M276433 八、新型說明： 【新型所屬之技術領域】 本創作係關於-錄熱器，_制於—射梭冷卻電子元件之熱 管散熱器。 【先如技術】 隨著電子産業不斷發展，電子元件（尤為中央處理器）運行速度和整 體性能不斷提昇。同時其產生之熱量亦隨之增多，使得其溫度不斷昇高， 溫昇將導致電子元件運行下降，純㈣子元舰正常運行，必須及 時排出其所産生之大量熱量。 為此，業界通常制-種散_進行散熱，該散熱器均包括—底座及 又於底座上之複數政熱，鰭片，该散熱底座為底面平滑的實體金屬，其貼設 中央處理器表面。隨著中央處理器體積愈來愈小，發熱亦更加集中，因局 限於金屬之傳熱性能，散減座^讀之歸往往過於集巾，而無法有效 傳遞至散熱器之四闕片，從而嚴重影響整體散熱效果，使得中央處理器 因過熱而性能下降，無法有效運算，甚至燒毀。 為克服上述問題，業界應用熱;I；散熱器日益增多，熱管係於金屬管體 内設置毛細結構物（如粉末燒結物、溝槽結構、絲網結構等），並密封裝 入工作jit (如水、酒精等），然後抽至真空狀態，通過工作液體受熱後 進行液氣兩相變化而吸收、釋放熱量，由於熱管之傳熱不定向且傳^距離 長而得到廣泛應用。 弓、专利么告第532758号揭露了一种使用热管之散热器，其包括一基 座、权置於基座上之複數相互平行之散热籍片及大致呈“〕，，形之热管。 M276433 該基座底面與電子元件表面貼合，該基座上表面及散熱鰭片下端緣對應開 设半圓形凹槽，該熱管一自由端部固定於該凹槽中。該等散熱鰭片遠離基 座之適當位置開設穿孔，供套設於熱管另一自由端部上。電子元件産生之 熱量傳遞至基座，其一部分熱量直接通過熱管傳遞至散熱鰭片之上方部 位，另一部分熱量從基座直接傳遞至散熱鰭片，最後散熱鰭片上之熱量散 發至周圍空氣中，達到冷卻電子元件之目的。然，該散熱裝置之熱管與散 熱鰭片遠離基座的部位之接觸面積較小，很難將熱量均勻傳送至散熱鰭片 的遠離基座的部位，從而降低熱管與散熱鰭片之利用率，且很難保證散熱 鰭片上端部位之結構穩固性，當風扇震動時散熱鰭片亦隨之産生震動而引 起噪音；另外，該散熱裝置因各散熱鰭片單—的平行排列，其形成的氣流 通道内對氣流之流阻較小，風壓較低，散熱則表面與氣流之熱交換不充 分。 【新型内容】 本創作之目的在於提供一種散熱效率高的具有熱管之散熱器。 本創作散熱m散發電子元件産生之熱量，其包括—基座、設置 於該基座上之第一散熱鰭片組、 、與第一散熱鰭片組頂端連接之一頂板、連M276433 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a heat recorder, which is made of a heat pipe radiator for cooling electronic components of a shuttle. [Xianru Technology] With the continuous development of the electronics industry, the operating speed and overall performance of electronic components (especially central processing units) have been continuously improved. At the same time, the amount of heat it generates will increase, which will cause its temperature to rise continuously. The temperature rise will cause the electronic components to run down, and the pure dumplings will operate normally, and a large amount of heat generated by them must be discharged in time. For this reason, the industry usually manufactures and dissipates heat for cooling. The heat sink includes a base and a plurality of political heat and fins on the base. The cooling base is a solid metal with a smooth bottom surface and is attached to the surface of the CPU. . As the volume of the central processing unit becomes smaller and smaller, the heat generation becomes more concentrated. Due to the limited heat transfer performance of the metal, the dispersing seat is often too concentrated, and cannot be effectively transmitted to the four fins of the radiator, thus It seriously affects the overall heat dissipation effect, making the central processor's performance decrease due to overheating, unable to effectively operate, and even burned. In order to overcome the above problems, the industry applies heat; I; heat sinks are increasing. Heat pipes are installed inside metal tubes with capillary structures (such as powder sintered objects, trench structures, wire mesh structures, etc.), and sealed into the work jit ( (Such as water, alcohol, etc.), and then evacuated to a vacuum state. After the working liquid is heated, it undergoes liquid-gas two-phase change to absorb and release heat. It is widely used because the heat transfer of the heat pipe is non-directional and has a long distance. Bow, Patent No. 532758 discloses a heat sink