TWI300692B - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
TWI300692B
TWI300692B TW95128627A TW95128627A TWI300692B TW I300692 B TWI300692 B TW I300692B TW 95128627 A TW95128627 A TW 95128627A TW 95128627 A TW95128627 A TW 95128627A TW I300692 B TWI300692 B TW I300692B
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Taiwan
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heat
heat sink
section
air outlet
loose
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TW95128627A
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Chinese (zh)
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TW200810666A (en
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Ching Bai Hwang
Jin-Gong Meng
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Foxconn Tech Co Ltd
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

1300692 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種散熱裝置,特別係一種適用於發熱電 子元件之散熱裝置。 【先前技術】 當如’隨著電腦產業之迅速發展,微處理晶片等發熱 電子元件產生之熱量愈來愈多,爲將該等多餘之熱量有效 散發,習知之方法係在發熱電子元件之表面貼設一散熱 器,在散熱風扇之辅助下將發熱電子元件産生之熱量强制 散去。請參照圖6,其所示爲一種習知之散熱裝置4〇,該 政熱裝置40包括一散熱風扇42及一散熱器44,該散熱器 44具有複數平行排列之散熱片442,並與一發熱電子元件 (圖未不)熱連接,以吸收該發熱電子元件産生之熱量,該散 熱風扇42包括一殼體422、一定子(圖未示)及一轉子423, 琢欢熱風扇42之殼體422形成有一出風口 421,該散埶突 44位於該出風口 421處。當該散熱風扇C逆時針運轉時°° 轉子423産生一冷却氣流46對該散熱器44進行强制散轨, 如圖6所示’㈣該散熱器44之散熱片442平行排歹, :間距相等’而出風口 421内各處冷却氣流*之购 位於氣流下游之散熱片442與冷却氣流46之流向戈 間存在-定夾角,從__散絲44之流 降低該散熱裝置40之散熱效率。 、、、 1300692 【發明内容】 有寥於此,有轉提供-種雜效雜高讀熱裝置。 一種散熱裝置’用於散發電子元件產生之熱量,包括 -散熱風扇及-散絲,該散熱風扇麟纽冷却氣流對 該散熱器進行强制散熱,其中,該散熱器爲—折叠式散熱 器,該散熱純括複數散熱片,該等散熱片之間的間距大 小對應該冷却氣流之强度大小成反比設置。 及一疏鬆段’概密段設⑽冷城流之上游,該疏鬆段 位於該冷却氣流之下游,該疏鬆段中散熱片之間的間距大 於該緻密段中散熱片之間的間距。 -種散熱裝置’包括—離心式散熱風扇及—散熱器, 該散熱風扇具有-出風口,該健^設置於該出風口處, 該散熱風扇產生之冷却氣流經由該出風口吹向該散熱器, 其中’該散熱II由金屬片_f折形成,其包括一緻密段 與習知技術相比,藉由對散熱片之間的間距相對氣流 # 自度進行調整設置,降低散熱器之流阻,提高散熱片之散 熱效率,從而使該散熱裝置具有散熱效率較高之優點。 【實施方式】 圖1所示爲本發明散熱裝置第一實施例之立體分解 圖,該散熱裝置100包括-散熱器10及一散熱風扇20。 中該放熱器與一發熱電子元件(圖未示)熱連接,該 政熱器10係-折叠式散熱器,由單一金屬片(如銘金屬片) 經連續彎折形成,其具有複數散熱片12,該等散熱片12 間隔疋距離相互平行排列,該散熱風扇20用於對該散熱 1300692 器10進行强制散熱。 該散熱風扇20爲-離心式散熱風扇,包括一殼體22、 -定子(圖未tf)及-轉子24,該定子及轉子24安裝在該 设體22内,該轉子24包括複數扇葉24a。 該殼體22包括一上蓋222、一底蓋224及一侧壁226。 該上蓋222上設有-進風孔222a,該底蓋224上設有複數 進風孔224a。該側壁226冑-“U,,型結構,並與該底蓋224 及上蓋222組成一具有長方形出風口 221之半封閉結構。 其中,該出風口 221處侧壁226之高度高於其他地方侧壁 226之高度,以便收容該散熱器1〇。 凊參照圖2,該定子及該轉子24偏心地安裝在該殼體 22内,該等扇葉24a之最外端與該侧壁226間隔一定距離 形成一流道223,爲提高轉子24產生之冷却氣流3〇之流 速,在沿逆時針方向即該冷却氣流3〇之流動方向上,該流 道223逐漸變寬。在該流道223最寬處,該轉子24之扇葉 24a與該側壁226形成一流道出口 223a,在與該流道出口 223a相對之另一側,該侧壁226於靠近出風口 22i之位置 向轉子24突伸設有一呈三角形之舌口 223b。 請參照圖1及圖2,該散熱器1〇對應於該轉子24設 置於該殼體22之出風口 221内,該散熱器1〇爲兩段式結 構其具有一緻欲段12a及一疏鬆段12b。該緻密段i2a 對應該流道出口 223a設置,該疏鬆段12b對應該舌口 223b 設置。該散熱器1〇遠離該散熱風扇2〇之一端與該殼體U 之出風口 221之最外端對齊,該緻密段12a之散熱片12比 1300692 _ 疏鬆段12b之散熱片12更長並伸入至該流道出口 223a内, 該疏鬆段12b中散熱片12之間的間距大於該緻密段12a中 散熱片12之間的間距。 請參照圖3,該散熱器1〇設置於該殼體22之出風口 221内,且該殼體22之上蓋222及底蓋224緊貼於該散熱 器10之上下知面,與該等散熱片12配合形成流道以供冷 却氣流30通過。 由以上叙述可知,由於該流道223沿逆時針方向逐漸 滅寬,使得轉子24轉動時,流道出口 223a處即上游之冷 却氣流30具有最大之流速,相應地,該散熱器1〇之緻密 丰又12a之政熱片12具有最大之長度及最小之間距,且上游 之冷却氣流30之流向與對應之緻密段12a中之散熱片12 基本平行,有效地提高該緻密段12a之散熱效率。另外, 從該緻密段12a至該疏鬆段12b,該等散熱片12之長度减 小且間距增大,使靠近該舌口 223b即位於下游低流速區域 之,却氣流3G更易於流過,彌補下游之冷却氣流30由於 與,熱片12存在夾角而引域速下降之缺陷,有效地降低 -速區域政熱器10之流阻,即藉由將散熱片12之間的 間距大小對應該冷却氣流30之强度大小成反比設置,使强 度車乂大之上游氣流對應之緻密段12a之間距較小,而强度 車乂小之下游氣流所對應之疏鬆段12b之間距較大,降低該 政…、器10整體之流阻,提高該散熱裝置100之散熱效率。 