M281394 八、新型說明： 【新型所屬之技術領域】 本創作與散熱相關，尤指一種具有較高散熱性能之散熱裝置。 【先前技術】 隨著大型積體電路技術之不斷進步及廣泛應用，資訊產業之發展突飛 猛進，電腦廣泛應用於各行各業，尤其個人電腦之應用已基本普及，為適 應資料處理量不斷增加及即時性要求提高之發展趨勢，必然要求電腦運行 速度不斷提高。眾所周知，_央處理器係電腦系統之核心元件，其性能之 優劣直接決定整個電腦之性能，因此，高頻高速處理器不斷推出。但是由 於高頻高速運行使得處理器單位時間產生大量熱量，如不及時排除這些熱 量將引起處理器自身溫度之升高，對系統之安全及性能造成很大影響，目 前散熱問題已經成為新一代高速處理器推出時必需解決之問題。 通常業界在中央處理器等晶片上安裝散熱器辅助其散熱，同時，在散 熱器上安裝風扇，以提供強制氣流促使散熱器之熱量快速散發，從而能夠 對中央處理器等發熱電子元件進行更為有效之散熱。最初，係採用簡單鋁 撥型及壓鑄型散熱器，而由於受限於機械加工而其散熱面積極其有限，與 周圍空氣交換溫度之面積不大，即使配用風扇亦無法及時充分地散發熱 量’為此’業者對傳統用散熱器進行改良，謀求散熱器整體散熱面積之增 加’從而，產生了一種由複數金屬散熱鰭片組成之組合式散熱器，如第六 圖所示’該散熱器1包括複數相互平行設置之散熱鰭片2，該散熱鰭片2呈 平板狀結構，相鄰兩散熱鰭片2之間形成風道3,每一散熱鰭片2上設有供 熱管4之冷凝部穿設之穿孔，從而可配合熱管4使用以增強散熱效果，其 中熱管4之蒸發部係與熱源熱性接觸，從而將熱源所產生之熱量快速傳導 至熱管4之冷凝部，進而將熱量較均勻地散佈至各散熱鰭片2上，同時於 散熱，1之側端設置一風扇，提供強制氣流辅助散熱，最終藉由散熱鰭片2 將熱量散發至周圍環境中。 然’上述散熱器雖然可藉由增加散熱鰭片2之數量或增大散熱鰭片2 之面積之方式提昇散熱器1之整體散熱面積，以提昇散熱效果，但隨著電 子技術日益朝著高密度與小型化方向發展，相應地，散熱元件所佔之空間 以及重量均受到限制，散熱鰭片2所能增加之數量及尺寸有限，而其對散 M281394 熱效果之改善亦同樣有限，另外，由於散熱鰭片2係平板結構，當風扇氣 流流經散熱鰭片2時，經熱管4分流，部分氣流自散熱鰭片2邊緣損失掉， 部分氣流撞擊正向氣流形成回流，增大氣流流阻，影響換熱效果，因此散 熱鰭片2與風扇氣流之換熱效果較低，其對風扇氣流之利用率不高，影響 整體之散熱效果。 【新型内容】 本創作為解決散熱鰭片之換熱效率不高之問題，提供一種具有高效換 熱效果之散熱裝置。 本創作散熱裝置，包括至少一熱管以及複數穿設於所述熱管上之散熱 鰭片’該熱管包括蒸發部及自該蒸發部延伸之冷凝部，所述散熱鰭片之間 • 形成風道，每一散熱鰭片包括至少一連續彎折之第一彎折段及分別設於該 第一彎折段兩側之兩第一平板段，每一第一平板段上設有供熱管冷凝部穿 - 設之穿孔。 該散熱裝置中，散熱鰭片形成交替之彎折段與平板段結構並相互扣合 成一整體，不僅增大散熱鰭片之散熱面積，提昇散熱鰭片之強度，還可對 流經散熱鰭片間之氣流進行導流，減小流阻，提昇散熱鰭片換熱效果。 【實施方式】 下面參照附圖，結合實施例對本創作作進一步說明。 如第一圖及第二圖所示，本創作散熱裝置包括一基座1〇，連結於該基 • 座之熱管30及穿設於該熱管30之複數散熱鰭片50。 請同時參考第三圖，該基座10包括一底板12及一蓋板14，該底板12 呈方形，其底部係用於與發熱元件（圖未示）相接觸，底板12上方兩側分 別設有兩圓孔120。蓋板14係與底板12相配合，該蓋板μ下方對應底板 12之每一圓孔120設有一凸柱140，該蓋板14兩側分別設有一貫穿該蓋板 14之開孔142，蓋板14底部中央位置向上凹陷形成與所述開孔142連通之 容置空間144。 泫底板12與蓋板14相對接，蓋板14之凸柱14〇藉由干涉配合容置於 底板12之圓孔120内，從而底板丨2與蓋板14固定連結形成基座1〇。 熱官30呈U形，其包括一蒸發部32及自該蒸發部32兩端分別向 上延伸之冷凝部34，該蒸發部32係收容於基座丨〇之容置空間144内，且 與底板12熱性連結，該蒸發部32與底板12之間可通過焊接，黏貼等方式 M281394 相固定，熱管30之冷凝部34分別自蓋板14之兩開孔142處向上穿出，以 便於散熱鰭片50之穿設。 請同時參考第四圖及第五圖，散熱鰭片5〇相互間隔平行設置，每一散 熱鰭片50包括相互交替設置之彎折段與平板段，其中該散熱鰭片5〇之中 央位置形成大致呈60。連續彎折之第一彎折段52，該第一彎折段52之彎折 ，均形成弧線狀過度，該第一彎折段52兩側分別形成一第一平板段54，該 ，一平板段54均設有供熱管3〇蒸發部穿設之穿孔54〇，每一穿孔54〇邊緣 没有-與該穿孔540連通之容置孔542，該穿孔54〇外緣向上延伸形成一環 狀凸，54^，該凸緣544對應於相應之容置孔542位置形成一缺口 5牝。 —每一第一平板段54外側向外彎折延伸分別形成一第二彎折段52，，該 第-膏折段52’大致呈12G°f折延伸，同樣該第二彎折段52，之料處亦形 成旅線狀過度。該第二彎折段52，之外側分別形成—第二平板段54，，該第 一平板#又54構成忒散熱鰭片5〇之兩邊緣，每一第二平板段54，之邊緣處靠 近兩之位置分別形成^片56，該卡片56係於該第二平板段54,向下脊 折，對應該卡片56之位置該第二平板段54,形成一凹陷％。， 其令第-、第二彎折段52、52,均可藉由對散熱鰭片％連續進行彎折 ^、亦可通，對散熱韓片5〇進行局部拉伸而成，在通過局部拉伸之成型 - 其係藉由散熱趙片5〇之局部拉伸變形形成料段，故該第一、第 之厚度小於該第—平板段54之厚度，相對於直接f折成 i料ΐϊ 之情況τ，由於其厚度減小，因此重量較輕，所需原 抵靠5〇相互間隔疊設’相鄰後一散熱韓片50之凸緣544 卡片56板」L1…东藉片5〇之第一平板段54，該相鄰前一散熱雜片50之 二1距，形成風道7G，㈣於散熱鰭片如呈彎折狀盘平 板狀^ #之力段結構，從而將風道70分為若干區域。 -欠穿套設於該熱管3Q冷凝部34上，_G之冷凝部34依 :入熱片5〇之穿孔540並與散熱韓片5〇敎性連社，同理，兮 之間可通過焊接或黏貼等方式狀連結，而^ 從而增強熱管30與散熱韓片5〇之間之熱傳導:—50之間之傳熱面積’ 該置工作時，底板12錄熱7"件相接觸，同時於正對散 一曰片位置以―風扇(圖未示），提供強制氣流輔助散熱，加強散熱效 M281394 果。 30之鄉、32 件誠生熱將所做之歸料至熱管 之…Jx邛32，熱官30内之工作介質快速吸埶汽 馱 34，然後冷凝部34 _量傳 …、^匕將熱里傳導至巧㈣ 將勒⑽W L !^得¥至各政—9片5G，糟由風扇產生之強制氣流 a至32 U帶走，而二作介胁冷凝部34職熱量後液化回 飢至五毛。卩32，並再次吸熱蒸發，如此循環，達到散埶之目的。 祕主片50上形成交替之彎折段與平板段結構，因此增大了散 Λ積，即增大了該散熱別％與風扇所產生之強制氣 二/5、广、、:提祕熱效果。而該交替之-折段與平板段結構將散熱 ^ H ㈣成之風運％分滅若干區域，當風扇產生之氣流流經散 =-^t，不僅可引導氣流沿風道70 _，而且可對流經熱管30之氣 1，氣流在流經熱管％后，沿熱管3G兩側分別以-核角流向 再：、、、 之第一及第二彎折段52、52’，而由於該彎折段之設置，氣流 =擊沿散熱縛片5〇正向流經該第…第二彎折段52、52,之氣流， =疋，^-、第二f折段52、52，邊緣之折邊逐漸形成與正向來風方向相 = 不财效贱氣流之_互干懸生騎，減小氣流之满 /；，L ^而且減小散熱鰭片50兩側之漏風，從而提昇氣流流速及流量，增 強換熱效果，而該第-、第二f折段52、52，之料處均錄線狀，有利減 小風阻，提昇散熱效果。 ^另外，該散熱鰭片50之彎折狀設計，可有效提昇散熱鰭片50之強度， 散熱錯>1 50兩側形成相互抵靠之卡片56結構，可增散熱則％整體之強 度，=使在高速高壓之氣流衝擊下，亦可減小震動以及噪音之產生。 紅上所述，本創作符合新型專利要件，爰依法提出專利申請。惟’以 上所述者僅為本創作之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本 創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係本創作散熱裝置組裝示意圖。 第二圖係本創作散熱裝置分解示意圖。 第二圖係本創作基座另一角度示圖。 第四圖係散熱鰭片示意圖。 第五圖係散熱鰭片放大示意圖。 