1305574 Λ 九、發明說明： 【發明所屬之技術領域】 本發明係涉及電子元件散熱領域’特別係關於一種適 合於電子元件散熱之鰭片組及具有該縛片組之散熱裝置。 【先前技術】 隨著中央處理器（CPU)等電子元器件功率之不斷 提高，散熱問題越來越受到人們的重視，在筆記本電腦 (Notebook computer )中更是如此，為了在有限之办 間長高效地帶走系統產生之熱量，目前業界主要採用由嗜 片組、熱管和風扇組成之散熱裝置，習知鰭片組通常包括 複數平行設置之散熱片，各散熱片在風扇之出風口處排列 成一矩形。工作時，熱管吸收發熱電子元件產生之熱量， 這些熱量通過熱管傳遞至鰭片組，而鰭片組之熱量則經由 鰭片組與風扇產生之強制氣流之間之熱交換散發至周圍環 境中’實現對電子元件散熱。 加系統噪音並引起氣流能量損失， 氣流與散熱片之熱交換效率及氣流 響該散熱裝置之散熱效率。因此， 用對系統之性能有非常大之影趣， 搭配使用，進而提高風扇與鰭片 該散熱過程t，風扇起著將系統產生之熱量傳遞到系 統外之重要作用’而則組之排财向與該風扇產生之氣 抓之抓向有-疋夾角，且各散熱片與該氣流間之夾角亦不 相同，氣流流經散糾時，與散熱片產生撞擊並反彈，增 ’導致氣流之流速降低， 良之利用率下降，最終影 ’風扇與鰭片組之搭配使 ’如何使兩者進行有效之 紐間之熱交換效率並降低 1305574 風扇流阻及料就顯得尤為重要。 【發明内容】 祐此下面以具體實施例說明—種散熱效率較高 裝置。至低•阻及噪音之則组及具有該則組之散熱 八二種，片組’包括複數散熱片，制片組包括第-部 二設，一部分及第二部分之間之第三部 Lr 5及第二部分之散熱片均包括—本體部及一 邱二笛該=一15刀之散熱片包括—本體部但不具有導流 ^該第-部分之散熱片之導流部與本體部位於同一平 第彳刀之政熱片之導流部從本體部向 部分傾斜。 斤 瘳 至小一裝置’包括至少—熱管、與該熱管熱接觸之 夕及用於產生冷卻氣流對_片組進行強制散 熱之-離心風扇’ _片組包括第—部分、第二部分及設 於，-部分及第二部分之間之第三部分，該第—部分及第 -部分之散熱片均包括—本體部及—導流部，該第三部分 之放熱片包括-本體部但不具有導流部，該第—部分之散 熱片之導流部與本體部位於同—平面，第二部分之散 之導流部從本體部向則組之第—部分傾斜。 一種散熱裝置，祕散發電子元件魅之熱量，包括 一離心風扇及設於離心風叙出風σ處之H组，該離 心風扇產生冷卻氣流對該鰭片組進行強制散熱，該韓片組 包括複數散細，沿氣流方向該則組包括位於氣流前端 1305574 :部分及位於氣流後端之第二部分，該第-部分及第 ^刀之散熱片均包括—本體部及位於本體部前端之一導 =、’,其中該第—部分之散熱狀導流部與其本體部位於 同平面’第二部分之散熱片之導流部從其本體部向籍片 組之第一部分傾斜。 ^與習知技術相比，通過設置該導流部及該本體部，使 #冷魏流之流動方向可以平緩過渡，降低該則組之流 卩及本曰並乓加該鰭片組之散熱面積，從而使該散熱裝置 具有散熱效率較高之優點。 【實施方式】 下面參照附圖，結合實施例對本發明作進一步說明。 請一併參閱圖1及圖2，該散熱裝置10包括一具有良好 導熱性之板體11 ’設於該板體1：1上部之兩根熱管12、’ 與熱管12、13熱接觸之第一、第二縛片組14、15，及用 於對該第一及第二韓片組14、15散熱之離心風扇16。 _ 該風扇16包括一扇框161、裝設於該扇框161内之定 子（圖未示）及可相對該定子轉動之轉子162。該扇框161 包括一頂板、一底板以及連接於頂板與底板間之一側板， 為方便氣流進出該扇框161 ’該風扇16在扇框161之頂板 與底板上正對轉子162之位置’即大致於頂板與底板之中 央位置分別設置有一圓孔，作為該風扇16之進風口 163、 164，扇框161之側板於其兩側分別形成與進風口 163、 164垂直之^ —出風口165、166 ’該兩出風口165、166 相垂直。該風扇16運轉時，在進風口 163、164處產生負 9 1305574 壓，將其關之錢由進風σΐ63、164吸人細6i内， 經加壓後Μ風π165、166相吹向[、第二縛片組 14、15,以冷卻該第-、第二鰭片組14、15。 第一及第二續片組14、15分別位於風扇16之出風口 165 166處該第―、第二轉片组分別由複數 散熱片140 150/σ—直線排列形成。該散熱片⑽、⑽ 均包括-主體部m、151及由這些主體部⑷、⑸之 下兩端分別彎_成之二相互平行之域142、152， 這二折邊142 152相抵靠形成_片組w、15之頂面和底 面以4大與熱g 12、13之接觸面積。本實施例中，該第 -轉片組14中之散熱14G與第二鰭片組15中之散熱片 150之設置方式相同’下面僅以第一則組】4中各散熱片 140為例加以介紹。 吻同時參照圖3，籍片組14位於沿氣流方向前端之第 部分14a之散熱片14〇朝向風扇方向向外延伸形成導流 部147，該導流部147與散熱片140之本體部141位於同一 平面上，位於氣流方向後端之第二部分14c之散熱片 之本體部141具有從本體部141前端朝向鰭片組14之第— °!^14a考折之導流部143，該導流部ία、ία彎折之方 向與氣流方向大致平行，其高度略小於本體部141之高度， 上、下兩端均與本體部141之上、下兩端形成一定距離， 其咼度差分別為扇框161之頂板與底板之厚度，以便伸入 至風扇16之扇框161内’導流部147、143之上端向一側 彎折形成與相鄰散熱片140之導流部143、147相抵靠之析 1305574 :邊148,於第一韓片組14之導流部143上端形成一頂面。 該導流部143、147與主體部141是一體成型，各相鄰之散 熱片140之間均存在—定間距，在這些散熱片⑽之間形成 順沿折邊148、142方向之氣流通道，供離心風_產生 之氣流經過。其中第二部分l4c之散熱片14〇之數量遠大於 第-部分14a之散熱# 140之數量，該實侧巾，第一部分 l4a僅包括四片散熱片140 ’其實際數 間之間距大小及氣流之流場狀況而定，比如可^三片以 上’但以第一部分之散熱片W0數量不超過韓片组14 之全部散熱片140數量之1/3為宜。另外，為便於氣流進 入，該韓片組14之第一部分14a與第二部分14c之間形成 第二部分14b ’該第三部分14b之散熱片14〇前端未設有導 流部，以避免第二部分14c之散熱片14〇之導流部143彎折 時與第一部分14a之散熱片14〇之平直之導流部147相抵 觸，將流道封閉。該實施方式中第三部分14b由三片散熱 片140組成，其實際數篁可視第二部分導流部143之 傾斜角度而定，比如可選擇一至三片，以不封閉氣流通道、 方便氣流流入為宜。另，該實施方式中導流部143之傾斜 角度相同，也可使每一導流部143之傾斜角度不一而使其 與氣流之流向一致，將更有利於氣流流入。當鰭片組14安 裝於風扇16之出風口 165處時，該導流部；[43、147之下 端抵靠於扇框161之底板上，頂面與扇框161之頂板之内表 面緊密貼合’將導流部143、147完全收容於風扇16出風 口 165處’使得鰭片組14之頂面與該扇框161之頂板位於 11 1305574 ::面上，縛片組14之底面_框161 =以此卿且14定位(參圖2)。同樣，韓片： :風口 166處，包括沿氣流方向前端之立 15a、位於顧泣太接 第—4分 15a鱼笛 後^之弟二部分l5c及位於第-部八 -I部分15c之間之第三部分l5b (參圖1)〇刀 該散熱裝置U)通過熱管12、13從兩個發 處（圖未示）吸收埶量，比如針對 …、7〇件 管12汀田 葦林電腦散熱而言，埶 & U可用於傳導中央處理器之熱量，而熱管13可用㈣熱 晶片或南橋與北橋“組之傳熱 ^員不 弟—鑛片組14、15，利用風扇I6運轉產生之 ❹IL將第-、第二H片組14、15處 熱元件散熱之目的。 走’達到對發 該風扇16順時針方向運轉時，產生氣流之方向如圖4 中所示’空氣掠過鰭片組W表面之速度越大，則熱交 換效率越高，越有利於系統散熱。出風口165、之前 端受扇框161影響，氣流流向大致與扇框平行，而後端= 流受扇框161之影響減少，逐漸朝其徑向方向流動，且沿 其行進之方向傾斜。第-部分14a、l5a設置於出風口 165、166靠近氣流方向之前端，該第—部分14&、 之散熱片140、150之間之氣流通道與氣流之流向大致^ 行。