TWI698169B - Cooling fan and cooling module including the same - Google Patents
Cooling fan and cooling module including the same Download PDFInfo
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- TWI698169B TWI698169B TW108119951A TW108119951A TWI698169B TW I698169 B TWI698169 B TW I698169B TW 108119951 A TW108119951 A TW 108119951A TW 108119951 A TW108119951 A TW 108119951A TW I698169 B TWI698169 B TW I698169B
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Abstract
Description
本發明係關於散熱風扇以及包含散熱風扇的散熱模組。The invention relates to a cooling fan and a cooling module including the cooling fan.
隨著科技進步,發展出了許多電子產品。在這些電子產品運作的過程中,會產生或累積大量的熱。若無法及時散熱,可能會影響電子產品的正常運作,降低其壽命甚至造成損壞。因此,為了維持電子產品的正常運作,需要安裝散熱元件。常見的散熱元件例如熱導管、散熱片及風扇等。With the advancement of science and technology, many electronic products have been developed. During the operation of these electronic products, a large amount of heat is generated or accumulated. Failure to dissipate heat in time may affect the normal operation of electronic products, reduce their life span and even cause damage. Therefore, in order to maintain the normal operation of electronic products, heat dissipation components need to be installed. Common heat dissipation elements such as heat pipes, heat sinks and fans.
一般的散熱模式為透過熱導管將熱傳遞到風扇的上蓋或底座,再搭配風扇進行散熱。然而,將熱源或熱管搭接於風扇的上蓋或底座,這種散熱方式受限於該處的表面積,而熱交換效果並不明顯。因此,如何改善散熱風扇的散熱效果是目前所欲解決的問題之一。The general heat dissipation mode is to transfer heat to the upper cover or base of the fan through a heat pipe, and then use the fan for heat dissipation. However, when the heat source or heat pipe is overlapped with the upper cover or base of the fan, this heat dissipation method is limited by the surface area there, and the heat exchange effect is not obvious. Therefore, how to improve the heat dissipation effect of the heat dissipation fan is one of the problems to be solved at present.
本發明提供一種散熱風扇與包含其的散熱模組。此散熱風扇藉由基板上的凸起結構來增加熱交換面積,以改善散熱風扇的散熱效果。The invention provides a heat dissipation fan and a heat dissipation module containing the same. The heat dissipation fan increases the heat exchange area through the raised structure on the substrate, so as to improve the heat dissipation effect of the heat dissipation fan.
本發明實施例提供一種散熱風扇,包含基板、軸管、軸承、定子、轉子以及多個扇葉。基板具有基板凸起結構。軸管固定於基板,基板凸起結構圍繞軸管。軸承位於軸管中。定子固定於基板。轉子樞設於軸承。多個扇葉與轉子連接,該些扇葉各具有第一凹陷結構,當轉子轉動時,基板凸起結構穿過各扇葉的第一凹陷結構。The embodiment of the present invention provides a heat dissipation fan, which includes a base plate, a shaft tube, a bearing, a stator, a rotor, and a plurality of fan blades. The substrate has a substrate protrusion structure. The shaft tube is fixed to the base plate, and the convex structure of the substrate surrounds the shaft tube. The bearing is located in the shaft tube. The stator is fixed to the base plate. The rotor is pivoted on the bearing. A plurality of fan blades are connected to the rotor, and each of the fan blades has a first recessed structure. When the rotor rotates, the raised structure of the substrate passes through the first recessed structure of each fan blade.
本發明提供一種散熱模組,包含如上述之散熱風扇以及熱管。熱管與散熱風扇的基板接觸。The present invention provides a heat dissipation module including the heat dissipation fan and heat pipe as described above. The heat pipe is in contact with the base plate of the cooling fan.
本發明實施例之散熱風扇,藉由基板的凸起結構和扇葉的凹陷結構,除了可以增加基板的熱交換面積,在扇葉旋轉時所產生的擾動氣流還可以反覆破壞基板表面的熱邊界層,藉以提升散熱效果。In the heat dissipation fan of the embodiment of the present invention, through the raised structure of the base plate and the recessed structure of the fan blade, in addition to increasing the heat exchange area of the base plate, the turbulent air flow generated when the fan blade rotates can also repeatedly destroy the thermal boundary on the surface of the base plate Layer to improve the heat dissipation effect.
