TWI698169B - Cooling fan and cooling module including the same - Google Patents

Cooling fan and cooling module including the same Download PDF

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TWI698169B
TWI698169B TW108119951A TW108119951A TWI698169B TW I698169 B TWI698169 B TW I698169B TW 108119951 A TW108119951 A TW 108119951A TW 108119951 A TW108119951 A TW 108119951A TW I698169 B TWI698169 B TW I698169B
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heat dissipation
substrate
base plate
top plate
fan
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TW108119951A
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TW202046852A (en
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楊智凱
鄭懿倫
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英業達股份有限公司
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Abstract

The present disclosure provides a cooling fan and a cooling module including the same. The cooling fan includes a base, an axial tube, a bearing, a stator, a rotor, and fan blades. The base includes a base convex structure. Each of the fan blades includes a first concave structure. When the cooling fan is working, the base convex structures go through the first concave structures on each fan blades. The base convex structure and the first concave structure not only increase the heat exchange area of the base but break the thermal boundary layer on the base repeatedly to improve the heat dissipating effect when the cooling fan is working.

Description

散熱風扇和包含其的散熱模組Cooling fan and cooling module containing the same

本發明係關於散熱風扇以及包含散熱風扇的散熱模組。The invention relates to a cooling fan and a cooling module including the cooling fan.

隨著科技進步,發展出了許多電子產品。在這些電子產品運作的過程中,會產生或累積大量的熱。若無法及時散熱,可能會影響電子產品的正常運作,降低其壽命甚至造成損壞。因此,為了維持電子產品的正常運作,需要安裝散熱元件。常見的散熱元件例如熱導管、散熱片及風扇等。With the advancement of science and technology, many electronic products have been developed. During the operation of these electronic products, a large amount of heat is generated or accumulated. Failure to dissipate heat in time may affect the normal operation of electronic products, reduce their life span and even cause damage. Therefore, in order to maintain the normal operation of electronic products, heat dissipation components need to be installed. Common heat dissipation elements such as heat pipes, heat sinks and fans.

一般的散熱模式為透過熱導管將熱傳遞到風扇的上蓋或底座,再搭配風扇進行散熱。然而,將熱源或熱管搭接於風扇的上蓋或底座,這種散熱方式受限於該處的表面積,而熱交換效果並不明顯。因此,如何改善散熱風扇的散熱效果是目前所欲解決的問題之一。The general heat dissipation mode is to transfer heat to the upper cover or base of the fan through a heat pipe, and then use the fan for heat dissipation. However, when the heat source or heat pipe is overlapped with the upper cover or base of the fan, this heat dissipation method is limited by the surface area there, and the heat exchange effect is not obvious. Therefore, how to improve the heat dissipation effect of the heat dissipation fan is one of the problems to be solved at present.

本發明提供一種散熱風扇與包含其的散熱模組。此散熱風扇藉由基板上的凸起結構來增加熱交換面積,以改善散熱風扇的散熱效果。The invention provides a heat dissipation fan and a heat dissipation module containing the same. The heat dissipation fan increases the heat exchange area through the raised structure on the substrate, so as to improve the heat dissipation effect of the heat dissipation fan.

本發明實施例提供一種散熱風扇,包含基板、軸管、軸承、定子、轉子以及多個扇葉。基板具有基板凸起結構。軸管固定於基板,基板凸起結構圍繞軸管。軸承位於軸管中。定子固定於基板。轉子樞設於軸承。多個扇葉與轉子連接,該些扇葉各具有第一凹陷結構,當轉子轉動時,基板凸起結構穿過各扇葉的第一凹陷結構。The embodiment of the present invention provides a heat dissipation fan, which includes a base plate, a shaft tube, a bearing, a stator, a rotor, and a plurality of fan blades. The substrate has a substrate protrusion structure. The shaft tube is fixed to the base plate, and the convex structure of the substrate surrounds the shaft tube. The bearing is located in the shaft tube. The stator is fixed to the base plate. The rotor is pivoted on the bearing. A plurality of fan blades are connected to the rotor, and each of the fan blades has a first recessed structure. When the rotor rotates, the raised structure of the substrate passes through the first recessed structure of each fan blade.

本發明提供一種散熱模組,包含如上述之散熱風扇以及熱管。熱管與散熱風扇的基板接觸。The present invention provides a heat dissipation module including the heat dissipation fan and heat pipe as described above. The heat pipe is in contact with the base plate of the cooling fan.