一2參照圖4,其所示爲本發明散熱裝置第二實施例之 立體分解圖,其與第-實施例之不同之處在於:該側壁227 1300692 •爲一弧形結構’其與該上蓋225及底蓋229組成一具有弧 .形出風口 221b之半封閉結構。該散熱器偷係一折叠式散 、熱器,其具有複數散熱片U ’該散熱器施對應該出風口 221b呈弧形排列。同樣的,該散熱器施包括一位於冷却 氣流30上游之緻密段ila及位於冷却氣流3〇 了游並與該 緻拔段11a相連接之-疏鬆段Ub。該緻密段11&amp;中的散熱 片11之間的間距比疏鬆段llb之間距小,而長度比疏鬆段 lib長,該緻密段lla的散熱片11/(申入該流道出口 2咖内。 請參照圖5,該散熱器1〇a靠近該轉子24之一端形成 -呈圓弧狀内邊13’該内邊13與該轉子24之扇葉池末 端保持大致相同的距離,該散熱器1〇a遠離該轉子24之一 端形成兩相互垂直之外邊15、17,該兩外邊15、17之間 藉由-缺口 19過渡。該散熱器他對應該流道出口 2说 處即氣流强度最大處之散熱片u _距較小,以提高該處 散熱片11之散熱效率。位於冷却氣流30上游之緻密段lla • 巾的散熱片11相互平行設置’以對應冷却氣流30之流向, 而位於冷却氣流30下游之疏鬆段Ub中的散熱片n則以 傾斜歧設置’以迎合該下游處冷却該3〇之流向,使得 該散熱器10a之每一散熱片11之方向對應冷却氣流30之 流向設置’讀盡可能地减小散糾11與冷却氣流30之 流向,間的夾角,從而减小該散熱器他、之流阻,提高該 散熱器10a之散熱效率。藉由該兩外邊…口及該缺口 19 之。又置’使得該散熱器1〇a對應該流道出口 22如及舌口 223b處之政熱片11較長,其餘部分較短,即該散熱器他 1300692 對應該冷却氣流30風速較高部分之散熱片11較長,而風 速較低部分之散熱片11較短,從而有效地降低該散熱器 l〇a之流阻,提高該散熱器l〇a之散熱效率。 另外,由於上述兩實施例中之散熱器10及散熱器l0a 係折叠式散熱器,而折叠式散熱器相對於堆叠扣合式散熱 器或其他種類之散熱器而言,可以更容易地調節散熱片之 長短、散熱片之間的間距以及散熱片之間所成的角度,從 而使該散熱器10及散熱器l〇a具有易於製造之優點。同 時,該折叠式散熱器1〇及l〇a可以在加工製造過程中靈活 控制並改變散熱片之間的間距,並可根據電腦内部之空間 構造及流場分布情况設計散熱片之形狀及長度,比如上述 第一實施例中缺口 19之設置可提供額外之空間供安裝等 相關用途使用。1300692 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device suitable for a heat generating electronic component. [Prior Art] As with the rapid development of the computer industry, heat generated by heat-generating electronic components such as micro-processed wafers is increasing, and the conventional method is applied to the surface of the heat-generating electronic component in order to effectively dissipate the excess heat. A heat sink is attached to force the heat generated by the heat-generating electronic components to be dissipated by the heat-dissipating fan. Referring to FIG. 6 , there is shown a conventional heat sink device 4 . The heat sink device 40 includes a heat dissipation fan 42 and a heat sink 44 . The heat sink 44 has a plurality of heat sinks 442 arranged in parallel and is heated. The electronic component (not shown) is thermally connected to absorb heat generated by the heat-generating electronic component. The heat-dissipating fan 42 includes a housing 422, a stator (not shown), and a rotor 423. The 422 is formed with an air outlet 421, and the divergent projection 44 is located at the air outlet 421. When the cooling fan C is operated counterclockwise, the rotor 423 generates a cooling airflow 46 to forcibly loosen the heat sink 44. As shown in FIG. 6, '(4) the heat sink 442 of the heat sink 44 is parallelly arranged, the spacing is equal. The cooling airflow ** located in the air outlet 421 is located at a downstream angle between the heat sink 442 and the cooling airflow 46, and the heat dissipation efficiency of the heat sink 40 is reduced from the flow of the scatterer 44. 