九、發明說明： 【發明所屬之技術領域】 尤其係指一種用於電子元 本發明涉及一種散熱裝置， 件散熱之散熱裝置。 【先前技術】 β 中錢理11等在運行過程中產生大量之熱 :出Γ、：子元件之正常運行’其產生之熱需及時地散 發出ΐ。通常’該電子元件上加裝-散熱裝置以為其散熱。 數散散熱裝置包括—金屬底板及從該底板延伸之複 =、、、鰭片。該底板貼置於發熱電子元件而吸收該電子元 生之熱量，進而將熱量傳遞至鰭片而散發到周圍空 二。然？遺著電子產業之發展，電子元件之運行頻率和功 月匕曰里提升’其發熱量亦隨之增加，為滿足該電子元件之 散”、、:，所述散熱裝置通常加裝一風扇向所述鰭片提供 =對流氣流’從而提高該散熱裝置之散熱能力。然而，電 系統中需散熱之電子元件越來越多’而其體積亦越來越 J故所述散熱裝置需進一步改進以滿足所述電子元件之 散熱需求。 【發明内容】 有鑒於此’實有必要提供一種散熱性能好之散熱裝置。 一種散熱襞置，用於電子元件散熱，其包括一散熱器， 該散熱器設有複數氣流通道，一風扇位於該散熱器氣流通 道之一端口以向該散熱器提供強對流氣流，一導流件位於 :散熱器軋流通道另一端口以導引通過該散熱器之氣流為 八他電子7L件散熱，該散熱器於該端一側設有一卡槽，該 導流件形成有—嵌卡人該卡槽内之定位片。 =省知技術相比，所述導流件固定至散熱器氣流通道 之端，而將通過鰭片組之部分氣流導引向其他電子元件 八散…、使所述風扇提供之強對流氣流得以充分利 用滿足電子系統小型化、強功能趨勢下之散熱需求。 【實施方式】 請參閱圖1，本發明散熱裝置用於對置於一電路板（圖 未示）上之電子元件（圖未示）散熱。該散熱裝置包括一 散熱器10、一風扇60、一將該風扇60固定至該散熱器10之 風扇固定件（未標示）、及一設於該散熱器1〇 一側之導流 件70。 "月同時參閱圖2至圖4,所述散熱器1〇包括一底板HQ和 置於該底板110上之鰭片組130。該底板11〇之上表面具有一 較尚部分（未標示）和位於該較高部分三側之一較低部分 (未標示）。該鰭片組13〇置於該底板11〇之較高部分處。 該鰭片組130之頂部結合有一頂板。該鰭片組13〇包括複 數籍片，相鄰鰭片之間形成氣流通道（未標示）。每一鰭 片包括一本體131和從該本體上下邊緣垂直延伸之上下折 邊133 ’該複數鰭片之上下折邊133分別形成結合底板11〇和 頂板17 0之結合面。每一鰭片之一侧邊設有一楔形切口（未 標示），該複數鰭片之切口形成結合所述導流件7〇之楔形 1323840 • ·. 卡槽135。二大致呈“U”形之熱管150連接該底板lio和該 頂板170。每一熱管150包括一第一傳熱段151、一與該第一 傳熱段151大致平行之第二傳熱段153和連接該第一傳熱段 151和第二傳熱段153之連接段155。該連接段155大致垂直 於該第一、二傳熱段151、153。該第一、二傳熱段151、153 及連接段155之連接處大致呈圓角。該底板11〇之較高部分 設有二平行溝槽111，該底板110於該二溝槽1U之兩端設有 鲁相對應之二缺口 113。該二熱管150之第一傳熱段151結合至 該底板110之二溝槽111内。該頂板170設有分開之二平行溝 槽171。該二熱管150之第二傳熱段153結合至該頂板170之 二溝槽171内。該二熱管150之二連接段155位於該鰭片組 130之一側。該鰭片組130上下端緣對應該熱管150第一、二 傳熱段151、153和連接段155之連接處分別設有二凹槽134。 風扇固定件包括一對支架50。每一支架50包括一面板 510及從該面板510—邊緣垂直延伸之定位板530。該面板 _ 510之另一相對邊緣大致呈“c，，形。該面板51〇之上下端部 分別設有一固定孔511，以固定風扇60。該面板510之下端 緣向外垂直延伸一固定片513,該固定片513設有一開孔（未 標示）以供一螺釘（圖未示）將該支架50固定至底板11〇上。 該定位板530之上端部設有一通孔（未標示）以供一螺釘533 將該支架50固定至散熱器10之頂板17〇上。該二支架5〇分別 固定至散熱器10之二邊角，其中，該定位板530位於所述鰭 片組130最外側鰭片之外側，該面板510對應所述鰭片組13〇 之氣流通道而固定於鰭片組13〇之一側。該二支架5〇之二面 1323840 r · · 板510相對’其間形成對應氣流通道之通口（未標示）， 該風扇60對應該通口通過螺釘（未標示）固定至該二面板 5-10上。 所述導流件70相對於所述風扇而固定於所述鰭片組 130之另外一側。該導流件7〇包括一導流板73〇及從該導流 板730之上邊緣兩端分別向上延伸之一對固定臂γιο ,其中 該導流板730相對於該固定臂71 〇呈傾斜設置。該導流板mo 之上邊緣中部於所述固定臂710之間向上延伸一定位片 731。每一固定臂710之上端部設有一穿孔711，以通過一螺 釘80將該導流件70固定至所述散熱器1〇之頂板17〇。 請參閱圖3和圖4，所述導流件7〇之二固定臂71〇固定至 所述鰭片組130之相對兩側，該導流板73〇之定位片731嵌卡 於該鰭片組130之卡槽135内，從而該導流板730對應該鰭片 組130之氣流通道而斜向下固定於該鰭片組一側。 使用時’所述散熱器1〇之底板11〇貼合發熱電子元件而 #吸收該電子元件產生之熱，該底板11〇上之部分熱量直接傳 遞至鰭片組130，部分熱量由熱管15〇傳遞至頂板17〇及鰭片 組130。風扇60對應該鰭片組13〇之氣流通道向該鰭片組13〇 提供強對流氣流，通過氣流通道後之部分氣流直接散發至 周圍空間，而對應所述導流件7〇導流板73〇之部分氣流在導 流板730之導引下吹向周圍之其他電子元件而為其散熱。 與習知技術相比，所述導流板73〇將通過鰭片組13〇之 部分氣流導引向其他電子元件而為其散熱，使所述風扇6〇 1323840 提供之強對流氣流得以充分利用，滿足電子系統小型化、 強功能趨勢下之散熱需求。 ^ 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係本發明散熱裝置中一鰭片組之立體圖。 圖3係圖1之組裝圖。 圖4係圖3之部分剖視圖。 【主要元件符號說明】 散熱器 10 底板 110 溝槽 111 缺口 113 籍片組 130 本體 131 折邊 133 卡槽 135 凹槽 134 執管 <、、、P 150 第一傳熱段 151 第二傳熱段 153 連接段 155 頂板 170 溝槽 171 支架 50 面板 510 固定孔 511 固定片 513 定位板 530 1323840 • «· 螺釘 533、80 風扇 60 導流件 70 固定臂 710 穿孔 711 導流板 730 定位片 731 11IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to an electronic device. The invention relates to a heat dissipating device and a heat dissipating device for dissipating heat. [Prior Art] β Zhong Qianli 11 and so on generate a large amount of heat during operation: the normal operation of the Γ, : sub-components, the heat generated by it needs to be released in time. Usually, the heat sink is attached to the electronic component to dissipate heat therefrom. The discrete heat sink includes a metal backplane and a plurality of fins, fins, and fins extending from the backplane. The bottom plate is placed on the heat-generating electronic component to absorb the heat generated by the electron, thereby transferring heat to the fins and radiating to the surrounding space. Then? With the development of the electronics industry, the operating frequency of electronic components and the increase in the power of the electronic components, the heat generation of the electronic components has also increased. In order to satisfy the dispersion of the electronic components, the heat sink is usually equipped with a fan. The fins provide a convection airflow to improve the heat dissipation capability of the heat sink. However, more and more electronic components