Ι3Ϊ0894 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種散熱裝置’尤指-種帶有導風罩之散熱裝置。 【先前技術】 隨著電子產業之迅速紐，如電财奸元件之運算速度大幅度 提高，其產生的熱量也隨之劇增，如何將電子元件 二Ι3Ϊ0894 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device with an air guiding hood. [Prior Art] With the rapid development of the electronics industry, such as the speed of computing the components of electricity, the heat generated by it has also increased dramatically, how to electronic components
以紐其正常運行，-直是業者必需解決的問題。衆關m 主機板上之中央處理器是電腦系統的核心，當電腦運行時，中央處理 器產生熱量。過多的熱量會導致中央處理器-無法正常運行。爲有效散 發中央處理器在運行過程中產生之熱量，通常在電路板之中央處理器 上加裝一散熱裝置以便將其產生之熱量散發出去。 _熱裝置包括—置於電子元件上之散熱H，該散熱ϋ通常包括 土座，基座上延伸設有複數散熱籍片，通過散熱韓片從而將電子元 n生之熱量散發到觸的空氣中。爲了提升散熱器之散熱效率，通 2於放熱器-側安裝-風扇’使風扇產生之氣流吹入散熱韓片之通道 ’從而加快散熱器之散熱。然而，此種將風扇安裝於散熱器上之方 一旦風扇與散熱器之尺寸不匹配，例如在平衡技術擴展架構 ianar^TeChn〇1〇gyEXtended)中，散熱器呈很矮、很寬的長方體狀， /广、此呈方形或圓形’風扇不能罩住整個散熱器，風扇產生之氣 &不能均勻的吹入整個散熱鰭片之通道中。 料f 1卜—種方法是觀扇絲於散熱11頂部，然硫種方法使整個 放…裝置之高度增加，不適崎散錄置高度有要求的環境中。 【發明内容】 鰭置有必要提供—種可將風射生之氣射向整個散熱器 之I執=絲置，包括—與奸元件接觸的紐；複數置於底板上 口 導風罩，該導風罩具有―進風口及―出風口，該出風 ' 之内彳 1大’該出風口罩設於該散熱片，該進風σ與出風 6 1310894 口之間形成複數氣流通道；一風扇，安裝於導風罩之進風口處；該風 扇產生之氣流經由S玄導風罩之氣流通道及出風口吹向散熱韓片。 本發明散熱裝置之導風罩具有一進風口及一放大之出風口，從而 可將導風罩完全罩設於散熱m側，從而使風扇產生之氣流吹向散 熱鰭片，另外本發明散熱裝置之導風罩具有複數氣流通道，可使風扇 產生之氣流分成複數區域吹向散熱鰭片，從而提升散熱效率。 【實施方式】In the normal operation of the New Zealand, it is a problem that the industry must solve. The central processor on the main board is the core of the computer system. When the computer is running, the central processor generates heat. Excessive heat can cause the central processor - not working properly. In order to effectively dissipate the heat generated by the central processing unit during operation, a heat sink is usually added to the central processing unit of the circuit board to dissipate the heat generated by the central processing unit. The heat device includes a heat sink H disposed on the electronic component, and the heat sink generally includes a soil seat, and the plurality of heat sinks are extended on the base, and the heat of the electron element is radiated to the touched air by dissipating the heat sink. in. In order to improve the heat dissipation efficiency of the heat sink, the radiator-side mounting-fan is used to blow the airflow generated by the fan into the passage of the heat-dissipating Korean film, thereby accelerating the heat dissipation of the heat sink. However, in the case where the fan is mounted on the heat sink, once the fan and the heat sink are not matched in size, for example, in the balance technology expansion structure ianar^TeChn〇1〇gyEXtended), the heat sink has a short, wide rectangular shape. , / wide, this is square or round 'fan can not cover the entire radiator, the gas generated by the fan & can not be evenly blown into the channel of the entire fin. The material f 1 - the method is to view the fan wire on the top of the heat sink 11, but the sulfur method makes the height of the whole device increase, and it is not suitable for the environment where the height is required to be recorded. SUMMARY OF THE INVENTION It is necessary to provide a fin-type gas that can be directed to the entire heat sink, including a button that is in contact with the stalking element, and a plurality of hoods placed on the bottom plate. The air hood has an air