本發明實施例之散熱風扇,藉由基板的凸起結構和扇葉的凹陷結構,除了可以增加基板的熱交換面積,在扇葉旋轉時所產生的擾動氣流還可以反覆破壞基板表面的熱邊界層,藉以提升散熱效果。In the heat dissipation fan of the embodiment of the present invention, through the raised structure of the base plate and the recessed structure of the fan blade, in addition to increasing the heat exchange area of the base plate, the turbulent air flow generated when the fan blade rotates can also repeatedly destroy the thermal boundary on the surface of the base plate Layer to improve the heat dissipation effect.

於以下實施方式中詳細敘述本發明之詳細特徵及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露的內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易理解本發明相關之目的及優點。以下實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and in accordance with the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with related art can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

首先說明本發明第一實施例之散熱風扇100。請參考圖1和圖2,圖1為本發明第一實施例之散熱風扇的分解圖,圖2為本發明第一實施例之散熱風扇的剖面示意圖。散熱風扇100包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170以及側壁180,且散熱風扇100具有入風口IN以及出風口OUT。First, the heat dissipation fan 100 of the first embodiment of the present invention will be described. Please refer to FIGS. 1 and 2. FIG. 1 is an exploded view of the heat dissipation fan according to the first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the heat dissipation fan according to the first embodiment of the present invention. The heat dissipation fan 100 includes a base plate 110, a shaft tube 120, a bearing 130, a stator 140, a rotor 150, a plurality of fan blades 160, a top plate 170 and a side wall 180, and the heat dissipation fan 100 has an air inlet IN and an air outlet OUT.

基板110具有承載面111和基板凸起結構112。基板凸起結構112位於承載面111。軸管120固定於承載面111,且基板凸起結構112圍繞著軸管120。基板凸起結構112具有基板通道113。軸管120暴露於基板通道113中。在本實施例中,基板通道113的數量為四個,但不以此為限。基板110的材質可由散熱性良好的材料製成,例如金屬。基板110的承載面111作為熱交換面時,基板凸起結構112可增加熱交換面積,以改善熱交換效率。The substrate 110 has a bearing surface 111 and a substrate protrusion structure 112. The substrate protrusion structure 112 is located on the carrying surface 111. The shaft tube 120 is fixed on the carrying surface 111, and the substrate protrusion structure 112 surrounds the shaft tube 120. The substrate protrusion structure 112 has a substrate channel 113. The shaft tube 120 is exposed in the substrate channel 113. In this embodiment, the number of substrate channels 113 is four, but it is not limited thereto. The material of the substrate 110 can be made of a material with good heat dissipation, such as metal. When the bearing surface 111 of the substrate 110 serves as a heat exchange surface, the substrate protrusion structure 112 can increase the heat exchange area to improve the heat exchange efficiency.

軸承130位於軸管120中。定子140透過軸管120固定於基板110的承載面111且圍繞著軸管120。轉子150樞設於軸承130。多個扇葉160與轉子150連接。定子140與轉子150用來驅動扇葉160旋轉。在其他實施例中,定子可直接固定於基板的承載面。The bearing 130 is located in the shaft tube 120. The stator 140 is fixed to the bearing surface 111 of the base plate 110 through the shaft tube 120 and surrounds the shaft tube 120. The rotor 150 is pivoted to the bearing 130. A plurality of fan blades 160 are connected to the rotor 150. The stator 140 and the rotor 150 are used to drive the fan blade 160 to rotate. In other embodiments, the stator can be directly fixed to the bearing surface of the substrate.