於以下實施方式中詳細敘述本發明之詳細特徵及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露的內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易理解本發明相關之目的及優點。以下實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and in accordance with the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with related art can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
首先說明本發明第一實施例之散熱風扇100。請參考圖1和圖2,圖1為本發明第一實施例之散熱風扇的分解圖,圖2為本發明第一實施例之散熱風扇的剖面示意圖。散熱風扇100包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170以及側壁180,且散熱風扇100具有入風口IN以及出風口OUT。First, the
基板110具有承載面111和基板凸起結構112。基板凸起結構112位於承載面111。軸管120固定於承載面111,且基板凸起結構112圍繞著軸管120。基板凸起結構112具有基板通道113。軸管120暴露於基板通道113中。在本實施例中,基板通道113的數量為四個,但不以此為限。基板110的材質可由散熱性良好的材料製成,例如金屬。基板110的承載面111作為熱交換面時,基板凸起結構112可增加熱交換面積,以改善熱交換效率。The
軸承130位於軸管120中。定子140透過軸管120固定於基板110的承載面111且圍繞著軸管120。轉子150樞設於軸承130。多個扇葉160與轉子150連接。定子140與轉子150用來驅動扇葉160旋轉。在其他實施例中,定子可直接固定於基板的承載面。The
扇葉160具有第一凹陷結構161。第一凹陷結構161位於扇葉160朝向基板110的一側。當轉子150轉動時,基板凸起結構112會穿過各扇葉160的第一凹陷結構161。同理,扇葉160之第一凹陷結構161之間的部分可以通過各基板凸起結構112之間的空間。基板凸起結構112具有第一寬度L1,第一凹陷結構161具有第二寬度L2,且第一寬度L1小於第二寬度L2。因此,當扇葉160轉動時,基板凸起結構112可以順利地穿過第一凹陷結構161而不會與第一凹陷結構161相干涉。在本實施例中,基板凸起結構112和第一凹陷結構161的形狀為矩形,但不以此為限。在其他實施例中,基板凸起結構和第一凹陷結構可以為矩形、三角形或弧形,只要基板凸起結構可以順利地穿過第一凹陷結構,兩者可為不同的形狀。藉由扇葉160的第一凹陷結構161和基板110的基板凸起結構112,扇葉轉動時可以產生擾動氣流,例如渦流或紊流,來破壞形成於基板110上的熱邊界層,藉此提升熱的傳導並改善散熱效率。此外,基板凸起結構112所具有的基板通道113作為出口,可讓累積在基板凸起結構112之間較高溫的氣流經基板通道113排出。The
頂板170與基板110相對,側壁180位於頂板170和基板110之間並與頂板170和基板110連接。頂板170、側壁180和基板110形成殼體,且定子140、轉子150和扇葉160位於殼體中。入風口IN位於頂板170,用以引入來自外界的氣流。在其他實施例中,入風口IN可以位於基板。在另一實施例中,入風口IN可同時位於頂板和基板。出風口OUT位於側壁180,用以排出帶有熱量的氣流。至少一個基板凸起結構112的基板通道113位於軸管120和出風口OUT之間,也就是靠近出風口OUT的位置。此配置可以幫助扇葉160將累積於基板凸起結構112的熱量盡快排出至散熱風扇100外。在本實施例中,定子140、轉子150和扇葉160位於頂板170、側壁180和基板110之間,但不以此為限。在其他實施例中,出風口和入風口可以分別位於頂板和基板,如軸流扇。The
接下來說明包含本發明第一實施例之散熱風扇100的散熱模組1。請參考圖3,圖3為包含本發明第一實施例之散熱風扇的散熱模組的立體圖。散熱模組1包含前述第一實施例的散熱風扇100以及熱管P。熱管P與基板110接觸,並將熱量傳導至散熱風扇100進行散熱。此散熱模組1可用於筆記型電腦、桌上型電腦等任何需要散熱器的電子產品。在本實施例中,散熱模組1使用第一實施例的散熱風扇100來進行散熱,但不以此為限。散熱模組也可以使用本發明其他實施例的散熱風扇來進行散熱。Next, the
接下來說明使用本發明第一實施例之散熱風扇100的散熱模組1散熱時熱量的傳遞途徑。熱管P與發熱源或其他導熱件接觸,並將熱量傳遞到基板110。基板110、頂板170和側壁180可由導熱性良好的材料製成,因此相連接的基板110、頂板170和側壁180可傳遞熱量,同時作為熱交換件以進行熱交換。基板凸起結構112可增加基板110的熱交換面積。在散熱風扇100運轉時,氣流從入風口IN被引入,經過基板110進行熱交換之後,帶著熱量的氣流再由出風口OUT被排出。此外,散熱風扇100運轉時,基板凸起結構112穿過第一凹陷結構161。同理,扇葉160之第一凹陷結構161之間的部分通過各基板凸起結構112之間的空間。藉此,轉動的扇葉160產生的擾動氣流反覆破壞形成於基板110表面的熱邊界層,以改善散熱效果。Next, the heat transfer path of the
接下來說明本發明第二實施例之散熱風扇200。請參考圖4,圖4為本發明第二實施例之散熱風扇的分解圖。散熱風扇200包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170、側壁180、入風口IN以及出風口OUT。第二實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。Next, the
