CN219474385U - Cooler cooling tube plate with high heat exchange efficiency - Google Patents

Abstract

The utility model relates to the technical field of cooling and radiating equipment, in particular to a cooler cooling tube plate with high heat exchange efficiency, which comprises a cooling liquid tube capable of providing a coolant, wherein the cooling liquid tube is fixedly arranged in a heat transfer plate to form a cooling tube plate structure, and the cooler cooling tube plate further comprises a heat dissipation strengthening part, the heat dissipation strengthening part is positioned below the heat transfer plate, and comprises a radiating fin capable of absorbing heat and an air flow structure capable of providing air flow, so that the heat exchange efficiency can be improved; this cooler cooling tube sheet that heat exchange efficiency is high can provide the cooling for the coolant pipe in the cooling tube sheet through the semiconductor refrigeration piece that is equipped with to based on heat transfer board and semiconductor refrigeration piece to heat release to the heat dissipation intracavity, and can realize the quick exchange flow of air under the effect of heat dissipation reinforcing part, absorb the heat simultaneously, remain efficient heat exchange efficiency and ability all the time.

Description

Cooler cooling tube plate with high heat exchange efficiency

Technical Field

The disclosure relates to the technical field of cooling and heat dissipating equipment, in particular to a cooler cooling tube plate with high heat exchange efficiency.

Background

Coolers are a type of heat exchange device for cooling a fluid, typically water as a coolant to remove heat. The heat exchange efficiency of the cooler is affected by the temperature of the coolant, and the improvement of the heat exchange efficiency is promoted based on the temperature difference.

The utility model patent with the prior authority publication number of CN205860849U discloses a cooling tube plate, which comprises a tube plate, a left interface, a filter plate hole, a right interface, a cooling tube, a cooling tank, a cooling liquid inlet, an upper mounting baffle, a cooling liquid outlet and a lower mounting baffle; the cooling tube in the cooling tube plate is connected with the tube plate through being installed in the cooling groove, the temperature of the cooling groove is always kept in a cooling state, the temperature of the tube plate is not increased to some extent, a hole is formed between the tube plate and the left interface and between the tube plate and the right interface, original internal circulation of the tube plate is not changed due to change of appearance, the filter plate is installed in the middle of the left interface through hole and the right interface through hole, filter plate holes are formed in the filter plate, all fluid media passing through the filter plate can be filtered out through the filter plate holes, the fluid media smaller than the filter plate holes can pass through, the fluid media larger than the filter plate holes can be blocked outside the filter plate, and the filter plate holes ensure internal circulation of the tube plate.

The cooling tube plate mainly absorbs heat based on the cool cooling groove, so that the temperature of the cooling tube plate is reduced or cannot rise, and other structures only provide a filtering structure, but the premise of ensuring the heat exchange efficiency is how to keep the coolant in the cooling groove at a low temperature or keep the coolant in a low-temperature state. In order to obtain a cooling tube plate with continuous and stable heat exchange capability, the cooling treatment is needed for the coolant so as to improve the heat exchange efficiency. In view of this, we propose a cooler cooling tube sheet with high heat exchange efficiency.

Disclosure of Invention

In view of the foregoing drawbacks or deficiencies in the prior art, it is desirable to provide a cooler cooling tube sheet with high heat exchange efficiency.

In a first aspect, the present application provides a cooler cooling tube sheet with high heat exchange efficiency, comprising:

the cooling liquid pipe is fixedly arranged in the heat transfer plate to form a cooling tube plate structure;

the heat dissipation enhancement part is positioned below the heat transfer plate, and comprises radiating fins capable of absorbing heat and an airflow structure for providing air flow, so that the heat exchange efficiency can be improved.

According to the technical scheme that this application embodiment provided, be equipped with on the heat transfer board with the installation cavity that the coolant liquid pipe agreed with, just be equipped with on the heat transfer board and run through the conduction structure of installation cavity.

