1290021 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤係涉及一種對電 子元件散熱之散熱裝置。 【先前技術】 隨著中央處理器（CPU)等電子元件功率的不斷 提高，散熱問題越來越受到人們的重視’在筆記本電 . 腦中更是如此。爲了在有限的空間裡高效地帶走系統 產生的熱量，目前業界主要採用由散熱片、熱導管及 散熱風扇組合的方式進行散熱。該方式的熱傳導路徑 爲·· CPU産生的熱量經熱導管傳至散熱片，再由散熱 風扇産生的氣流將傳至散熱片的熱量帶走。故在散熱 模組中散熱風扇起著將系統産生的熱量傳到系統外 的重要作用，所以散熱風扇與散熱片的搭配對系統的 | 性能有非常大的影響。 如圖4所示爲一散熱裝置2〇，該散熱裝置20包括 一鰭片組24與一散熱風扇22。該鰭片組24設置於該散 熱風扇22之出風口 211處且與一發熱電子元件（圖未 示）熱接觸以吸收發熱電子元件産生的熱量，該錯片 魬24由複數鰭片242堆叠而成。該散熱風扇22包括一 屬框222、一定子（圖未示）及一轉子223，該定子設 置於該扇框222内，該轉子223設置於該定子上且可繞 該疋子轉動。當散熱風扇22運行時，該轉子223繞定 子逆時針轉動從而産生氣流吹向鰭片組24，將鰭片組 7 1290021 24吸收的熱量帶走，從而達到對發熱電子元件散熱的 目的。 該散熱裝置20在工作時，如圖4所示，該扇框222 將氣流引向散熱風扇22的出風口221，由該出風口221 處離開散熱風扇流向鰭片組24，在鰭片組24的上側 246，氣流方向與該處的鰭片242大致平行，而在鰭片 組24的下側244,氣流方向卻與該處的鰭片242形成一 夾角，因此，流向鰭片組24的下側244的氣流會與鰭 _ 片242發生碰撞，使得氣流的動能減小，氣流壓力和 速度也都會降低，這樣就降低了鰭片組24與氣流的熱 交換效率，導致散熱裝置20的散熱效率無法得到有效 提升。 爲了解決這一問題，目前的解決方案係在壓鑄的 扇框222中長出導風肋，但由於受壓鑄工藝的限制， 導風肋的肋體較粗大，會對氣流產生阻力並發出噪 | 音，從而影響散熱裝置20的散熱性能。 【發明内容】 有鑒於此，實有必要提供一種具有提升散熱性能 的散熱裝置。 一種散熱裝置，包括一鰭片組與一散熱風扇，該 鰭片組與發熱電子元件熱接觸以吸收該發熱電子元 件所産生的熱量，該散熱風扇産生的氣流吹向該鰭片 組以將該鰭片組吸收的熱量散發，該散熱風扇包括一 葉輪、一殼座及一設於該殼座上的蓋板，該殼座具有 8 1290021 一容置室，該葉輪設置于該容置室内，該容置室具有 一出風口，該蓋板上延伸出複數導流板，利用該等導 流板，可以使該散熱風扇産生的氣流盡可能沿與鰭片 組平行方向流過鰭片組的表面，使空氣在流動過程中 不會産生太大的速度下降，從而提升散熱裝置的散熱 效果。 【實施方式】 下面參照附圖，結合實施例作進一步說明。 如圖1至圖3所示爲本發明散熱裝置10的一較佳 實施例之示意圖，該散熱裝置10包括一散熱風扇12與 一呈弧形的鰭片組14，該鰭片組14與一發熱電子元件 (圖未示）熱接觸以吸收該發熱電子元件産生的熱量， 該鰭片組14由複數鰭片142堆叠而成，並在每兩相鄰 鰭片142間形成氣流通道144。 該散熱風扇12爲一離心式風扇以提供較高的空 氣壓力，該散熱風扇12包括一扇框121、一定子（圖 未示）及一葉輪，該定子設置於該扇框121内，該葉 輪具有複數葉片122且可繞著定子轉動。如圖3所示， 該等葉片122的自由端與扇框121的内壁之間形成氣 流通道123。 該扇框121包括一殼座124和一設於該殼座124上 的蓋板125，該蓋板125由金屬材料如铭、鋼、銅等製 成，該殼座124由塑膠壓鑄而成。 該蓋板125設有一進氣口 126以供散熱風扇12吸 9 1290021 入空氣，該蓋板125朝向殼座124的一側設置有複數導 流板127，該等導流板127係由蓋板125衝壓所成，衝 壓出的導流板127與蓋板125垂直，同時在該蓋板125 上可形成相應的複數缺口 128，該等缺口 128可由聚脂 薄膜（Mylar)等材料製成的遮片129來密封，以防止 空氣從該等缺口 128溢出。 該殼座124底部設有一支撐部131用來安置定 子，在該殼座124—侧設有一弧形的出風口 132，該弧 形鰭片組14設置於該出風口 132處，其外形與出風口 132的形狀大致相同，導流板127位於葉片122與鰭片 組14之間，且繞著葉輪的軸線A分佈於出風口 132處， 如圖3所示，該導流板127的前端B靠近葉片122，當轉 子轉到一特定的位置時，該等葉片122中之某一葉片 122與導流板127中之某一導流板127距離最近，該葉 片122的自由端與該導流板127的縱向平行，導流板 127的後端C靠近該鰭片組14且每一導流板127分別與 相鄰的鰭片142大致平行。當風扇12運行時，葉片122 繞定子做逆時針方向轉動，驅使該風扇12的扇框121 内的氣流流向導流板127，該導流板127將氣流分成複 數股，並改變氣流方向，使每一股氣流方向分別與相 鄰的鰭片142大致平行，最後，氣流流向鰭片組14並 由鰭片142將其分成複數小股，每一小股氣流流經相 應的氣流通道144並將鰭片組14吸收的熱量帶走。 在本實施例中，導流板127的設置，使氣流沿與 1290021 - 各鰭片142大致平行的方向通過氣流通道144，從而減 少氣流到達氣流通道144時産生的碰撞，可使氣流在 流動過程中速度下降的不會太大，從而可提升散熱模 ，組的散熱性能。 在本實施例中，導流板127係由蓋板125向朝向殼 座124的一侧一體衝壓所成，與習知技術的由殼座124 一體壓鑄成型的導流板127相比，由於不需要在製造 殼座124的模具上增設導流板127的成型空間，使得散 , 熱風扇12的設計和製造都變得簡單，從而散熱風扇12 的製造成本也就有所降低，而且殼座124上一體成型 的導流板127，由於受壓禱成型工藝的限制，使得導 流板127的厚度較寬，該較寬的厚度增加了導流板127 的流阻，所以具有這種導流板127的散熱風扇12在運 轉時會産生較大的嗓音。而由衝壓方式形成的導流板 127，其厚度比壓鑄所形成的要小，因此可降低對氣 _ 流的阻力，使氣流較順暢的流經鰭片組14的氣流通道 144，從而可減小散熱風扇12運轉時産生的噪音，並 提升散熱性能。 在本實施例中，該散熱風扇12的出風口 132與該 鰭片組14均呈弧形，此外，散熱風扇12的出風口 132 也可爲矩形或圓形，與之相對應的鰭片組14也同爲矩 形或圓形。 在本實施例中’導流板127與該蓋板125垂直。此 外’導流板127可以根據縛片組14的不同’設置成與 11 1290021 該蓋板125成一傾斜角度。 在本實施例中，導流板127係由蓋板125向朝向殼 座124的一側一體衝壓形成。可以理解地，導流板127 •與蓋板125也可以分開製造，再藉由焊接等方式組裝 .在一起。 【圖式簡單說明】 圖1係本發明散熱裝置其中一較佳實施例之立體 ’組裝圖。 圖2係圖1所示散熱裝置之立體分解圖。 圖3係圖1所示散熱裝置移去其殼座之仰視圖。 圖4係一習知的散熱裝置之俯視圖。 