1311460 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤係涉及一種用於對電 子元件散熱之散熱裝置。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art]
當前，為將微處理晶片等發熱電子元件所產生之熱量 有效散發，習知方法係採用一散熱裝置對發熱電子元件散 熱。該散熱裝置包括一風扇及設於該風扇出風口之一散熱 器，該散熱器與發熱電子元件熱連接並吸收其產生之埶 量，該風扇產生之氣流與該散熱器之散熱片交換熱量並將 其吸收之熱量散發，從而達到散熱之目的。 成型。這樣就使付散熱器在有限之空間内 起初該散熱器係由複數與風扇之殼體一體壓鑄成型之 散熱片組成。然而，隨著電子工業之不斷發展，微處理晶 片荨發熱電子元件之處理速度越來越快，隨之所產生之熱 置也就越來越多。由於壓鑄成型之散熱片受壓鑄模具成型 條件之限制，單錄熱之寬度和高度以及散^與散熱 片之間距都受-定限制和要求，否則散熱片將無法用= 散熱表面積不 量之 足，散熱性能無法得到提高，從而不能滿足對高發熱 發熱電子元件散熱之需求。 ” 為滿足散熱之需求，又出現-種採用扣合式之。。 之散熱裝置，該散熱n由複數片狀之散熱片堆叠’、、、器 於散熱片與風扇之殼體係相製造，故單個散熱片二由 之見度 6 1311460 以及散刻與散熱片之間财阿做得轉鑄之散熱片小。 與壓鑄成型之散熱器相比，扣人 … ^ a _^± a σ式之散熱器在相同之體積 本較高 内二=大續熱表面積，散熱性能得到有效提升。但該 口二散熱紅製造成本較高，從*使整個散絲置之成 【發明内容】Currently, in order to effectively dissipate heat generated by heat-generating electronic components such as micro-processed wafers, conventional methods use a heat sink to dissipate heat from the heat-generating electronic components. The heat dissipating device comprises a fan and a heat sink disposed at the air outlet of the fan, the heat sink is thermally connected to the heat generating electronic component and absorbs the amount of heat generated by the fan, and the airflow generated by the fan exchanges heat with the heat sink of the heat sink. The heat absorbed by it is dissipated to achieve the purpose of heat dissipation. forming. This allows the heat sink to be in a limited space. The heat sink is initially composed of a plurality of heat sinks integrally molded with the housing of the fan. However, with the continuous development of the electronics industry, the processing speed of micro-processed wafers and heat-generating electronic components is becoming faster and faster, and the resulting heat generation is increasing. Since the die-cast heat sink is limited by the molding conditions of the die-casting mold, the width and height of the single recording heat and the distance between the heat sink and the heat sink are subject to the limitation and requirements, otherwise the heat sink will not be able to use = the heat dissipation surface area is not sufficient. The heat dissipation performance cannot be improved, and thus the demand for heat dissipation of the high heat-generating electronic components cannot be satisfied. In order to meet the demand for heat dissipation, there is also a type of snap-on type. The heat sink is made up of a plurality of fin-shaped heat sink stacks, and is fabricated in the shell of the heat sink and the fan, so that a single The heat sink 2 has a visibility of 6 1311460 and a heat sink that is made by casting between the heat sink and the heat sink. Compared with the die-cast heat sink, it is... ^ a _^± a σ-type heat sink The heat dissipation performance of the device is effectively improved in the same volume of the second volume = the maximum thermal surface area. However, the manufacturing cost of the two heat dissipation red is higher, and the whole filament is made from * [invention content]
