T342742 100年02月25日梭正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及熱傳領域，尤其涉及一種液冷式散熱裝置及 散熱單元。 【先前技術】 [0002] 近年來電子技術迅速發展，電子元件之運行頻率及速度 不斷提昇。然，電子元件產生之熱量亦愈來愈多，溫度 亦愈來愈高，嚴重威脅電子元件運行時之性能及穩定性 ，為確保電子元件能正常工作，電子元件進行有效 散熱。目前風冷式歡子元件散熱T342742 On February 25, 100, the shuttle is replacing the page. 6. Description of the Invention: [Technical Field] [0001] The present invention relates to the field of heat transfer, and more particularly to a liquid-cooled heat sink and a heat sink. [Prior Art] [0002] In recent years, electronic technology has developed rapidly, and the operating frequency and speed of electronic components have been continuously improved. However, electronic components generate more and more heat, and the temperature is getting higher and higher, which seriously threatens the performance and stability of electronic components during operation. To ensure the normal operation of electronic components, electronic components are effectively cooled. Currently air-cooled components
惟 生之熱量 。雖然風 容性較好， 1噪聲和振動大 中，其一般修彝由散熱鰭 傳導出，再以風扇強迫空 冷式散熱裝置結構簡單， 且成本低廉，因而得到廣泛應用 ，且因其散熱原理為空氣τ熱對流：而全氣f熱傳導效率 甚低，散熱能力受到限制速電子元件 pi _ · ' 之散熱需求。液冷式散熱高效、快速等特 點，適合解決目前電子元#昇所衍生之散熱問 題。 [0003] 惟，先前技術之液冷式散熱裝置，皆由一系列分散設置 之單元連接而成，一則安裝拆卸極為不便，易造成主機 振動或電子元件受損；二則佔用空間較大，難以適應如 今電腦朝小型化發展之趨勢。 [0004] 有鑑於此，提供一種體積小、散熱效率良好之液冷式散 熱裝置實為必要。 095101364 表單編號A0101 第4頁/共13頁 1003064015-0 1342742 100年02月25日核1 正替换頁 【發明内容】 [0005] 以下，將以實施例說明一種液冷式散熱裝置及散熱單元 〇 [0006] —種液冷式散熱裝置，其包括：一吸熱單元；一散熱單 元，所述散熱單元包括一水箱、設於所述水箱中之泵浦 、至少一致冷晶片及至少一散熱片，所述致冷晶片之冷 端與水箱外壁貼接，熱端與所述散熱片貼接，靠近致冷 晶片之水箱内壁延伸有複數鰭片，所述每一個鰭片形成 有複數通孔；連接所述吸熱單元與所述散熱單元之連接 導管；及流動於所述吸熱單元、散熱單元與連接導管中 之冷卻液。 [0007] 一種散熱單元，其包括：一水箱；設於所述水箱中之泵 浦；至少一致冷晶片；及至少一散熱片：所述致冷晶片 之冷端與水箱外壁貼接，熱端與所述散熱片貼接，靠近 致冷晶片之水箱内壁延伸有複數鰭片，所述每一個鰭片 形成有複數通孔。 [0008] 相較於先前技術，所述液冷式散熱裝置中之散熱單元設 計集中，可安裝於電腦機箱内之插接槽中，佔用空間小 且便於拆卸。所述散熱單元中之水箱内壁向水箱内延伸 形成有複數鰭片，從而可增大冷卻液與水箱之間之熱交 換面積，提高熱交換效率，從而提高整個液冷式散熱裝 置之散熱效率。 【實施方式】 [0009] 下面結合附圖對本發明提供之液冷式散熱裝置作進一步 詳細說明。 095101364 表單編號A0101 第5頁/共13頁 1003064015-0 1342742 100年02月25日核正替換頁 [0010] 請參閱第一圖，為本發明之實施例提供之液冷式散熱裝 置1之立體示意圓。所述液冷式散熱裝置1包括一吸熱單 元10 ; —散熱單元20，所述散熱單元20包括一水箱21、 設於所述水箱21中之泵浦25、兩個致冷晶片22、22’及 兩組散熱片23、23’ ，致冷晶片22、22’ 一般有冷熱兩 端，所述致冷晶片22、22’之冷端與水箱21外壁貼接， 熱端與所述散熱片23、23’貼接，靠近致冷晶片22、22 ’之水箱21内壁延伸有複數鰭片211 ;連接所述吸熱單元 1 0與散熱單元2 0之連接導管30 ;各竭動於所述吸熱單元 10、散熱單元20與，速圖未示）》 [0011] [0012] 所述吸熱單;rfe帛於與發發熱元件 4 0產生之熱..量，並由流經帶走。 本實施例中，所述散熱單元20進一步兩個風扇24、 24’ ，分別配置於散熱片23、23’上ffc加快所述散熱 片23、23，之散熱。為提科科邊熱效率，降 低水箱21與散熱片23、23’P今熱^，可在所述致冷 晶片22、22，與水箱21外象邊碎‘秀并冷晶片22、22’與 散熱片23、23’間設置熱介面材料。為便於控制致冷晶 片22、22’之熱傳量，所述散熱單元20還可包括一功率 控制元件，通過控制致冷晶片22、22’之功率來達到控 制其熱傳量之效果。由於致冷晶片22、22’熱傳量之大 小由流經致冷晶片之電流大小決定，所以所述功率控制 元件可具體為一電流控制元件，用於控制流經致冷晶片 22、22’之電流大小，從而達到控制致冷晶片22、22’ 之熱傳量之效果。本實施例中，所述散熱單元20還包括 095101364 表單編珑Α0101 第6頁/共13頁 1003064015-0 1342742 100 年 02 月^^ -與所述水箱21連通之液位觀視槽26，該^^觀視槽 上設有-液位視窗261及—冷卻液注入口如，通過該液 位視窗261可觀察舰倾視㈣巾冷料之液位高低， 間接反映出水箱21巾之冷卻液之餘高低，若由液位視 窗261觀察狀冷純线位低於“25之最低液位時， 即可通過冷卻液注入口 262補充冷卻液。本實施例中，所 述液位觀視槽26具體設於兩組散熱片23、23，之間，在 所述液位觀視槽26頂部使用透明材料形成液位視窗261， 所述冷卻液注入口 262設於所述液位觀視槽26遠離水箱 之表面。因而，所述散熱單元20整體形成一緊湊組合。 [0013] 本貪施例中，與貼接有致冷晶片22、22，之水箱21外髮 對應之水箱21内壁向水箱21内延伸形成複數鰭片211，讀 複數鰭片211可增大水箱21中冷卻液與水箱21間之熱交換 面積，提高熱交換效率，優選地，所述複數鰭片211與水 箱21為一體結構，其形成方法可採用模鑄方法。