【主要元件符號說明】 本發明元件符號說明:1290021 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention from people's minds. In order to efficiently remove the heat generated by the system in a limited space, the industry currently uses a combination of heat sinks, heat pipes and cooling fans to dissipate heat. The heat conduction path of this method is that the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air flow generated by the heat dissipation fan carries away the heat transferred to the heat sink. Therefore, in the heat dissipation module, the cooling fan plays an important role in transferring the heat generated by the system to the outside of the system, so the combination of the cooling fan and the heat sink has a great influence on the performance of the system. As shown in FIG. 4, a heat sink 2 includes a fin set 24 and a heat dissipation fan 22. The fin group 24 is disposed at the air outlet 211 of the heat dissipation fan 22 and is in thermal contact with a heat-generating electronic component (not shown) to absorb heat generated by the heat-generating electronic component. The chip stack 24 is stacked by the plurality of fins 242. to make. The cooling fan 22 includes a frame 222, a stator (not shown) and a rotor 223. The stator is disposed in the frame 222. The rotor 223 is disposed on the stator and rotatable around the dice. When the cooling fan 22 is in operation, the rotor 223 rotates counterclockwise around the stator to generate airflow to the fin group 24, and the heat absorbed by the fin group 7 1290021 24 is taken away, thereby achieving heat dissipation for the heat-generating electronic components. When the heat sink 20 is in operation, as shown in FIG. 4, the fan frame 222 directs the airflow to the air outlet 221 of the heat dissipation fan 22, and the air outlet 221 exits the heat dissipation fan and flows to the fin group 24, in the fin group 24. On the upper side 246, the direction of the airflow is substantially parallel to the fins 242 there, and on the underside 244 of the fin set 24, the direction of the airflow forms an angle with the fins 242 there, and thus flows down the fin set 24. The airflow of the side 244 collides with the fin 242, so that the kinetic energy of the airflow is reduced, and the airflow pressure and speed are also reduced, thus reducing the heat exchange efficiency of the fin group 24 and the airflow, resulting in heat dissipation efficiency of the heat sink 20. Unable to get an effective boost. In order to solve this problem, the current solution is to wind the air guiding ribs in the die-cast fan frame 222, but due to the limitation of the die casting process, the ribs of the air guiding ribs are coarse, which will generate resistance to the airflow and emit noise | Sound, thereby affecting the heat dissipation performance of the heat sink 20. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having improved heat dissipation performance. A heat dissipating device includes a fin set and a heat dissipating fan, the fin set is in thermal contact with the heat generating electronic component to absorb heat generated by the heat generating electronic component, and the airflow generated by the heat radiating fan is blown toward the fin set to The heat dissipated by the fin assembly is dissipated. The heat dissipating fan includes an impeller, a housing and a cover plate disposed on the housing. The housing has an 8 1290021 housing chamber, and the impeller is disposed in the receiving chamber. The accommodating chamber has an air outlet, and the plurality of baffles are extended on the cover plate, and the airflow generated by the heat dissipation fan can flow through the fin group in a direction parallel to the fin group as far as possible. The surface does not cause too much speed drop during the flow of the air, thereby