、,, 1300692 [Summary of the Invention] In view of this, there is a turn-providing-hybrid high-heating device. The heat dissipating device is configured to dissipate heat generated by the electronic component, including: a cooling fan and a loose wire, wherein the cooling fan cools the airflow to forcibly dissipate the heat sink, wherein the heat sink is a folding heat sink, The heat dissipation is purely a plurality of heat sinks, and the spacing between the heat sinks is inversely proportional to the intensity of the cooling airflow. And a loose section </ RTI> is located upstream of the cold city stream, the loose section is located downstream of the cooling airflow, and the spacing between the heat sinks in the loose section is greater than the spacing between the heat sinks in the dense section. The heat dissipating device includes a centrifugal cooling fan and a heat sink, and the cooling fan has an air outlet, and the heat is disposed at the air outlet, and the cooling airflow generated by the cooling fan is blown to the radiator through the air outlet , wherein the heat dissipation II is formed by folding the metal sheet _f, and the uniform dense section is compared with the prior art, and the flow resistance of the heat sink is reduced by adjusting the spacing between the heat sinks relative to the air flow # self-degree adjustment. The heat dissipation efficiency of the heat sink is improved, so that the heat sink has the advantages of high heat dissipation efficiency. 1 is a perspective exploded view of a first embodiment of a heat sink according to the present invention. The heat sink 100 includes a heat sink 10 and a heat sink fan 20. The heat radiator is thermally connected to a heat-generating electronic component (not shown). The heat exchanger 10 is a folded heat sink formed by continuous bending of a single metal piece (such as a metal plate) having a plurality of heat sinks. 12, the heat sinks 12 are arranged at a distance from each other, and the heat dissipation fan 20 is used for forcibly dissipating the heat dissipation 1300692. The cooling fan 20 is a centrifugal fan, comprising a housing 22, a stator (not shown) and a rotor 24, the stator and rotor 24 being mounted in the housing 22, the rotor 24 including a plurality of blades 24a . The housing 22 includes an upper cover 222, a bottom cover 224 and a side wall 226. The upper cover 222 is provided with an air inlet hole 222a, and the bottom cover 224 is provided with a plurality of air inlet holes 224a. The side wall 226胄-“U,” is configured to form a semi-closed structure having a rectangular air outlet 221 with the bottom cover 224 and the upper cover 222. The height of the side wall 226 of the air outlet 221 is higher than other side. The height of the wall 226 is such as to accommodate the heat sink 1. Referring to Figure 2, the stator and the rotor 24 are eccentrically mounted in the housing 22, and the outermost ends of the blades 24a are spaced apart from the side walls 226. The flow path 223 is gradually widened in the flow direction of the cooling air flow 3 为 in the counterclockwise direction, that is, the flow direction of the cooling air flow 3 产生 generated by the rotor 24 . The flow path 223 is widened at the flow path 223 . Wherein, the fan blade 24a of the rotor 24 and the side wall 226 form a first-class air outlet 223a. On the other side opposite to the flow path outlet 223a, the side wall 226 protrudes toward the rotor 24 at a position close to the air outlet 22i. Referring to FIG. 1 and FIG. 2, the