200819031 九、發明說明： f發明所屬之技術領域】 ^發明係涉及-種散熱裝置，尤係涉及一種用於對電 子疋件散熱之散熱裝置。 【先前技術】 右对ίΓ⑽财㈣”發_子元件賴生之熱量 敎x ’ f知方法係細—散難置對發熱電子元件散 Γ。遠散熱裝置包括—風扇及設於該風扇出風口之-散埶 Γ該散熱11與發熱電子^件熱連接並吸收其產生之埶 ^ ’該風扇產生之氣流與該散熱器之散熱片交換熱量並將 /、吸收之熱量散發’㈣達到散熱之目的。 起初該散熱器係由複數與風扇之殼體 散熱片組成。秋而，哼莫贵工# 電子工業之不斷發展，微處理晶 .旦U子兀件之處理速度越來越快，隨之所產生之熱 :也就越來越多。由於壓鑄成型之散糾受壓鑄模呈成型 =件之限制，單個散熱片之寬度和高如及散200819031 IX. Description of the invention: The technical field to which the invention belongs. The invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] Right to Γ 10 10 10 10 10 10 10 10 子 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The heat dissipation 11 is thermally connected to the heat-generating electronic component and absorbs the generated heat. The airflow generated by the fan exchanges heat with the heat sink of the heat sink and dissipates heat absorbed by the heat sink (4) to achieve heat dissipation. Purpose: At first, the radiator consists of a plurality of heat sinks with a fan shell. Autumn, 哼莫贵工# The continuous development of the electronic industry, the processing speed of the micro-processed crystal. The U-piece is getting faster and faster. The heat generated by it: more and more. Due to the limitation of the die-casting die of the die-casting molding, the width and height of the single heat sink are as high as
=間距都受—鎌制和要求，否則散熱片將無法用模I 樣就使得散_在有限之空_總散熱表面積不 =熱性能無法得到提高，從而不能滿足對高發熱量之 發熱電子元件散熱之需求。 之散熱1求’又出現一種採用扣合式之散熱器 月…、装置，該散熱器由複數片狀之散熱片堆疊而成， 於散熱片與風扇之殼體係分開製造，故單個散二片之寬产 200819031 片與放熱片之間距都可做得比麼鑄之散熱片小。 與壓禱成型之散熱11相比，扣合式之散熱ϋ在侧之體積 内ί有f大之散熱表面積，散熱性能得到有效提升。但該 4 口式放熱n之製造成本較高，從而使整個散a裝置之成 本較高。 u 【發明内容】 有鑒於此，有必要提供一種具有較佳之散熱性能同時 又具較低成本之散熱裝置。 種政熱裝置，包括—散熱風扇及-散熱H，該散熱 風扇設有-出風口，該出風口具有一近端及一遠端，由出 風口吹出之氣流由該近端吹向遠端，該散熱器設於該出風 口處’該散熱器包括第-鰭片組與第二鰭片組，該第一鰭 片組靠近該出風口之遠端設置，其包括複數與散熱風扇一 體成型之第一散熱片，該第二鰭片組靠近該出風口之近端 设置，其包括堆疊在-起之複數獨立製造之第二散熱片。 —種散歸置，包括-離錢扇、—鮮以及設於該 離心風扇之出風口處之複數散熱片，該熱管之一端與一發 熱電子兀件熱連接，另一端與該等散熱片熱連接，該等散 熱片包括複數與離心風扇一體壓鑄成型之第一散熱片及複 數堆疊扣合形成之第二散熱片，該等第二散熱片設置在出 風口處氣流流速較大之區域，而該等第一散熱片設置在出 風口處氣流流速較小之區域。 與習知技術相比，該散熱裝置藉由在出風口對應氣流 流速及流餘大之近端區域設置由堆4形成而具較大散熱 200819031 面積之第二,it片組’而在出風〇對應氣流流速較小之遠端 區域設置—體成型之第—^組，這樣設置可使散熱風扇 氣流得到充分利狀同時使散驗置具有較低之生產成 本，具較高之性價比。 【實施方式】 圖1所示為本發明散熱裝i 1〇其中-較佳實施例，該 散熱裝置10包括一政熱為12、一扁平狀之熱管13及一散 熱風扇14，該散熱裝置1〇適合於筆記型電腦等可檇式電 子產品之散熱，該熱官13具有一蒸發段132及一冷凝段 131。 该散熱風扇14為一離心風扇，其包括一殼體及一 具有複數扇葉142a之轉子142，該轉子142安裝在該殼體 141内。該殼體141包括一底座143及設於該底座143上 之一蓋板144。該盍板144為一板體，其中部設有一圓形 之入風口 145。該底座143包括一底板146及一渦形之侧 壁147 ’該側壁147上設有一直線形之出風口 148。該侧壁 147之内壁與扇葉142a之最外端之間形成一流道149，該 流道149之寬度沿逆時針方向即轉子m2之轉動方向逐漸 變寬（圖4所示）。該散熱風扇14在出風口 148處具有_ 近端148a及一遠端148b，當散熱風扇14在運轉時，所產 生之冷卻氣流先到達出風口 148之近端148a，再到達出風 口 148之遠端148b，且流過近端148a區域之冷卻氣流之流 速要大於遠端148b區域冷卻氣流之流速。藉由仿真分析可 知，散熱風扇14之出風口 148之近端148a —側占出風口 8 200819031 148約寬度1/3之區域所流過氣流之流量約為氣流總流量之 一半，故，在相等之面積上，流過近端148a區域之冷卻氣 流之流量遠大於遠端148b區域冷卻氣流之流量。該底板 146之下側設有一弧形之溝槽151 (圖3所示），熱管13 收容於該溝槽151内。 