improving the heat dissipation effect of the heat sink. [Embodiment] Hereinafter, the embodiments will be further described with reference to the accompanying drawings. FIG. 1 to FIG. 3 are schematic diagrams showing a preferred embodiment of a heat dissipation device 10 according to the present invention. The heat dissipation device 10 includes a heat dissipation fan 12 and an arc-shaped fin assembly 14 , and the fin assembly 14 and the A heat generating electronic component (not shown) is in thermal contact to absorb heat generated by the heat generating electronic component. The fin set 14 is formed by stacking a plurality of fins 142 and forming an air flow passage 144 between each two adjacent fins 142. The cooling fan 12 is a centrifugal fan to provide a high air pressure. The cooling fan 12 includes a frame 121, a stator (not shown) and an impeller. The stator is disposed in the fan frame 121. The impeller is disposed in the fan frame 121. There are a plurality of blades 122 that are rotatable about the stator. As shown in Fig. 3, an air flow passage 123 is formed between the free end of the vane 122 and the inner wall of the fan frame 121. The frame 121 includes a housing 124 and a cover plate 125 disposed on the housing 124. The cover 125 is made of a metal material such as Ming, steel, copper, etc., and the housing 124 is die-cast from plastic. The cover plate 125 is provided with an air inlet 126 for the heat dissipation fan 12 to suck into the air. The cover plate 125 is provided with a plurality of baffles 127 facing the side of the housing 124. The guide plates 127 are covered by the cover plate 127. 125 stamping, the punched baffle 127 is perpendicular to the cover plate 125, and a corresponding plurality of notches 128 can be formed on the cover plate 125. The notches 128 can be covered by a material such as Mylar. Sheet 129 is sealed to prevent air from escaping from the gaps 128. A support portion 131 is disposed at the bottom of the housing 124 for arranging the stator. An arc-shaped air outlet 132 is disposed on the side of the housing 124. The curved fin assembly 14 is disposed at the air outlet 132. The shape of the tuyere 132 is substantially the same, and the baffle 127 is located between the vane 122 and the fin set 14 and is distributed around the axis A of the impeller at the air outlet 132. As shown in FIG. 3, the front end B of the deflector 127 Close to the blade 122, when the rotor is turned to a specific position, one of the blades 122 is closest to one of the baffles 127, and the free end of the blade 122 and the diversion The longitudinal direction of the plates 127 is parallel, and the rear end C of the baffle 127 is adjacent to the fin set 14 and each baffle 127 is substantially parallel to the adjacent fins 142, respectively. When the fan 12 is in operation, the blade 122 rotates counterclockwise around the stator to drive the airflow in the fan frame 121 of the fan 12 to the flow plate 127. The deflector 127 divides the airflow into a plurality of strands and changes the direction of the airflow. Each airflow direction is substantially parallel to the adjacent fins 142. Finally, the airflow flows to the fin set 14 and is divided into a plurality of small strands by the fins 142, each small airflow flowing through the corresponding airflow passage 144 and The heat absorbed by the fin set 14 is carried away. In the present embodiment, the