有馨於此，有必要提供—種具有較佳之散熱性能同時 又具較低成本之散熱裝置。 -種散熱裝置，包括-散熱風扇及—散熱器，該散熱 風扇設有-出風π，該出風σ具有—近端及—遠端，由出 風口吹出之氣流由該近端吹向遠端，該散熱綠於該出風 口處，趙熱③包括第-_片組與第二鰭片組，該第一縛 片組靠近該出風Π之遠端設置，其包括複數與散熱風扇〆 體成型之第-散熱片，該第二鰭片組靠近該出風口之近端 設置’其包括堆疊在-起之複數獨立製造之第二散熱片。 -種散熱裝置，包括-離心風扇、—熱管以及設於該 離心風扇之出風口處之複數散熱片，該熱管之一端與一發 熱電子元賴連接’另-端與該等錄#熱賴，該等散 熱片包括複數與離心風扇一體壓鑄成型之第一散熱片及複 數堆宜扣合形成之第—散熱片，該等第二散熱片設置在出 風口處氣流流速較大之區域，而該等第一散熱片設置在出 風口處氣流流速較小之區域。 與習知技術相比，該散熱裝置藉由在出風口對應氣流 流速及流量較大之近端區域設置由堆疊形成而具較大散熱 7 1311460 _ _之第二鰭片組’而在㈣Π對應氣流流速較小之遠端 區域設置-體成型之第-鳍片組，這樣設置可使散熱風扇 氣流得到充分利狀同時使散熱裝置具有較低之生產成 本，具較高之性價比。 【實施方式】 圖ί所示為本發明散熱裝置10其中一較佳實施例，該 政熱裝置10包括-散熱器12、-爲平狀之熱管13及一散 魯 #風扇14，該散熱裝置10適合於筆記型電腦等可搗式電 子產品之散熱’該熱管13具有一蒸發段m及一冷凝段 m。 該散熱風扇14為一離心風扇，其包括一殼體141及一 具有複數扇葉142a之轉子142，該轉子142安裝在該殼體 141内。該殼體141包括一底座143及設於該底座143上 之一蓋板144。該蓋板144為一板體，其中部設有一圓形 之入風口 145。該底座143包括一底板146及一渦形之側 • 壁147 ’該侧壁147上設有一直線形之出風口 148。該侧壁 147之内壁與扇葉142a之最外端之間形成一流道149，該 流道149之寬度沿逆時針方向即轉子⑷之轉動方向逐漸 變寬（圖4所示）。該散熱風扇14在出風口 148處具有一 近端148a及一遠端148b，當散熱風扇14在運轉時，所產 生之冷卻氣流先到達出風口 148之近端148a，再到達出風 口 148之遠端148b，且流過近端148a區域之冷卻氣流之流 速要大於遠端148b區域冷卻氣流之流速。藉由仿真分析可 知，散熱風扇14之出風口 148之近端148a 一侧占出風口 1311460 14 8約寬度1 /3之區域所流過氣流之流量約為氣流總流量之 一半，故，在相等之面積上，流過近端148a區域之冷卻氣 流之流量遠大於遠端148b區域冷卻氣流之流量。該底板 146之下側設有一弧形之溝槽151 (圖3所示），熱管13 收容於該溝槽151内。 該散熱器12設於散熱風扇14之出風口 148處，其包 括靠近出風口 148之遠端148b設置之第一鰭片組121及靠 近出風口 W8之近端148a設置之第二鰭片組122，本實施 例中該第二鰭片組122所占出風口 148之寬度小於該第— 鰭片組121所占出風口 148之寬度，該第二鰭片組122所 占出風口 148之寬度可為出風口 148整體寬度之1/4至1/2 之間，以使該第二鰭片組122與第一鰭片組121所占出風 口 148之i度與該出風口 148處之氣流狀況相符，以發揮 最大之散熱效能，同時達到控制成本之目的。在本實施例 中，該第二鰭片組122所占出風口 148整體寬度之左 右。該第一鰭片組121包括複數自底座143之底板146 一 體延伸之第-散熱片ma，該等第一散熱片ma與底柄 146垂直’且在整體上排列成直線形，以與散熱風扇μ之 出風口 148相配合。該等第一散熱片12U與底座143為一 體壓鑄製成。該等第-散熱片咖具有較大之厚度，且相 鄰兩第-散熱片Hla之間距也較大。本實施例中，該等筹 一散熱片121a之厚度為1Omm，相鄰兩第一散熱片 之間距為1.5mm。 該第二鰭片組122包括複數片狀之第二散熱片 1311460 :=t122,狀之金屬製成，其包括-大致呈 H 該主體123之上、下兩端向主體⑵ 邊124’後—第二散熱片122a之折邊124與 ==第散熱片122a之上、下兩端之折邊從 !25，: 之上端面（未標號）及下端面 散数几第二散熱片i22a之間形成一間距以供 散=饱之冷卻氣流流過。可以理解地，所述第 合孔，__扣合孔 -使該等第二散熱片1223形 鰭月組m收容於纽口 14δ之近端148a «片組⑵之底面及該第二讀月組122之下端面门 ==151内之熱管13之冷凝段131接觸，以增加5 散熱片ma及第二散熱片122a之熱 率、， 蒸發端132與一發熱電子元件如筆記型電腦内 狀=Γ圖未示)連接。由於第二散熱片122a由片 兩第、’第一散熱片122a之厚度可做得較小，相鄰 等ίΐί 之間距也可做得較小。本實施例中，該 散熱片 ^實施例中，該第一鰭片組121與第二韓片組似相 可利之第-散熱片ma與風扇之底座⑷ 第二=具一次成型’生產成本較低。第二鰭片組122之 …、片122a由片狀之金屬製成，這樣第二散熱片 122a 1311460 „片與片之間距與第—散熱片ma相比均較小， -韓片組m之第二散熱片122a之設置密度較大， 早積上第二鰭片組122之總散熱面積較大。It is necessary to provide a heat sink with better heat dissipation performance and lower cost. a heat dissipating device comprising: a cooling fan and a radiator, wherein the cooling fan is provided with an outlet π, the outlet σ has a proximal end and a distal end, and the airflow blown by the air outlet is blown away from the proximal end The heat dissipation is green at the air outlet, and the Zhao heat 3 includes a first----------------------------------------------------------------------------- The body-formed first heat sink, the second fin set is disposed near the proximal end of the air outlet, and includes a plurality of independently fabricated second heat sinks stacked in a stack. a heat dissipating device comprising: a centrifugal fan, a heat pipe, and a plurality of fins disposed at an air outlet of the centrifugal fan, wherein one end of the heat pipe is connected to a heat generating element, and the other end is connected