heat sink 1 is disposed in the air outlet 221 of the housing 22 corresponding to the rotor 24, and the heat sink 1 is a two-stage structure having a The desire segment 12a and the sparse segment 12b. The dense segment i2a corresponds The duct outlet 223a is disposed, and the loose section 12b is disposed corresponding to the tongue port 223b. One end of the heat sink 1 away from the heat dissipating fan 2 is aligned with the outermost end of the air outlet 221 of the casing U, and the heat dissipation of the dense section 12a The sheet 12 is longer than the heat sink 12 of the 1300692 _ loose section 12b and extends into the flow path outlet 223a. The spacing between the fins 12 in the loose section 12b is greater than the spacing between the fins 12 in the dense section 12a. Referring to FIG. 3, the heat sink 1 is disposed in the air outlet 221 of the casing 22, and the upper cover 222 and the bottom cover 224 of the casing 22 are in close contact with the heat sink 10, and the like The fins 12 cooperate to form a flow path for the passage of the cooling airflow 30. As can be seen from the above description, since the flow passage 223 is gradually widened in the counterclockwise direction, so that the rotor 24 rotates, the upstream cooling airflow 30 at the flow passage outlet 223a has The maximum flow rate, correspondingly, the heat sink 12 of the heat sink 1 has the largest length and the smallest distance, and the flow of the upstream cooling air flow 30 and the heat sink 12 in the corresponding dense section 12a Basically parallel, effectively increasing the density The heat dissipation efficiency of the segment 12a. In addition, from the dense segment 12a to the loose segment 12b, the length of the fins 12 is reduced and the pitch is increased, so that the tongue 223b is located in the downstream low flow velocity region, but the airflow 3G It is easier to flow through, and compensates for the defect that the downstream cooling airflow 30 is decelerated due to the angle between the hot film 12, and the flow resistance of the heat exchanger 10 is effectively reduced, that is, by the heat sink 12 The spacing size is inversely proportional to the intensity of the cooling airflow 30, so that the distance between the dense sections 12a corresponding to the upstream airflow of the strength rut is small, and the distance between the loose sections 12b corresponding to the downstream airflow of the small reinforced rut is relatively small. Large, reducing the overall flow resistance of the device, the device 10, and improving the heat dissipation efficiency of the heat sink device 100. 2 is a perspective exploded view of a second embodiment of the heat sink according to the present invention, which is different from the first embodiment in that the side wall 227 1300692 is an arc-shaped structure and the upper cover The 225 and the bottom cover 229 form a semi-closed structure having an arc-shaped air outlet 221b. The heat sink is a folding type heat sink having a plurality of heat sinks U' which are arranged in an arc shape corresponding to the air outlets 221b. Similarly, the radiator