using a heat pipe, which includes a base, a plurality of parallel heat-radiating fins placed on the base, and a generally shaped heat pipe. M276433 The bottom surface of the base is attached to the surface of the electronic component, a semicircular groove is correspondingly formed on the upper surface of the base and the lower end edge of the heat dissipation fin, and a free end of the heat pipe is fixed in the groove. The heat dissipation fins are far away from A perforation is provided at an appropriate position of the base for being sleeved on the other free end of the heat pipe. The heat generated by the electronic components is transmitted to the base, and a part of the heat is directly transmitted through the heat pipe to the upper part of the heat dissipation fin, and another part of the heat is from the base. The base directly transfers to the heat dissipation fins, and finally the heat on the heat dissipation fins is radiated to the surrounding air to cool the electronic components. However, the contact area between the heat pipe of the heat dissipation device and the part of the heat dissipation fins away from the base is small, It is difficult to uniformly transfer heat to the part of the heat dissipation fin away from the base, thereby reducing the utilization rate of the heat pipe and the heat dissipation fin, and it is difficult to ensure the stability of the structure of the upper part of the heat dissipation fin. The cooling fins also generate vibration when the fan vibrates, causing noise; in addition, the cooling device has a single parallel arrangement of the cooling fins, and the flow resistance formed by the air flow channel is small, and the wind pressure Lower heat dissipation, the heat exchange between the surface and the air flow is insufficient. [New content] The purpose of this creation is to provide a heat sink with a heat pipe with high heat dissipation efficiency. The heat dissipation m of this creation emits heat generated by electronic components, including- A base, a first heat radiation fin group disposed on the base, a top plate connected to the top of the first heat radiation fin group, and
、連接该基座及第二散熱鰭片組之至少一第二熱管。At least one second heat pipe connected to the base and the second heat dissipation fin group.
本創作散熱器之進一步改進在於，該第一 用¥，而且使得散熱器結構穩固。 ’該第一散_片組和第二散熱錯片 M276433 組之排列方式呈交叉狀態。由於散熱器的第一散熱鰭片組和第二散熱鰭片 組交又式鄰靠在一起，其組合形成的氣流通道令部形成流阻，當氣流流過 時其風壓較高，有效的促進氣流和散熱鰭片之熱交換，從而提高散熱器的 散熱效率。 【實施方式】The further improvement of this creative radiator is that the first use ¥ and makes the radiator structure stable. ’The arrangement of the first scattered sheet group and the second heat-dissipating sheet M276433 group is in a cross state. Since the first fin group and the second fin group of the radiator are adjacently adjacent to each other, the air flow channel formed by the combination causes the flow resistance of the portion, and the wind pressure is higher when the air flows through, effectively promoting The heat exchange between the airflow and the fins improves the heat dissipation efficiency of the heat sink. [Embodiment]