with the other The heat sink comprises a plurality of first heat sinks integrally molded with the centrifugal fan and a first heat sink formed by the plurality of stacks, wherein the second heat sinks are disposed at a region where the air flow velocity is larger at the air outlet, and the heat sink is disposed The first heat sink is disposed in an area where the air flow rate is small at the air outlet. Compared with the prior art, the heat dissipating device corresponds to the second fin group formed by the stack and has a large heat dissipation 7 1311460 _ _ in the near end region corresponding to the air flow velocity and the flow rate at the air outlet. The distal region of the airflow flow rate is set to the body-shaped first-fin group, so that the cooling fan airflow can be sufficiently profited and the heat sink has a lower production cost, and the cost is higher. [Embodiment] FIG. 1 is a preferred embodiment of a heat dissipating device 10 of the present invention. The thermal device 10 includes a heat sink 12, a flat heat pipe 13 and a diffuse fan 14. The heat sink 10 is suitable for heat dissipation of a portable electronic product such as a notebook computer. The heat pipe 13 has an evaporation section m and a condensation section m. The cooling fan 14 is a centrifugal fan including a housing 141 and a rotor 142 having a plurality of blades 142a, the rotor 142 being mounted in the housing 141. The housing 141 includes a base 143 and a cover 144 disposed on the base 143. The cover plate 144 is a plate body having a circular inlet 145 therein. The base 143 includes a bottom plate 146 and a side of a scroll. The wall 147 has a straight-shaped air outlet 148. A gap 149 is formed between the inner wall of the side wall 147 and the outermost end of the blade 142a, and the width of the flow path 149 is gradually widened in the counterclockwise direction, that is, the direction of rotation of the rotor (4) (shown in Fig. 4). The cooling fan 14 has a proximal end 148a and a distal end 148b at the air outlet 148. When the cooling fan 14 is in operation, the generated cooling airflow first reaches the proximal end 148a of the air outlet 148 and reaches the air outlet 148. End 148b, and the flow rate of the cooling gas stream flowing through the region of proximal end 148a is greater than the flow rate of the cooling gas stream in the region of distal end 148b. According to the simulation analysis, the side of the proximal end 148a of the air outlet 148 of the cooling fan 14 occupies the air outlet 1311460. The flow rate of the airflow flowing through the airflow is about one-half of the total flow of the airflow. Therefore, it is equal. The area of the cooling airflow flowing through the region of the proximal end 148a is much larger than the flow of the cooling airflow in the region of the distal end 148b. An arcuate groove 151 (shown in FIG. 3) is disposed on the lower side of the bottom plate 146, and the heat pipe 13 is received in the groove 151. The heat sink 12 is disposed at the air outlet 148 of the heat dissipation fan 14, and includes