扇葉160具有第一凹陷結構161。第一凹陷結構161位於扇葉160朝向基板110的一側。當轉子150轉動時,基板凸起結構112會穿過各扇葉160的第一凹陷結構161。同理,扇葉160之第一凹陷結構161之間的部分可以通過各基板凸起結構112之間的空間。基板凸起結構112具有第一寬度L1,第一凹陷結構161具有第二寬度L2,且第一寬度L1小於第二寬度L2。因此,當扇葉160轉動時,基板凸起結構112可以順利地穿過第一凹陷結構161而不會與第一凹陷結構161相干涉。在本實施例中,基板凸起結構112和第一凹陷結構161的形狀為矩形,但不以此為限。在其他實施例中,基板凸起結構和第一凹陷結構可以為矩形、三角形或弧形,只要基板凸起結構可以順利地穿過第一凹陷結構,兩者可為不同的形狀。藉由扇葉160的第一凹陷結構161和基板110的基板凸起結構112,扇葉轉動時可以產生擾動氣流,例如渦流或紊流,來破壞形成於基板110上的熱邊界層,藉此提升熱的傳導並改善散熱效率。此外,基板凸起結構112所具有的基板通道113作為出口,可讓累積在基板凸起結構112之間較高溫的氣流經基板通道113排出。The fan blade 160 has a first recessed structure 161. The first recessed structure 161 is located on the side of the fan blade 160 facing the substrate 110. When the rotor 150 rotates, the substrate convex structure 112 will pass through the first concave structure 161 of each fan blade 160. In the same way, the portion between the first recessed structures 161 of the fan blade 160 can pass through the spaces between the raised structures 112 on the substrate. The substrate protrusion structure 112 has a first width L1, the first recess structure 161 has a second width L2, and the first width L1 is smaller than the second width L2. Therefore, when the fan blade 160 rotates, the substrate protrusion structure 112 can smoothly pass through the first recess structure 161 without interfering with the first recess structure 161. In this embodiment, the shapes of the substrate protrusion structure 112 and the first recess structure 161 are rectangular, but not limited to this. In other embodiments, the convex structure of the substrate and the first concave structure may be rectangular, triangular or arc-shaped, as long as the convex structure of the substrate can smoothly pass through the first concave structure, the two may have different shapes. With the first recessed structure 161 of the fan blade 160 and the substrate protruding structure 112 of the substrate 110, disturbing air flow, such as vortex or turbulence, can be generated when the fan blade rotates to destroy the thermal boundary layer formed on the substrate 110, thereby Improve heat conduction and improve heat dissipation efficiency. In addition, the substrate channel 113 of the substrate protrusion structure 112 serves as an outlet, which allows the higher temperature air flow accumulated between the substrate protrusion structures 112 to be discharged through the substrate channel 113.

頂板170與基板110相對,側壁180位於頂板170和基板110之間並與頂板170和基板110連接。頂板170、側壁180和基板110形成殼體,且定子140、轉子150和扇葉160位於殼體中。入風口IN位於頂板170,用以引入來自外界的氣流。在其他實施例中,入風口IN可以位於基板。在另一實施例中,入風口IN可同時位於頂板和基板。出風口OUT位於側壁180,用以排出帶有熱量的氣流。至少一個基板凸起結構112的基板通道113位於軸管120和出風口OUT之間,也就是靠近出風口OUT的位置。此配置可以幫助扇葉160將累積於基板凸起結構112的熱量盡快排出至散熱風扇100外。在本實施例中,定子140、轉子150和扇葉160位於頂板170、側壁180和基板110之間,但不以此為限。在其他實施例中,出風口和入風口可以分別位於頂板和基板,如軸流扇。The top plate 170 is opposite to the base plate 110, and the side wall 180 is located between the top plate 170 and the base plate 110 and connected to the top plate 170 and the base plate 110. The top plate 170, the side walls 180, and the base plate 110 form a housing, and the stator 140, the rotor 150, and the fan blade 160 are located in the housing. The air inlet IN is located on the top plate 170 for introducing airflow from the outside. In other embodiments, the air inlet IN may be located on the substrate. In another embodiment, the air inlet IN may be located on the top plate and the base plate at the same time. The air outlet OUT is located on the side wall 180 for discharging the air flow with heat. The substrate channel 113 of the at least one substrate protrusion structure 112 is located between the shaft tube 120 and the air outlet OUT, that is, close to the air outlet OUT. This configuration can help the fan blade 160 dissipate the heat accumulated in the substrate protrusion structure 112 to the outside of the heat dissipation fan 100 as soon as possible. In this embodiment, the stator 140, the rotor 150, and the fan blade 160 are located between the top plate 170, the side wall 180 and the base plate 110, but not limited to this. In other embodiments, the air outlet and the air inlet may be respectively located on the top plate and the base plate, such as an axial fan.

接下來說明包含本發明第一實施例之散熱風扇100的散熱模組1。請參考圖3,圖3為包含本發明第一實施例之散熱風扇的散熱模組的立體圖。散熱模組1包含前述第一實施例的散熱風扇100以及熱管P。熱管P與基板110接觸,並將熱量傳導至散熱風扇100進行散熱。此散熱模組1可用於筆記型電腦、桌上型電腦等任何需要散熱器的電子產品。在本實施例中,散熱模組1使用第一實施例的散熱風扇100來進行散熱,但不以此為限。散熱模組也可以使用本發明其他實施例的散熱風扇來進行散熱。Next, the heat dissipation module 1 including the heat dissipation fan 100 of the first embodiment of the present invention will be described. Please refer to FIG. 3, which is a perspective view of a heat dissipation module including the heat dissipation fan according to the first embodiment of the present invention. The heat dissipation module 1 includes the heat dissipation fan 100 and the heat pipe P of the aforementioned first embodiment. The heat pipe P contacts the substrate 110 and conducts heat to the heat dissipation fan 100 for heat dissipation. The heat dissipation module 1 can be used for any electronic products that require a heat sink, such as notebook computers and desktop computers. In this embodiment, the heat dissipation module 1 uses the heat dissipation fan 100 of the first embodiment for heat dissipation, but it is not limited to this. The heat dissipation module can also use heat dissipation fans in other embodiments of the present invention to dissipate heat.