第二部分14c、15c設置於出風口 165、166之後端， 氣流之傾斜角度增大，該第二部分14c、l5c之散熱片 140、150之導流部M3、153向氣流方向彎折約3〇度。 12 1305574 通過該第二部分14c、15c之散熱片140、150之導流部 143、153與本體部141、151間夾角之設置，使得冷卻 氣流可以迅速流入，冷卻氣流之流動方向可以在該縛片組 14、15内平緩過渡，減少冷卻氣流衝擊這些散熱片14〇、 工5〇而造成之能量損失’降低該鰭片組14、15之流阻，並 降低系統噪音。另一方面’通過該第一部分14&、15a之 散熱片140、150之導流部147、157、第二部分14。、 工化之散熱片140、150之導流部143、153及該本體部 、151之設置，增加韓片組14、15之散熱面積，提高 鰭片組14、15之散熱效率。 由以上敘述可知，通過該導流部143、153、147、 157及該本體部141、151之設置，使風秘產生之氣流 與鰭片組！4、進行合理搭配，使得散熱片i4〇、15〇之 =方向與冷卻氣流之流動方向大致—致，從而避免氣流 私擊散熱叫0、15〇產生触，損耗氣流能量，降低該 韓片組14、15之流阻及嗓音，並增加該則組14、^之 散熱面積’㈣使得該散錄置1()具魏高之散執效 =施例中’該風扇16設有兩個進風叫3、⑹以 夕之氣流進人，兩個出風ϋ165、166之設置可择 流出量，比如針對筆記本電腦而言，可將散: 置二，設於機殼之角落位置，使風扇“之出風口 出叫有利於散熱。實際應用中，風扇 風咖、⑽出風咖、166錢量、位置與^ 13 1305574. -可據實際之政熱需求而調整，如一個或多個，鰭片組、 15之數量需對應出風口 165、166之數量作相應之調整。 鰭片組 14、15 中各部分 14a、14b、14c、15a、15b、 15c包括之散熱片140、15〇之數量和排列方式也可根據實 際所使用之風扇之氣流方向確定，使得鰭片組i 4、丄5之導 流部143、153、147、157之延伸方向與氣流方向大致 一致，進入流道之氣流流速及風量最大，從而取得較佳之 散熱效果。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申请。惟，以上所述者僅為本發明之較佳實施例，舉凡 喊悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置其中一實施例之立體分解圖。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of heat dissipation of electronic components, and in particular to a fin assembly suitable for heat dissipation of electronic components and a heat sink having the same. [Prior Art] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has received more and more attention, especially in a notebook computer, in order to be limited in a limited office. Efficiently take away the heat generated by the system. Currently, the industry mainly uses a heat sink composed of a film set, a heat pipe and a fan. The conventional fin set usually includes a plurality of heat sinks arranged in parallel, and the heat sinks are arranged at the air outlet of the fan. Into a rectangle. During operation, the heat pipe absorbs heat generated by the heat-generating electronic components, and the heat is transferred to the fin group through the heat pipe, and the heat of the fin group is radiated to the surrounding environment through heat exchange between the fin group and the forced airflow generated by the fan. Achieve heat dissipation from electronic components. Adding system noise and causing loss of airflow energy, heat exchange efficiency between the airflow and the heat sink, and airflow damaging the heat dissipation efficiency of the heat sink. Therefore, it has a great interest in the performance of the system, and it can be used together to improve the heat dissipation process of the fan and the fin. The fan plays an important role in transferring the heat generated by the system to the outside of the system. The angle of the catch with the gas generated by the fan has an angle of -疋, and the angle between each fin and the airflow is also different. When the airflow flows through the air, it collides with the heat sink and rebounds, which increases the airflow. The flow rate is reduced, and the utilization rate is reduced. The final result of the combination of the fan and the fin group makes it particularly important to make the heat exchange efficiency between the two effective and reduce the flow resistance and material of the 1305574 fan. SUMMARY OF THE INVENTION The following is a description of a specific embodiment of a device with high heat dissipation efficiency. The group of low to the resistance and the noise and the heat dissipation of the group have eight or two types. The film group includes a plurality of heat sinks, and the production group includes a second portion, and a third portion between the second portion and the second portion. The heat sinks of the second part and the second part comprise a body portion and a heat sink of a Qiu two flutes = a 15 knife, including a body portion but not having a flow guiding portion, and a guide portion and a body portion of the heat sink of the first portion The flow guiding portion of the political tablet of the same flat shovel is inclined from the body portion to the portion.