第六圖係習知之散熱器示意圖。 M281394 【主要元件符號說明】M281394 8. Description of the new type: [Technical field to which the new type belongs] This creation is related to heat dissipation, especially a heat dissipation device with high heat dissipation performance. [Previous technology] With the continuous progress and wide application of large-scale integrated circuit technology, the development of the information industry has made rapid progress. Computers have been widely used in various industries, especially personal computer applications have been basically popularized. In order to adapt to the continuous increase in data processing and real-time The development trend of increasing sexual requirements will inevitably require the computer to continue to run faster. As we all know, the central processor is the core component of a computer system, and its performance directly determines the performance of the entire computer. Therefore, high-frequency and high-speed processors continue to be introduced. However, due to the high-frequency and high-speed operation, the processor generates a large amount of heat per unit time. If this heat is not removed in time, the processor's own temperature will increase, which will have a great impact on the safety and performance of the system. Currently, the heat dissipation problem has become a new generation of high-speed Issues that must be addressed when the processor is launched. Generally, the industry installs a radiator on a chip such as a central processing unit to assist its heat dissipation. At the same time, a fan is installed on the radiator to provide forced airflow to promote the rapid dissipation of heat from the radiator. Effective heat dissipation. Initially, simple aluminum dial-type and die-casting radiators were used. Due to the limited mechanical processing, the heat dissipation area was extremely limited. The area for exchanging temperature with the surrounding air was not large. Even with a fan, the heat could not be fully dissipated in time. To this end, "the industry improved the traditional radiator and sought to increase the overall heat dissipation area of the radiator." Thus, a combined radiator composed of a plurality of metal heat sink fins was produced, as shown in the sixth figure. "The radiator 1 It includes a plurality of heat radiation fins 2 arranged in parallel with each other. The heat radiation fins 2 have a flat plate structure, and an air duct 3 is formed between two adjacent heat radiation fins 2. Each heat radiation fin 2 is provided with a condensation part of a heat supply pipe 4. The perforation can be used to enhance the heat dissipation effect with the heat pipe 4. The evaporation part of the heat pipe 4 is in thermal contact with the heat source, so that the heat generated by the heat source is quickly transmitted to the condensation part of the heat pipe 4, and the heat is more evenly distributed. Disperse to each heat dissipation fin 2, and at the same time, a fan is installed at the side of 1 to provide forced airflow to assist heat dissipation. Finally, the heat is dissipated to the surroundings through the heat dissipation fins 2. Environment. However, although the above-mentioned heat sink can increase the overall heat dissipation area of the heat sink 1 by increasing the number of heat dissipation fins 2 or increasing the area of the heat dissipation fins 2 to improve the heat dissipation effect, with the increasing trend of electronic technology, Density and miniaturization are developing. Correspondingly, the space and weight occupied by the heat-dissipating components are