a first fin set 121 disposed near the distal end 148b of the air outlet 148 and a second fin set 122 disposed near the proximal end 148a of the air outlet W8. In this embodiment, the width of the air outlet 148 of the second fin set 122 is smaller than the width of the air outlet 148 of the first fin set 121, and the width of the air outlet 148 of the second fin set 122 can be Between 1/4 and 1/2 of the overall width of the air outlet 148, so that the second fin set 122 and the first fin set 121 occupy the air outlet 148 and the airflow condition at the air outlet 148 Matches to maximize heat dissipation while achieving cost control. In this embodiment, the second fin set 122 occupies the entire width of the air outlet 148. The first fin set 121 includes a plurality of first heat sinks ma extending integrally from the bottom plate 146 of the base 143. The first heat sinks ma are perpendicular to the bottom handle 146 and are arranged in a straight line as a whole to dissipate the heat sink fan. The air outlet 148 of μ fits. The first fins 12U and the base 143 are integrally die cast. The first heat sinks have a large thickness, and the distance between the adjacent two first heat sinks H1a is also large. In this embodiment, the thickness of the fins 121a is 10 mm, and the distance between the adjacent first fins is 1.5 mm. The second fin set 122 includes a plurality of second fins 1311460:=t122, which is made of metal, and includes - substantially H. The upper and lower ends of the main body 123 are opposite to the side of the main body (2) 124'. The flange 124 of the second heat sink 122a and the == the flange of the upper and lower ends of the heat sink 122a are separated from the upper end surface (not numbered) and the lower end surface by a plurality of second heat sinks i22a A spacing is formed for the flow of the cooling gas to be saturated = saturated. It can be understood that the first hole, the __ fastening hole, allows the second fin 1223 to form the fin assembly m at the proximal end 148a of the button 14 δ «the bottom of the slice group (2) and the second reading month The lower portion of the lower end of the group 122 == 151 contacts the condensation section 131 of the heat pipe 13 to increase the heat rate of the heat sink ma and the second heat sink 122a, and the evaporation end 132 and a heat generating electronic component such as a notebook computer = Γ unshown) connection. Since the thickness of the second heat sink 122a is smaller than that of the first heat sink 122a, the distance between adjacent ones can be made smaller. In this embodiment, in the embodiment of the heat sink, the first fin set 121 and the second Korean set are similar to the first heat sink MA and the fan base (4). low. The second fin group 122 is formed of a sheet metal, such that the second fin 122a 1311460 „the distance between the sheet and the sheet is smaller than that of the first heat sink ma, and the Korean sheet group m is The second heat sink 122a is densely disposed, and the total heat dissipation area of the second fin set 122 is large.