inlet and an air outlet, and the air outlet is disposed at the heat sink, and the air inlet σ and the air outlet 6 1310894 form a plurality of air flow passages; The fan is installed at the air inlet of the air hood; the airflow generated by the fan is blown toward the heat sink through the air passage and the air outlet of the S-window hood. The air guiding cover of the heat dissipating device of the present invention has an air inlet and an enlarged air outlet, so that the air guiding cover can be completely covered on the heat dissipating m side, so that the airflow generated by the fan is blown to the heat dissipating fin, and the heat dissipating device of the invention The air hood has a plurality of air flow passages, so that the airflow generated by the fan is divided into a plurality of regions and blown toward the heat dissipation fins, thereby improving heat dissipation efficiency. [Embodiment]
請參閱第m顯示本發明實補之—散織置，該散熱 裝置安裝於-電路板10上，祕㈣路板1Q上之發熱電子元件(圖 未不)進行散熱，其包括-散熱器組合、—安裝於該散熱器組合一側 之導風罩50 ' -朝向散熱器組合吹風之風扇7〇及一用於將風扇％ 與導風罩5G安裝於雜驗合上之安餘60。其巾，安裝架60置 於導風罩50與風扇70之間。 八 同時請參閱第二圖及第三圖，該散熱器組合包括—第一散熱瑟 20及通過-對熱管21安裝於第一散熱器2〇上之一第二散轨器^ 該第-散熱H 20之寬度長於其高度，其包括—基座22、—頂板2 ，置於基座22與頂板24之間的複數散熱鰭片26 ;該基座22底这 6又有-導熱板23，用於與電路板1〇上之電子元件接觸，該導数板2 由熱鱗性能良好的金屬，例如銅製成。導熱板23之面積小於基月 22之面積以使基座22邊緣相對於導熱板B形成一台階η4，該台^ 224上設有螺孔226。基座22自其四角落分別向外延伸設有四凸] =〇一四扣具28牙過相應之凸耳no同置於電路板背面之背板(層 ^不)相螺合，從而使第-散熱器2G安裝於電路板ig上。頂板Μ」 =座22台階，相對之位置處亦設有—台階，該台階細j 目又有一對螺孔242。 —對平行設置之鮮21錢於第—散熱器2G上。每-敎管2 設置’其内具有毛細結構，填充有工作，該㈣ 匕括吸熱部跡平行於吸熱部調之放熱部2 部210與放熱部212之連接部加。吸熱部2叫置於基座22網 7 1310894 熱板23之間用於吸收發熱電子元件產生之熱量；放熱部Μ]夹置於 頂板24與散熱鰭片26頂部之間，如此由吸熱部21〇吸收之熱量通過 放熱部212可迅速傳遞至散熱鰭片26之頂部。發熱電子元^與置於 熱管21吸熱部21〇下方導熱板23之底面配合，當熱管21之吸熱部 210吸收來自電子元件之熱量時，熱管21内之工作流體變成氣'態後 流經熱管21之放熱部212被冷卻後變成液體，被冷卻之工作流體流 回至熱管21之吸熱部210，如此熱管21完成熱量轉移的循環:作： 第二散熱器30安裝於第一散熱器20上用於提高散熱效率，該第 一散熱器30包括一基座32,該基座32連接於熱管21之連接部213, 該基座32 —側垂直延伸有複數散熱鰭片34，該第二散熱器3〇之每 政熱鰭片34垂直於第一散熱器20之每一散熱籍片26。Please refer to the mth display of the present invention-dispersion device, the heat sink is mounted on the circuit board 10, and the heat-generating electronic components (not shown) on the secret (4) circuit board 1Q perform heat dissipation, which includes a heat sink combination - a windshield 50' mounted on one side of the heat sink assembly - a fan 7'' that faces the heat sink combination blower and a balance 60 for mounting the fan % and the air duct 5G on the miscellaneous cover. The cover 60 is placed between the air hood 50 and the fan 70. VIII, please refer to the second figure and the third figure, the heat sink combination includes a first heat sink 20 and a pass-to-heat pipe 21 mounted on the first heat sink 2 第二 a second tracker ^ the first heat sink The width of the H 20 is longer than the height thereof, and includes a base 22, a top plate 2, and a plurality of heat dissipation fins 26 disposed between the base 22 and the top plate 24; the base 22 has a heat transfer plate 23, For contact with electronic components on the board 1 , the derivative board 2 is made of a metal having good thermal scale properties, such as copper. The area of the heat conducting plate 23 is smaller than the area of the base moon 22 so that the edge of the base 22 forms a step η4 with respect to the heat conducting plate B, and the table 224 is provided with a screw hole 226. The pedestal 22 extends outwardly from the four corners thereof and has four convexities. 