1309293 九、發明說明： 【發明所屬之技術領域】 本發明係一種顯示卡散熱模組，尤指一種應用於顯示 卡上的散熱模組，係藉由水冷之方式，令顯示卡上所產生 之熱源能迅速且有效地排出。 【先前技術】 按，現今之電腦零件如中央處理器、記憶體及顯示卡 等等，處理資料的效能愈來愈快。以顯示卡為例，目前市 面上的顯示卡上的處理晶片均包含有上千萬個電晶體，且 效能較高的顯示卡通常伴隨著具有更多電晶體數目之處理 晶片，而電晶體數目的多寡恰為影響晶片運作時所產生的 熱功率之重要因素之一。效能越高的顯示卡，其處理晶片 之電晶體愈多，所產生的熱功率愈高，導致顯示卡運作時 晶片的溫度更是居高不下，嚴重影響顯示卡操作之安定性 〇 因此，中高階的顯示卡在出廠時大多在其處理晶片上 加裝一散熱器，將處理晶片所產生之高溫熱量予以向外排 出，以保護處理晶片之溫度不致於過高，而保持處理晶片 執行之穩定性。 目前習知之使用於顯示卡之散熱裝置，如中華民國新 型專利第M267511號，其揭露有：一散熱板組件，其具有 一散熱板，於散熱板上設置有一散熱鰭片組’該散熱鰭片 組係包含有數片間隔相距的鰭片，各相鄰鰭片間分別形成 1309293 有-通道；-散熱組件，其連接於散熱板組件並具有_中 空的導風罩’該導風罩連接於散熱板的後侧，在該導風罩 的财、後端處分別形成有—靠近散熱板之前開口，及相對 於前開口的後開口，在導風罩内設有一轴流風扇，該轴流 風扇的旋轉軸Μ直樞設於導風罩的頂、底部間；使用時 ’將散熱板底料置於顯示卡晶片頂部，藉由軸流風扇轉 動而可引導導風罩内的熱空氣分別通過趙片間的通道/導 =内部，而自散熱板組件前端及導風罩後端排出電腦機 相外，以保持顯示卡晶片之溫度不致於過高。 =而，該專獅可保持顯示卡晶片之溫度不致於過高 係以氣冷方式冷卻顯示卡晶片之溫度，以 率有限，無法料賴_走，達„ ^ 不能算是良好之散熱裝置。 < 政”、、要求， 【發明内容】 依与』：有‘於别述習用顯示卡之散熱裝置的缺點，乃 :從=種散熱器之製造經驗和技㈣積，針對上述缺 各轉㈣紐，在錢不㈣ =’終於開發設計出本發明之一種全新顯示二 -月以期產摒除先前技術所產生之缺失。，、、、、 迅速且：目的’係提供一種顯示卡散熱模組，以能 速且有效地將顯示卡所產生之熱源排出。 組件根據，本發明之散熱模組包含有—散熱板 政…且件及-水箱組件；其令，散熱板組件具有 1309293 一散熱板體’該散熱板體底部與顯示卡之發熱源相接，該 散熱板體中設置有一水道，供散熱液流通，而散熱組件設 有一風罩，該風罩中具有一散熱鰭片組，且其—端設置有 一軸流風扇’令軸流風扇可將氣流引入，並吹向散熱籍片 組，使散熱鰭片組上熱量被散去，該水箱組件則設有一水 箱及一幫浦’水箱分別設置有通往散熱板體、散熱韓片組 之管路；俾使用時，可藉由幫浦之作動，將水箱之冷卻水 送入散熱板體之水道中流動，使冷卻水吸收顯示卡之發熱 源傳導至散熱板體的熱量後’再將該水送入散熱鰭片組中 散熱，散熱後再重新將冷卻水送入散熱板體的水道中吸熱 ’如此，不斷地循環，即矸迅速且有效地將顯示卡所產生 之熱源排出。 根據上述之另一目的，本發明之散熱模組包含有一散 熱板組件、一散熱組件及/水箱組件；其中，散熱板組件 具有一散熱板體，該散熱板體底部與顯示卡之發熱源相接 ’該散熱板體中設置有一水道’供散熱液流通，而散熱組 件設有—散熱鰭片組，使散熱鰭片組上熱量被散去，該水 箱組件則設有一水箱及一幫浦，水箱分別設置有通往散熱 板體、散熱鰭片組之管路；俾使用時，可藉由幫浦之作動 ’將水箱之冷卻水送入散熱板體之水道中流動，使冷卻水 吸收顯示卡之發熱源傳導炱散熱板體的熱量後’再將該水 送入散熱鰭片組中散熱，散熱後再重新將冷卻水送入散熱 板體的水道中吸熱，如此，不斷地循環，即可迅速且有效 地將顯示卡所產生之熱源排出。 1309293 為便貴審查委員能對本發明之目的、形狀、構造裝 . ϊ特徵及其功效，做更進一步之認識與暸解，茲舉實施例 配合圖式，詳細説明如下： 【實施方式】 本發明乃有關一種「顯示卡散熱模組」，請參閱第1 、2圖所示，本發明之第一實施例中，該散熱模組包含有一 散熱板組件11、一散熱組件12及一水箱組件13 ;其中’散 > 熱板組件11設有一高導熱金屬材質（如：銅、鋁·.·等）之 散熱板體14，該散熱板體14設有一上蓋141及一導熱板142 ’該導熱板142底部與顯示卡2之發熱源（如：圖形處理晶 片（GPU)、記憶體...等）相接，該導熱板142上設置有一 水道143，供冷卻水流通。 而散熱組件12設有一風罩15，該風罩15中具有一散熱 鰭片組151，該散熱鰭片組151係包含有數片間隔相距的鰭 .片152，各相鄰鰭片152間分別形成有一通道153，該風罩15 〜端設置有一軸流風扇154，令軸流風扇154可將氣流引入 ’並吹向散熱鰭片組151，使散熱鰭片組151上熱量被散去 〇 該水箱組件13則設有一水箱16及一幫浦17，水箱I6設 置有通往散熱板體14之管路。 使用時，可藉由幫浦17之作動，將水箱16之冷卻水送 入散熱板體14之水道143中流動，使冷卻水吸收顯示卡2傳 導至散熱板體14的熱量後，該熱量則經由散熱鰭片組151 8 1309293 * 、 中散熱’散熱後再重新將冷卻水送入散熱板體14的水道143 中吸熱，如此，不斷地循環，即可迅速且有效地將顯示卡] 所產生之熱源排出。 復請參閱第1、2圖所示，該顯示卡2上設有複數個固定 孔21，而散熱板體14上則設有複數個與固定孔21相配合之 固定元件111，俾散熱板體14結合於顯示卡2頂面時，可藉 由固定元件111嵌固於固定孔21中，使散熱板體14之導熱板 142底部與顯示卡2之發熱源相接。又，該導熱板142之水道 I 143在對應顯示卡2發熱源之位置上’設置有複數個等間距 排列之隔板144，以分隔水流。 復請參閱第1、2圖所示，該水箱16另設置有一液體補 充孔161，俾可於冷卻水不足時，透過該補充孔161補充冷 卻水。 請參閱第3、4、5圖所示’本發明之第二實施例中，該 散熱模組包含有一散熱板組件11、一散熱組件12及一水箱 > 組件13 ;其中’散熱板組件η設有一高導熱金屬材質（如 :銅、銘…等）之散熱板體14，該散熱板體14設有一上蓋 141及一導熱板142，該導熱板142底部與顯示卡2之發熱源 (如：圖形處理晶片（GPU)、記憶體…等）相接，該導 熱板142上設置有一水道143，供冷卻水流通，該水道143 末端設有一集水槽31，使水道143中流動之冷卻水，最後可 '流入該集水槽31中。 而散熱組件12設有一風罩15，該風罩15中具有一散熱 鰭片組151 ’該散熱鰭片組151係包含有數片間隔相距的鰭 1309293 片152’各相鄰鰭片152間分別形成有—通道153，該風罩^ 端設置有一轴流風扇154，令軸流風扇154可將氣流引入 ，並吹向散熱鰭片組151，使散熱鰭片組151上熱散去 〇 該水箱組件13則設有-水箱16，該水箱叫，有一、、尤 水幫浦32’沈水幫浦32設有-連接集水槽31、水道⑷前端 t管路，令沈水幫浦32可將集水槽31中之冷卻水抽回再送 入水道143前端。 ' 使用時’可藉由沈水幫浦32之作動，將冷卻水送入散 熱板體14之水道143中循環流動，使冷卻水吸收顯示卡二傳 導至散熱板體14的熱量，同時，顯示卡2傳導至散熱板體“ 的熱量，並傳至散熱鰭片組15卜使散_片組151將此執 量散去，如此，不斷地循環，即可迅速且有效地將顯示卡2 所產生之熱源排出。 復請參閱第3 ' 4 ' 5®所示’該顯示卡2上設有複數個 固定孔21，而散熱板體14上則設有複數個與固定孔21相配 1 合之固定元件111，俾散熱板體14結合於顯示卡2頂面時， 可藉由固定元件111後固於固定孔21中，使散熱板體14之導 熱板142底部與顯示卡2之發熱源相接。又，該導熱板142 之水道143在對應顯示卡2發熱源之位置上，設置有複數個 等間距排列之隔板144，以分隔水流。 請參閱第6、7、8圖所示，本發明之第三實施例中，該 散熱模組包含有一散熱板組件11、一散熱組件12及一水箱 組件13 ;其中，散熱板組件Π設有一高導熱金屬材質（如 10 1309293 :銅、鋁…等）之散熱板體14，該散熱板體14設有一上蓋 141及一導熱板142，該導熱板U2底部與顯示卡2之發熱源 (如.圖形處理晶片（GPU)、記憶體...等）相接，該導 熱板142上设置有一水道143 ’供冷卻水流通，該導熱板142 在對應顯示卡2發熱源之位置上，並設置有另一水道41。 -而散熱組件12設有一風罩15，該風罩15中具有一散熱 • 鰭片組151，該散熱鰭片組ι51係包含有數片間隔相距的鰭 片152 ’各相鄰鰭片152間分別形成有一通道153，該風罩15 籲-端設置有-軸流風扇154 ’令軸流風扇154可將氣流引入 ，並吹向散熱鰭片組151，使散熱鰭片組151上熱量被散去 〇 該水箱組件13則設有-水箱16及—幫浦17，水箱16分 別設置有通往散熱板體14、散熱鰭片組151之管路，散熱鰭 «片組151中並設置有通往另一水道41之管路42。 使用時’可藉由幫浦17之作動，將水箱16、散熱籍片 組151中之冷卻水送入散熱板體14之水道143、另一水道41 綠’使冷卻水直接錄顯针2鱗至散減㈣的熱 量後’再將該水送入散熱鰭片組151中散熱，散熱後再重新 將冷卻水送入散熱板體14的水道143、另—水道“中吸熱， 如此，不斷地循環，即可迅逮且有效地將顯示卡2所產生之 ，熱源排出。 • 復請參閱第6、7、8圖所示，該顯示卡2上設有複數個 固定孔21 ’而散熱板體Η上則設有複數個與固定孔^相配 合之固定元件m ’俾散熱板體14結合於顯示卡2頂面時， 1309293 可藉由蚊it件m嵌固於以孔21中，使散熱板體14之導 熱板142底部與顯示卡2之發熱源相接。 0月參閱第9 10、11圖所示’本發明之第四實施例中， =散熱模組包含有1熱板組件11、-散餘件12及-水 相組件13，其巾，散熱板組件11設有-高導熱金屬材質（ ^ .銅、铭…等）之散熱板體14，該散熱板體14設有一上 盖141及-導熱板142 ’該導純142底部與顯示卡2之發熱1309293 IX. Description of the Invention: [Technical Field] The present invention relates to a display card heat dissipation module, and more particularly to a heat dissipation module applied to a display card, which is produced by a water cooling method. The heat source can be discharged quickly and efficiently. [Prior Art] According to today's computer parts such as CPUs, memory and video cards, the efficiency of processing data is getting faster and faster. Taking a display card as an example, currently, the processing chips on the display cards on the market contain tens of millions of transistors, and the higher performance display cards are usually accompanied by a processing chip having a larger number of transistors, and the number of transistors. The amount of this is just one of the important factors that affect the thermal power generated by the operation of the wafer. The higher the performance of the graphics card, the more transistors it processes the chip, the higher the thermal power generated, resulting in higher temperature of the chip during the operation of the display card, which seriously affects the stability of the operation of the display card. High-end graphics cards are often shipped with a heat sink on their processing wafers, which discharges the high-temperature heat generated by the processing wafers to protect the processing wafers from excessively high temperatures, while maintaining stable processing of the wafers. Sex. A conventional heat sink for a display card, such as the Republic of China, No. M267511, which discloses a heat sink assembly having a heat sink and a heat sink fin disposed on the heat sink The group includes a plurality of fins spaced apart from each other, and 1309293 has a channel formed between each adjacent fin; a heat dissipating component is connected to the heat sink assembly and has a hollow air hood. The air hood is connected to the heat sink a rear side of the panel, at the front end of the air hood, an opening adjacent to the heat sink and a rear opening relative to the front opening, and an axial fan is disposed in the air hood The rotating shaft is vertically disposed between the top and bottom of the air hood; when used, the heat sink bottom material is placed on the top of the display card wafer, and the axial air fan rotates to guide the hot air in the air hood to pass through The channel/guide=inside of the Zhao film is discharged from the front end of the heat sink assembly and the rear end of the air hood to keep the temperature of the display card chip from being too high. = However, the lion can keep the temperature of the display card chip from being too high, and cool the temperature of the display card chip in an air-cooled manner. The rate is limited, and it cannot be expected to go _ ^ is not a good heat sink.