According to the technical scheme that this application embodiment provided, be equipped with in the heat transfer board with the cell body that the installation cavity corresponds, just fixed mounting has the semiconductor refrigeration piece in the cell body, semiconductor refrigeration piece absorb heat one side with the cooling liquid pipe corresponds, and emits heat one side and correspond and be equipped with the heat dissipation chamber.

According to the technical scheme provided by the embodiment of the application, the cavity wall of the heat dissipation cavity is provided with at least two symmetrically arranged mounting holes, the heat dissipation device is arranged in the mounting holes, and the heat dissipation reinforcing part is fixedly arranged in the heat dissipation cavity.

According to the technical scheme provided by the embodiment of the application, the heat dissipation strengthening part comprises a plurality of branch pipes which are rotatably installed, each branch pipe is provided with a flow cavity which can be used for air flow exchange in a conducting mode, and the radiating fin is fixedly installed on the cavity wall of the flow cavity.

According to the technical scheme provided by the embodiment of the application, a plurality of branch pipes are installed on the main pipe in a conducting mode, the other ends of the branch pipes are connected with the outside of the heat dissipation cavity in a conducting mode, and the main pipe is provided with an air receiving port which can be externally connected with air blowing or sucking equipment.

To sum up, this technical scheme specifically discloses a cooler cooling tube sheet that heat exchange efficiency is high, can provide cooling for the coolant pipe in the cooling tube sheet through the semiconductor refrigeration piece that is equipped with to based on heat transfer plate and semiconductor refrigeration piece to heat release to the heat dissipation intracavity, and can realize the quick exchange flow of air under the effect of heat dissipation enhancement portion, absorb the heat simultaneously, remain efficient heat exchange efficiency and ability all the time.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:

FIG. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is an exploded view of the overall structure of the present utility model.

FIG. 3 is a schematic view of a heat dissipation enhancing portion according to the present utility model.

Reference numerals in the drawings: 1. a coolant tube; 2. a heat transfer plate; 21. a mounting cavity; 3. a heat dissipation cavity; 31. a mounting hole; 4. a heat radiation strengthening part; 41. a header pipe; 411. an air receiving port; 42. a branch pipe; 43. a flow chamber; 44. a heat sink; 5. semiconductor refrigerating sheet.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the utility model are shown in the drawings.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example 1

Referring to fig. 1 to 3, a cooler cooling tube plate with high heat exchange efficiency includes a cooling liquid tube 1 capable of providing a coolant, the cooling liquid tube 1 is fixedly installed in a heat transfer plate 2 to form a cooling tube plate structure, and further includes:

the heat dissipation enhancing portion 4, the heat dissipation enhancing portion 4 is located below the heat transfer plate 2, and the heat dissipation enhancing portion 4 includes a heat sink 44 capable of absorbing heat and an air flow structure providing air flow, so that heat exchange efficiency can be improved.

Be equipped with on the heat transfer plate 2 with the installation cavity 21 that liquid pipe 1 agrees with, and be equipped with on the heat transfer plate 2 and run through the conduction structure of installation cavity 21, specifically be the via hole for the heat that the coolant liquid absorbed in the cooler can be conducted downwards through the via hole, mainly can provide low temperature refrigeration based on semiconductor refrigeration piece 5, realize temperature gradient difference, be favorable to forming more efficient heat exchange efficiency.

The heat transfer plate 2 is internally provided with a groove body corresponding to the mounting cavity 21, the groove body is fixedly provided with a semiconductor refrigerating piece 5, one side of the semiconductor refrigerating piece 5 absorbing heat corresponds to the cooling liquid pipe 1, and one side emitting heat corresponds to the heat dissipation cavity 3.

The semiconductor refrigerating sheet 5 is a heat pump, has high reliability requirement, mainly uses the Peltier effect of semiconductor materials, and can absorb heat and release heat respectively at two ends of a couple when direct current passes through the couple formed by the semiconductor materials in series, so that the aim of refrigeration can be achieved.

Two symmetrically arranged mounting holes 31 are formed in the cavity wall of the heat dissipation cavity 3, a heat dissipation device, in particular a heat dissipation fan, is mounted in the mounting holes 31, air flow is generated to drive heat, and the heat dissipation reinforcing part 4 is fixedly mounted in the heat dissipation cavity 3.