接下來說明使用本發明第一實施例之散熱風扇100的散熱模組1散熱時熱量的傳遞途徑。熱管P與發熱源或其他導熱件接觸,並將熱量傳遞到基板110。基板110、頂板170和側壁180可由導熱性良好的材料製成,因此相連接的基板110、頂板170和側壁180可傳遞熱量,同時作為熱交換件以進行熱交換。基板凸起結構112可增加基板110的熱交換面積。在散熱風扇100運轉時,氣流從入風口IN被引入,經過基板110進行熱交換之後,帶著熱量的氣流再由出風口OUT被排出。此外,散熱風扇100運轉時,基板凸起結構112穿過第一凹陷結構161。同理,扇葉160之第一凹陷結構161之間的部分通過各基板凸起結構112之間的空間。藉此,轉動的扇葉160產生的擾動氣流反覆破壞形成於基板110表面的熱邊界層,以改善散熱效果。Next, the heat transfer path of the heat dissipation module 1 using the heat dissipation fan 100 of the first embodiment of the present invention will be described. The heat pipe P is in contact with a heat source or other heat-conducting parts, and transfers heat to the substrate 110. The base plate 110, the top plate 170, and the side wall 180 may be made of materials with good thermal conductivity, so the connected base plate 110, the top plate 170, and the side wall 180 can transfer heat and at the same time serve as a heat exchange member for heat exchange. The substrate protrusion structure 112 can increase the heat exchange area of the substrate 110. When the cooling fan 100 is running, the airflow is introduced from the air inlet IN, and after the heat exchange is performed through the substrate 110, the airflow carrying the heat is discharged from the air outlet OUT. In addition, when the heat dissipation fan 100 is running, the substrate protrusion structure 112 passes through the first recess structure 161. In the same way, the portion between the first recessed structures 161 of the fan blade 160 passes through the spaces between the raised structures 112 on the substrate. Thereby, the turbulent airflow generated by the rotating fan blade 160 repeatedly destroys the thermal boundary layer formed on the surface of the substrate 110 to improve the heat dissipation effect.

接下來說明本發明第二實施例之散熱風扇200。請參考圖4,圖4為本發明第二實施例之散熱風扇的分解圖。散熱風扇200包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170、側壁180、入風口IN以及出風口OUT。第二實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。Next, the heat dissipation fan 200 of the second embodiment of the present invention will be described. Please refer to FIG. 4, which is an exploded view of a heat dissipation fan according to a second embodiment of the present invention. The heat dissipation fan 200 includes a base plate 110, a shaft tube 120, a bearing 130, a stator 140, a rotor 150, a plurality of fan blades 160, a top plate 170, a side wall 180, an air inlet IN and an air outlet OUT. The second embodiment is substantially the same as the first embodiment, and only the differences are described below. Please refer to the above description for the same parts, and will not repeat them here.

在第一實施例中,基板凸起結構112具有四個基板通道113,但不以此為限。在第二實施例的散熱風扇200中,基板凸起結構112不具有基板通道113,換句話說,基板凸起結構112為連續不中斷的結構。不具有基板通道113的散熱風扇200亦可藉由扇葉160的第一凹陷結構161和基板110的基板凸起結構112,在扇葉轉動時產生擾動氣流,例如渦流或紊流,來破壞形成於基板110上的熱邊界層,藉此提升熱的傳導並改善散熱效率。In the first embodiment, the substrate protrusion structure 112 has four substrate channels 113, but it is not limited thereto. In the heat dissipation fan 200 of the second embodiment, the substrate protrusion structure 112 does not have the substrate passage 113. In other words, the substrate protrusion structure 112 is a continuous and uninterrupted structure. The heat dissipation fan 200 without the substrate channel 113 can also use the first recessed structure 161 of the fan blade 160 and the substrate protruding structure 112 of the substrate 110 to generate turbulent airflow, such as vortex or turbulence, when the fan blade rotates. The thermal boundary layer on the substrate 110 enhances heat conduction and improves heat dissipation efficiency.