請參閱第一圖至四圖所示，本創作散熱器係用於安裝於中央處理器（圖 未示）等發熱電子元件上對其進行散熱。該散熱器包括一雙層基板10、一 垂直立於基板10上之第一散熱鰭片組20、一連接基板10與第一散熱鰭片 組20之第一熱管30、一平行於基板1〇並與第一散熱鰭片組2〇相緊鄰之第 一散熱鰭片組40、一連接基板1〇與第二散熱鰭片組4〇之第二熱管5〇、及 一設置於第一、二散熱鰭片組2〇、4〇頂部之頂板6〇。 該基板ίο包括-與電子元件接觸之銅板12及貼靠於該銅板12上之铭 板u，該銅板η和_ u間相應設有分別容置上述第一、二熱管、5〇 -端之溝槽16、18 ’該魄14四聽分別延伸形成固定腳⑽，該固定腳 140上預、.且衣有扣口件142。該等扣合件142可將散熱器緊密固定於電子元 件上。 • 、以、攸…）、叫 穴印τ夂双寻間距和 排列之ί —散熱鰭片22組成，轉-散熱的上下端緣同向戰 伸折邊24。亥折邊24抵頂相鄰散熱轉片η，從而每兩相鄰之第二^ 雜片22 _成-側向之氣流通道’鮮—散熱則組Μ頂端設有^ 第一熱管30另一端接觸之凹揭 9 '、側緣％向延伸一台階部28，#包 熱管30大概呈“〔”字型 ^ 、具有兩自由端部及連接該兩自由端之中杳 M276433 該兩自由端分別從側向插入於溝槽16及凹槽26内，該 ，+ ^ …、官3 0與溝伊 16結合之自由端為蒸發端，而與凹槽26結合之自由端為冷凝端。63Please refer to the first to fourth figures. This creative radiator is used to dissipate heat on electronic components such as central processing units (not shown). The heat sink includes a double-layer substrate 10, a first heat dissipation fin group 20 standing perpendicularly on the substrate 10, a first heat pipe 30 connecting the substrate 10 and the first heat dissipation fin group 20, and a parallel to the substrate 10. The first heat radiation fin group 40 adjacent to the first heat radiation fin group 20, a second heat pipe 50 connecting the substrate 10 and the second heat radiation fin group 40, and one disposed on the first and second The top plate 60 of the top of the heat dissipation fin group 20 and 40. The substrate includes a copper plate 12 that is in contact with electronic components and a nameplate u abutting on the copper plate 12, and the copper plates η and _u are respectively provided with the first and second heat pipes and 50-terminals respectively. The grooves 16 and 18 are respectively extended to form a fixed foot loop, and the fixed foot 140 is provided with a buckle 142. The fasteners 142 can tightly fix the heat sink to the electronic component. •, ，，…。, called acupoints τ 夂 double search spacing and arrangement of —— cooling fins 22, the upper and lower end edges of the turn-to-heat extension are in the same direction and the fold 24 is extended. The seam edge 24 abuts the adjacent heat-dissipating fin η, so that every two adjacent second ^ miscellaneous pieces 22 _ into-the side airflow channel 'fresh-the heat-dissipating group M is provided at the top with the other end of the first heat pipe 30 The contact recess 9 ', the side edge% extending a step portion 28, the # 包 热 管 30 is approximately a "[" shape ^, has two free ends and is connected to the two free ends 276M276433, the two free ends are respectively Inserted into the groove 16 and the groove 26 from the side, the free end combined with + ^, guan 30 and the groove 16 is the evaporation end, and the free end combined with the groove 26 is the condensation end. 63