政政,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, New, in the money does not (four) = 'finally developed to design a new display of the invention for two months to produce the lack of prior art. , , , , , and quickly provide a display card cooling module to efficiently and efficiently discharge the heat generated by the display card. According to the invention, the heat dissipation module of the present invention comprises: a heat dissipation plate assembly and a water tank assembly; wherein the heat dissipation plate assembly has a 1309293 heat dissipation plate body. The bottom of the heat dissipation plate body is connected to a heat source of the display card. The heat dissipation plate body is provided with a water channel for the heat dissipation liquid to circulate, and the heat dissipation component is provided with a wind cover, the air cover has a heat dissipation fin group, and the end portion is provided with an axial flow fan to enable the axial flow fan to flow the airflow Introduced and blown to the heat-dissipating group to dissipate heat from the heat-dissipating fin set, the water tank assembly is provided with a water tank and a pump's water tank is respectively provided with a pipeline leading to the heat sink body and the heat-dissipating Korean group俾 When using, the cooling water of the water tank can be sent to the water channel of the heat sink body by the action of the pump, so that the cooling water absorbs the heat generated by the heat source of the display card to the heat sink body. The heat is sent into the heat sink fin group, and after the heat is dissipated, the cooling water is again sent to the water channel of the heat sink body to absorb heat. Thus, the loop is continuously circulated, that is, the heat source generated by the display card is quickly and effectively discharged. According to another object of the present invention, the heat dissipation module of the present invention comprises a heat dissipation plate assembly, a heat dissipation assembly and/or a water tank assembly; wherein the heat dissipation plate assembly has a heat dissipation plate body, and the bottom of the heat dissipation plate body and the heat source of the display card The water-dissipating body is provided with a water channel for the heat-dissipating liquid to flow, and the heat-dissipating component is provided with a heat-dissipating fin group, so that heat is dissipated on the heat-dissipating fin group, and the water tank assembly is provided with a water tank and a pump. The water tanks are respectively provided with a pipeline leading to the heat dissipation plate body and the heat dissipation fin group; when used, the water can be sent to the water channel of the heat dissipation plate body by the action of the pump to make the cooling water absorb the display. After the heat source of the card conducts the heat of the heat sink body, the water is sent to the heat sink fin group to dissipate heat, and then the cooling water is again sent to the water channel of the heat sink body to absorb heat, so that the system continuously circulates, that is, The heat source generated by the display card can be quickly and efficiently discharged. 1309293 A more detailed understanding and understanding of the purpose, shape, structure, and function of the present invention can be made by the review committee. The embodiments are described in detail with reference to the following drawings: [Embodiment] The present invention is In a first embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation assembly 12, and a water tank assembly 13; The heat sink assembly 11 is provided with a heat-dissipating plate body 14 of a high-heat-conducting metal material (such as copper, aluminum, etc.), and the heat-dissipating plate body 14 is provided with an upper cover 141 and a heat-conducting plate 142. The bottom of the 142 is connected to a heat source of the display card 2 (such as a graphics processing unit (GPU), a memory, etc.), and the heat conducting plate 142 is provided with a water channel 143 for circulating cooling water. The heat dissipating component 12 is provided with a windshield 15 having a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and the adjacent fins 152 are respectively formed. There is a passage 153, and an air flow fan 154 is disposed at the end of the air hood 15 so that the axial flow fan 154 can introduce the airflow into the heat dissipation fin group 151, so that the heat on the heat dissipation fin group 151 is dissipated. The assembly 13 is provided with a water tank 16 and a pump 17, and the water tank I6 is provided with a pipe leading to the heat sink body 14. In use, the cooling water of the water tank 16 can be sent to the water channel 143 of the heat dissipation plate body 14 by the action of the pump 17, so that the cooling water absorbs the heat transferred from the display card 2 to the heat dissipation plate body 14, the heat is then Through the heat dissipation fin group 151 8 1309293 *, the heat dissipation 'heat dissipation and then re-send the cooling water into the water channel 143 of the heat dissipation plate body 14 to absorb heat, so that the cycle can be quickly and effectively generated by the display card] The heat source is discharged. Referring to FIG. 1 and FIG. 2, the display card 2 is provided with a plurality of fixing holes 21, and the heat dissipation plate body 14 is provided with a plurality of fixing elements 111 matching the fixing holes 21, and the heat dissipation plate body. When the top surface of the display card 2 is coupled to the top surface of the display card 2, the fixing member 111 can be embedded in the fixing hole 21, so that the bottom of the heat conducting plate 142 of the heat sink body 14 is connected to the heat source of the display card 2. Further, the water channel I 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at positions corresponding to the heat source of the display card 2 to separate the water flow. Referring to Figures 1 and 2, the water tank 16 is further provided with a liquid replenishing hole 161 through which the cooling water can be replenished when the cooling water is insufficient. Referring to the third embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation assembly 12, and a water tank> assembly 13; wherein the 'heat dissipation plate assembly η The heat dissipating plate body 14 is provided with a heat-dissipating metal material (such as copper, metal, etc.). The heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate 142. The bottom of the heat conducting plate 142 and the heat source of the display card 2 (such as The graphics processing unit (GPU), the memory, etc. are connected to each other. The heat conducting board 142 is provided with a water channel 143 for circulating cooling water. The water channel 143 is provided with a water collecting tank 31 at the end to make the cooling water flowing in the water channel 143. Finally, it can flow into the sump 31. The heat dissipating component 12 is provided with a windshield 15 having a heat dissipating fin group 151'. The heat dissipating fin group 151 includes a plurality of fins 1309293 spaced apart from each other. The air passage cover 154 is provided with an axial flow fan 154, so that the axial flow fan 154 can introduce the air flow to the heat dissipation fin group 151, so that the heat dissipation fin group 151 is dissipated and the water tank assembly is dissipated. 