所述鹎 片211上設有複數通孔212’並且所述鰭片2Π表面還形 成有複數奈米碳管》所述複數.通孔21 2可避免水箱21中出 現冷卻液流動死角，所述複數奈米碳管可進一步增大冷 卻液與縛片211間之熱交換面積。 [0014] 所述連接導管30包括-進液管31及-出&管32，所述進 液管31連接吸熱單元1〇與泵浦25 ’出液管32連接水箱21 與吸熱單元10 » 所述冷卻液可採用水、氨水、曱醇、丙鲷或庚烷等中之 一種或幾種之混合，亦可採用含導熱粒子之懸浮液。 095101364 表單編號A0101 第7頁/共13頁 1003064015-0 [0015] 1342742 [0016] [0017] [0018] [0019] 095101364 100年02月25日梭正替換頁 使用時，先將吸熱單元10安裝於發熱元件40上，再將散 熱單元20安裝於電腦機箱之插接槽中，如5. 25吋插接槽 中。發熱元件40產生之熱量傳導至吸熱單元10，使吸熱 單元10中之冷卻液溫度上升，溫度上升之冷卻液於泵浦 25抽送下，經進液管31流到水箱21中，並通過與複數鰭 片211及水箱21内壁快速熱交換，將其攜帶的熱量依次通 過水箱21壁，致冷晶片22、22’傳導到散熱片22、22’ 上，通過散熱片22、22’與空氣之熱對流將熱量散發出 去，然後冷卻後之冷卻液再通過出液管32流回吸熱單元 10。如此，循環往復，為碑Ί潑哉亦生之熱量不 斷帶走，使發巍元件40可Only the heat of birth. Although the wind capacity is better, 1 noise and vibration are large, the general repair is conducted by the heat radiating fin, and then the forced air cooling device with the fan is simple in structure and low in cost, so it is widely used, and the heat dissipation principle is Air τ heat convection: The total gas f heat conduction efficiency is very low, and the heat dissipation capability is limited by the heat dissipation of the speed electronic component pi _ · '. The liquid-cooled heat dissipation is efficient and fast, and is suitable for solving the heat problem caused by the current electronic element #升. [0003] However, the prior art liquid-cooled heat sinks are all connected by a series of discretely arranged units, one is extremely inconvenient to install and disassemble, and is likely to cause damage to the host vibration or electronic components; Adapt to the trend of computer development towards miniaturization. In view of the above, it is necessary to provide a liquid-cooled heat sink having a small volume and good heat dissipation efficiency. 095101364 Form No. A0101 Page 4 of 13 1003064015-0 1342742 February 25, 2005 Core 1 Positive Replacement Page [Invention] [0005] Hereinafter, a liquid-cooled heat sink and a heat sink unit will be described by way of example. [0006] A liquid-cooled heat sink comprising: a heat absorbing unit; a heat dissipating unit, the heat dissipating unit comprising a water tank, a pump disposed in the water tank, at least a uniform cold wafer, and at least one heat sink, The cold end of the cooling chip is attached to the outer wall of the water tank, the hot end is attached to the heat sink, and the inner wall of the water tank adjacent to the cooling chip has a plurality of fins, and each of the fins is formed with a plurality of through holes; a connecting conduit of the heat absorbing unit and the heat dissipating unit; and a cooling liquid flowing in the heat absorbing unit, the heat dissipating unit and the connecting duct. [0007] A heat dissipating unit comprising: a water tank; a pump disposed in the water tank; at least a uniform cold wafer; and at least one heat sink: a cold end of the cold wafer is attached to an outer wall of the water tank, and the hot end Attached to the heat sink, a plurality of fins extend from an inner wall of the water tank adjacent to the cooling chip, and each of