在第一實施例中,一個基板凸起結構112穿過各扇葉160上的一個第一凹陷結構161,但不以此為限。請參考圖5,圖5為本發明第三實施例之散熱風扇的扇葉部分的剖面示意圖。第三實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第三實施例的散熱風扇300中,扇葉160還具有缺口162。缺口162與第一凹陷結構161設置於扇葉160之同側。當轉子150轉動時,基板凸起結構112穿過第一凹陷結構161,但不穿過缺口162。缺口162在不影響扇葉功能與結構強度的情況下可為任意數量和任意位置。缺口162可在扇葉160轉動時,進一步產生擾動氣流,例如渦流或紊流,來幫助破壞基板110表面的熱邊界層。In the first embodiment, a substrate protrusion structure 112 passes through a first recess structure 161 on each fan blade 160, but it is not limited to this. Please refer to FIG. 5, which is a schematic cross-sectional view of a fan blade portion of a heat dissipation fan according to a third embodiment of the present invention. The third embodiment is substantially the same as the first embodiment, and only the differences are described below. Please refer to the above description for the same parts, and will not repeat them here. In the heat dissipation fan 300 of the third embodiment, the fan blade 160 further has a notch 162. The notch 162 and the first recessed structure 161 are disposed on the same side of the fan blade 160. When the rotor 150 rotates, the substrate convex structure 112 passes through the first concave structure 161 but does not pass through the gap 162. The gap 162 can be any number and any position without affecting the function and structural strength of the fan blade. The notch 162 can further generate turbulent airflow, such as vortex or turbulence, when the fan blade 160 rotates to help destroy the thermal boundary layer on the surface of the substrate 110.

在第一實施例中,一個基板凸起結構112穿過各扇葉160上的一個第一凹陷結構161,但不以此為限。請參考圖6,圖6為本發明第四實施例之散熱風扇的扇葉部分的剖面示意圖。第四實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第四實施例的散熱風扇400中,當轉子150轉動時,多個基板凸起結構112同時穿過各扇葉160上的一個第一凹陷結構161,也就是說一個第一凹陷結構161可容納多個基板凸起結構112。多個基板凸起結構112可在扇葉160轉動時,進一步產生擾動氣流,例如渦流或紊流,來幫助破壞基板110表面的熱邊界層。In the first embodiment, a substrate protrusion structure 112 passes through a first recess structure 161 on each fan blade 160, but it is not limited to this. Please refer to FIG. 6, which is a schematic cross-sectional view of a fan blade portion of a heat dissipation fan according to a fourth embodiment of the present invention. The fourth embodiment is substantially the same as the first embodiment, and only the differences are described below. Please refer to the above description for the same parts, and will not repeat them here. In the heat dissipation fan 400 of the fourth embodiment, when the rotor 150 rotates, a plurality of substrate protrusion structures 112 simultaneously pass through a first recess structure 161 on each fan blade 160, that is to say, a first recess structure 161 can be A plurality of substrate protrusion structures 112 are accommodated. The plurality of substrate protrusion structures 112 can further generate disturbing airflow, such as vortex or turbulence, when the fan blade 160 rotates, to help destroy the thermal boundary layer on the surface of the substrate 110.

接下來說明本發明第五實施例之散熱風扇500。請參考圖7和圖8,圖7為本發明第五實施例之散熱風扇的分解圖,圖8為本發明第五實施例之散熱風扇的扇葉部分的剖面示意圖。散熱風扇500包含基板110、軸管120、軸承130、定子140、轉子150、多個扇葉160、頂板170、側壁180、入風口IN以及出風口OUT。第五實施例大致上與第一實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。Next, the heat dissipation fan 500 of the fifth embodiment of the present invention will be described. Please refer to FIGS. 7 and 8. FIG. 7 is an exploded view of a heat dissipation fan according to a fifth embodiment of the present invention, and FIG. 8 is a schematic cross-sectional view of a blade portion of a heat dissipation fan according to a fifth embodiment of the present invention. The heat dissipation fan 500 includes a base plate 110, a shaft tube 120, a bearing 130, a stator 140, a rotor 150, a plurality of fan blades 160, a top plate 170, a side wall 180, an air inlet IN and an air outlet OUT. The fifth embodiment is substantially the same as the first embodiment, and only the differences are described below. Please refer to the above description for the same parts, and will not repeat them here.