在第一實施例中,基板凸起結構112具有四個基板通道113,但不以此為限。在第二實施例的散熱風扇200中,基板凸起結構112不具有基板通道113,換句話說,基板凸起結構112為連續不中斷的結構。不具有基板通道113的散熱風扇200亦可藉由扇葉160的第一凹陷結構161和基板110的基板凸起結構112,在扇葉轉動時產生擾動氣流,例如渦流或紊流,來破壞形成於基板110上的熱邊界層,藉此提升熱的傳導並改善散熱效率。In the first embodiment, the
在第一實施例中,一個基板凸起結構112穿過各扇葉160上的一個第一凹陷結構161,但不以此為限。請參考圖5,圖5為本發明第三實施例之散熱風扇的扇葉部分的剖面示意圖。第三實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第三實施例的散熱風扇300中,扇葉160還具有缺口162。缺口162與第一凹陷結構161設置於扇葉160之同側。當轉子150轉動時,基板凸起結構112穿過第一凹陷結構161,但不穿過缺口162。缺口162在不影響扇葉功能與結構強度的情況下可為任意數量和任意位置。缺口162可在扇葉160轉動時,進一步產生擾動氣流,例如渦流或紊流,來幫助破壞基板110表面的熱邊界層。In the first embodiment, a
在第一實施例中,一個基板凸起結構112穿過各扇葉160上的一個第一凹陷結構161,但不以此為限。請參考圖6,圖6為本發明第四實施例之散熱風扇的扇葉部分的剖面示意圖。第四實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第四實施例的散熱風扇400中,當轉子150轉動時,多個基板凸起結構112同時穿過各扇葉160上的一個第一凹陷結構161,也就是說一個第一凹陷結構161可容納多個基板凸起結構112。多個基板凸起結構112可在扇葉160轉動時,進一步產生擾動氣流,例如渦流或紊流,來幫助破壞基板110表面的熱邊界層。In the first embodiment, a
接下來說明本發明第五實施例之散熱風扇500。請參考圖7和圖8,圖7為本發明第五實施例之散熱風扇的分解圖,圖8為本發明第五實施例之散熱風扇的扇葉部分的剖面示意圖。散熱風扇500包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170、側壁180、入風口IN以及出風口OUT。第五實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。Next, the
在第五實施例中,頂板170具有頂板凸起結構171,頂板凸起結構171圍繞著入風口IN。頂板凸起結構171具有頂板通道172。在本實施例中,頂板通道172的數量為四個,但不以此為限。於本發明其他實施例中,可不具有頂板通道。頂板凸起結構171可增加熱交換面積,藉此提升熱的傳導並改善散熱效率。In the fifth embodiment, the
扇葉160具有第一凹陷結構161和第二凹陷結構163。第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且互相對齊。當轉子150轉動時,基板凸起結構112會穿過各扇葉160的第一凹陷結構161,而頂板凸起結構171會穿過各扇葉160的第二凹陷結構163。同理,扇葉160之第一凹陷結構161之間的部分可以通過各基板凸起結構112之間的空間,第二凹陷結構163之間的部分可以通過各頂板凸起結構171之間的空間。藉由第一凹陷結構161、第二凹陷結構163、基板凸起結構112和頂板凸起結構171,扇葉轉動時可以產生擾動氣流,例如渦流或紊流,來破壞形成於基板110和頂板170的熱邊界層,藉此提升熱的傳導並改善散熱效率。此外,基板通道113和頂板通道172作為出口,可讓累積在基板凸起結構112之間與頂板凸起結構171之間較高溫的氣流經基板通道113和頂板通道172排出。The
在第五實施例中,第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且互相對齊,但不以此為限。請參考圖9,圖9為本發明第六實施例之散熱風扇的扇葉部分的剖面圖。第六實施例大致上與第五實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第六實施例的散熱風扇600中,第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且相錯位。第二凹陷結構163的位置可配合頂板170的頂板凸起結構171,使頂板170在結構設計上更有彈性。在其他實施例中,在不影響扇葉功能的情況下,第一凹陷結構161與第二凹陷結構163可為任意的數量和位置關係。In the fifth embodiment, the first recessed
本發明實施例之散熱風扇,藉由基板的凸起結構和扇葉的凹陷結構,除了可以增加基板的熱交換面積,在扇葉旋轉時所產生的擾動氣流還可以反覆破壞基板表面的熱邊界層,藉以提升散熱效果。In the heat dissipation fan of the embodiment of the present invention, through the raised structure of the base plate and the recessed structure of the fan blade, in addition to increasing the heat exchange area of the base plate, the turbulent air flow generated when the fan blade rotates can also repeatedly destroy the thermal boundary on the surface of the base plate Layer to improve the heat dissipation effect.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent scope.