13 is equipped with - water tank 16, the water tank is called, there is a, Yushui Bangpu 32' submersible pump 32 is provided - connecting the sump 31, the water channel (4) front end t pipeline, so that the submerged pump 32 can be the sump 31 The cooling water in the middle is pumped back to the front end of the water channel 143. When used, the cooling water can be sent to the water channel 143 of the heat dissipation plate body 14 to circulate and flow, so that the cooling water absorbs the heat of the display card 2 to the heat dissipation plate body 14, and at the same time, the display card 2 The heat that is transmitted to the heat sink body is transmitted to the heat sink fin group 15 to dissipate the heat sink fin group 151, so that the loop is continuously circulated, and the display card 2 can be quickly and efficiently generated. The heat source is discharged. Please refer to the 3 ' 4 ' 5® as shown in the figure. 'The display card 2 is provided with a plurality of fixing holes 21, and the heat sink body 14 is provided with a plurality of fixings matched with the fixing holes 21 The element 111 and the heat sink body 14 are coupled to the top surface of the display card 2, and can be fixed in the fixing hole 21 by the fixing member 111, so that the bottom of the heat conducting plate 142 of the heat sink body 14 is connected to the heat source of the display card 2. Further, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at a position corresponding to the heat source of the display card 2 to separate the water flow. Please refer to Figures 6, 7, and 8 to illustrate In a third embodiment of the invention, the heat dissipation module includes a heat dissipation plate assembly 11 and a heat dissipation The heat dissipating plate assembly 14 is provided with a heat dissipating plate body 14 having a high thermal conductivity metal material (such as 10 1309293: copper, aluminum, etc.). The heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate. 142. The bottom of the heat conducting board U2 is connected to a heat source of the display card 2 (such as a graphics processing unit (GPU), a memory, etc.), and the heat conducting board 142 is provided with a water channel 143 ′ for cooling water to circulate. The heat conducting plate 142 is disposed at a position corresponding to the heat source of the display card 2, and is provided with another water channel 41. The heat dissipating component 12 is provided with a windshield 15 having a heat dissipating fin set 151 therein. The sheet group ι51 includes a plurality of fins 152 spaced apart from each other. A channel 153 is formed between each adjacent fin 152. The hood 15 is provided with an axial fan 154 ′ to allow the axial fan 154 to flow the airflow. The heat sink fin group 151 is introduced and blown to dissipate heat on the heat sink fin group 151. The water tank assembly 13 is provided with a water tank 16 and a pump 17, and the water tank 16 is respectively provided with a heat sink body 14 The heat-dissipating fin group 151 is provided with a heat-dissipating fin «the film group 151 is provided with a pass The pipeline 42 of the other water channel 41. When used, the cooling water in the water tank 16 and the heat radiation group 151 can be sent to the water channel 143 of the heat dissipation plate body 14 and the other water channel 41 green by the action of the pump 17 After the cooling water is directly recorded to the needle 2 scale to reduce the heat of the (four), the water is sent to the heat dissipation fin group 151 for heat dissipation, and then the cooling water is again sent to the water channel 143 of the heat dissipation plate body 14, and another The water channel “absorbs heat in the middle, so that it can circulate continuously, and the heat source can be quickly and effectively discharged from the display card 2. • Referring to Figures 6, 7, and 8, the display card 2 is provided with a plurality of fixing holes 21', and the heat sink body is provided with a plurality of fixing elements mating with the fixing holes. When the heat sink body 14 is coupled to the top surface of the display card 2, the 1309293 can be embedded in the hole 21 by the mosquito member m, so that the bottom of the heat conducting plate 142 of the heat sink body 14 is connected to the heat source of the display card 2. In the fourth embodiment of the present invention, the heat dissipation module includes a hot plate assembly 11, a spare member 12, and an aqueous phase assembly 13, a towel, and a heat dissipation plate. The assembly 11 is provided with a heat-dissipating plate body 14 of a high-heat-conducting metal material (^. Copper, Ming..., etc.), and the heat-dissipating plate body 14 is provided with an upper cover 141 and a heat-conducting plate 142 'the bottom of the pure 142 and the display card 2 heat
源（如：圖形處理晶片（GPU)、記憶體…等）相接，該 導熱板142上設置有—水道143，供冷卻水錢，該水道⑷ 末端設有一集水槽31，使水道143中流動之冷卻水，最後可 流入該集水槽31中。A source (such as a graphics processing unit (GPU), a memory, etc.) is connected. The heat conducting board 142 is provided with a water channel 143 for cooling water, and a water collecting tank 31 is arranged at the end of the water channel (4) to flow in the water channel 143. The cooling water finally flows into the sump 31.
而散熱組件12設有—風罩15，該風罩15巾具有-散熱 ，片組15卜錢熱鰭片組151係包含有數片μ隔相距的韓 片152 ’各相鄰籍片152間分別形成有-通道153,該風罩15 一端設置有—軸流風扇154，令轴流風扇154可將氣流引入 ’並°人向散觸 >；經151，使散熱鰭片組151上熱量被散去 ^該散熱鰭片組151上並設置有至少-U形熱管51，該等熱 管51 一端與散鱗片組151相接，另端職接於導熱板142 上，令^51藉其⑽體減發傳熱方式，可將導熱板142 上之熱量傳導至散麟片組⑸，#由散熱鰭片組⑸將此 熱量散去。 *該水箱組件13則設有一水箱16 ’該水箱16中設有一沈 水#浦32，沈水幫浦％設有一連接集水槽31、水道1幻前端 之管路，令沈水幫浦32可將集水槽31中之冷卻水抽回再送 12 1309293 入水道143或端。 使用日寸’可藉由沈水幫浦％之作動，將冷卻水送入散 熱板體14之水道143中循環流動，使冷卻水吸收顯示卡2傳 導至散熱板體14的熱量，同時，熱管51可將導熱板142上之 熱量傳導至散熱鰭片組151，藉由散熱鰭片組151將此熱量 散去。如此，不斷地循環，即可迅速且有效地將顯示卡2 所產生之熱源排出。 復請參閱第9、10、u圖所示，該顯示卡2上設有複數 個固定孔21 ’而散熱板體14上則設有複數個與固定孔21相 配合之固定元件111 ’俾散熱板體14結合於顯示卡2頂面時 ，可籍由固定元件111嵌固於固定孔21中’使散熱板體14 之導熱板142底部與顯示卡2之發熱源相接。又，該導熱板 142之水道143在對應顯示卡2發熱源之位置上，設置有複數 個等間距排列之隔板144，以分隔水流。 請參閱第12、13圖所示，本發明之第五實施例中，該 I 散熱模組包含有一散熱板組件11、一散熱組件12及一水箱 組件13 ;其中，散熱板組件11設有一高導熱金屬材質（如 :銅、銘…等）之散熱板體14，該散熱板體14設有一上蓋 141及一導熱板142，該導熱板142底部與顯示卡2之發熱源 (如：圖形處理晶片（GPU )、記憶體…等）相接，該導 熱板142上設置有一水道143，供冷卻水流通。 而散熱組件設有一風罩15，該風罩15中具有一散熱 鰭片組151，該散熱鰭片組151係包含有數片間隔相距的縛 片152，各相鄰鰭片152間分別形成有一通道153，該風罩15 13 1309293 一端設置有一轴流風扇154，令軸流風扇154可將氣流引入 並13人向政熱縛片組151，使散熱鑛片組151上熱量被散去 ，該散熱鰭片組151上並設置有至少一u形熱管61，該等熱 管61—端與散熱鰭片組151相接，另端則連接於導熱板142 上，令熱管61藉其内液體熱蒸發傳熱方式，可將導熱板m2 上之熱量傳導至散熱鰭片組151，藉由散熱鰭片組151將此 熱量散去。 該水箱組件13則設有一水箱16及一幫浦π，水箱16設 置有通往散熱板體14之管路。 使用日寸，可藉由幫浦17之作動，將水箱16之冷卻水送 入散熱板體14之水道143中流動，使冷卻水吸收顯示卡2傳 導至政熱板體14的熱量後，再將該水送入散熱鑛片組151 中散熱’散熱後再重新將冷卻水送入散熱板體14的水道^43 中吸熱，同時，熱管61可將導熱板142上之熱量傳導至散熱 鰭片組151，藉由散熱鰭片組} 51將此熱量散去。如此，不 斷地循環，即可迅速且有效地將顯示卡2所產生之熱源排出 〇 復睛參閱第12、13圖所示，該顯示卡2上設有複數個固 定孔21，而散熱板體14上則設有複數個與固定孔21相配合 之固定元件m，俾散熱板體14結合於顯示卡2頂面時，可 藉由固定元件111嵌固於固定孔21中，使散熱板體14之導熱 板142底部與顯示卡2之發熱源相接。 明參閱第14、15、16、17圖所示，本發明之第六實施 例中，該散熱模組包含有一散熱板組件U、一散熱組件12 14 1309293 .及一水箱組件13 ;其中，散熱板組件U設有一高導熱金屬 材質（如：銅、銘…等）之散熱板體14，該散熱板體咐 有一上蓋14丨及一導熱板142，該導熱板142底部與顯示卡2 之發熱源（如：圖形處理晶片（GPU)、記憶體·.等）相 接，該導熱板142上設置有一水道143，供冷卻水流通，該 水道143末端設有一集水槽31，使水道143中流動之冷卻= ，最後可流入該集水槽31中。 而散熱組件12设有一風罩15，該風罩ι5中具有一散熱 鰭片組151，該散熱鰭片組151係包含有數片間隔相距的鰭 片152’各相鄰鰭片152間分別形成有一通道153,該風罩^ 一端設置有一軸流風扇154，令軸流風扇154可將氣流引入 ，並吹向散熱鰭片組151，使散熱鰭片組151上熱量被散去 ，該散熱鰭片組151並設置有通往散熱板體14之管路71。 該水箱組件13則設有一水箱16，該水箱16中設有一沈 水幫浦32，水箱16分別設置有通往散熱板體14、散熱鰭片 組151之管路，沈水幫浦32則設有一連接集水槽31之管路， 令沈水幫浦32可將集水槽31中之冷卻水抽回水箱16。 