斤瘳至小一装置' includes at least a heat pipe, a thermal contact with the heat pipe, and a centrifugal fan for generating a cooling airflow for the forced cooling of the slice group _ the film set includes the first portion, the second portion, and the In the third portion between the - portion and the second portion, the heat sinks of the first portion and the first portion each include a body portion and a flow guiding portion, and the heat releasing sheet of the third portion includes a body portion but not The flow guiding portion has a flow guiding portion of the first portion and the body portion is located at the same plane, and the diffusing portion of the second portion is inclined from the body portion to the first portion of the group. A heat dissipating device for dissipating heat of an electronic component, comprising a centrifugal fan and a group H disposed at a centrifugal wind σ, the centrifugal fan generating a cooling airflow for forcibly dissipating the fin group, the Korean group comprising In the airflow direction, the group includes a first portion at the front end of the airflow 1305574: a portion and a second portion at the rear end of the airflow, and the heat sinks of the first portion and the second blade each include a body portion and one of the front ends of the body portion Guide =, ', wherein the heat-dissipating portion of the first portion is located in the same plane as the body portion. The second portion of the fin guide portion is inclined from the body portion thereof toward the first portion of the group of sheets. ^ Compared with the conventional technology, by setting the flow guiding portion and the body portion, the flow direction of the #冷魏流 can be smoothly transitioned, and the flow and the surface of the group and the heat dissipation area of the fin group are reduced. Therefore, the heat sink has the advantage of high heat dissipation efficiency. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2 together, the heat dissipating device 10 includes a plate body 11 having good thermal conductivity, and two heat pipes 12 disposed on the upper portion of the plate body 1:1, and the first contact with the heat pipes 12 and 13 1. A second die set 14, 15 and a centrifugal fan 16 for dissipating heat to the first and second Korean sets 14, 15. The fan 16 includes a frame 161, a stator (not shown) mounted in the frame 161, and a rotor 162 rotatable relative to the stator. The fan frame 161 includes a top plate, a bottom plate, and a side plate connected between the top plate and the bottom plate. To facilitate airflow in and out of the fan frame 161', the fan 16 is positioned on the top plate and the bottom plate of the fan frame 161 opposite to the rotor 162. A circular hole is formed in the center of the top plate and the bottom plate respectively as the air inlets 163 and 164 of the fan 16, and the side plates of the fan frame 161 respectively form an air outlet 165 perpendicular to the air inlets 163 and 164. 