〇 四 四 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 The first heat sink 2G is mounted on the circuit board ig. The top plate Μ = seat 22 steps, the opposite position is also provided with a step, the step has a pair of screw holes 242. - For the parallel set of fresh 21 money on the first - radiator 2G. Each of the manifolds 2 is provided with a capillary structure therein, and is filled with a work. The (4) heat absorption portion is parallel to the connection portion of the heat radiating portion 2 and the heat radiating portion 212. The heat absorbing portion 2 is placed between the susceptor 22 net 7 1310894 and the hot plate 23 for absorbing the heat generated by the heat generating electronic component; the heat radiating portion 夹 is sandwiched between the top plate 24 and the top of the heat radiating fin 26, so that the heat absorbing portion 21 is The heat absorbed by the crucible can be quickly transferred to the top of the heat dissipation fins 26 through the heat radiation portion 212. The heating electron element is matched with the bottom surface of the heat conducting plate 23 disposed under the heat absorbing portion 21 of the heat pipe 21. When the heat absorbing portion 210 of the heat pipe 21 absorbs heat from the electronic component, the working fluid in the heat pipe 21 becomes a gas state and then flows through the heat pipe. The heat radiating portion 212 of 21 is cooled to become a liquid, and the cooled working fluid flows back to the heat absorbing portion 210 of the heat pipe 21, so that the heat pipe 21 completes the heat transfer cycle: the second heat sink 30 is mounted on the first heat sink 20 The first heat sink 30 includes a pedestal 32. The pedestal 32 is connected to the connecting portion 213 of the heat pipe 21. The pedestal 32 has a plurality of heat radiating fins 34 extending vertically from the side. Each of the thermal fins 34 of the device 3 is perpendicular to each of the heat sinks 26 of the first heat sink 20.
同時請參閱第四圖至第六圖，導風罩50安裝於第一散熱器2〇 之側用於引導風扇7〇產生之氣流吹向第一散熱器2〇之散敎嗜片 26形成之通道中，鱗風罩5Q可用硬紙片折疊而成或㈣膠^ 型。該導風罩50包括一第一導風管51、一第二導風管&及一第三 管53，該第—、第二及第三導風管51、52、53大致呈漏斗形， 其/刀別設有-進風σ 51〇、52〇、53〇及一放大之出風口 M2、知、 該^ 口 510、520、530與出風口 512、522、532連通以形成 導風通道，該導風通道呈漏斗形設置，該出風口 512、522、532 之直錄進風口 51〇、52〇、53〇之直徑大，該第_、第二及第 沿軸向方⑽紐姻；第—導崎51之直歡進風 口 522 ^風口 512逐漸增加，第二及第三導風管52、53臨近出風 W ^ 面及相對底面則被削平以形成—對相對之平壁汹、 導風二及第—導風罩52、51依次裝入第三導風管53中，第二 由第二^平壁524與第三導風管53之平壁534接觸，導風罩5〇 最線，徑依次逐漸增大，該導風罩5〇整體 配。第— ^Ar"度的尺寸大以方便與第-散熱器2G的尺寸匹 第—及第三導風管51、52、53之進風口 51〇、52〇、53〇 1310894 的邊緣分別設有四凹口 5160、5260、5360。四凹口 5160、5260、5360 分別位於二相互交叉垂直的直線上。At the same time, referring to the fourth to sixth figures, the air hood 50 is mounted on the side of the first heat sink 2 to guide the airflow generated by the fan 7 to be blown toward the first heat sink 2 In the channel, the scale hood 5Q can be folded with a piece of cardboard or (4) glue type. The air hood 50 includes a first air duct 51, a second air duct & and a third tube 53, and the first, second and third air ducts 51, 52, 53 are substantially funnel-shaped. , the knife is provided with - the inlet air σ 51 〇, 52 〇, 53 