limited, the number and size of the heat-dissipating fins 2 can be limited, and the improvement of the thermal effect of the heat-dissipating M281394 is also limited. In addition, Because the cooling fin 2 is a flat structure, when the fan air flows through the cooling fin 2, it is shunted through the heat pipe 4, part of the air is lost from the edge of the cooling fin 2, and part of the air hits the forward air to form a backflow, increasing the air flow resistance. It affects the heat exchange effect, so the heat exchange effect between the heat dissipation fins 2 and the fan airflow is low, and the utilization rate of the fan airflow is not high, which affects the overall heat radiation effect. [New content] In order to solve the problem of low heat exchange efficiency of heat sink fins, this article provides a heat sink with high efficiency heat exchange effect. This creative heat dissipation device includes at least one heat pipe and a plurality of heat dissipation fins penetrating the heat pipe. The heat pipe includes an evaporation part and a condensation part extending from the evaporation part, and an air duct is formed between the heat dissipation fins, Each heat dissipation fin includes at least one continuously bent first bending section and two first flat plate sections respectively disposed on both sides of the first bending section, and each first flat plate section is provided with a heat pipe condensation section through -Set the perforation. In the heat dissipation device, the heat dissipation fins form an alternating bent section and flat plate structure and are integrated with each other, which not only increases the heat dissipation area of the heat dissipation fins, enhances the strength of the heat dissipation fins, but also convectively flows between the heat dissipation fins. The airflow guides the flow, reduces the flow resistance, and improves the heat transfer effect of the fins. [Embodiment] With reference to the accompanying drawings, the present invention will be further described in combination with the embodiments. As shown in the first and second figures, the creative heat sink includes a base 10, a heat pipe 30 connected to the base, and a plurality of heat sink fins 50 passing through the heat pipe 30. Please refer to the third figure at the same time. The base 10 includes a base plate 12 and a cover plate 14. The base plate 12 has a square shape, and its bottom is used for contact with a heating element (not shown). There are two round holes 120. The cover plate 14 is matched with the bottom plate 12. A convex column 140 is provided below each of the circular holes 120 of the bottom plate 12 under the cover plate μ, and an opening 142 penetrating the cover plate 14 is provided on both sides of the cover plate 14. The bottom central position of 14 is recessed upward to form an accommodation space 144 communicating with the opening 142. (2) The bottom plate 12 is opposite to the cover plate 14, and the convex column 14 of the cover plate 14 is accommodated in the circular hole 120 of the bottom plate 12 through interference fit, so that the bottom plate 2 and the cover plate 14 are fixedly connected to form the base 10. The heat official 30 is U-shaped and includes an evaporation portion 32 and condensation portions 34 extending upwardly from both ends of the evaporation portion 32, respectively. The evaporation portion 32 is housed in the accommodation space 144 of the base and is connected to the bottom plate. 