166 'The two air outlets 165, 166 are vertical. When the fan 16 is in operation, a negative pressure of 9 1305574 is generated at the air inlets 163, 164, and the money is closed by the intake air σ ΐ 63, 164 into the thin 6i, and the hurricane π 165, 166 is blown toward the pressure after being pressurized [, The second set of sheets 14, 15 cools the first and second fin sets 14, 15. The first and second splicing groups 14, 15 are respectively located at the air outlet 165 166 of the fan 16, and the first and second rotator groups are respectively formed by a plurality of fins 140 150 / σ - linear arrangement. The heat sinks (10) and (10) each include a body portion m, 151 and two mutually parallel domains 142, 152 which are bent and formed by the lower ends of the body portions (4) and (5), and the two folded edges 142 152 are abutted against each other. The top and bottom surfaces of the wafer groups w, 15 have a contact area of 4 with heat g 12, 13. In this embodiment, the heat dissipation 14G in the first-rotor group 14 and the heat sink 150 in the second fin group 15 are arranged in the same manner. Introduction. At the same time, referring to FIG. 3, the heat sink 14 of the first group 14a of the front end portion 14a of the film group 14 is outwardly extended toward the fan to form a flow guiding portion 147, and the flow guiding portion 147 is located at the body portion 141 of the heat sink 140. On the same plane, the body portion 141 of the heat sink of the second portion 14c at the rear end of the air flow direction has a flow guiding portion 143 which is folded from the front end of the body portion 141 toward the first portion of the fin group 14 The direction of the bending of the portion ία, ία is substantially parallel to the direction of the airflow, and the height thereof is slightly smaller than the height of the body portion 141. Both the upper and lower ends form a certain distance from the upper and lower ends of the body portion 141, and the difference in the twist is The thickness of the top plate and the bottom plate of the fan frame 161 so as to extend into the fan frame 161 of the fan 16 and the upper ends of the flow guiding portions 147 and 143 are bent toward one side to form abutting with the flow guiding portions 143 and 147 of the adjacent fins 140. According to the analysis of 1305574: the edge 148, a top surface is formed on the upper end of the flow guiding portion 143 of the first Korean film group 14. The flow guiding portions 143 and 147 are integrally formed with the main body portion 141, and a predetermined interval exists between the adjacent fins 140, and an air flow passage along the edges 148 and 142 is formed between the fins (10). The airflow generated by the centrifugal wind passes. The number of the heat sinks 14 of the second portion l4c is much larger than the number of heat sinks 140 of the first portion 14a. The first portion 14a includes only four fins 140'. Depending on the condition of the flow field, for example, it can be more than three pieces, but it is preferable that the number of heat sinks W0 of the first portion does not exceed one third of the total number of heat sinks 140 of the Korean group 14. In addition, in order to facilitate airflow, a second portion 14b is formed between the first portion 14a and the second portion 14c of the Korean group 14. The front end of the heat sink 14 of the third portion 14b is not provided with a flow guiding portion to avoid When