the fins is formed with a plurality of through holes. Compared with the prior art, the heat dissipating unit in the liquid cooling type heat dissipating device is designed to be installed in a plugging slot in a computer case, which occupies a small space and is easy to disassemble. The inner wall of the water tank in the heat dissipating unit extends into the water tank to form a plurality of fins, thereby increasing the heat exchange area between the coolant and the water tank, improving the heat exchange efficiency, and thereby improving the heat dissipation efficiency of the entire liquid cooling heat dissipating device. [Embodiment] The liquid cooling heat dissipating device provided by the present invention will be further described in detail below with reference to the accompanying drawings. 095101364 Form No. A0101 Page 5 of 13 1003064015-0 1342742 February 25, 2005 Nuclear Replacement Page [0010] Please refer to the first figure, which is a three-dimensional embodiment of a liquid-cooled heat sink 1 according to an embodiment of the present invention. Indicate the circle. The liquid-cooling heat dissipating device 1 includes a heat absorbing unit 10; a heat dissipating unit 20, the heat dissipating unit 20 includes a water tank 21, a pump 25 disposed in the water tank 21, and two refrigerating wafers 22, 22' And two sets of fins 23, 23', the fins 22, 22' generally have hot and cold ends, the cold ends of the fins 22, 22' are attached to the outer wall of the water tank 21, the hot end and the fins 23 And a pair of fins 211 extending from the inner wall of the water tank 21 adjacent to the cooling fins 22, 22'; a connecting duct 30 connecting the heat absorbing unit 10 and the heat dissipating unit 20; each exhausting the heat absorbing unit 10. The heat dissipating unit 20 and the speed map are not shown. [0012] [0012] The heat absorbing sheet; rfe is entangled with the heat generated by the heat generating component 40, and is carried away by the flow. In this embodiment, the heat dissipating unit 20 further has two fans 24, 24' disposed on the heat sinks 23, 23', respectively, to accelerate the heat dissipation of the heat sinks 23, 23. For the thermal efficiency of the Ticono side, the water tank 21 and the heat sink 23, 23'P are cooled, and the cold-rolled wafers 22, 22 and the outer side of the water tank 21 are shredded 'show and cold wafers 22, 22' and A thermal interface material is disposed between the fins 23, 23'. To facilitate control of the heat transfer of the cryostats 22, 22', the heat sink unit 20 can also include a power control component that effects the control of its heat transfer by controlling the power of the cooled wafers 22, 22'. Since the amount of heat transfer of the cooled wafers 22, 22' is determined by the magnitude of the current flowing through the cooled wafer, the power control element can be specifically a current control element for controlling flow through the cooled wafers 22, 22' The magnitude of the current is such that the effect of controlling the heat transfer of the