includes a dense section ila located upstream of the cooling air stream 30 and a loose section Ub located in the cooling air stream 3 and connected to the extracting section 11a. The distance between the fins 11 in the dense section 11&amp; is smaller than the distance between the loose sections 11b, and the length is longer than the loose section lib, and the fins 11/ of the dense section 11a are applied to the runner outlet 2 Referring to FIG. 5, the heat sink 1A is formed adjacent to one end of the rotor 24 and has an arc-shaped inner side 13'. The inner side 13 maintains substantially the same distance from the end of the fan pool of the rotor 24. Far from one end of the rotor 24, two mutually perpendicular outer edges 15, 17 are formed, and the two outer edges 15, 17 are transitioned by a notch 19. The radiator corresponds to the flow passage outlet 2, that is, the heat dissipation at the maximum intensity of the airflow. The distance u is smaller to improve the heat dissipation efficiency of the heat sink 11. The dense fins 11a located upstream of the cooling airflow 30 are disposed in parallel with each other to correspond to the flow direction of the cooling airflow 30, and are located in the cooling airflow 30. The fins n in the downstream loose section Ub are disposed in an inclined manner to meet the downstream direction of the cooling of the 3 ,, so that the direction of each fin 11 of the heat sink 10a corresponds to the flow direction of the cooling airflow 30. Reduce the amount of distortion 11 and cooling gas as much as possible The flow direction of 30, the angle between them, thereby reducing the flow resistance of the heat sink, and improving the heat dissipation efficiency of the heat sink 10a. By the two outer ports and the gap 19, the heat sink 1 is again set 〇a corresponds to the runner exit 22 and the tongue 223b at the tongue 223b is longer, the rest is shorter, that is, the radiator 1300692 corresponds to the cooling airflow 30, the higher part of the heat sink 11 is longer, and The heat sink 11 of the lower portion of the wind speed is shorter, thereby effectively reducing the flow resistance of the heat sink 10a, and improving the heat dissipation efficiency of the heat sink 10a. In addition, due to the heat sink 10 and the heat dissipation in the above two embodiments The device l0a is a folding heat sink, and the folding heat sink can more easily adjust the length of the heat sink, the spacing between the heat sinks, and the heat sink between the heat sinks and the stacked heat sinks or other types of heat sinks. The angle formed so that the heat sink 10 and the heat sink 10a have the advantage of being easy to manufacture. At the same time, the folded heat sinks 1 and 10a can flexibly control and change between the heat sinks during the manufacturing process. Spacing, and root The shape and length of the heat sink are designed according to the space structure and the flow field distribution inside the computer. For example, the above-mentioned setting of the notch 19 in the first embodiment can provide additional space for installation and other related purposes.