該散熱器12設於散熱風扇14之出風口 148處，其包 括靠近出風口 148之遠端148b設置之第一鰭片組121及靠 近出風口 148之近端148a設置之第二鰭片組122，本實施 例中該第一鰭片組122所占出風口 148之寬度小於該第一 鰭片組121所占出風口 148之寬度，該第二鰭片組122所 占出風口 148之寬度可為出風口 148整體寬度之1/4至1/2= The spacing is subject to the requirements and requirements, otherwise the heat sink will not be able to use the die I to make the dispersion _ in a limited space _ total heat dissipation surface area does not = thermal performance can not be improved, thus can not meet the heat dissipation of high heat generating electronic components Demand. The heat dissipation 1 seeks a kind of a heat sink with a snap-on type, and the device is formed by stacking a plurality of heat sinks, which are separately manufactured from the heat sink and the shell of the fan, so that the two pieces are separated. The wide distance between the production of the 200819031 film and the heat release film can be made smaller than that of the heat sink. Compared with the heat-dissipating 11 formed by the praying, the heat-dissipating heat-dissipating ϋ has a large heat-dissipating surface area in the volume of the side, and the heat-dissipating performance is effectively improved. However, the 4-port exotherm n is relatively expensive to manufacture, resulting in a higher cost for the entire device. u SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having better heat dissipation performance and lower cost. The heat management device includes a heat dissipation fan and a heat dissipation H. The heat dissipation fan is provided with an air outlet having a proximal end and a distal end, and the airflow blown by the air outlet is blown to the distal end by the proximal end. The heat sink is disposed at the air outlet. The heat sink includes a first fin set and a second fin set. The first fin set is disposed near the distal end of the air outlet, and includes a plurality of integrated heat sink fans. The first fin is disposed near the proximal end of the air outlet, and includes a second heat sink that is independently fabricated and stacked. - a kind of scatter, including - a fan, a fresh, and a plurality of fins disposed at an air outlet of the centrifugal fan, one end of the heat pipe is thermally connected to a heat generating electronic component, and the other end is heated with the heat sink Connecting, the heat sink comprises a plurality of first heat sinks integrally molded with the centrifugal fan and a second heat sink formed by a plurality of stacks, wherein the second heat sinks are disposed at a region where the air flow velocity is large at the air outlet, and The first fins are disposed in an area where the air flow rate is small at the air outlet. Compared with the prior art, the heat dissipating device is formed by the stack 4 in the near end region corresponding to the air flow velocity and the flow margin, and has a large heat dissipation of the second area of the 200819031 area. 〇 Corresponding to the far-end area setting with small airflow velocity—the first group of body forming, so that the cooling fan airflow can be fully profited and the dispersing inspection has a lower production cost, and the cost is higher. [Embodiment] FIG. 1 shows a heat dissipating device of the present invention. In the preferred embodiment, the heat dissipating device 10 includes a heat pipe 12 having a flat heat of 12 and a heat dissipating fan 14. The heat dissipating device 1 〇 Suitable for heat dissipation of a portable electronic product such as a notebook computer having an evaporation section 132 and a condensation section 131. The cooling fan 14 is a centrifugal fan including a housing and a rotor 142 having a plurality of blades 142a, the rotor 142 being