在第五實施例中,頂板170具有頂板凸起結構171,頂板凸起結構171圍繞著入風口IN。頂板凸起結構171具有頂板通道172。在本實施例中,頂板通道172的數量為四個,但不以此為限。於本發明其他實施例中,可不具有頂板通道。頂板凸起結構171可增加熱交換面積,藉此提升熱的傳導並改善散熱效率。In the fifth embodiment, the top plate 170 has a top plate convex structure 171, and the top plate convex structure 171 surrounds the air inlet IN. The top plate protrusion structure 171 has a top plate channel 172. In this embodiment, the number of top plate channels 172 is four, but it is not limited thereto. In other embodiments of the present invention, the ceiling channel may not be provided. The top plate protrusion structure 171 can increase the heat exchange area, thereby enhancing heat conduction and improving heat dissipation efficiency.

扇葉160具有第一凹陷結構161和第二凹陷結構163。第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且互相對齊。當轉子150轉動時,基板凸起結構112會穿過各扇葉160的第一凹陷結構161,而頂板凸起結構171會穿過各扇葉160的第二凹陷結構163。同理,扇葉160之第一凹陷結構161之間的部分可以通過各基板凸起結構112之間的空間,第二凹陷結構163之間的部分可以通過各頂板凸起結構171之間的空間。藉由第一凹陷結構161、第二凹陷結構163、基板凸起結構112和頂板凸起結構171,扇葉轉動時可以產生擾動氣流,例如渦流或紊流,來破壞形成於基板110和頂板170的熱邊界層,藉此提升熱的傳導並改善散熱效率。此外,基板通道113和頂板通道172作為出口,可讓累積在基板凸起結構112之間與頂板凸起結構171之間較高溫的氣流經基板通道113和頂板通道172排出。The fan blade 160 has a first recessed structure 161 and a second recessed structure 163. The first recessed structure 161 and the second recessed structure 163 are located on opposite sides of the fan blade 160 and aligned with each other. When the rotor 150 rotates, the base plate protrusion structure 112 will pass through the first recess structure 161 of each fan blade 160, and the top plate protrusion structure 171 will pass through the second recess structure 163 of each fan blade 160. In the same way, the part between the first recessed structure 161 of the fan blade 160 can pass through the space between the base plate raised structures 112, and the part between the second recessed structure 163 can pass through the space between the top plate raised structures 171 . With the first recessed structure 161, the second recessed structure 163, the base plate raised structure 112, and the top plate raised structure 171, when the fan blade rotates, disturbing airflow, such as vortex or turbulence, can be generated to damage the base plate 110 and the top plate 170. The thermal boundary layer to enhance heat conduction and improve heat dissipation efficiency. In addition, the substrate channel 113 and the top plate channel 172 are used as outlets to allow the higher-temperature air flow accumulated between the substrate protrusion structure 112 and the top plate protrusion structure 171 to be discharged through the substrate channel 113 and the top plate channel 172.

在第五實施例中,第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且互相對齊,但不以此為限。請參考圖9,圖9為本發明第六實施例之散熱風扇的扇葉部分的剖面圖。第六實施例大致上與第五實施例相同,以下僅對差異處做說明。相同的部分請參考上文描述,於此不再贅述。在第六實施例的散熱風扇600中,第一凹陷結構161與第二凹陷結構163位於扇葉160的相對兩側,且相錯位。第二凹陷結構163的位置可配合頂板170的頂板凸起結構171,使頂板170在結構設計上更有彈性。在其他實施例中,在不影響扇葉功能的情況下,第一凹陷結構161與第二凹陷結構163可為任意的數量和位置關係。In the fifth embodiment, the first recessed structure 161 and the second recessed structure 163 are located on opposite sides of the fan blade 160 and are aligned with each other, but not limited to this. Please refer to FIG. 9, which is a cross-sectional view of the fan blade portion of the heat dissipation fan according to the sixth embodiment of the present invention. The sixth embodiment is substantially the same as the fifth embodiment, and only the differences are described below. Please refer to the above description for the same parts, and will not repeat them here. In the heat dissipation fan 600 of the sixth embodiment, the first recessed structure 161 and the second recessed structure 163 are located on opposite sides of the fan blade 160, and are out of phase. The position of the second concave structure 163 can be matched with the top plate protrusion structure 171 of the top plate 170, so that the top plate 170 is more flexible in structural design. In other embodiments, the first recessed structure 161 and the second recessed structure 163 may have any number and positional relationship without affecting the function of the fan blade.