型’其具有兩自由端部及連接該兩自由端之中部，該熱㈣兩自由端（冷 ♦)處於垂直向上延伸並分別由下而上穿過第二散熱韓片組*的穿孔 46 亥熱官5〇中部（蒸發端）位於銅板12與铭板14間的溝槽18内，使 得第-散熱H片組2G和第二散_肢4()之制方式呈十字交又狀態。 上述第二散熱趙片組40平行設置於紹板14上方且鄰靠第_散熱韓片 組20 ’其由複數等間距堆疊排列之第二散熱轉片42組成，每—散_片 42的兩側端緣同向彎折延伸一折邊Μ ’其最下層之散_片&疊靠於上 述第-散熱則組2〇的台階部28上，該每—第二散熱㈣^靠近兩侧端 處分別開設-其周緣具有接觸面之穿孔46，上述第二熱管5〇 m 。亥第、一政熱鰭片組20、40頂端共同設置上述頂板6〇，該頂板6〇 有凹^ 62，该凹槽62與上述第一散熱鰭片組2〇的凹槽26組合成一管 孔，該管孔使第-熱管3〇 一端部完全容置於其内，從而該第一熱管3〇端 勺…、里亦月匕均勻之傳送至第一散熱鰭片組2〇的各頂端部位，並且該頂板 '四_ 遇可以％固散熱器結構。另外，一風扇70通過風扇固定架72安裝於該 第1i：熱則組4G的外側，制定架72從兩側夾住第二散熱㈣組4〇的 、^而邛，其底部固定於基板1〇側緣而頂部固定於頂板60側緣。 田電子7L件運行時，其所産生該熱量通過銅板丨2快速的傳導至第一、 〜熱官30、50的蒸發端及鋁板14，而該第一、二熱管30、50蒸發端的熱 曰 、 里錢轉移到其冷凝端並傳送至與其接觸之第-、二散熱㈣22、42 (第 :、、、S 的熱1同時傳送至頂板60)，由於銅板12的傳熱速度較快，其 M276433 熱量分佈較均勻’對電子元件能夠提供較均勻的溫度環境，該鋁板14上的 熱量傳至與其接觸的各第一、二散熱鰭片22、42及第一、二熱管％、⑽ 瘵發端，最後，傳送至第一、二散熱鰭片組20、40上的熱量通過其表面與 風扇70吹來之強制氣流接觸而進行換熱。 本創作散熱器由於散熱器頂端連接有頂板，使得熱量亦能均勻之傳送 至散熱器遠離基座的各部位，充分利用熱管及散熱鰭片，且兩組散煞鰭片 形成十字交叉的排列方式，其相鄰端處風壓較高，使得散熱鰭片與氣流換 熱能力較強，提高散熱器的散熱能力。 上述散熱H僅是本創作散熱器之較佳實施例，該散_還可以包含更 多的其他實施例，如散熱器可以增加另外一散熱鰭片組與上述第一、二散 熱籍片組組合形成各種交叉式氣流通道；散熱器基座亦可為—體製成之一 塊銅基座或銅板的形狀可為圓形、多邊形等；_，第_、二熱管的數目 可分別增加至兩個或兩個以上，還可以使用板型或爲平歸等；又有，風 射安裝在第—散觸妝外慣增加縣之數量，將兩倾扇分別安裝 在第一、二散熱鰭片外側等等。 綜上所述，本創作符合新型專利要件，爰依法提出專射請。惟，以 上所述者僅為糊狀難實_，孰麵杨跋之人士，在麦依本 創作精^所作之等效修飾或變化，皆應涵蓋㈣下a請專職圍内。 【圖式簡單說明】 - 第一圖係本創作散熱器之立體分解圖。 第二圖係本創作散熱器與風扇安裝前之立體圖。 第三圖係本創作散熱器之立體組裝圖。 M276433 第四圖係本創作散熱器之側視圖。 【主要元件符號說明】 基座 10 銅板 12 溝槽 16、18 鋁板 14 固定腳 140 扣合件 142 第一散熱鰭片組 20 第一散熱鰭片 22 折邊 24、44 凹槽 26 台階部 28 第一熱管 30 第二散熱鰭片組 40 第二散熱鰭片 42 穿孔 46 第二熱管 50 頂板 60 風扇 70 風扇固定架 72 10Type 'has two free ends and a middle portion connecting the two free ends. The hot free ends (cold) are vertically extended upwards and pass through the perforations 46 of the second heat sink group * from bottom to top, respectively. The middle part (evaporating end) of the heat official 50 is located in the groove 18 between the copper plate 12 and the name plate 14, so that the system of the first heat sink group 2G and the second fan_limb 4 () is in a cross state. The above-mentioned second heat-dissipating sheet group 40 is arranged in parallel above the shao board 14 and is adjacent to the _ heat-dissipating sheet group 20 ′. The side edge is bent in the same direction to extend a fold edge M 'and its lowermost layer of the sheet & stacks on the step portion 28 of the above-mentioned second heat dissipation group 20, each of the second heat dissipation ㈣ is close to both sides Openings are made at the ends-a perforation 46 having a contact surface at the periphery, and the second heat pipe 50 m above. The tops of the first and second heat fin groups 20 and 40 are provided with the above-mentioned top plate 60. The top plate 60 has a recess 62, and the groove 62 is combined with the groove 26 of the first heat dissipation fin group 20 to form a tube. The tube hole allows one end of the first heat pipe 30 to be completely accommodated therein, so that the end of the first heat pipe 30 and the spoon are evenly transmitted to each of the first heat radiating fin group 20 The top part, and the top plate can meet the solid heat sink structure. In addition, a fan 70 is installed on the outside of the first i: heat-receiving group 4G through a fan fixing frame 72. The fixing frame 72 clamps the second heat-dissipating unit 40 from both sides, and its bottom is fixed to the substrate 1. 