〇 and an enlarged air outlet M2, the 510, 520, 530 communicate with the air outlets 512, 522, 532 to form a wind guide a channel, the air guiding channel is arranged in a funnel shape, and the diameters of the direct recording air inlets 51〇, 52〇, 53〇 of the air outlets 512, 522, 532 are large, and the first, second and third axial directions (10) Marriage; the first - the direct air inlet 522 of the guide 51, the tuyere 512 gradually increases, the second and third air ducts 52, 53 are adjacent to the wind W ^ surface and the opposite bottom surface is flattened to form - the opposite flat wall汹, the guide air 2 and the first air hood 52, 51 are sequentially loaded into the third air duct 53, and the second second wall 524 is in contact with the flat wall 534 of the third air duct 53, the air hood 5〇 The most line, the diameter gradually increases, and the air hood 5〇 is integrally matched. The size of the ^Ar" degree is large to facilitate the size of the first radiator 2G and the edges of the air inlets 51〇, 52〇, 53〇1310894 of the third air ducts 51, 52, 53 are respectively provided. Four notches 5160, 5260, 5360. The four notches 5160, 5260, and 5360 are respectively located on two straight lines which are perpendicular to each other.
請~併參閱第七圖，安裝架60大致呈U形設置，其包括一對平 行設置之侧壁62，該對侧壁62平行於導風罩50之平壁534以方便 將導風罩50夾置其中，該安裝架60進一步包括與側壁62連接之側 板64 ’該側壁62之二相對邊緣620設有一對貫穿孔622與第一散熱 器20之螺孔242、226相對應’該安裝架60側壁62之邊緣620置於 第一散熱器20之台階240、224上以便頂板24之台階240及基座22 之=階224夾置於安裝架60的二側壁62之間，通過螺絲(圖未示)穿 過貝穿孔62並與第一散熱器20之螺孔242、226相螺合，從而將安 裝架60固定於第一散熱器20上。該侧板64呈方形設置，其中央設 有一圓形開口 640，一對垂直交叉之肋條642連接該開口 64〇周壁， 該對肋條642與導風罩50上之凹口 5160、5260'5360相對應，該肋 條642同凹口 5160、5260、5360相互卡扣配合以使導風罩5〇之進風 口 510、520、530對準安裝架60之開口並將導風罩5〇固定至該安裝 架60上。該側板64之四角落644分別設有一螺孔646。 响再參閱第二圖，風扇70呈方形設置，與安裝架6〇之尺寸相匹 配，其包括一風扇架72及安裝於風扇架72中之扇輪74，該風扇架 72之四角落76分別設有一與安裝架6〇之螺孔646相對應之貫穿孔 观’通過螺絲(圖未示)穿過貫穿孔與安裝架6〇之螺^ 646相螺 合從而將風扇70安裝固定於安裝架6〇上。 當風扇6運轉時’其產生之氣流從安裝架6〇之開口 64〇吹向導 風罩5〇之複數通道56，導風罩50之複數通道50將氣流分成複數區 域從而吹向第-散魅2G之散_片26,導風罩5G放大之出風口 512、522、532使氣流擴散從而均勻吹向第一散熱器2〇之散執 26:散熱韓片26吸收電子元件產生之熱量，如此，電子元件產生之 熱量迅速被散發，從而提高了整個散熱裝置之散熱效率。 【圖式簡單說明】 第一圖係本發明散熱裝置立體組裝圖。 1310894 第二圖係第-圖之立體分解圖。 f二圖係第二®中散熱器組合另-角度之組裝圖。 f四圖係第二圖中導風罩之立體分解圖。 第五圖係第四圖之組裝圖。 電路板 熱管Please refer to the seventh figure. The mounting bracket 60 is generally U-shaped and includes a pair of parallel disposed side walls 62 which are parallel to the flat wall 534 of the air guiding cover 50 to facilitate the air guiding cover 50. The mounting bracket 60 further includes a side plate 64 connected to the side wall 62. The opposite edge 620 of the side wall 62 is provided with a pair of through holes 622 corresponding to the screw holes 242, 226 of the first heat sink 20. The edge 620 of the side wall 62 of the 60 is placed on the steps 240, 224 of the first heat sink 20 so that the step 240 of the top plate 24 and the step 224 of the base 22 are sandwiched between the two side walls 62 of the mounting frame 60, through the screws (Fig. Not shown) passes through the bay perforations 62 and is screwed with the screw holes 242, 226 of the first heat sink 20, thereby fixing the mounting bracket 60 to the first heat sink 20. The side plate 64 is disposed in a square shape, and has a circular opening 640 at the center thereof. A pair of vertically