need to be dissipated in the electrical system, and the volume thereof is also increased. Therefore, the heat sink needs further improvement. The heat dissipation requirement of the electronic component is satisfied. [Invention] In view of the above, it is necessary to provide a heat dissipation device with good heat dissipation performance. A heat dissipation device for heat dissipation of electronic components includes a heat sink, and the heat sink is provided a plurality of airflow passages, a fan being located at one of the radiator airflow passages to provide a strong convection airflow to the radiator, and a flow guide located at another port of the radiator flow passage to guide the airflow through the radiator The eight-piece electronic heat-dissipating device has a card slot on one side of the end, and the flow guiding member is formed with a positioning piece in the card slot of the card-incorporating person. The flow guiding member is fixed to the end of the radiator airflow passage, and guides a part of the airflow passing through the fin group to the other electronic components, so that the strong convection airflow provided by the fan can be fully utilized to meet the miniaturization of the electronic system. The heat dissipation device of the present invention is used to dissipate heat from an electronic component (not shown) disposed on a circuit board (not shown). The heat dissipation device includes a heat sink 10, a fan 60, a fan fixing member (not shown) for fixing the fan 60 to the heat sink 10, and a flow guiding member 70 disposed on one side of the heat sink 1 " Referring to Figures 2 to 4, the heat sink 1A includes a bottom plate HQ and a fin set 130 disposed on the bottom plate 110. The upper surface of the bottom plate 11 has a portion (not labeled) and is located at the upper portion One of the three sides of the upper portion is a lower portion (not shown). The fin group 13 is placed at a higher portion of the bottom plate 11A. The top of the fin group 130 is coupled with a top plate. The fin group 13 includes Multiple pieces of paper, forming an air flow path between adjacent fins (not shown) Each fin includes a body 131 and a lower folded edge 133 from the upper and lower edges of the body. The upper fins 133 of the plurality of fins respectively form a joint surface of the bottom plate 11 and the top plate 170. One of the fins is provided with a wedge-shaped slit (not shown) on one side of the fin, and the slit of the plurality of fins forms a wedge shape 1323840 which is combined with the flow guiding member 7 · ·. The card slot 135. The two are substantially "U" shaped The heat pipe 150 connects the bottom plate lio and the top plate 170. Each heat pipe 150 includes a first heat transfer portion 151, a second heat transfer portion 153 substantially parallel to the first heat transfer portion 151, and a first heat transfer portion a connecting section 155 of the second heat transfer section 153. The connecting section 155 is substantially perpendicular to the first and second heat transfer sections 151, 153. The junction of the first and second heat transfer sections 151, 153 and the connecting section 155 Roughly rounded. The upper portion of the bottom plate 11 is provided with two parallel grooves 111. The bottom plate 110 is provided with two corresponding notches 113 at opposite ends of the two grooves 1U. The first heat transfer section 151 of the two heat pipes 150 is coupled to the two grooves 111 of the bottom plate 110. The top plate 170 is provided with two separate parallel grooves 171. The second heat transfer section 153 of the two heat pipes 150 is coupled to the two grooves 171 of the top plate 170. The two connecting sections 155 of the two heat pipes 150 are located on one side of the fin set 130. The upper and lower edges of the fin set 130 are respectively provided with two recesses 134 at the junctions of the first and second heat transfer sections 151, 153 and the connecting section 155 of the heat pipe 150. The fan mount includes a pair of brackets 50. Each bracket 50 includes a panel 510 and a positioning plate 530 extending perpendicularly from the edge of the panel 510. The other opposite edge of the panel _ 510 is substantially "c". The lower end of the panel 51 is respectively provided with a fixing hole 511 for fixing the fan 60. The lower edge of the panel 510 extends perpendicularly outwardly from the fixing piece. 