the deflector 143 of the fin 14 of the two portions 14c is bent, it is in contact with the straight guide portion 147 of the fin 14 of the first portion 14a, and the flow passage is closed. In this embodiment, the third portion 14b is composed of three fins 140, and the actual number thereof may be determined by the inclination angle of the second portion of the flow guiding portion 143. For example, one to three sheets may be selected to not close the airflow passage and facilitate airflow inflow. It is appropriate. In addition, in this embodiment, the inclination angles of the flow guiding portions 143 are the same, and the inclination angle of each of the flow guiding portions 143 may be made uniform to match the flow direction of the airflow, which is more advantageous for the inflow of the airflow. When the fin set 14 is installed at the air outlet 165 of the fan 16, the lower portion of the [43, 147 abuts against the bottom plate of the fan frame 161, and the top surface is closely attached to the inner surface of the top plate of the fan frame 161. The 'the flow guiding portions 143, 147 are completely accommodated at the air outlet 165 of the fan 16' such that the top surface of the fin set 14 and the top plate of the fan frame 161 are located on the surface of the 11 1305574::, the bottom surface of the die set 14 161 = Positioning with this and 14 (see Figure 2). Similarly, the Korean film: : 166 at the tuyere, including the front 15a along the direction of the airflow, the second part l5c of the second part of the fish whistle after the 4th 15a, and the 15th part of the VIII-I part 15c The third part l5b (refer to Fig. 1) boring the heat sink U) through the heat pipes 12, 13 from two sources (not shown) to absorb the amount of enthalpy, such as for ..., 7 管 tube 12 Tingda Yulin computer cooling埶, 埶 & U can be used to conduct the heat of the central processor, and the heat pipe 13 can be used (four) hot wafer or the south bridge and the north bridge "group of heat transfer ^ 不 不 — 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用The purpose of dissipating heat from the heat elements at the first and second H-groups 14, 15 is as follows: when the clockwise operation of the fan 16 is performed, the direction of the airflow is generated as shown in Fig. 4, the air sweeps over the fin group. The higher the velocity of the W surface, the higher the heat exchange efficiency, and the more favorable the system heat dissipation. The air outlet 165 and the front end are affected by the fan frame 161, the airflow direction is substantially parallel to the fan frame, and the rear end = flow is affected by the fan frame 161. Decrease, gradually flowing in its radial direction and tilting in the direction in which it travels. The portions 14a, l5a are disposed at the front end of the air outlets 165, 166 near the airflow direction, and the flow passages between the first portions 14&, the fins 140, 150 and the flow of the air flow are substantially aligned. The second portions 14c, 15c At the rear ends of the air outlets 165, 166, the inclination angle of the airflow is increased, and the flow guiding portions M3, 153 of the fins 140, 150 of the second portions 14c, 15c are bent about 3 degrees in the direction of the airflow. 