intersecting ribs 642 are connected to the peripheral wall of the opening 64. The pair of ribs 642 are opposite to the notches 5160 and 5260'5360 of the air guiding cover 50. Correspondingly, the rib 642 and the notches 5160, 5260, 5360 are snap-fitted to each other such that the air inlets 510, 520, 530 of the air hood 5 are aligned with the opening of the mounting bracket 60 and the air hood 5 is fixed to the installation. On the shelf 60. The four corners 644 of the side plate 64 are respectively provided with a screw hole 646. Referring to the second figure, the fan 70 is arranged in a square shape to match the size of the mounting bracket 6 . The fan 70 includes a fan frame 72 and a fan wheel 74 mounted in the fan frame 72. The four corners 76 of the fan frame 72 respectively A through hole corresponding to the screw hole 646 of the mounting bracket 6 is provided. The screw (not shown) is screwed through the through hole to screw with the mounting bracket 6 to fix the fan 70 to the mounting bracket. 6 〇. When the fan 6 is in operation, the generated airflow blows the plurality of passages 56 of the guide hood 5 from the opening 64 of the mounting bracket 6 , and the plurality of passages 50 of the air hood 50 divide the airflow into a plurality of regions to blow the first-dissipating 2G scattered _ sheet 26, air hood 5G enlarged air outlet 512, 522, 532 to spread the airflow and evenly blow to the first heat sink 2 散 散 26: heat sink Korean 26 absorbs the heat generated by the electronic components, so The heat generated by the electronic components is quickly dissipated, thereby improving the heat dissipation efficiency of the entire heat sink. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a three-dimensional assembly diagram of the heat sink of the present invention. 1310894 The second figure is a perspective exploded view of the first figure. f The second figure is the assembly diagram of the second-in-one radiator combination and the angle. f Four figures are perspective exploded views of the air hood in the second figure. The fifth figure is an assembly diagram of the fourth figure. Circuit board
放熱部 基座 台階 導熱板 散熱鰭片 導風罩 進風口 凹口 平壁 導風通道Heat release pedestal step heat transfer plate heat sink fin air hood air inlet notch flat wall air guide channel
係沿第五圖巾yj-yj、線之導風罩的截面圖 係第二圖中導風罩和安裝架之組裝圖。 付號說明】 10 第一散熱器 20 21 吸熱部 210 212 連接部… 213 22、32 凸耳 220 224、240 螺孔 226、242、646 23 頂板 24 26、34 第二散熱器 30 50 第一導風管 51 510、520、 530出風口 512、522、532 5160'5260 '5360第二導風管 52 524、534 第三導風管 53 56 安裝架 60 62 邊緣 620 622、760 側板 64 640 肋條 642 644、76 風屬 70 72 屬輪 74 側壁 貫穿孔 開口 角落 風扇架A cross-sectional view of the air hood along the fifth towel yj-yj and the line is an assembly view of the air hood and the mounting frame in the second figure. Explanation of the payment number] 10 First heat sink 20 21 Heat absorbing part 210 212 Connecting part... 213 22, 32 Lug 220 224, 240 Screw hole 226, 242, 646 23 Top plate 24 26, 34 Second heat sink 30 50 First guide Duct 51 510, 520, 530 air outlet 512, 522, 532 5160 '5260 '5360 second air duct 52 524, 534 third air duct 53 56 mounting bracket 60 62 edge 620 622, 760 side panel 64 640 rib 642 644, 76 wind is 70 72 wheel 74 side wall through hole opening corner fan frame