cooled wafers 22, 22' is achieved. In this embodiment, the heat dissipation unit 20 further includes a 095101364 form editor 0101 page 6/13 page 1003064015-0 1342742 100 years of the year ^^ - a liquid level viewing slot 26 communicating with the water tank 21, ^^The viewing tank is provided with a liquid level window 261 and a coolant injection port. For example, the liquid level window 261 can observe the liquid level of the ship's slanting (four) towel cold material, and indirectly reflects the coolant of the water tank 21 towel. If the liquid level window 261 observes that the cold line position is lower than the lowest liquid level of 25, the coolant can be replenished through the coolant injection port 262. In this embodiment, the liquid level viewing tank 26 is specifically disposed between the two sets of fins 23, 23, and a liquid material window 261 is formed on the top of the liquid level viewing trough 26 by using a transparent material, and the coolant injection port 262 is disposed in the liquid level viewing trough. 26 is away from the surface of the water tank. Therefore, the heat dissipating unit 20 integrally forms a compact combination. [0013] In the present embodiment, the inner wall of the water tank 21 corresponding to the outer surface of the water tank 21 to which the cooling chips 22 and 22 are attached is attached to the water tank. The plurality of fins 211 are formed in the extension of 21, and the reading of the plurality of fins 211 can increase the cooling in the water tank 21. The heat exchange area between the water tank 21 and the water tank 21 improves the heat exchange efficiency. Preferably, the plurality of fins 211 and the water tank 21 are integrally formed, and the forming method thereof may adopt a die casting method. The plurality of through holes are provided on the cymbal 211 212' and the surface of the fin 2 is further formed with a plurality of carbon nanotubes. The plurality of through holes 21 2 can prevent a coolant flow dead angle from appearing in the water tank 21, and the plurality of carbon nanotubes can further increase the coolant The heat exchange area with the tab 211. [0014] The connecting duct 30 includes a liquid inlet tube 31 and an outlet tube 32, and the liquid inlet tube 31 is connected to the heat absorbing unit 1 and the pump 25' The tube 32 is connected to the water tank 21 and the heat absorbing unit 10. The cooling liquid may be a mixture of one or more of water, ammonia water, decyl alcohol, propylene glycol or heptane, or a suspension containing heat conductive particles. 095101364 Form No. A0101 Page 7 of 13 1003064015-0 [0015] [0019] [0019] [0019] 095101364 When the shuttle is replacing the page on February 25, 100, the heat absorbing unit 10 is first installed in the heat. On the component 40, the heat dissipation unit 20 is mounted on the socket of the computer case. The heat generated by the heating element 40 is transmitted to the heat absorbing unit 10, so that the temperature of the coolant in the heat absorbing unit 10 rises, and the coolant