本發明實施例之散熱風扇,藉由基板的凸起結構和扇葉的凹陷結構,除了可以增加基板的熱交換面積,在扇葉旋轉時所產生的擾動氣流還可以反覆破壞基板表面的熱邊界層,藉以提升散熱效果。In the heat dissipation fan of the embodiment of the present invention, through the raised structure of the base plate and the recessed structure of the fan blade, in addition to increasing the heat exchange area of the base plate, the turbulent air flow generated when the fan blade rotates can also repeatedly destroy the thermal boundary on the surface of the base plate Layer to improve the heat dissipation effect.

雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent scope.

1:散熱模組1: Cooling module

100、200、300、400、500、600:散熱風扇100, 200, 300, 400, 500, 600: cooling fan

110:基板110: substrate

111:承載面111: bearing surface

112:基板凸起結構112: substrate raised structure

113:基板通道113: substrate channel

120:軸管120: shaft tube

130:軸承130: bearing

140:定子140: stator

150:轉子150: Rotor

160:扇葉160: fan blade

161:第一凹陷結構161: The first recessed structure

162:缺口162: Gap

163:第二凹陷結構163: second recessed structure

170:頂板170: top plate

171:頂板凸起結構171: Top plate raised structure

172:頂板通道172: roof channel

180:側壁180: side wall

200:散熱模組200: cooling module

P:熱管P: Heat pipe

IN:入風口IN: Air inlet

OUT:出風口OUT: Outlet

L1:第一寬度L1: first width

L2:第二寬度L2: second width

圖1為本發明第一實施例之散熱風扇的分解圖。 圖2為本發明第一實施例之散熱風扇的剖面示意圖。 圖3為包含本發明第一實施例之散熱風扇的散熱模組的立體圖。 圖4為本發明第二實施例之散熱風扇的分解圖。 圖5為本發明第三實施例之散熱風扇的扇葉部分的剖面示意圖。 圖6為本發明第四實施例之散熱風扇的扇葉部分的剖面示意圖。 圖7為本發明第五實施例之散熱風扇的分解圖。 圖8為本發明第五實施例之散熱風扇的扇葉部分的剖面示意圖。 圖9為本發明第六實施例之散熱風扇的扇葉部分的剖面圖。 Fig. 1 is an exploded view of the cooling fan according to the first embodiment of the present invention. 2 is a schematic cross-sectional view of the heat dissipation fan according to the first embodiment of the present invention. 3 is a perspective view of a heat dissipation module including the heat dissipation fan of the first embodiment of the present invention. Fig. 4 is an exploded view of the cooling fan according to the second embodiment of the present invention. 5 is a schematic cross-sectional view of the fan blade portion of the heat dissipation fan according to the third embodiment of the present invention. 6 is a schematic cross-sectional view of the fan blade portion of the cooling fan according to the fourth embodiment of the present invention. Fig. 7 is an exploded view of a heat dissipation fan according to a fifth embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a fan blade portion of a heat dissipation fan according to a fifth embodiment of the present invention. Fig. 9 is a cross-sectional view of a fan blade portion of a heat dissipation fan according to a sixth embodiment of the present invention.

100:散熱風扇 100: cooling fan

110:基板 110: substrate

111:承載面 111: bearing surface

112:基板凸起結構 112: substrate raised structure

113:基板通道 113: substrate channel

120:軸管 120: shaft tube

130:軸承 130: bearing

140:定子 140: stator

150:轉子 150: Rotor

160:扇葉 160: fan blade

161:第一凹陷結構 161: The first recessed structure

170:頂板 170: top plate

180:側壁 180: side wall

IN:入風口 IN: Air inlet

OUT:出風口 OUT: Outlet

Claims (9)