12 thermal connection, the evaporation portion 32 and the bottom plate 12 can be fixed by welding, pasting, etc. M281394, the condensation portion 34 of the heat pipe 30 is pushed out from the two openings 142 of the cover plate 14 to facilitate heat dissipation fins 50's wear. Please refer to the fourth and fifth figures at the same time. The heat dissipation fins 50 are arranged parallel to each other at intervals. Each heat dissipation fin 50 includes a bent section and a flat plate section which are alternately arranged. The central position of the heat dissipation fin 50 is formed. Approximately 60. The first bending section 52 is continuously bent, and the bending of the first bending section 52 forms an arc-like transition. Two sides of the first bending section 52 form a first flat plate section 54 respectively. The sections 54 are provided with perforations 54 through which the heating section 30 evaporates. The edges of each perforation 54 have no accommodating holes 542 that communicate with the perforations 540. The outer edge of the perforations 54 extends upward to form a ring-shaped projection. 54 ^, the flange 544 forms a gap 5 牝 corresponding to the position of the corresponding accommodation hole 542. -Each of the first flat plate segments 54 is outwardly bent and extended to form a second bent segment 52 respectively. The first paste segment 52 ′ extends approximately 12G ° f. Similarly, the second bent segment 52, The brigade also formed a line-like transition. The second bent section 52 is formed on the outer side, respectively, a second flat plate section 54. The first flat plate 54 again constitutes two edges of the heat dissipation fin 50, and the edge of each second flat plate section 54 is close to The two positions respectively form a sheet 56. The card 56 is tied to the second flat plate segment 54 and is folded down. The second flat plate segment 54 corresponding to the position of the card 56 forms a depression%. It enables the first and second bending sections 52 and 52 to be formed by continuously bending the heat sink fin% ^, and also can be partially stretched by the heat sink Korean sheet 50. Stretched molding-it is formed by the local tensile deformation of the heat sink Zhao 50, so the first and first thickness is less than the thickness of the first-flat section 54, compared to the direct f folded into i material ΐϊ In the case of τ, due to its reduced thickness, the weight is lighter, and the original needs to be stacked against each other at a distance of 50 °, the flange 544 of the adjacent next heat sink 50, the card 56 board, L1 ... The first flat plate section 54 has a distance of 2 to 1 from the adjacent previous heat sinking fins 50 to form an air duct 7G. 70 is divided into several areas. -The under-through sleeve is set on the condensation part 34 of the heat pipe 3, and the condensation part 34 of the _G is inserted into the perforation 540 of the heat sink 50 and connected with the heat sink 50, and the same can be done by welding Or paste-like connection, and ^ to enhance the heat transfer between the heat pipe 30 and the heat sink 50: the heat transfer area between -50 'When this device is set to work, the bottom plate 12 records heat 7 "and contacts at the same time. A fan (not shown) is located directly opposite the fan to provide forced airflow to assist heat dissipation and enhance the heat dissipation effect. The hometown of 30, 32 pieces of sincere heat will be done to the heat pipe ... Jx 邛 32, the working medium in the heat official 30 quickly sucks the steam 驮 34, and then the condensing part 34 _volume transmission ... It is transmitted to Qiao ㈣. It will be used to control W L! ^ To each government-9 pieces of 5G, which will be taken away by the forced air flow a to 32 U generated by the fan, and the second one will liquefy and return to 50 cents after liquefying the heat in the condensation part 34. .