513, the fixing piece 513 is provided with an opening (not shown) for fixing the bracket 50 to the bottom plate 11 by a screw (not shown). The upper end of the positioning plate 530 is provided with a through hole (not labeled). The bracket 50 is fixed to the top plate 17 of the heat sink 10 by a screw 533. The two brackets 5 are respectively fixed to the two corners of the heat sink 10, wherein the positioning plate 530 is located at the outermost side of the fin set 130. On the outer side of the fin, the panel 510 is fixed to one side of the fin group 13 对应 corresponding to the air flow passage of the fin group 13 。. The two sides of the two brackets 5 132 132 132 132 132 132 132 132 132 132 132 板 板 板 板 板 板a port (not shown) of the air flow passage, the fan 60 is fixed to the second panel 5-10 by a screw (not shown) corresponding to the through port. The flow guiding member 70 is fixed to the fin with respect to the fan. The other side of the set 130. The flow guide 7 includes a deflector 73〇 And a pair of fixed arms γιο extending upward from opposite ends of the upper edge of the baffle 730, wherein the baffle 730 is disposed obliquely with respect to the fixed arm 71. The upper edge of the baffle mo is centrally located A positioning piece 731 extends upwardly between the fixing arms 710. An upper end of each fixing arm 710 is provided with a through hole 711 for fixing the flow guiding member 70 to the top plate 17A of the heat sink 1 through a screw 80. Referring to FIG. 3 and FIG. 4 , the two fixing arms 71 of the baffle 7 are fixed to opposite sides of the fin set 130 , and the positioning piece 731 of the baffle 73 is embedded in the fin In the card slot 135 of the group 130, the baffle 730 is fixed obliquely downward to the side of the fin group corresponding to the air flow passage of the fin group 130. When used, the bottom plate 11 of the heat sink 1 is attached. The heat generated by the electronic component is absorbed, and part of the heat on the bottom plate 11 is directly transmitted to the fin set 130, and part of the heat is transferred from the heat pipe 15〇 to the top plate 17〇 and the fin set 130. The airflow channel of the fin group 13〇 provides a strong convective airflow to the fin group 13〇 through the gas A part of the airflow behind the passage is directly radiated to the surrounding space, and a part of the airflow corresponding to the deflector 7 〇 deflector 73 is blown toward the surrounding electronic components by the deflector 730 to dissipate heat. Compared with the prior art, the deflector 73 导引 guides a part of the airflow passing through the fin set 13 to other electronic components to dissipate heat, so that the strong convection airflow provided by the fan 6 〇 1323840 can be fully utilized. It satisfies the heat dissipation requirements under the trend of miniaturization and strong function of the electronic system. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, and is familiar with Equivalent modifications or variations of the present invention in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective view of a fin set in the heat sink of the present invention. Figure 3 is an assembled view of Figure 1. Figure 4 is a partial cross-sectional view of Figure 3. [Main component symbol description] Heat sink 10 Base plate 110 Groove 111 Notch 113 Chip set 130 Body 131 Fold 133 Card slot 135 Groove 134 Hold tube <,,, P 150 First heat transfer section 151 Second heat transfer Section 153 Connection section 155 Top plate 170 Groove 171 Bracket 50 Panel 510 Fixing hole 511 Fixing piece 513 Positioning plate 530 1323840 • «· Screw 533, 80 Fan 60 Guide 70 Fixed arm 710 Perforation 711 Baffle 730 Positioning plate 731 11