使用時，可藉由沈水幫浦32之作動，將水箱16、散熱 鰭片組151之冷卻水送入散熱板體14之水道143中流動，使 冷卻水吸收顯示卡2傳導至散熱板體丨4的熱量後，抽回水箱 16中，再將該水送入散熱鰭片組151中散熱，散熱後再重新 將冷卻水送入散熱板體14的水道143中吸熱，如此，不斷地 循環，即可迅速且有效地將顯示卡2所產生之熱源排出。 復請參閲第14、15、16、π圖所示，該顯示卡2上設有 15 1309293 複數個固定孔21，而散熱板體14上則設有複數個與固定孔 21相配合之固定元件1Π，俾散熱板體14結合於顯示卡2頂 面時，可藉由固定元件1Η嵌固於固定孔21中’使散熱板體 14之導熱板H2底部與顯示卡2之發熱源相接。又，該導熱 板142之水道H3在對應顯示卡2發熱源之位置上，設置有複 數個等間距排列之隔板144，以分隔水流。 請參閱第18、19圖所示，本發明之第七實施例中，該 散熱模組包含有一散熱板組件11、一散熱組件12及一水箱 組件13 ;其中，散熱板組件11設有一高導熱金屬材質（如 ••銅、鋁...等）之散熱板體14，該散熱板體14設有一上蓋 141及一導熱板142，該導熱板142底部與顯示卡2之發熱源 (如：圖形處理晶片（GPU)、記憶體…等）相接，該導 熱板142上設置有一水道143，供冷卻水流通。 而散熱組件12設有一散熱鰭片組151，該散熱鰭片組 151係包含有數片間隔相距的鰭片152,各相鄰鰭片152間分 別形成有一適道153 ’使散熱鰭片組151上熱量被散去。 該水箱組件13則設有一水箱16及一幫浦17，水箱16設 置有通往散熱板體14之管路。 使用時，可藉由幫浦17之作動，將水箱16之冷卻水送 入散熱板體14之水道143中流動，使冷卻水吸收顯示卡2傳 導至散熱板體14的熱量後，該熱量則經由散熱鰭片組i5i 中政熱’政熱後再重新將冷卻水送入散熱板體14的水道Μ] 中吸熱’如此’不斷地循環，即可迅速且有效地將顯示封 所產生之熱源排出。 16 1309293 復請參閱第18、19圖所示，該顯示卡2上設有複數個固 定孔21，而散熱板體14上則設有複數個與固定孔21相配合 之固定元件111 ’俾散熱板體14結合於顯示卡2頂面時，可 藉由固定元件111喪固於固定孔21中，使散熱板體μ之導熱 板142底部與顯示卡2之發熱源相接。又，該導熱板142之水 道143在對應顯示卡2發熱源之位置上，設置有複數個等間 距排列之隔板144，以分隔水流。 復請參閱第18、19圖所示，該水箱16另設置有一液體 補充孔161，俾可於冷卻水不足時，透過該補充孔κι補充 冷卻水。 請參閱第20、21、22圖所示，本發明之第八實施例中 ，該散熱模組包含有一散熱板組件11、一散熱組件12及一 水箱組件13 ;其中，散熱板組件11設有一高導熱金屬材質 (如：銅、鋁…等）之散熱板體14，該散熱板體μ設有一 上蓋141及一導熱板142，該導熱板142底部與顯示卡2之發 熱源（如：圖形處理晶片（GPU)、記憶體.·.等）相接， 該導熱板142上設置有一水道143，供冷卻水流通，該水道 143末端設有一集水槽31 ’使水道143中流動之冷卻水，最 後可流入該集水槽31中。 而散熱組件12設有一散熱鰭片組151，該散熱鰭片組 151係包含有數片間隔相距的鰭片152,各相鄰鳍片ι52間分 別形成有一通道15 3，使散熱轉片組151上熱量被散去。 該水箱組件13則設有一水箱16，該水箱16中設有一沈 水幫浦32，沈水幫浦32設有一連接集水槽31、水道143前端 17 1309293 之管路，令沈水幫浦32可將集水槽31中之冷卻水抽回再送 入水道143前端。 使用時，可藉由沈水幫浦32之作動，將冷卻水送入散 熱板體14之水道143中循環流動，使冷卻水吸收顯示卡2傳 導至散熱板體14的熱量，同時，顯示卡2傳導至散熱板體14 • 的熱量，並傳至散熱鰭片組151，使散熱鰭片組151將此熱 • 量散去，如此，不斷地循環’即可迅速且有效地將顯示卡2 所產生之熱源排出。 • 復請參閱第2〇、21、22圖所示，該顯示卡2上設有複數 個固定孔21 ’而散熱板體14上則設有複數個與固定孔^相 配合之固定元件in，俾散熱板體14結合於顯示卡2頂面時 ，可藉由固定元件H1後固於固定孔21中，使:熱 之導熱板142底部與顯示卡2之發熱源相接。v , 又，該導熱板 • 142之水道143在對應顯示卡2發熱源之仅置& 及上’设置有複數 個等間距排列之隔板144，以分隔水流。 請參閱第23、24、25圖所示，本發明之第九實施例中 ，該散熱模組包含有一散熱板組件11、一散熱組件12及一 水箱組件13 ;其中，散熱板組件11設有一高導熱金屬材質 (如：銅、鋁…等）之散熱板體Μ ’該散熱板體14設有二 上蓋141及一導熱板142，該導熱板142底部與顯示卡2之發 . 熱源（如：圖形處理晶片（GPU)、記憶體...等）相接’ • 該導熱板142上設置有一水道143，供冷卻呔流通，該導熱 板142在對應顯示卡2發熱源之位置上，並敦复有另一水道 41 〇 18 1309293 而散熱組件12設有一散熱鰭片組151 ,該散熱鰭片組 151係包含有數片間隔相距的鰭片152，各相鄰鰭片152間分 別形成有一通道153，使散熱鰭片組151上熱量被散去。 該水箱組件13則設有一水箱16及一幫浦17，水箱16分 別設置有通往散熱板體14、散熱鰭片組151之管路，散熱鰭 片組151中並設置有通往另一水道々I之管路42。 使用時，可藉由幫浦17之作動’將水箱16、散熱鰭片 組151中之冷卻水送入散熱板體14之水道143、另一水道“ 中流動’使冷卻水直接吸收顯示卡2傳導至散熱板體14的熱 里後，再將該水送入散熱韓片組151中散熱，散熱後再重新 將冷卻水送入散熱板體14的水道143、另一水道41中吸熱， 如此，不斷地循環，即可迅速且有效地將顯示卡2所產生之 熱源排出。 復請參閱第23、24、25圖所示，該顯示卡2上設有複數 個固定孔21，而散熱板體14上則設有複數個與固定孔21相 配合之固定元件1Π，俾散熱板體14結合於顯示卡2頂面時 ，可藉由固定元件U1嵌固於固定孔21中，使散熱板體14 之導熱板142底部與顯示卡2之發熱源相接。 請參閱第26、27、28圖所示，本發明之第十實施例中 ，該散熱模組包含有一散熱板組件11、一散熱組件12及一 水箱組件13 ;其中，散熱板組件11設有一高導熱金屬材質 (如：銅、鋁.··等）之散熱板體14，该散熱板體14設有一 上蓋141及一導熱板142，該導熱板142底部與顯示卡2之發 熱源（如：圖形處理晶片（GpU)、記憶體..·等）相接， 19 1309293 該導熱板142上設置有一水道143，供冷卻水流通，該水道 143末端设有一集水槽31，使水道143中流動之冷卻水，最 後可流入該集水槽31中。 而散熱組件12設有一散熱鰭片組151，該散熱鰭片組 151係包含有數片間隔相距的鰭片152，各相鄰鰭片152間分 別形成有一通道153 ,使散熱鰭片組151上熱量被散去，該 散熱鰭片組151上並設置有至少一u形熱管51，該等熱管51 一端與散熱鰭片組151相接，另端則連接於導熱板142上， 令熱官51藉其内液體熱蒸發傳熱方式，可將導熱板142上之 熱量傳導至散熱鰭片組151 ’藉由散熱則組151將此熱量 散去。 該水相組件13則設有一水箱16，該水箱16中設有一沈 水幫浦32’沈水幫浦32設有—連接集水卿、水道143前端 之管路’令沈水幫浦 入水道143前端。 使用時’可藉由沈水幫浦32之作動，將冷卻水送入散 熱板體14之水道143巾循環賴，使冷卻水吸㈣示卡增 導i散熱板體14的熱量，同時，熱管51可將導熱板142上之 熱量傳導至放熱mw5卜藉由散熱鰭片組⑸將此敎量 散去。如此，不斷地循環，即可迅速且有效地將顯示卡2 所彥生之熱源排出。 復請參閱第26、27、28圖所示，該顯示卡2上設有複數 個固定孔21 ]而散熱板體14上則設有複數個與固定孔以相 配合之固定元件m，俾散熱板體14結合於顯示卡2頂面時 20 1309293 ’可藉由固定元件111嵌固於固定孔21中，使散熱板體14 之導熱板142底部與顯示卡2之發熱源相接。又，該導熱板 142之水道143在對應顯示卡2發熱源之位置上，設置有複數 個等間距排列之隔板144,以分隔水流。 請參閱第29、30圖所示，本發明之第十一實施例中’ 該散熱模組包含有一散熱板組件11、一散熱組件12及一水 箱組件13 ;其中，散熱板組件11設有一高導熱金屬材質（ 如：銅、鋁…等）之散熱板體14，該散熱板體14設有一上 蓋141及一導熱板142，該導熱板142底部與顯示卡2之發熱 源（如：圖形處理晶片（GPU)、記憶體…等）相接，該 導熱板142上設置有一水道143，供冷卻水流通。 而散熱組件12設有一散熱鰭片組151，該散熱鰭片組 151係包含有數片間隔相距的鰭片152,各相鄰鰭片i52間分 別形成有一通道153，使散熱鰭片組151上熱量被散去，該 散熱鰭片組151上並設置有至少一u形熱管61，該等熱管61 一端與散熱鰭片組151相接，另端則連接於導熱板丨42上， 令熱管61藉其内液體熱蒸發傳熱方式，可將導熱板142上之 熱量傳導至散熱鰭片組151，藉由散熱鰭片組151將此熱量 散去。 該水箱組件13則設有一水箱16及一幫浦17，水箱16設 置有通往散熱板體14之管路。 使用時，可藉由幫浦17之作動，將水箱μ之冷卻水送 入散熱板體14之水道143中流動，使冷卻水吸收顯示卡2傳 導至散熱板體14的熱量後，再將該水送入散熱鰭片組151 21 1309293 散熱後再重新料卻水送人賴板體1猶水道143 ”、、同蚪，熱官61可將導熱板142上之熱量傳導至散熱The heat dissipating component 12 is provided with a windshield 15 which has heat dissipation, and the chip set 15 includes a plurality of negatively spaced Korean 152 'each adjacent pieces 152 respectively Formed with a channel 153, the hood 15 is provided with an axial fan 154 at one end, so that the axial fan 154 can introduce the airflow into the 'and the human touch>; 151, the heat on the heat sink fin group 151 is The heat dissipation fin group 151 is disposed and provided with at least a U-shaped heat pipe 51. One end of the heat pipe 51 is connected to the scaly chip group 151, and the other end is connected to the heat conduction plate 142, so that the (51) body By reducing the heat transfer mode, the heat on the heat conducting plate 142 can be conducted to the bulk film set (5), and the heat is dissipated by the heat sink fin group (5). * The water tank assembly 13 is provided with a water tank 16'. The water tank 16 is provided with a submerged water #浦32, and the submersible pump is provided with a pipeline connecting the sump 31 and the waterway 1 phantom front end, so that the submersible pump 32 can be sump The cooling water in 31 is pumped back to the 12 1309293 water inlet 143 or end. The use of the day inch can be carried out by the submersible pump, and the cooling water is sent into the water channel 143 of the heat sink body 14 to circulate, so that the cooling water absorbs the heat conducted by the display card 2 to the heat sink body 14, and at the same time, the heat pipe 51 The heat on the heat conducting plate 142 can be conducted to the heat sink fin group 151, and the heat is dissipated by the heat sink fin group 151. In this way, the heat source generated by the display card 2 can be quickly and efficiently discharged by continuously circulating. Referring to Figures 9, 10 and u, the display card 2 is provided with a plurality of fixing holes 21', and the heat dissipating plate body 14 is provided with a plurality of fixing elements 111 which cooperate with the fixing holes 21. When the board body 14 is coupled to the top surface of the display card 2, it can be embedded in the fixing hole 21 by the fixing member 111. The bottom of the heat conducting board 142 of the heat sink body 14 is connected to the heat source of the display card 2. Moreover, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at a position corresponding to the heat source of the display card 2 to separate the water flow. In the fifth embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation assembly 12, and a water tank assembly 13; wherein the heat dissipation plate assembly 11 is provided with a high A heat dissipating plate body 14 of a heat conductive metal material (such as copper, metal, etc.), the heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate 142, and the bottom of the heat conducting plate 142 and the heat source of the display card 2 (eg, graphics processing) A GPU, a memory, etc. are connected, and a water channel 143 is disposed on the heat conducting plate 142 for circulating cooling water. The heat dissipating component is provided with a windshield 15 having a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of spaced apart tabs 152, and a channel is formed between each adjacent fin 152. 