卩 32, and absorb the heat again to evaporate, and circulate in this way to achieve the purpose of dispersal. Alternately bent sections and flat plate structures are formed on the mysterious main piece 50, so the scattered Λ product is increased, that is, the heat dissipation percentage and the forced air generated by the fan are increased. effect. And the structure of the alternating-folding section and flat section will dissipate heat in several areas, and when the airflow generated by the fan flows through the diffuser =-^ t, it can not only guide the airflow along the air duct 70 _, but also The air 1 flowing through the heat pipe 30 can be convected. After the air flow has passed through the heat pipe%, the air flows along the two sides of the heat pipe at a nuclear angle of-, respectively, and the first and second bending sections 52, 52 ', and The setting of the bending section, the airflow = the airflow flowing along the heat dissipation fin 50 through the first ... second bending section 52, 52, = 疋, ^-, the second f-folding section 52, 52, the edge The folded edge gradually forms the direction of the forward air flow = the inefficient airflow of _ mutually interdependent suspension riding, reducing the full airflow / ;, L ^ and reducing the air leakage on both sides of the cooling fin 50, thereby improving the airflow The flow velocity and flow rate enhance the heat exchange effect, and the first and second f-fold sections 52 and 52 are linearly recorded at the material, which is beneficial to reduce wind resistance and improve heat dissipation. ^ In addition, the curved design of the heat dissipation fins 50 can effectively enhance the strength of the heat dissipation fins 50, and the heat dissipation error> 1 50 sides of the card 56 structure can be formed against each other, which can increase the heat dissipation% of the overall strength, = Under the impact of high-speed and high-pressure airflow, the generation of vibration and noise can also be reduced. As mentioned above, this creation meets the requirements for new patents, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with the skills of this case, and equivalent modifications or changes made based on the spirit of this creation, should be covered by the following patent applications. [Brief description of the drawings] The first figure is a schematic diagram of the assembly of the heat sink of this creation. The second figure is an exploded view of the heat sink of this creation. The second picture is another perspective view of the creative base. The fourth diagram is a schematic diagram of a heat dissipation fin. The fifth diagram is an enlarged schematic view of the heat dissipation fins. The sixth diagram is a schematic diagram of a conventional radiator. M281394 [Description of main component symbols]
基座 10 底板 12 圓孔 120 蓋板 14 圖柱 140 開孔 142 容置空間 144 執管 30 蒸發部 32 冷凝部 34 散熱鰭片 50 第一彎折段 52 第二彎折段 52， 第一平板段 54 第二平板段 54， 穿孔 540 容置孔 542 凸緣 544 缺口 546 卡片 56 凹陷 58 風道 70Base 10 Base plate 12 Round hole 120 Cover plate 14 Figure column 140 Opening hole 142 Receiving space 144 Tube 30 Evaporating part 32 Condensing part 34 Radiating fin 50 First bending section 52 Second bending section 52, first plate Section 54 Second plate section 54, Perforation 540 Receiving hole 542 Flange 544 Notch 546 Card 56 Depression 58 Air duct 70
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