mounted in the housing 141. The housing 141 includes a base 143 and a cover 144 disposed on the base 143. The seesaw 144 is a plate body having a circular inlet 145 therein. The base 143 includes a bottom plate 146 and a vortex side wall 147'. The side wall 147 is provided with a linear air outlet 148. A gap 149 is formed between the inner wall of the side wall 147 and the outermost end of the blade 142a, and the width of the flow path 149 is gradually widened in the counterclockwise direction, that is, the direction of rotation of the rotor m2 (shown in Fig. 4). The cooling fan 14 has a proximal end 148a and a distal end 148b at the air outlet 148. When the cooling fan 14 is in operation, the generated cooling airflow first reaches the proximal end 148a of the air outlet 148 and reaches the air outlet 148. End 148b, and the flow rate of the cooling gas stream flowing through the region of proximal end 148a is greater than the flow rate of the cooling gas stream in the region of distal end 148b. According to the simulation analysis, the proximal end 148a of the air outlet 148 of the cooling fan 14 occupies the air outlet 8 200819031 148. The flow rate of the airflow flowing through the airflow is about one-half of the total flow of the airflow, so it is equal. The area of the cooling airflow flowing through the region of the proximal end 148a is much larger than the flow of the cooling airflow in the region of the distal end 148b. An arcuate groove 151 (shown in FIG. 3) is disposed on the lower side of the bottom plate 146, and the heat pipe 13 is received in the groove 151. The heat sink 12 is disposed at the air outlet 148 of the heat dissipation fan 14, and includes a first fin set 121 disposed near the distal end 148b of the air outlet 148 and a second fin set 122 disposed near the proximal end 148a of the air outlet 148. In this embodiment, the width of the air outlet 148 of the first fin set 122 is smaller than the width of the air outlet 148 of the first fin set 121, and the width of the air outlet 148 of the second fin set 122 can be 1/4 to 1/2 of the overall width of the air outlet 148
之間，以使該第二鰭片組122與第一鰭片組121所占出風 =⑽之寬度與該出風口⑽處之氣流狀況相符，以發揮 最大之散熱效能，同時達到控制成本之目的。在本實^例 中，該第二鰭片組122所占出風口 148整體寬度之1/3左 右。該第一鰭片組121包括複數自底座143之底板146 一 體（伸之第-政熱片I2la，該等第—散熱片121&與底板 施垂直，且在整體上排列成直線形，以與散熱風扇Μ之 出風口 148相配合。該等第一散熱片ma與底座14 體壓鑄製成。該等第-散熱片121a具有較 θ 鄰兩第一散埶片121a之Η跖★龄I 予又’且相 乐月文…月121a之間距也較大。本實施例中 一散熱片121a之厚度為以晒’相鄰 以 之間距為1.5mm。 I、月121a 該第二鰭片組122 包括複數片狀之第二散熱片ma 200819031 所述第二散熱片ma由片狀之金屬製成，其包括一大致呈 形之主體123及自該主體123之上、下兩端向主體⑵ ::彎折之折邊124,後一第讀熱片咖之折邊124與 ^第-散熱片122a之折邊124相互扣接抵靠形成該第二 :片、、且122’所述第二散熱片ma之上、下兩端之折邊以 刀別形成該第H组122之上端面（未標號）及下端面 ^5 ’同時在相鄰兩第二散熱片之間形成—間距以供 散熱風扇14所產生之冷卻氣流流過。可以理解地，所述第 二散熱片122a還可具有扣鉤及扣合孔，藉由扣鉤與扣合孔 之相互扣合而使該等第二散刻122a形成-整體。該第二 轉片組122收容於出風口 148之近端14如處，同時該第一 鰭片組121之底面及該第二鰭片組122之下端面125與設 ;冓槽151内之熱管丄3之冷凝段131接觸，以增加熱管 U與第一散熱片121a及第二散熱片12厶之埶交 該熱管U之蒸發端132與一發熱電子元件如筆記型^内 之中央處理器（圖未示）連接。由於第二散熱片122a由片 狀，金屬製成’第二散熱片ma之厚度可做得較小，相鄰 兩第二散熱片ma之間距也可做得較小。本實施例中，該 等第二散熱片122a之厚度為G.2mm，相鄰兩第 122a之間距gUmm。 ’、』 本實施例中，該第一鰭片組121與第二鰭片組相 比’第i片組121之第一散熱片121a與風扇之底座143 可利用模具一次成型，生產成本較低。第二鰭片組122之 第二散熱片122a由片狀之金屬製成，這樣第二散熱片i22a 200819031 之厚度及>1與片之間距與第—散熱片丨瓜相比均較小， ^第一鰭片組122之第二散熱片122a之設置密度較大， 單位體積上第H组122之總散熱面積較大。 