The heat dissipation enhancing part 4 comprises four branch pipes 42 rotatably installed, a flow cavity 43 capable of exchanging air flow is installed on each branch pipe 42 in a conducting mode, and a heat dissipation plate 44 is fixedly installed on the cavity wall of the flow cavity 43. One end of each of the four branch pipes 42 is connected and installed on the main pipe 41, the other end of each of the four branch pipes is connected and connected with the outside of the heat dissipation cavity 3, and the main pipe 41 is provided with an air receiving port 411 which can be externally connected with air blowing equipment; the blowing device provides blowing air flow to enable heat exchanged by the cooling fins 44 into the flow cavity 43 to be blown out quickly, so that high efficiency of heat dissipation is maintained, and further high efficiency of a heat mixing process is guaranteed.

Working principle: the user at first assembles this tube sheet structure, in the use coolant pipe 1 needs to pour into the coolant into, the coolant can absorb the heat in the cooler and intensify, but based on the semiconductor refrigeration piece 5 can make the coolant cooling refrigeration in the coolant pipe 1 that sets up through the annular, the heat that gives off gets into in the heat dissipation chamber 3, external blowing device at air receiving port 411, start the radiator fan of fixed mounting in mounting hole 31, the heat in the air can be derived mostly by radiator fan, another part is absorbed by fin 44, the heat can be transferred to flow in the chamber 43, blow in the flow gas through blowing device through house steward 41 and branch pipe 42 to flow in the chamber 43 and take away the heat, improve the fin 44 cooling, then can have quick heat exchange efficiency.

The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the utility model referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the utility model. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.

Claims (6)

1. A cooler cooling tube sheet with high heat exchange efficiency, comprising:

the cooling liquid pipe (1) is fixedly arranged in the heat transfer plate (2) to form a cooling tube plate structure;

the heat dissipation enhancement part (4), heat dissipation enhancement part (4) are located heat transfer board (2) below, just heat dissipation enhancement part (4) are including fin (44) that can absorb heat and the air current structure that provides the air flow, can improve heat exchange efficiency.

2. A cooler cooling tube plate with high heat exchange efficiency according to claim 1, characterized in that the heat transfer plate (2) is provided with a mounting cavity (21) which is in fit with the coolant tube (1), and that the heat transfer plate (2) is provided with a conducting structure which can penetrate the mounting cavity (21).

3. A cooler cooling tube plate with high heat exchange efficiency according to claim 2, wherein a groove body corresponding to the installation cavity (21) is arranged in the heat transfer plate (2), a semiconductor refrigerating sheet (5) is fixedly installed in the groove body, one side of the semiconductor refrigerating sheet (5) absorbing heat corresponds to the cooling liquid tube (1), and one side of the semiconductor refrigerating sheet emitting heat corresponds to the heat dissipation cavity (3).

4. A cooler cooling tube plate with high heat exchange efficiency according to claim 3, wherein at least two symmetrically arranged mounting holes (31) are arranged on the cavity wall of the heat dissipation cavity (3), a heat dissipation device is arranged in the mounting holes (31), and the heat dissipation strengthening part (4) is fixedly arranged in the heat dissipation cavity (3).

5. A cooler cooling tube plate with high heat exchange efficiency according to claim 4, wherein the heat radiation strengthening part (4) comprises a plurality of branch tubes (42) which are rotatably arranged, a flow cavity (43) which can exchange air flow is arranged on each branch tube (42) in a conducting way, and the radiating fins (44) are fixedly arranged on the cavity wall of the flow cavity (43).

6. A cooler cooling tube plate with high heat exchange efficiency according to claim 5, wherein one end of the plurality of branch tubes (42) is connected and installed on the main tube (41), the other end is connected and connected with the outside of the heat dissipation cavity (3), and the main tube (41) is provided with an air receiving port (411) which can be externally connected with air blowing or sucking equipment.