由以上敘述可知,藉由該散熱器1〇及散熱器1〇a中散 熱片12及散熱片n的長短、間距及夾肖之設置,有效地 /降低該散熱器10之流阻,提高該散熱器1()之散熱面積, 從而有效提w該散熱裝置觸之散熱效率,使得該散熱裝 置100具有散熱效率較高之優點。 ^上所述,本發明符合發财利要件,銳法提出專 申月it m所述者僅為本發明之較佳實施例,舉凡 =杨技藝之人士,在爰依本發明精神所作之等效修飾 缝化,皆應涵蓋独下之申請翻範圍内。 【圖式簡單說明】 圖1爲本發明散熱裝置第—實施例之立體分解圖。 11 1300692 圖2爲圖1所示散熱裝置去掉上蓋後之俯視圖。 圖3爲圖1所示散熱裝置之立體組合圖。 圖4爲本發明散熱裝置第二實施例之立體分解圖。 圖5爲圖4所示散熱裝置去掉上蓋後之俯視圖。 圖6爲一習知散熱裝置去掉上蓋後之俯視圖。 【主要元件符號說明】As can be seen from the above description, by the arrangement of the length, the pitch, and the clip of the heat sink 12 and the heat sink n in the heat sink 1 and the heat sink 1A, the flow resistance of the heat sink 10 is effectively reduced/reduced, and the flow resistance is improved. The heat dissipation area of the heat sink 1 () effectively improves the heat dissipation efficiency of the heat sink device, so that the heat sink device 100 has the advantage of high heat dissipation efficiency. As described above, the present invention is in accordance with the advantages of the invention, and the above-mentioned ones are only preferred embodiments of the present invention, and those who are in the spirit of the present invention are in the spirit of the present invention. Effective modification of the seam, should cover the scope of the application alone. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a first embodiment of a heat sink according to the present invention. 11 1300692 Figure 2 is a top view of the heat sink of Figure 1 with the upper cover removed. 3 is a perspective assembled view of the heat sink shown in FIG. 1. 4 is an exploded perspective view of a second embodiment of a heat sink according to the present invention. Figure 5 is a plan view of the heat sink of Figure 4 with the upper cover removed. Figure 6 is a top plan view of a conventional heat sink with the upper cover removed. [Main component symbol description]

&lt;本發明&gt; 散熱裝置 100 散熱器 10. 10a 散熱片 12、11 緻密段 12a、 11a 疏鬆段 12b、 lib 内邊 13 外邊 15、17 缺口 19 散熱風扇 20 機殼 22 出風口 221 上蓋 222Λ 225 進風孔 222a 流道 223 流道出口 223a 舌口 223b 底蓋 224、 229 進風孔 224a 側壁 226、 227 轉子 24 扇葉 24a 冷卻氣流 30 〈習知&gt; 散熱裝置 40 散熱風扇 42 出風口 421 殼體 422 轉子 423 散熱器 44 散熱片 442 冷卻氣流 46 12&lt;The present invention&gt; Heat sink 100 Heat sink 10. 10a Heat sink 12, 11 Compact section 12a, 11a Loose section 12b, lib Inner side 13 Outer side 15, 17 Notch 19 Cooling fan 20 Case 22 Air outlet 221 Upper cover 222 225 Air inlet hole 222a Flow path 223 Flow path outlet 223a Tongue port 223b Bottom cover 224, 229 Air inlet hole 224a Side wall 226, 227 Rotor 24 Fan blade 24a Cooling airflow 30 <General knowledge> Heat sink 40 Cooling fan 42 Air outlet 421 Shell Body 422 rotor 423 heat sink 44 heat sink 442 cooling airflow 46 12

Claims (1)