12 1305574 The angle between the flow guiding portions 143, 153 of the fins 140, 150 of the second portion 14c, 15c and the body portions 141, 151 is such that the cooling airflow can flow in rapidly, and the flow direction of the cooling airflow can be in the patch group 14 The smooth transition in 15 reduces the energy loss caused by the cooling airflow impinging on these fins, and reduces the flow resistance of the fin sets 14, 15 and reduces system noise. On the other hand, 'passing the first part The flow guiding portions 147 and 157 and the second portion 14 of the heat sinks 140 and 150 of the 14&, 15a, and the flow guiding portions 143 and 153 of the heat radiating fins 140 and 150, and the arrangement of the main body portion and the 151, increase the Korean Heat dissipation area of the film groups 14, 15 and increase the fin The heat dissipation efficiency of the groups 14 and 15. As can be seen from the above description, by the arrangement of the flow guiding portions 143, 153, 147, 157 and the main body portions 141, 151, the airflow generated by the wind and the fin group are reasonable. With the combination, the direction of the fins i4〇, 15〇= is substantially the same as the direction of the cooling airflow, so as to avoid airflow, the heat is called 0, 15〇, and the airflow energy is lost, and the Korean group 14 and 15 are reduced. Flow resistance and arpeggio, and increase the heat dissipation area of the group 14 and ^ (4) so that the scatter is set to 1 () with Wei Gaozhi's effect = in the example, the fan 16 is provided with two inlet winds called 3, (6) The air of the eve enters the air, and the settings of the two outlets 165 and 166 can be selected as the outflow. For example, for the notebook computer, it can be separated: set at the corner of the casing to make the fan “out of the air outlet” Conducive to heat dissipation. In practical applications, fan wind coffee, (10) wind coffee, 166 money, position and ^ 13 1305574. - can be adjusted according to the actual political heat demand, such as one or more, the number of fins, 15 need to correspond The number of tuyes 165, 166 is adjusted accordingly. The number and arrangement of the fins 140, 15〇 included in each of the fins 14 and 15 of the fin sets 14, 15 can also be determined according to the direction of the airflow of the fan actually used, so that the fin set The extending direction of the flow guiding portions 143, 153, 147, and 157 of i4 and 丄5 is substantially the same as the direction of the airflow, and the flow velocity and the amount of airflow entering the flow channel are maximized, thereby achieving a better heat dissipation effect. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing an embodiment of a heat sink according to the present invention.
圖2係圖1所示散熱裝置之組裝圖。 圖3係圖1中散熱裝置之第一鰭片組之立體圖。 圖4係圖1中散熱裝置之散熱風扇去掉頂板後與鰭片組 之立體圖。 【主要元件符號說明】 10 板體 11 12,13 鰭片組 14,15 14a,15a 第三部分 14b,15b 14c,15c 散熱片 140,150 141,151 折邊 142,152,148 143,147 導流部 153,157 16 扇框 161 散熱裝置 熱管 第一部分 第二部分 本體部 導流部 風扇 14 1305574 163,164 ： 轉子 162 進風口 * 出風口 165，1662 is an assembled view of the heat sink shown in FIG. 1. 3 is a perspective view of the first fin set of the heat sink of FIG. 1. 4 is a perspective view of the heat dissipating fan of the heat dissipating device of FIG. 1 with the top plate removed and the fin set removed. [Description of main components] 10 Plate 11 12, 13 Fin set 14, 15 14a, 15a Third part 14b, 15b 14c, 15c Heat sink 140, 150 141, 151 Folding 142, 152, 148 143, 147 Guide 153, 157 16 Fan frame 161 Heat sink heat pipe Part 1 Second Part Body Section Guide Fan 14 1305574 163,164 : Rotor 162 Air Inlet * Air Outlet 165, 166
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