本實㈣+，藉*在氣流之流速及流量較大之出風口 之近端148a區域設置具較大散熱面積之第二籍片組 ，而在氣流之流速及流量較小之遠端區域設置與 之底座143 一體成型之第-韓片組⑵，這樣 :敕/散熱風扇14產生之冷卻氣流得到充分利用，同時 熱裝置具有較低之生產成本。與散熱片全部採 /、$羽縣鑄魅之傳贿錄置概，本實施例中 之散熱裝置10由於在氣流之流速及流量較大之出風口⑽ 之近端148a區域使用具較大散熱面積之第二鰭片组似， 從而散熱打1G之整雜熱__較錢升。盘全採用 扣合式散⑼讀統散熱裝置相比，本實施The real (4)+, by the * in the proximal end 148a of the air flow and the flow of the larger air outlet, the second piece set with a larger heat dissipation area, and set in the far end area where the flow rate and flow rate of the air flow are small The first-Korean group (2) integrally formed with the base 143 is such that the cooling airflow generated by the 敕/cooling fan 14 is fully utilized, and the thermal device has a lower production cost. The heat sink 10 in this embodiment is used for heat transfer in the vicinity of the air outlet (10). The second fin group of the area is similar, so that the heat dissipation of 1G is more complicated than the money. The disc is fully equipped with a snap-fit type (9) read system heat sink compared to this implementation
=梅之流速及流量較小之出風口 148之遠端= S域仍保留設置與散熱風扇14之底座i43—體成型之第一 韓片組m，在散熱性能影響不大之情況下降低生產成本。 =本散歸置10與傳統之散録置她具較高之性價 綜上所述’本發簡合伽翻要件，纽法提 利申請。惟，以上所述者僅為本發明之較佳實施例 熟悉本案技藝之人士，在爰依本發明精神所作之等效 或變化’皆應涵蓋独下之帽翔範圍内。 11 1311460 【圖式簡單說明】 圖1係本發明散熱裝置較佳實施例之立體分解圖。 圖2係圖1所示散熱裝置之立體組裝圖。 圖3係圖1所示散熱裝置之另一角度之部分組裝圖。 圖4係圖2所示散熱裝置去掉上蓋之俯視圖。= the far end of the air outlet 148 with a small flow rate and flow rate of the plum = the S field still retains the first Korean group m that is formed with the base i43 of the cooling fan 14, and the production is reduced if the heat dissipation performance is not greatly affected. cost. = The original placement of 10 and the traditional transcript set her higher price. In summary, this is a simple and versatile application, Newfatili application. However, the above description is only for the preferred embodiment of the present invention. Those skilled in the art will be able to cover the scope of the present invention within the scope of the present invention. 11 1311460 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a preferred embodiment of a heat sink according to the present invention. 2 is an assembled, isometric view of the heat sink shown in FIG. 1. Figure 3 is a partial assembled view of another angle of the heat sink shown in Figure 1. Figure 4 is a plan view showing the heat sink of Figure 2 with the upper cover removed.
【主要元件符號說明】 散熱裝置 10 散熱器 12 第一鰭片組 121 第一散熱片 121a 第二鰭片組 122 第二散熱片 122a 主體 123 折邊 124 下端面 125 熱管 13 冷凝段 131 蒸發段 132 散熱風扇 14 殼體 141 轉子 142 扇葉 142a 底座 143 蓋板 144 入風口 145 底板 146 侧壁 147 出風口 148 近端 148a 遠端 148b 流道 149 溝槽 151 12[Main component symbol description] Heat sink 10 Heat sink 12 First fin set 121 First heat sink 121a Second fin set 122 Second heat sink 122a Main body 123 Folding 124 Lower end surface 125 Heat pipe 13 Condensation section 131 Evaporation section 132 Cooling fan 14 housing 141 rotor 142 blade 142a base 143 cover 144 air inlet 145 bottom plate 146 side wall 147 air outlet 148 proximal end 148a distal end 148b flow path 149 groove 151 12