153, the windshield 15 13 1309293 is provided with an axial fan 154 at one end, so that the axial flow fan 154 can introduce the airflow into the 13-way heat-binding plate group 151, so that the heat on the heat-dissipating chip group 151 is dissipated. The fin group 151 is provided with at least one U-shaped heat pipe 61. The heat pipe 61-end is connected to the heat-dissipating fin group 151, and the other end is connected to the heat-conducting plate 142, so that the heat pipe 61 is transferred by the liquid heat evaporation. In the thermal mode, the heat on the heat conducting plate m2 can be conducted to the heat radiating fin group 151, and the heat is dissipated by the heat radiating fin group 151. The water tank assembly 13 is provided with a water tank 16 and a pump π, and the water tank 16 is provided with a pipe leading to the heat sink body 14. By using the daylight, the cooling water of the water tank 16 can be sent to the water channel 143 of the heat sink body 14 by the action of the pump 17, so that the cooling water absorbs the heat of the display card 2 to the heat board 14, and then The water is sent to the heat dissipating mass group 151 to dissipate heat, and then the cooling water is again sent to the water channel 43 of the heat dissipating plate body 14 to absorb heat. At the same time, the heat pipe 61 can conduct the heat on the heat conducting plate 142 to the heat dissipating fins. The group 151 dissipates this heat by the heat sink fin group 51. In this way, the heat source generated by the display card 2 can be quickly and efficiently discharged. Referring to Figures 12 and 13, the display card 2 is provided with a plurality of fixing holes 21, and the heat sink body is provided. The fixing member m is matched with the fixing hole 21. When the heat sink body 14 is coupled to the top surface of the display card 2, the fixing member 111 can be embedded in the fixing hole 21 to make the heat sink body. The bottom of the heat conducting plate 142 of 14 is connected to the heat source of the display card 2. Referring to Figures 14, 15, 16, and 17, in the sixth embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly U, a heat dissipation component 12 14 1309293, and a water tank assembly 13; The plate assembly U is provided with a heat-dissipating plate body 14 of a high-heat-conducting metal material (such as copper, metal, etc.). The heat-dissipating plate body has an upper cover 14 丨 and a heat-conducting plate 142, and the bottom of the heat-conducting plate 142 and the display card 2 are heated. A source (such as a graphics processing unit (GPU), a memory, etc.) is connected. The heat conducting plate 142 is provided with a water channel 143 for circulating cooling water. The water channel 143 is provided with a sump 31 at the end to flow in the water channel 143. The cooling = and finally can flow into the sump 31. The heat dissipating component 12 is provided with a windshield 15 having a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other. In the channel 153, an axial fan 154 is disposed at one end of the hood, so that the axial fan 154 can introduce the airflow and blows toward the heat dissipation fin group 151, so that heat is dissipated from the heat dissipation fin group 151, and the heat dissipation fin The group 151 is provided with a line 71 leading to the heat sink body 14. The water tank assembly 13 is provided with a water tank 16, and the water tank 16 is provided with a submersible pump 32. The water tank 16 is respectively provided with a pipeline leading to the heat dissipation plate body 14 and the heat dissipation fin group 151, and the submersible pump 32 is provided with a connection. The pipeline of the water collecting tank 31 allows the submerged water pump 32 to draw the cooling water in the sump 31 back to the water tank 16. When in use, the cooling water of the water tank 16 and the heat dissipation fin group 151 can be sent into the water channel 143 of the heat dissipation plate body 14 by the operation of the submersible pump 32, so that the cooling water absorption display card 2 is conducted to the heat dissipation plate body. After the heat of 4, the water is sucked back into the water tank 16, and the water is sent to the heat dissipation fin group 151 for heat dissipation. After the heat is dissipated, the cooling water is again sent to the water channel 143 of the heat dissipation plate body 14 to absorb heat, and thus, the system continuously circulates. The heat source generated by the display card 2 can be quickly and efficiently discharged. Referring to the figures 14, 15, 16, and π, the display card 2 is provided with 15 1309293 plurality of fixing holes 21, and the heat dissipation plate body 14 is provided with a plurality of fixings matched with the fixing holes 21. When the heat sink body 14 is coupled to the top surface of the display card 2, the fixing member 1 can be embedded in the fixing hole 21 to make the bottom of the heat conducting plate H2 of the heat sink body 14 connect with the heat source of the display card 2. . Further, the water channel H3 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at positions corresponding to the heat source of the display card 2 to separate the water flow. Referring to FIGS. 18 and 19, in the seventh embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation component 12, and a water tank assembly 13; wherein the heat dissipation plate assembly 11 is provided with a high thermal conductivity. A heat dissipating plate body 14 of a metal material (such as: copper, aluminum, etc.), the heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate 142, and the bottom of the heat conducting plate 142 and the heat source of the display card 2 (such as: A graphics processing unit (GPU), a memory, etc. are connected, and a water channel 143 is disposed on the heat conducting plate 142 for circulating cooling water. The heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and a suitable track 153 ′ is formed between each adjacent fin 152 to make the heat dissipating fin set 151 The heat is dissipated. The water tank assembly 13 is provided with a water tank 16 and a pump 17, and the water tank 16 is provided with a pipe leading to the heat sink body 14. In use, the cooling water of the water tank 16 can be sent to the water channel 143 of the heat dissipation plate body 14 by the action of the pump 17, so that the cooling water absorbs the heat transferred from the display card 2 to the heat dissipation plate body 14, the heat is then After the heat dissipation fin group i5i, the heat is sent to the water channel of the heat sink body 14 and then the heat is 'circulated' continuously, the heat source generated by the seal can be quickly and effectively displayed. discharge. 