Hole 76 Baffle 246 Groove 12, 14 Through hole 160, 244 Heat sink 220 Slot 242 Air deflector 249 Heat absorbing part 32, 42 First heat absorbing section 320 Second heat pipe 40 Body 510 Positioning plate 530 Fan 60 Buckle arm 70 Buckle lever 74 Screw 80, 90 13