whose temperature rises is pumped under the pump 25, through the liquid inlet tube. 31 flows into the water tank 21, and through the rapid heat exchange with the inner surfaces of the plurality of fins 211 and the water tank 21, the heat carried by the heat is sequentially passed through the wall of the water tank 21, and the cooled wafers 22, 22' are conducted to the heat sinks 22, 22'. The heat is dissipated by the heat convection of the fins 22, 22' with the air, and then the cooled coolant flows back to the heat absorbing unit 10 through the liquid discharge pipe 32. In this way, the cycle is reciprocating, and the heat generated for the monument is continuously taken away, so that the hairpin component 40 can be
•'X 當然，根據需要可減少或增冷晶片的 數目，以達到快速散熱之效果。另，爲_?於冷卻液流動 還可採用複數出液管，對稱分佈於進;4Μ兩側。 相較於先前技術，所述液散熱單元設 計集中，可安裝於電腦機落:内，今墙辑it/中，佔用空間小 且便於拆卸。所述散熱單元...中t乏丨香禪内壁向水箱内延伸 形成有複數鰭月，從而可增大冷卻液與水箱之間之熱交 換面積，提高熱交換效率，從而提高整個液冷式散熱裝 置之散熱效率。 惟，以上所述者僅為本發明之較佳實施方式，本發明之 範圍並不以上述實施方式為限，舉凡熟習本案技藝之人 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋 於以下申請專利範圍内。 【圖式簡單說明】 表單編號A0101 第8頁/共13頁 1003064015-0 1342742 - 100年02月25日核正替换頁 [0020] 第一圖係本發明之實施例提供之液冷式散熱裝置之立體 示意圖。 【主要元件符號說明】 [0021] 液冷式散熱裝置：1 [0022] 吸熱單元：10 [0023] 散熱單元：20 [0024] 水箱：21 [0025] 致冷晶片：22, 22’ [0026] 散熱片：23, 23’ [0027] 風扇：2 4，2 4 [0028] 泵浦：25 [0029] 液位觀視槽：26 [0030] 連接導管：30 [0031] 進液管：31 [0032] 出液管：32 [0033] 發熱元件：40 [0034] 鰭片：211 [0035] 通孔：212 [0036] 液位視窗：261 [0037] 冷卻液注入口 ： 262 表單编號A0101 095101364 第9頁/共13頁 1003064015-0• 'X Of course, the number of wafers can be reduced or increased as needed to achieve rapid heat dissipation. In addition, for the flow of the coolant, a plurality of liquid discharge pipes can be used, which are symmetrically distributed on the sides; Compared with the prior art, the liquid heat dissipating unit is designed to be installed in the computer: within the current wall, it has a small space and is easy to disassemble. In the heat dissipating unit, the inner wall of the scented scent is extended into the water tank to form a plurality of fins, thereby increasing the heat exchange area between the coolant and the water tank, improving the heat exchange efficiency, thereby improving the entire liquid cooling type. The heat dissipation efficiency of the heat sink. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Form No. A0101 Page 8 of 13 1003064015-0 1342742 - February 25, 2005 Nuclear Replacement Page [0020] The first figure is a liquid-cooled heat sink provided by an embodiment of the present invention A three-dimensional diagram. [Main component symbol description] [0021] Liquid-cooled heat sink: 1 [0022] Heat-absorbing unit: 10 [0023] Heat-dissipating unit: 20 [0024] Water tank: 21 [0025] Cooling wafer: 22, 22' [0026] Heat sink: 23, 23' [0027] Fan: 2 4, 2 4 [0028] Pump: 25 [0029] Liquid level viewing tank: 26 [0030] Connecting conduit: 30 [0031] Inlet: 31 [ 0032] Outlet tube: 32 [0033] Heating element: 40 [0034] Fin: 211 [0035] Through hole: 212 [0036] Level window: 261 [0037] Coolant injection port: 262 Form No. A0101 095101364 Page 9 / Total 13 pages 1003064015-0