1300692 .十、申請專利範圍 1·種散熱裝置’用於散發電子元件産生之熱量,包括一 散熱風扇及一散熱器,該散熱風扇用於産生冷却氣流對 該散熱器進行强制散熱,其改良在於,該散熱器爲一折 叠式散熱器,該散熱器包括複數散熱片,該等散熱片之 間的間距大小對應該冷却氣流之强度大小成反比設置。 2·如申請專利範圍第1項所述之散熱裝置,其中該散熱風 ,扇爲離心風扇且包括一殼體及設於該殼體内之複數扇 葉,該殼體包括一上蓋、一侧壁及一底蓋,該上蓋及該 底蓋至少其中之一設有一進風口,該殼體之一侧設有一 出風口’該散熱器設置於該出風口内。 3·如申請專利範圍第2項所述之散熱裝置,其中該等扇葉 __之間形成—流道,在冷域流之流動方向上, 該流道逐漸加寬。 4·如申明專利範圍第2項所述之散熱裝置,其中該散熱器 _ 包括一緻密段及一疏鬆段,分別設置於冷却氣流之上、 下游,該疏鬆段巾散刻之間的間耻於纖密段中散 . 熱片之間的間距。 * 5·如_請專纖圍第4項所述之散熱裝置,其中該側壁呈 U型結構,該散熱器中之散熱片平行排列。 6·如申請專利範圍第5項所述之散熱裝置,其中該出風口 處之側壁w於該織之其他部分,且該題之上蓋及下 蓋緊貼於該散熱器上。 7·如申請專利範圍第4項所述之散熱裝置,其中該緻密段 13 1300692 8中散熱片之長度大於該疏鬆段中散熱片之長度。 朗第4項所述之散熱裝置,其中該側壁呈 $結構’該散熱器整體呈弧狀排列。 9.專利11圍第8項所述之散熱裝置,其中該疏鬆段 政熱片對應於該冷却氣流之方向傾斜設置。 10中柄範_項賴之散齡4,射該緻密段 甲之放熱片相互平行排列。 11勺t㈣專職圍第8項所述之散齡置,其中該散熱器 二7邊及_互垂直之外邊’該内邊呈圓弧狀,該 兩卜邊之間藉由一缺口過渡。 種散録置’包括—如式散熱風献—散熱器,該 二風扇具有—出風口,該散熱器設置於該出風口處, f散熱風4產生之冷却氣流經由該出風Π吹向該散熱 、中該散熱ϋ由金屬片連續彎折形成,其包括一緻 被段及-疏鬆段,該緻密段設於該冷却氣流之上游,玆 疏鬆段位於該冷却氣流之下游,該疏鬆段巾散熱二 的間距大於該緻密段中散熱片之間的間距。 3 I3.如申凊專利範圍第U項所述之散熱裝置,其中 風扇包,殼體及設於該殼體内之_扇葉,該‘=、 括-上蓋、-側壁及—底蓋,該上蓋及該底蓋至少其= 之一設有-進風口,該殼體之一側設有一出風口,ς 熱器設置於該出風口内。 散 认如申請專利範圍第13項所述之散熱裝置,其中 葉與該側壁之間形成一流道,在冷却氣流之流動方向 1300692 上,該流道逐漸加寬。 15二申請專利範_ 13項所述之散絲置,其中該 里結構,該散熱器中之散熱片平行排列。 &amp;如申請專利範圍第12項所述之散熱裝置, 段中散埶干該緻岔 17 二 長度大於該疏鬆段中散熱片之長度。 •如申請專利範圍第12項所述之散熱裝置,其; K形結構,該散熱器整體呈弧狀排列。 ^ 土 於t申:糊範圍第17項所述之散熱H其中該疏鬆 l/如對胁該冷城流之方向傾斜設置。 •曱,專利範圍第17項所述之散_置,立中該緻密 丰又中之散熱片相互平行排列。 20:如申請專利範圍第17項所述之散熱袭置,其中該散熱 裔包括1邊及兩相互垂直之外邊’該内輕圓孤狀, 該兩外邊之間藉由一缺口過渡。 151300692. X. Patent Application No. 1. A heat dissipating device for dissipating heat generated by an electronic component, comprising a heat dissipating fan and a heat sink for generating a cooling airflow for forcibly dissipating the heat sink, the improvement is The heat sink is a folded heat sink, and the heat sink includes a plurality of heat sinks, and the spacing between the heat sinks is inversely proportional to the intensity of the cooling airflow. The heat dissipating device of claim 1, wherein the heat dissipating wind fan is a centrifugal fan and includes a casing and a plurality of blades disposed in the casing, the casing including an upper cover and a side The wall and a bottom cover, at least one of the upper cover and the bottom cover is provided with an air inlet, and one side of the housing is provided with an air outlet. The heat sink is disposed in the air outlet. 3. The heat sink according to claim 2, wherein a flow path is formed between the blades __, and the flow path is gradually widened in a flow direction of the cold flow. 4. The heat dissipating device according to claim 2, wherein the radiator _ comprises a uniform dense section and a loose section, respectively disposed above and below the cooling airflow, and the shame between the loose sectioned towels Disperse the gap between the hot sheets in the dense section. * 5 · _ Please use the heat dissipation device described in item 4, wherein the side wall has a U-shaped structure, and the heat sinks in the heat sink are arranged in parallel. 6. The heat sink of claim 5, wherein the side wall of the air outlet is at the other portion of the weave, and the upper cover and the lower cover are in close contact with the heat sink. 7. The heat sink according to claim 4, wherein the length of the heat sink in the dense section 13 1300692 8 is greater than the length of the heat sink in the loose section. The heat dissipating device of claim 4, wherein the side wall has a structure. The heat sink is arranged in an arc shape as a whole. 9. The heat sink of claim 8, wherein the loose section is disposed obliquely corresponding to the direction of the cooling airflow. 