16 1309293 Please refer to the figures 18 and 19, the display card 2 is provided with a plurality of fixing holes 21, and the heat dissipation plate body 14 is provided with a plurality of fixing elements 111 corresponding to the fixing holes 21. When the board 14 is coupled to the top surface of the display card 2, the fixing member 111 can be secured in the fixing hole 21, so that the bottom of the heat conducting board 142 of the heat sink body μ is connected to the heat source of the display card 2. Moreover, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at a position corresponding to the heat source of the display card 2 to separate the water flow. Referring to Figures 18 and 19, the water tank 16 is further provided with a liquid replenishing hole 161 through which the cooling water can be replenished when the cooling water is insufficient. In the eighth embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation component 12, and a water tank assembly 13; wherein the heat dissipation plate assembly 11 is provided with a heat dissipation plate assembly 11 A heat-dissipating plate body 14 of a high-heat-conducting metal material (such as copper, aluminum, etc.) is provided with an upper cover 141 and a heat-conducting plate 142. The bottom of the heat-conducting plate 142 and the heat source of the display card 2 (eg, graphics) Processing the wafer (GPU), the memory, etc., the heat conducting plate 142 is provided with a water channel 143 for circulating cooling water. The water channel 143 is provided with a water collecting tank 31' to make the cooling water flowing in the water channel 143. Finally, it can flow into the sump 31. The heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and a channel 15 3 is formed between each adjacent fin ι 52 to make the heat dissipating fin set 151. The heat is dissipated. The water tank assembly 13 is provided with a water tank 16, and the water tank 16 is provided with a submersible pump 32. The submersible pump 32 is provided with a pipeline connecting the sump 31 and the front end of the water passage 143 17 1309293, so that the submersible pump 32 can be used for collecting the sink. The cooling water in 31 is withdrawn and sent to the front end of the water channel 143. In use, the cooling water can be sent to the water channel 143 of the heat dissipation plate body 14 to circulate through the operation of the submersible pump 32, so that the cooling water absorbs the heat conducted by the display card 2 to the heat dissipation plate body 14, and at the same time, the display card 2 The heat conducted to the heat sink body 14 is transferred to the heat sink fin group 151, so that the heat sink fin group 151 dissipates the heat amount, and thus, the loop is continuously circulated, and the display card 2 can be quickly and efficiently The generated heat source is discharged. • Referring to Figures 2, 21 and 22, the display card 2 is provided with a plurality of fixing holes 21', and the heat dissipation plate body 14 is provided with a plurality of fixing elements in which the fixing holes are matched. When the heat sink body 14 is coupled to the top surface of the display card 2, it can be fixed in the fixing hole 21 by the fixing member H1, so that the bottom of the heat conducting plate 142 is in contact with the heat source of the display card 2. v. Further, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 corresponding to the heat source of the display card 2 to separate the water flow. Referring to FIG. 23, FIG. 24 and FIG. 25, in the ninth embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation component 12, and a water tank assembly 13; wherein the heat dissipation plate assembly 11 is provided with a A heat-dissipating plate body of a high-heat-conducting metal material (such as copper, aluminum, etc.) 'The heat-dissipating plate body 14 is provided with two upper covers 141 and a heat-conducting plate 142, and the bottom of the heat-conducting plate 142 and the display card 2 are generated. : graphics processing chip (GPU), memory, etc.) are connected to each other. • The heat conducting plate 142 is provided with a water channel 143 for circulating cooling, and the heat conducting plate 142 is located at a position corresponding to the heat source of the display card 2, and There is another water channel 41 〇 18 1309293, and the heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and a channel is formed between each adjacent fin 152. 153, the heat is dissipated from the heat dissipation fin group 151. The water tank assembly 13 is provided with a water tank 16 and a pump 17. The water tank 16 is respectively provided with a pipeline leading to the heat dissipation plate body 14 and the heat dissipation fin group 151, and the heat dissipation fin group 151 is provided with a water passage to another water passage.管路I's line 42. When in use, the cooling water in the water tank 16 and the heat radiating fin group 151 can be sent to the water channel 143 of the heat radiating plate body 14 and the other water channel "flowing" by the pump 17 to directly absorb the cooling water to the display card 2 After being conducted to the heat of the heat sink body 14, the water is sent to the heat sink Korean group 151 for heat dissipation, and then the cooling water is again sent to the water channel 143 of the heat sink body 14, and the other water channel 41 absorbs heat. By continuously cycling, the heat source generated by the display card 2 can be quickly and efficiently discharged. Referring to Figures 23, 24 and 25, the display card 2 is provided with a plurality of fixing holes 21 and a heat dissipation plate. The body 14 is provided with a plurality of fixing elements 1 配合 which are matched with the fixing holes 21. When the heat sink body 14 is coupled to the top surface of the display card 2, the fixing element U1 can be embedded in the fixing hole 21 to make the heat sink. The bottom of the heat conducting plate 142 of the body 14 is connected to the heat source of the display card 2. Referring to Figures 26, 27 and 28, in the tenth embodiment of the present invention, the heat dissipating module comprises a heat dissipating plate assembly 11 and a a heat dissipating component 12 and a water tank assembly 13; wherein the heat sink assembly 11 is provided with a high thermal conductivity a heat dissipating plate body 14 of a metal material (such as copper, aluminum, etc.), the heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate 142, and the bottom of the heat conducting plate 142 and the heat source of the display card 2 (eg, graphics) Processing wafer (GpU), memory, etc.), 19 1309293 The heat conducting plate 142 is provided with a water channel 143 for circulating cooling water. The water channel 143 is provided with a water collecting tank 31 at the end to cool the water flowing in the water channel 143. The heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and an adjacent fin 152 is formed between the fins 152. The heat dissipation fins 151 are disposed on the heat dissipation fin group 151, and the heat dissipation fins 151 are provided with at least one U-shaped heat pipe 51. One end of the heat pipes 51 is connected to the heat dissipation fin group 151, and the other ends are connected. On the heat conducting plate 142, the heat officer 51 can transfer the heat on the heat conducting plate 142 to the heat radiating fin group 151' by means of the liquid heat evaporation heat transfer mode. The heat is dissipated by the group 151 by heat dissipation. The phase component 13 is provided with a water tank 16 having a sink in the water tank 16 The pump 32' submersible pump 32 is provided with a pipe connecting the front of the water collecting water and the water channel 143 to make the submersible pump into the front end of the water channel 143. When used, the cooling water can be sent by the submersible pump 32. The water