〇 the side edge and the top is fixed to the side edge of the top plate 60. When Tian Electronics 7L is running, the heat generated by it is quickly transmitted to the first and second heat pipes 30 and 50 and the aluminum plate 14 through the copper plate 2 and the heat of the first and second heat pipes 30 and 50 is , Li money is transferred to its condensing end and transferred to the first and second heat sinks 22, 42 (the heat 1 of the: ,,, S is transmitted to the top plate 60 at the same time). Due to the fast heat transfer speed of the copper plate 12, its M276433 The heat distribution is more uniform. It can provide a more uniform temperature environment for the electronic components. The heat on the aluminum plate 14 is transmitted to the first and second heat radiating fins 22 and 42 and the first and second heat pipes. Finally, the heat transmitted to the first and second heat dissipation fin groups 20 and 40 is heat-exchanged by contacting the surface with the forced air blown from the fan 70. Because the top of the radiator is connected with the top plate, the heat can be evenly transmitted to the parts of the radiator that are far away from the base. The heat pipe and the cooling fins are fully used, and the two sets of dispersing fins form a cross arrangement. The high wind pressure at its adjacent end makes the heat-dissipating fins and the airflow have a stronger heat-exchanging ability and improves the heat-dissipating ability of the radiator. The above-mentioned heat dissipation H is only a preferred embodiment of this creative radiator, and this heat dissipation can also include more other embodiments. For example, the heat sink can add another heat-dissipating fin group and the above-mentioned first and second heat-dissipating chip combinations. Form various cross-flow airflow channels; the radiator base can also be made of a copper base or a copper plate in the shape of a circle, a polygon, etc .; the number of heat pipes can be increased to two Or two or more, you can also use a plate type or leveling; etc., there are wind shots installed on the first-scattered touch makeup to increase the number of counties, two tilting fans are installed on the outside of the first and second cooling fins, respectively and many more. To sum up, this creation complies with the requirements of the new patent. However, those mentioned above are only mushy and difficult to achieve. The equivalent modifications or changes made by the face-to-face Yang Ba's creative spirit should be covered by His Majesty a full-time staff. [Schematic description]-The first picture is a three-dimensional exploded view of this creative radiator. The second picture is a perspective view of the radiator and fan before installation. The third picture is a three-dimensional assembly drawing of the original radiator. M276433 The fourth picture is a side view of this creative radiator. [Description of main component symbols] Base 10 Copper plate 12 Groove 16, 18 Aluminum plate 14 Fixing foot 140 Fastener 142 First heat sink fin group 20 First heat sink fin 22 Fold 24, 44 Groove 26 Step portion 28 A heat pipe 30 The second heat dissipation fin group 40 The second heat dissipation fin 42 Perforation 46 The second heat pipe 50 The top plate 60 The fan 70 The fan holder 72 10