本實施例中，藉由在氣流之流速及流量較大之出風口 148之近端施區域設置具較大散熱面積之第二縛片組 m ’而在氣流之流速及流量較小之遠端丨區域設置與 =熱風扇14之底座143 —體成型之第片組m，這樣 叹置可使散熱風扇M產生之冷卻氣流_紐湘，同時 使整個散歸置1G具有較低之生產成本。與散刻全部採 用與風扇—體壓鑄成型之傳統散熱裝置概，本實施例中 之散熱裝置10由於在氣流之流速及流量較大之出風口 148 之近端148a區域使用具較大散熱面積之第二鰭片組122， 從而散熱裝置H)之整體散難能得聰A提升。與全採用 扣合式散熱片之傳統散熱裝置相比，本實施例中之散熱裝 置1〇在氣流之流速及流量較小之出風口 148之遠端觸 區域仍保留設置與散熱風扇14之底座i43—體成型之第一 二片、、且m ’在散紐龄彡響不大之情況下降低生產成本。 本放熱衣置ίο與傳統之散熱裝置相比具較高之 比0 ^上舰’本伽符合糾專财件，銳法提出專 5月。惟’以上所述者僅為本發明之較佳實施例，舉凡 :二：案技藝之人士’在爰依本發明精神所作之等效修飾 或艾化’ ^應涵蓋於町之申請翻範圍内。 11 200819031 【圖式簡單說明】 圖1係本發明散熱裝置較佳實施例之立體分解圖。 圖2係圖1所示散熱裝置之立體組裝圖。 圖3係圖1所示散熱裝置之另一角度之部分組裝圖。 圖4係圖2所示散熱裝置去掉上蓋之俯視圖。 【主要元件符號說明】 散熱裝置 10 散熱器 12 第一鰭片組 121 第一散熱片 121a 第二鰭片組 122 第二散熱片 122a 主體 123 折邊 124 下端面 125 熱管 13 冷凝段 131 蒸發段 132 散熱風扇 14 殼體 141 轉子 142 扇葉 142a 底座 143 蓋板 144 入風口 145 底板 146 侧壁 147 出風口 148 近端 148a 遠端 148b 流道 149 溝槽 151 12Therefore, the width of the air generated by the second fin set 122 and the first fin set 121=(10) is consistent with the airflow condition at the air outlet (10) to maximize the heat dissipation performance while achieving control cost. purpose. In the embodiment, the second fin set 122 occupies about 1/3 of the overall width of the air outlet 148. The first fin set 121 includes a plurality of bottom plates 146 integrally formed from the base 143 (the first heat-dissipating fins I2la, the first heat sinks 121 & are perpendicular to the bottom plate, and are arranged in a straight line as a whole to dissipate heat The air vents 148 of the fan are matched. The first heat sinks ma and the base 14 are die-cast. The first heat sinks 121a have a θ adjacent to the first first entangled sheets 121a. 'And the phase of the moon...the distance between the months 121a is also larger. In the present embodiment, the thickness of one of the fins 121a is approximately 1.5 mm between the adjacent sides. I, month 121a The second fin set 122 includes The second heat sink ma 200819031 The second heat sink ma is made of a sheet metal, and includes a substantially shaped body 123 and upper and lower ends of the body 123 (2) :: The folded edge 124, the folded edge 124 of the first reading hot chip and the folded edge 124 of the first heat sink 122a are fastened to each other to form the second: heat dissipation of the second piece, and 122' The upper and lower ends of the sheet ma are formed by a knife to form an upper end surface (not labeled) and a lower end surface ^5 ' of the H group 122. A gap is formed between the two second heat sinks for the cooling airflow generated by the heat dissipation fan 14. The second heat sink 122a may further have a hook and a fastening hole, and the buckle and the buckle The second holes 122a are formed integrally with each other. The second rotor group 122 is received at the proximal end 14 of the air outlet 148, and the bottom surface of the first fin group 121 and the same The lower end surface 125 of the second fin set 122 is in contact with the condensation section 131 of the heat pipe 3 in the groove 151 to increase the heat pipe U and the first heat sink 121a and the second heat sink 12 The evaporation end 132 is connected to a heat-generating electronic component such as a central processing unit (not shown) in the notebook type. Since the second heat sink 122a is