channel 143 of the heat dissipation plate body 14 circulates, so that the cooling water suction (four) card enhances the heat of the heat dissipation plate body 14. At the same time, the heat pipe 51 can conduct the heat on the heat conduction plate 142 to the heat release mw5 by the heat dissipation fins. Group (5) dissipates this amount. Thus, by continuously cycling, the heat source of the display card 2 can be quickly and efficiently discharged. See Figure 26, 27, and 28 for the display card 2 A plurality of fixing holes 21 are provided, and the heat dissipating plate body 14 is provided with a plurality of fixing elements m for matching with the fixing holes. When the heat dissipating plate body 14 is coupled to the top surface of the display card 2, 20 1309293 ' can be fixed by The element 111 is embedded in the fixing hole 21 such that the bottom of the heat conducting plate 142 of the heat sink body 14 is in contact with the heat source of the display card 2. Moreover, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers 144 at a position corresponding to the heat source of the display card 2 to separate the water flow. Referring to FIGS. 29 and 30, in the eleventh embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation assembly 12, and a water tank assembly 13; wherein the heat dissipation plate assembly 11 is provided with a high a heat dissipating plate body 14 of a heat conductive metal material (such as copper, aluminum, etc.), the heat dissipating plate body 14 is provided with an upper cover 141 and a heat conducting plate 142, and the bottom of the heat conducting plate 142 and the heat source of the display card 2 (eg, graphics processing) A GPU, a memory, etc. are connected, and a water channel 143 is disposed on the heat conducting plate 142 for circulating cooling water. The heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and a channel 153 is formed between each adjacent fin i52 to heat the heat dissipating fin set 151. The heat dissipating fin set 151 is disposed with at least one U-shaped heat pipe 61. One end of the heat pipe 61 is connected to the heat dissipating fin set 151, and the other end is connected to the heat conducting plate 丨42, so that the heat pipe 61 is borrowed. The heat transfer heat transfer mode of the liquid heat conduction plate 142 can be conducted to the heat dissipation fin group 151, and the heat is dissipated by the heat dissipation fin group 151. The water tank assembly 13 is provided with a water tank 16 and a pump 17, and the water tank 16 is provided with a pipe leading to the heat sink body 14. In use, the cooling water of the water tank μ can be sent to the water channel 143 of the heat dissipation plate body 14 by the action of the pump 17, so that the cooling water absorbs the heat transferred from the display card 2 to the heat dissipation plate body 14, and then The water is sent into the heat sink fin group 151 21 1309293. After the heat is dissipated, the water is sent to the board body 1 and the water channel 143", and the heat officer 61 can conduct the heat on the heat conducting board 142 to the heat sink.
«Μ、曰片会曰1^*1 I Μ ，稭由散熱鰭片組151將此熱量散去。如此，不 循％ ’即可迅速且有效地將顯示卡2所產生之熱源排出«Μ,曰片曰1^*1 I Μ , the straw is dissipated by the heat sink fin group 151. Thus, the heat source generated by the display card 2 can be quickly and efficiently discharged without following %'
定復明參閱第29、30圖所示，該顯示卡2上設有複數個固 而政熱板體14上則設有複數個與固定孔21相配合 ―口定元件111，俾散熱板體14結合於顯示卡2頂面時，可 ，由固疋凡件1U嵌固於固定孔21中，使散熱板體14之導熱 板底部與顯示卡2之發熱源相接。 卜明參閱第31、32、33、34圖所示，本發明之第十二實 ^例中，該散熱模組包含有一散熱板組件11、一散熱組件 12及一水箱組件13 ;其中，散熱板組件11設有一高導熱金 屬材貝（如：銅、鋁…等）之散熱板體14 ’該散熱板體14 °又有—上蓋141及一導熱板142,該導熱板142底部與顯示卡 2之發熱源（如：圖形處理晶片（GPU)、記憶體…等）相 接，該導熱板142上設置有一水道143，供冷卻水流通，該 水道I43末端設有一集水槽31，使水道143中流動之冷卻水As shown in Figures 29 and 30, the display card 2 is provided with a plurality of solids, and the thermal plate body 14 is provided with a plurality of matching holes 21, which are matched with the fixing holes 21, and the heat dissipating plate body 14 is provided. When the top surface of the display card 2 is coupled to the top surface of the display card 2, the fixing member 1U is embedded in the fixing hole 21, so that the bottom of the heat conducting plate of the heat dissipation plate body 14 is connected to the heat source of the display card 2. Referring to Figures 31, 32, 33, and 34, in the twelfth embodiment of the present invention, the heat dissipation module includes a heat dissipation plate assembly 11, a heat dissipation assembly 12, and a water tank assembly 13; The plate assembly 11 is provided with a heat-dissipating plate body 14 of a high-heat-conducting metal material (such as copper, aluminum, etc.). The heat-dissipating plate body 14 has an upper cover 141 and a heat-conducting plate 142, and the bottom of the heat-conducting plate 142 and the display card The heat source (such as a graphics processing unit (GPU), a memory, etc.) is connected to each other. The heat conducting plate 142 is provided with a water channel 143 for circulating cooling water. The water channel I43 is provided with a water collecting tank 31 at the end to make the water channel 143. Cooling water flowing in
，最後可流入該集水槽31中。 而散熱組件12設有一散熱鰭片組151，該散熱鰭片組 151係包含有數片間隔相距的鰭片152,各相鄰鰭片152間分 別形成有一通道153，使散熱鰭片組151上熱量被散去，該 散熱鰭片組151並設置有通往散熱板體14之管路71。 該水箱組件13則設有一水箱16，該水箱16中設有一沈 22 1309293 水幫浦32，水箱16分別設置有通往散熱板體14、散熱鰭片 組151之管路，沈水幫浦32則設有一連接集水槽31之管路， 令沈水幫浦32可將集水槽31中之冷卻水抽回水箱16。 .使用時’可藉由沈水幫浦32之作動，將水箱16、散熱 鰭片組151之冷卻水送入散熱板體14之水道143中流動，使 冷卻水吸收顯示卡2傳導至散熱板體14的熱量後，抽回水箱 16中’再將該水送入散熱鰭片組151中散熱，散熱後再重新 將冷卻水送入散熱板體14的水道143中吸熱，如此，不斷地 循環’即可迅速且有效地將顯示卡2所產生之熱源排出。 復請參閱第31、32、33、34圖所示，該顯示卡2上設有 複數個固定孔21，而散熱板體14上則設有複數個與固定孔 21相配合之固定元件111，俾散熱板體結合於顯示卡2頂 面時’可藉由固定元件111嵌固於固定孔21中，使散熱板體 14之導熱板142底部與顯示卡2之發熱源相接。又，該導熱 板142之水道143在對應顯示卡2發熱源之位置上，設置有複 數個等間距排列之隔板W4 ’以分隔水流。 1 綜合上所述，本發明之顯示卡散熱模組，確實具有前 所未有之創新構造，其既未見於任何刊物，且市面上亦未 見有任何類似的產品’是以’其具有新穎性應無疑慮。另 外，本發明戶斤具有之獨特特徵以及功能遠非習用所可比擬 ，所以其確實比習用更具有其進步性，而符合我國專利法 有關發明專利之申請要件之規定，乃依法提起專利申請。 以上所述，僅為本發明最佳具體實施例，惟本發明之 構造特徵並不侷限於此，任何熟悉該項技藝者在本發明領 23 1309293 _ 域内，可輕易思及之變化或修飾，皆可涵蓋在以下本案之 ' 專利範圍。 【圖式簡單說明】 ' 第1圖為本發明散熱模組第一實施例之立體外觀圖。 • 第2圖為本發明散熱模組第一實施例之立體分解圖。 - 第3圖為本發明散熱模組第二實施例之立體分解圖之 —— 〇 • 第4圖為本發明散熱模組第二實施例之立體分解圖之 一一 〇 第5圖為本發明散熱模組第二實施例之立體分解圖之 二 〇 第6圖為本發明散熱模組第三實施例之立體分解圖之 • '—* 〇 第7圖為本發明散熱模組第三實施例之立體分解圖之 〇 第8圖為本發明散熱模組第三實施例之立體分解圖之 二 〇 第9圖為本發明散熱模組第四實施例之立體分解圖之 ---- ‘第10圖為本發明散熱模組第四實施例之立體分解圖之 # 一 〇 — _ 第11圖為本發明散熱模組第四實施例之立體分解圖之 24 1309293 第12圖為本發明散熱模組第五實施例之立體分解圖之 • - -—- 〇 \ 第13圖為本發明散熱模組第五實施例之立體分解圖之 _ 一墨 〇 ' 第14圖為本發明散熱模組第六實施例之立體分解圖之 « * 〇 . 第15圖為本發明散熱模組第六實施例之立體分解圖之 二。 • 第16圖為本發明散熱模組第六實施例之立體分解圖之 一 〇 第17圖為本發明散熱模組第六實施例之立體分解圖 之四。 第18圖為本發明散熱模組第七實施例之立體外觀圖。 - 第19圖為本發明散熱模組第七實施例之立體分解圖。 第20圖為本發明散熱模組第八實施例之立體分解圖之 ---- 〇 第21圖為本發明散熱模組第八實施例之立體分解圖之 二 _ 〇 第2 2圖為本發明散熱模組第八實施例之立體分解圖之 冒墨 〇 •第2 3圖為本發明散熱模組第九實施例之立體分解圖之 ** ——* 〇 第24圖為本發明散熱模組第九實施例之立體分解圖之 25 1309293 第25圖為本發明散熱模組第九實施例之立體分解圖之 « ， 二 〇 ' 第26圖為本發明散熱模組第十實施例之立體分解圖之 ---- 〇 ' 第2 7圖為本發明散熱模組第十實施例之立體分解圖之 * 二0 . 第28圖為本發明散熱模組第十實施例之立體分解圖之 二 〇 • 第29圖為本發明散熱模組第十一實施例之立體分解圖 之一。 第3 0圖為本發明散熱模組第十一實施例之立體分解圖 之二。 第31圖為本發明散熱模組第十二實施例之立體分解圖 • 之 ° 第32圖為本發明散熱模組第十二實施例之立體分解圖 之二。 第33圖為本發明散熱模組第十二實施例之立體分解圖 之三。 第34圖為本發明散熱模組第十二實施例之立體分解 圖之四。 