baffle 127 is disposed such that the airflow passes through the airflow passage 144 in a direction substantially parallel to the 1290021 - fins 142, thereby reducing collisions when the airflow reaches the airflow passage 144, and the airflow is in the flow process. The medium speed does not drop too much, which can improve the heat dissipation performance of the heat sink and the group. In the present embodiment, the deflector 127 is integrally stamped by the cover plate 125 toward the side facing the housing 124, compared to the baffle plate 127 which is integrally molded by the housing 124 from the prior art. It is necessary to add a molding space of the deflector 127 to the mold for manufacturing the housing 124, so that the design and manufacture of the heat dissipation fan 12 are simplified, and the manufacturing cost of the heat dissipation fan 12 is also reduced, and the housing 124 is lowered. The upper integrally formed baffle plate 127 has a wider thickness of the baffle plate 127 due to the limitation of the pressure forming process, and the wider thickness increases the flow resistance of the baffle plate 127, so that the baffle plate has such a baffle The cooling fan 12 of 127 generates a large arpeggio during operation. The deflector 127 formed by the stamping method has a smaller thickness than that formed by the die casting, so that the resistance to the air flow can be reduced, and the airflow can smoothly flow through the air flow passage 144 of the fin group 14, thereby being The noise generated by the small cooling fan 12 during operation is improved and the heat dissipation performance is improved. In this embodiment, the air outlet 132 of the heat dissipation fan 12 and the fin set 14 are both curved. In addition, the air outlet 132 of the heat dissipation fan 12 may also be rectangular or circular, and the corresponding fin group 14 is also a rectangle or a circle. In the present embodiment, the deflector 127 is perpendicular to the cover plate 125. Further, the deflector 127 may be disposed at an oblique angle to the cover plate 125 according to the difference of the set of tabs 14. In the present embodiment, the deflector 127 is integrally formed by the cover plate 125 toward the side facing the housing 124. It can be understood that the baffle 127 and the cover plate 125 can also be manufactured separately and assembled by welding or the like. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a preferred embodiment of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. Figure 3 is a bottom plan view of the heat sink of Figure 1 with its housing removed. Figure 4 is a top plan view of a conventional heat sink. [Description of main component symbols] Symbol description of the components of the present invention:
散熱裝置 10 散熱風扇 12 扇框 121 葉片 122 氣流通道 123 殼座 124 蓋板 125 進氣口 126 導流板 127 缺口 128 遮片 129 支撐部 131 出風口 132 轴線 A 前端 B 後端 C 先前技術元件符號說明: 12 1290021 散熱裝置 20 出風口 211 散熱風扇 22 扇框 222 轉子 223 縛片組 24 籍片 242 下侧 244 上侧 246Heat sink 10 Cooling fan 12 Fan frame 121 Blade 122 Air flow channel 123 Housing 124 Cover plate 125 Air inlet 126 Guide plate 127 Notch 128 Mask 129 Support 131 Air outlet 132 Axis A Front end B Rear end C Pre-technical components DESCRIPTION OF SYMBOLS 12 1290021 Heat sink 20 Air outlet 211 Cooling fan 22 Fan frame 222 Rotor 223 Binder group 24 Pieces 242 Lower side 244 Upper side 246
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