made of a sheet metal, the thickness of the second heat sink ma can be made. The distance between the adjacent two second heat sinks ma can also be made smaller. In this embodiment, the thickness of the second heat sinks 122a is G.2 mm, and the distance between adjacent two 122a is gUmm. In this embodiment, the first fin set 121 is compared with the second fin set, and the first heat sink 121a of the i-th set 121 is The base 143 of the fan can be molded in one time, and the production cost is low. The second fin 122a of the second fin set 122 is made of sheet metal, so that the thickness of the second fin i22a 200819031 and the sheet and the sheet The distance between the second fins 122a of the first fin group 122 is relatively large, and the total heat dissipating area of the H group 122 per unit volume is larger. In the example, the second patch group m′ having a larger heat dissipation area is disposed in the vicinity of the air outlet 148 having a larger flow velocity and a larger flow rate, and the distal flow region of the airflow having a smaller flow velocity and flow rate is provided. The first group m is formed integrally with the base 143 of the hot fan 14, so that the sigh can make the cooling airflow generated by the cooling fan M_New Zealand, and at the same time, the whole bulk is set to 1G with lower production cost. The heat dissipating device 10 of the present embodiment uses a larger heat dissipating area in the region of the proximal end 148a of the air outlet 148 having a larger flow velocity and a larger flow rate. The second fin set 122, so that the overall dissipating of the heat sink H) can be improved. Compared with the conventional heat dissipating device that uses the snap-on heat sink, the heat dissipating device 1 in this embodiment still retains the base i43 of the heat dissipating fan 14 in the distal contact area of the air outlet 148 with a small flow velocity and a small flow rate. - The first two pieces of body forming, and m 'reduced the production cost in the case of a small number of years of noise. Compared with the traditional heat sink, this heat-dissipating garment has a higher ratio than the 0 ^ ship's own. However, the above description is only a preferred embodiment of the present invention, and the second embodiment of the present invention is to be included in the scope of the application of the invention. . 11 200819031 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a preferred embodiment of a heat sink according to the present invention. 2 is an assembled, isometric view of the heat sink shown in FIG. 1. Figure 3 is a partial assembled view of another angle of the heat sink shown in Figure 1. Figure 4 is a plan view showing the heat sink of Figure 2 with the upper cover removed. [Main component symbol description] Heat sink 10 Heat sink 12 First fin set 121 First heat sink 121a Second fin set 122 Second heat sink 122a Main body 123 Folding 124 Lower end surface 125 Heat pipe 13 Condensation section 131 Evaporation section 132 Cooling fan 14 housing 141 rotor 142 blade 142a base 143 cover 144 air inlet 145 bottom plate 146 side wall 147 air outlet 148 proximal end 148a distal end 148b flow path 149 groove 151 12