【主要元件符號說明】 11 散熱板組件 12 散熱組件 26 1309293Finally, it can flow into the sump 31. The heat dissipating component 12 is provided with a heat dissipating fin set 151. The heat dissipating fin set 151 includes a plurality of fins 152 spaced apart from each other, and a channel 153 is formed between each adjacent fin 152 to heat the heat dissipating fin set 151. Dissipated, the heat dissipation fin group 151 is provided with a pipe 71 leading to the heat dissipation plate body 14. The water tank assembly 13 is provided with a water tank 16 having a sinking 22 1309293 water pump 32. The water tank 16 is respectively provided with a pipeline leading to the heat sink body 14 and the heat radiating fin group 151, and the submersible pump 32 is provided. A pipe connecting the sump 31 is provided so that the submersible pump 32 can draw the cooling water in the sump 31 back to the water tank 16. When in use, the cooling water of the water tank 16 and the fins 151 can be sent into the water channel 143 of the heat sink body 14 by the operation of the submersible pump 32, so that the cooling water absorption display card 2 is conducted to the heat sink body. After the heat of 14, the water is sucked back into the water tank 16 and the water is sent to the heat dissipation fin group 151 for heat dissipation. After the heat is dissipated, the cooling water is again sent to the water channel 143 of the heat dissipation plate body 14 to absorb heat, thus continuously circulating. The heat source generated by the display card 2 can be quickly and efficiently discharged. As shown in the figures 31, 32, 33 and 34, the display card 2 is provided with a plurality of fixing holes 21, and the heat dissipation plate body 14 is provided with a plurality of fixing elements 111 matched with the fixing holes 21, When the heat sink body is coupled to the top surface of the display card 2, the fixing member 111 can be embedded in the fixing hole 21, so that the bottom of the heat conducting plate 142 of the heat sink body 14 is connected to the heat source of the display card 2. Further, the water channel 143 of the heat conducting plate 142 is provided with a plurality of equally spaced spacers W4' at a position corresponding to the heat source of the display card 2 to separate the water flow. 1 In summary, the display card heat dissipation module of the present invention does have an unprecedented innovative structure, which is not found in any publication, and there is no similar product on the market, which is based on its novelty. doubt. In addition, the unique features and functions of the households of the present invention are far from comparable to those of the conventional ones, so they are indeed more progressive than the conventional ones, and comply with the requirements of the application requirements of the invention patents of the Chinese Patent Law, and the patent applications are filed according to law. The above description is only the best embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any one skilled in the art can easily change or modify it in the field of the present invention 23 1309293. Can be covered in the following patent scope of the case. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a first embodiment of a heat dissipation module of the present invention. • Fig. 2 is an exploded perspective view of the first embodiment of the heat dissipation module of the present invention. - Figure 3 is a perspective exploded view of a second embodiment of the heat dissipation module of the present invention - Fig. 4 is a perspective exploded view of a second embodiment of the heat dissipation module of the present invention. FIG. 6 is a perspective exploded view of a third embodiment of the heat dissipation module of the present invention. FIG. 7 is a third embodiment of the heat dissipation module of the present invention. 8 is an exploded perspective view of a third embodiment of the heat dissipation module of the present invention. FIG. 9 is an exploded perspective view of a fourth embodiment of the heat dissipation module of the present invention---- 10 is a perspective exploded view of a fourth embodiment of the heat dissipation module of the present invention. FIG. 11 is a perspective exploded view of a fourth embodiment of the heat dissipation module of the present invention. The three-dimensional exploded view of the fifth embodiment of the present invention - - - - - 〇 \ Figure 13 is a perspective exploded view of the fifth embodiment of the heat dissipation module of the present invention - Figure 1 is a heat dissipation module of the present invention The three-dimensional exploded view of the six embodiments « * 〇. Figure 15 is the sixth heat dissipation module of the present invention. The second exploded view of the embodiment. Figure 16 is a perspective exploded view of a sixth embodiment of the heat dissipation module of the present invention. Figure 17 is a perspective exploded view of the sixth embodiment of the heat dissipation module of the present invention. Figure 18 is a perspective view showing a seventh embodiment of the heat dissipation module of the present invention. - Figure 19 is a perspective exploded view of a seventh embodiment of the heat dissipation module of the present invention. Figure 20 is a perspective exploded view of the eighth embodiment of the heat dissipation module of the present invention - Fig. 21 is a perspective exploded view of the eighth embodiment of the heat dissipation module of the present invention. The inkjet lens of the eighth embodiment of the invention is an exploded view of the ninth embodiment of the heat dissipation module of the present invention. ** Figure 24 is a heat dissipation module of the present invention. 25 is a perspective exploded view of a ninth embodiment of the heat dissipation module of the present invention. FIG. 26 is a perspective view of a tenth embodiment of the heat dissipation module of the present invention. The exploded view of the heat dissipation module of the present invention is a perspective exploded view of the tenth embodiment of the heat dissipation module of the present invention. II. Fig. 29 is an exploded perspective view showing the eleventh embodiment of the heat dissipation module of the present invention. FIG. 30 is a perspective exploded view of the eleventh embodiment of the heat dissipation module of the present invention. Figure 31 is a perspective exploded view of the twelfth embodiment of the heat dissipation module of the present invention. Fig. 32 is a perspective exploded view of the twelfth embodiment of the heat dissipation module of the present invention. Figure 33 is a perspective exploded view of the twelfth embodiment of the heat dissipation module of the present invention. Figure 34 is a perspective exploded view of the twelfth embodiment of the heat dissipation module of the present invention. [Main component symbol description] 11 Heat sink assembly 12 Heat sink assembly 26 1309293
13 水箱組件 14 散熱板體 141 上蓋 142 導熱板 143 水道 144 隔板 15 風罩 151 散熱鰭片組 152 鰭片 153 通道 154 轴流風扇 16 水箱 161 液體補充孔 17 幫浦 2 顯示卡 21 固定孔 31 集水槽 32 沈水幫浦 41 另一水道 42 管路 51 U形熱管 61 U形熱管 71 管路 2713 Water tank assembly 14 Heat sink body 141 Upper cover 142 Heat transfer plate 143 Water channel 144 Partition 15 Wind hood 151 Heat sink fin set 152 Fin 153 Channel 154 Axial fan 16 Water tank 161 Liquid replenishing hole 17 Pump 2 Display card 21 Fixing hole 31 Water collection tank 32 submersible pump 41 another water channel 42 pipeline 51 U-shaped heat pipe 61 U-shaped heat pipe 71 Pipeline 27