一種散熱風扇,包含:一基板,具有一基板凸起結構;一軸管,固定於該基板,該基板凸起結構圍繞該軸管;一軸承,位於該軸管中;一定子,固定於該基板;一轉子,樞設於該軸承;多個扇葉,與該轉子連接,該些扇葉各具有一第一凹陷結構,當該轉子轉動時,該基板凸起結構穿過各該些扇葉的該第一凹陷結構;一頂板,與該基板相對;一側壁,位於該頂板和該基板之間並與該頂板和該基板連接,該頂板、該側壁和該基板形成一殼體,該定子、該轉子和該些扇葉位於該殼體中;以及一入風口和一出風口,當該入風口位於該頂板時,該出風口位於該基板或該側壁;當該入風口位於該基板時,該出風口位於該頂板或該側壁。 A heat dissipation fan includes: a base plate with a base plate protrusion structure; a shaft tube fixed to the base plate, the base plate protrusion structure surrounding the shaft tube; a bearing located in the shaft tube; a stator fixed to the base plate A rotor pivoted on the bearing; a plurality of fan blades connected to the rotor, each of the fan blades has a first concave structure, when the rotor rotates, the base plate convex structure passes through each of the fan blades The first recessed structure; a top plate, opposite to the base plate; a side wall, located between the top plate and the base plate and connected with the top plate and the base plate, the top plate, the side wall and the base plate forming a housing, the stator , The rotor and the fan blades are located in the housing; and an air inlet and an air outlet, when the air inlet is located on the top plate, the air outlet is located on the base plate or the side wall; when the air inlet is located on the base plate , The air outlet is located on the top plate or the side wall. 如請求項1所述之散熱風扇,其中該基板凸起結構具有一第一寬度,該第一凹陷結構具有一第二寬度,該第一寬度小於該第二寬度。 The heat dissipation fan according to claim 1, wherein the raised structure of the substrate has a first width, and the first recessed structure has a second width, and the first width is smaller than the second width. 如請求項1所述之散熱風扇,其中該基板凸起結構或該第一凹陷結構的形狀為矩形、三角形或弧形。 The heat dissipation fan according to claim 1, wherein the shape of the convex structure of the substrate or the first concave structure is a rectangle, a triangle, or an arc. 如請求項1所述之散熱風扇,其中該些扇葉更具有一缺口,該缺口與該第一凹陷結構設置於該些扇葉的同側。 The heat dissipation fan according to claim 1, wherein the fan blades further have a notch, and the notch and the first recessed structure are disposed on the same side of the fan blades. 如請求項1所述之散熱風扇,其中該基板凸起結構的數量為多個,該些基板凸起結構同時穿過各該些扇葉的該第一凹陷結構。 The heat dissipation fan according to claim 1, wherein the number of the convex structure of the substrate is multiple, and the convex structures of the substrate pass through the first concave structure of each of the fan blades at the same time. 如請求項1所述之散熱風扇,其中該基板凸起結構具有一基板通道,該基板通道位於該軸管和該出風口之間。 The heat dissipation fan according to claim 1, wherein the substrate protrusion structure has a substrate passage, and the substrate passage is located between the shaft tube and the air outlet. 如請求項1所述之散熱風扇,其中該頂板具有一頂板凸起結構,該頂板凸起結構具有一頂板通道,該些扇葉具有一第二凹陷結構,當該轉子轉動時,該頂板凸起結構穿過該第二凹陷結構,該第一凹陷結構與該第二凹陷結構位於該些扇葉的相對兩側。 The heat dissipation fan according to claim 1, wherein the top plate has a top plate convex structure, the top plate convex structure has a top plate channel, the fan blades have a second concave structure, and when the rotor rotates, the top plate convex The lift structure passes through the second recessed structure, and the first recessed structure and the second recessed structure are located on opposite sides of the fan blades. 如請求項7所述之散熱風扇,其中該第一凹陷結構與該第二凹陷結構相錯位。 The heat dissipation fan according to claim 7, wherein the first recessed structure and the second recessed structure are misaligned. 一種散熱模組,包含如請求項1~8中任一項所述之散熱風扇以及一熱管,該熱管與該基板接觸。 A heat dissipation module includes the heat dissipation fan described in any one of claims 1-8 and a heat pipe, and the heat pipe is in contact with the substrate.
TW108119951A 2019-06-10 2019-06-10 Cooling fan and cooling module including the same TWI698169B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036511A2 (en) * 2004-09-24 2006-04-06 Carrier Corporation Fan
TWI563175B (en) * 2014-11-14 2016-12-21 Foxconn Tech Co Ltd Fan
TWM548813U (en) * 2017-03-23 2017-09-11 Power Logic Tech Inc Fan blade module and transparent blade thereof
CN208870840U (en) * 2017-09-28 2019-05-17 日本电产株式会社 Wheel portion, impeller and air supply device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036511A2 (en) * 2004-09-24 2006-04-06 Carrier Corporation Fan
TWI563175B (en) * 2014-11-14 2016-12-21 Foxconn Tech Co Ltd Fan
TWM548813U (en) * 2017-03-23 2017-09-11 Power Logic Tech Inc Fan blade module and transparent blade thereof
CN208870840U (en) * 2017-09-28 2019-05-17 日本电产株式会社 Wheel portion, impeller and air supply device

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