JP3072013U - Central processor heat dissipation device - Google Patents

Abstract

(57) [Problem] To provide a heat radiating device for a central processing unit which can quickly and effectively lower the temperature of the central processing unit. SOLUTION: The heat conduction unit is adhered to a central processing unit,
The heat conducting unit is provided with a liquid passage, a coolant is drawn in from an inlet, and a relatively hot coolant is discharged from an outlet, and the inlet and the outlet of the heat conducting unit are respectively connected to the outlet and the inlet of the cooler by pipes. Since the cooling liquid connected and stored in the cooler is sucked and delivered by the liquid sucker, the cooling liquid is configured to circulate.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention mainly relates to a heat radiating device of a central processing unit (CPU), and more particularly to a heat radiating device of a central processing unit capable of giving a more heat radiating effect to the central processing unit.

[0002]

[Prior art]

 Conventionally, this type is as follows. The heat dissipation method of the conventional central processing unit utilizes the fact that the heat sink and the central processing unit are attached to each other, and the heat dissipation plate is provided with a heat dissipation fan. It is configured so that a better heat radiation effect can be obtained by the heat radiation plate.

[0003]

[Problems to be solved by the invention]

 The technology described in the prior art has the following problems. With the above-mentioned conventional heat dissipation method of the central processing unit, as the operation speed of the central processing unit becomes faster, the effect of heat dissipation by the flow of air cannot meet the demand for rapid cooling or large temperature reduction. . SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the related art, and has as its object to provide a heat dissipation device for a central processing unit that can quickly and effectively lower the temperature of the central processing unit.

[0004]

[Means for Solving the Problems]

 In order to achieve the above object, the heat dissipation device of the central processing unit according to the present invention is as follows. That is, the present invention is a heat dissipating device for a central processing unit composed of a heat conducting unit and a cooler. The heat conducting unit can be attached to the central processing unit, and the heat conducting unit has a liquid passage. Provided, the liquid passage has an inlet and an outlet, so that the cooling liquid can freely enter and store the cooling liquid in the cooler, and the cooler is provided with a liquid sucker, Coolant can be delivered from the outlet of the liquid sucker, the outlet can be connected to the inlet of the heat transfer unit by a pipe, the cooler is provided with an inlet, and the inlet is connected to the heat transfer unit by a pipe. It can be connected to the outlet, and the cooler is provided with a cap for refilling or replacing the coolant.

[0005] In addition to the above, the heat radiating device of the central processing unit of the present invention can be configured as follows. 1. A radiator is provided at an appropriate position at the inlet of the cooler, the radiator pipe is formed in a meandering shape, and fins are provided on its outer peripheral wall. One end of the radiator pipe is connected to the outlet of the heat conduction unit. While the other end of the radiator pipe is connected to the radiator pipe, the other end of the radiator pipe can supply coolant to the cooler. 2. The radiator includes a radiating fan.

[0006]

[Embodiment of the invention]

 FIG. 1 is an exploded perspective view according to an embodiment of the present invention. The heat dissipation device of the central processing unit of the present invention includes main components such as a heat conduction unit 1 and a cooler 2.

[0007] Referring to FIGS. 1, 2, and 3, the heat conduction unit 1 is constituted by a closed case body. The heat conduction unit 1 is provided with a liquid passage 11, and the liquid passage 11 is separated by a plate or a pipe. An inlet 12 is formed at one end of the liquid passage 11 and an outlet 13 is formed at the other end of the liquid passage 11, so that the coolant can freely enter, circulate and flow. ing. The heat conduction unit 11 can be bonded to the central processing unit 3 and can be locked by the clip 14, so that the best heat conduction effect can be obtained between the two.

The cooler 2 is formed in a container for storing a liquid, and is configured so that the coolant can be replenished or replaced by a cap 21. The cooling liquid can be composed of water or a water-cooled liquid agent. The cooler 2 is provided with a window 22 for checking the amount of the coolant, and the cooler 2 is provided with an inlet 23 and an outlet 24. The inlet 23 and the outlet 24 are connected to the heat transfer unit 1 by the pipe 4. As a result, the coolant can circulate and flow. Further, the cooler 2 is provided with a liquid sucker 25 such as a pump so that the coolant can circulate so as to flow quickly in a certain passage or in a certain direction.

A radiator 26 is provided at an appropriate position of the inlet 23 of the cooler 2, and a pipe of the radiator 26 is formed in a meandering shape, and fins are provided on an outer peripheral wall thereof. Cools quickly and effectively. In addition, a radiator fan 27 can be attached to the radiator 26 as needed, and a better radiating effect can be obtained.

Referring to FIG. 4, heat conduction unit 1 is adhered to central processing unit 3, and heat conduction unit 1 and cooler 2 are connected by a pipe 4. As a result, the coolant can be circulated by sucking and sending out the coolant stored by the liquid sucker 25. Then, the cooling liquid is circulated to the cooler 2 via the radiator 26.

[0011]

[Effect of the invention]

 Since the present invention is configured as described above, the following effects can be obtained. According to the heat dissipation device of the central processing unit of the present invention, cooling is performed by absorbing heat using the cooling liquid, so that the cooling effect is the best and the temperature of the central processing unit is quickly and effectively lowered. be able to. The present invention may be implemented in other ways without departing from its gist and essential characteristics. Accordingly, the embodiments described herein are described by way of example only and are not intended to limit the present invention.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view.

FIG. 2 is a perspective view showing a state in which the heat conduction unit and the central processing unit according to the embodiment of the present invention are assembled.

FIG. 3 is a sectional view taken along line AA.

FIG. 4 is a schematic view showing the operation of the present invention in a sectional state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat conduction unit 11 Liquid passage 12 Inlet 13 Outlet 14 Clip 2 Cooler 21 Cap 22 Window 23 Inlet 24 Outlet 25 Liquid sucker 26 Radiator 27 Radiator fan 3 Central processor 4 Pipe

Claims (3)

[Utility model registration claims] 1. A heat conduction unit (1) and a cooler (2). The heat conduction unit (1) can be bonded to a central processing unit (3). A liquid passage (11) is provided, and an inlet (12) and an outlet (13) provided in the liquid passage (11)
The cooling liquid can flow freely, can store the cooling liquid in the cooler (2), and is provided with a liquid sucker (25) in the cooler (2). Can be delivered from the outlet (24) of the vessel (25),
The outlet (24) is configured to be able to communicate with the inlet (12) of the heat transfer unit (1) by a pipe (4), and the cooler (2) is provided with an inlet (23), and the inlet (23) Can be connected to the outlet (13) of the heat transfer unit (1) by a pipe (4), and the cooler (2) has a cap (2) for replenishing or replacing the coolant.
(1) A heat dissipation device for a central processing unit, wherein (1) is provided. 2. A radiator (26) is provided at an appropriate position of an inlet (23) of the cooler (2). A pipe of the radiator (26) is formed in a meandering shape, and fins are formed on an outer peripheral wall thereof. The one end of the pipe of the radiator (26) is connected to the pipe connected to the outlet (13) of the heat conduction unit (1), while the other end of the pipe of the radiator (26) is supplied with the coolant. The heat radiating device of a central processing unit according to claim 1, wherein the heat radiating device is configured to be able to be sent to a cooler (2). 3. The heat radiating device of a central processing unit according to claim 2, wherein the radiator (26) is formed to include a radiating fan (27).