10 middle handle van _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 11 scoops t (four) full-length enclosures according to item 8, wherein the radiators have two sides and _ mutually perpendicular sides. The inner side has an arc shape, and the two sides are transitioned by a gap. The scatter recording includes: a heat dissipation air-heating device, the two fans have an air outlet, the heat sink is disposed at the air outlet, and the cooling airflow generated by the heat dissipation wind 4 is blown to the air through the air outlet The heat dissipating heat is formed by continuous bending of the metal sheet, and comprises a uniform section and a loose section, the dense section is disposed upstream of the cooling airflow, and the loose section is located downstream of the cooling airflow, the loose scarf The spacing between the heat sinks 2 is greater than the spacing between the heat sinks in the dense sections. 3 I3. The heat sink of claim U, wherein the fan pack, the housing and the fan blade disposed in the housing, the '=, the bracket-upper cover, the side wall and the bottom cover, At least one of the upper cover and the bottom cover is provided with an air inlet, and one side of the housing is provided with an air outlet, and the heat exchanger is disposed in the air outlet. The heat dissipating device according to claim 13 is claimed, wherein a first-class track is formed between the blade and the side wall, and the flow path is gradually widened in the flow direction of the cooling airflow 1300692. The dispersing wire according to Item 13 of the invention, wherein the heat sink in the heat sink is arranged in parallel. &amp; As claimed in claim 12, the heat sink is in the section, and the length is greater than the length of the heat sink in the loose section. The heat dissipating device according to claim 12, wherein the heat sink is arranged in an arc shape as a whole in a K-shaped structure. ^ 土在t申: The heat dissipation H described in item 17 of the paste range, which is loose l/ as set to the direction of the cold city flow. • 曱, the scatterer described in item 17 of the patent scope, the heat sinks in the dense and medium-sized heat sinks are arranged in parallel with each other. 20: The heat-dissipating device according to claim 17, wherein the heat sink comprises one side and two mutually perpendicular sides, wherein the inner side is lightly orphaned, and the two outer sides are separated by a gap. 15
TW95128627A 2006-08-04 2006-08-04 Heat dissipation apparatus TWI300692B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458892B (en) * 2012-01-31 2014-11-01 Quanta Comp Inc Centrifugal fan
TWI513400B (en) * 2011-08-29 2015-12-11 Hon Hai Prec Ind Co Ltd Heat dissipation device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513400B (en) * 2011-08-29 2015-12-11 Hon Hai Prec Ind Co Ltd Heat dissipation device
TWI458892B (en) * 2012-01-31 2014-11-01 Quanta Comp Inc Centrifugal fan
US9011090B2 (en) 2012-01-31 2015-04-21 Quanta Computer Inc. Centrifugal fan

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