1:散熱模組1: Cooling module
100、200、300、400、500、600:散熱風扇100, 200, 300, 400, 500, 600: cooling fan
110:基板110: substrate
111:承載面111: bearing surface
112:基板凸起結構112: substrate raised structure
113:基板通道113: substrate channel
120:軸管120: shaft tube
130:軸承130: bearing
140:定子140: stator
150:轉子150: Rotor
160:扇葉160: fan blade
161:第一凹陷結構161: The first recessed structure
162:缺口162: Gap
163:第二凹陷結構163: second recessed structure
170:頂板170: top plate
171:頂板凸起結構171: Top plate raised structure
172:頂板通道172: roof channel
180:側壁180: side wall
200:散熱模組200: cooling module
P:熱管P: Heat pipe
IN:入風口IN: Air inlet
OUT:出風口OUT: Outlet
L1:第一寬度L1: first width
L2:第二寬度L2: second width
圖1為本發明第一實施例之散熱風扇的分解圖。 圖2為本發明第一實施例之散熱風扇的剖面示意圖。 圖3為包含本發明第一實施例之散熱風扇的散熱模組的立體圖。 圖4為本發明第二實施例之散熱風扇的分解圖。 圖5為本發明第三實施例之散熱風扇的扇葉部分的剖面示意圖。 圖6為本發明第四實施例之散熱風扇的扇葉部分的剖面示意圖。 圖7為本發明第五實施例之散熱風扇的分解圖。 圖8為本發明第五實施例之散熱風扇的扇葉部分的剖面示意圖。 圖9為本發明第六實施例之散熱風扇的扇葉部分的剖面圖。 Fig. 1 is an exploded view of the cooling fan according to the first embodiment of the present invention. 2 is a schematic cross-sectional view of the heat dissipation fan according to the first embodiment of the present invention. 3 is a perspective view of a heat dissipation module including the heat dissipation fan of the first embodiment of the present invention. Fig. 4 is an exploded view of the cooling fan according to the second embodiment of the present invention. 5 is a schematic cross-sectional view of the fan blade portion of the heat dissipation fan according to the third embodiment of the present invention. 6 is a schematic cross-sectional view of the fan blade portion of the cooling fan according to the fourth embodiment of the present invention. Fig. 7 is an exploded view of a heat dissipation fan according to a fifth embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a fan blade portion of a heat dissipation fan according to a fifth embodiment of the present invention. Fig. 9 is a cross-sectional view of a fan blade portion of a heat dissipation fan according to a sixth embodiment of the present invention.
100:散熱風扇 100: cooling fan
110:基板 110: substrate
111:承載面 111: bearing surface
112:基板凸起結構 112: substrate raised structure
113:基板通道 113: substrate channel
120:軸管 120: shaft tube
130:軸承 130: bearing
140:定子 140: stator
150:轉子 150: Rotor
160:扇葉 160: fan blade
161:第一凹陷結構 161: The first recessed structure
170:頂板 170: top plate
180:側壁 180: side wall
IN:入風口 IN: Air inlet
OUT:出風口 OUT: Outlet
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW108119951A TWI698169B (en) | 2019-06-10 | 2019-06-10 | Cooling fan and cooling module including the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW108119951A TWI698169B (en) | 2019-06-10 | 2019-06-10 | Cooling fan and cooling module including the same |
Publications (2)
Publication Number | Publication Date |
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TWI698169B true TWI698169B (en) | 2020-07-01 |
TW202046852A TW202046852A (en) | 2020-12-16 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW108119951A TWI698169B (en) | 2019-06-10 | 2019-06-10 | Cooling fan and cooling module including the same |
Country Status (1)
Country | Link |
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TW (1) | TWI698169B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006036511A2 (en) * | 2004-09-24 | 2006-04-06 | Carrier Corporation | Fan |
TWI563175B (en) * | 2014-11-14 | 2016-12-21 | Foxconn Tech Co Ltd | Fan |
TWM548813U (en) * | 2017-03-23 | 2017-09-11 | Power Logic Tech Inc | Fan blade module and transparent blade thereof |
CN208870840U (en) * | 2017-09-28 | 2019-05-17 | 日本电产株式会社 | Wheel portion, impeller and air supply device |
-
2019
- 2019-06-10 TW TW108119951A patent/TWI698169B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006036511A2 (en) * | 2004-09-24 | 2006-04-06 | Carrier Corporation | Fan |
TWI563175B (en) * | 2014-11-14 | 2016-12-21 | Foxconn Tech Co Ltd | Fan |
TWM548813U (en) * | 2017-03-23 | 2017-09-11 | Power Logic Tech Inc | Fan blade module and transparent blade thereof |
CN208870840U (en) * | 2017-09-28 | 2019-05-17 | 日本电产株式会社 | Wheel portion, impeller and air supply device |
Also Published As
Publication number | Publication date |
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TW202046852A (en) | 2020-12-16 |
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