1326199 九、發明說明： 【發明所屬之技術領域】 特別係一種具有導流結構 本發明涉及一種散熱裝置 之散熱裝置。 【先前技術】 隨著電子產業之迅速發展，如電腦中電子元件之運遺 速度大幅度提高’其產生之熱量也隨之劇增，如何將電: 元件之熱量散發出去’以保證其正常運行，—直係業者必 需解決之問題。眾所周知，安裝在主機板上之中央處理器 係電腦系統之核心，當電腦運行時，t央處理器產生熱量' 過多之熱量會導致中央處理器無法正常運行。為有效散發 I央2ft運订過程中產生之熱量，通常在電路板上加 裝-與中央處理器接觸之散㈣置以便將其產 發出去。 …里狀 為提高散熱效細毅越來越冑讀熱需求，目前很 多產品中採用了熱管，並在該散熱裝置之—側加裝—風扇 以加快空氣流動。該散熱裝置通常包括—基座、複數平行 f座並間隔排列之散熱韓片、連接基座及散熱鰭片之u形熱 b及女裝於散熱鰭片一側之風扇。該1；形熱管包括烊接在基 座上之水準部和二分別穿過散熱鰭片兩端之豎直部。該： 仃熱官安裝，其產生之強制氣流可將散熱鰭片中之熱 ”走。該等U形熱管將基座上之熱量傳導到散熱鳍片之靠 6 1326199 向兩端部分，使散熱鰭片與熱管接觸處及其附近區域溫度 .較高，如果對該集熱區域加快熱量之散發，將使該散熱裝 v置之散熱效率能得到相應之提高。 【發明内容】 有鑒於此，有必要提供一種有效利用風扇氣流之散熱 裝置。 一種散熱裝置，包括一基座、至少一熱管以及複數散 籲熱鰭片；該至少一熱管具有與該基座相連之吸熱部和穿設 於該散熱鰭片中之放熱部；該散熱鰭片間隔排列，且每相 鄰之兩散熱鰭片間形成供氣流通過之流道，該流道中設置 有導流結構，以將從流道入口流入之氣流導向該熱管之放 熱部與散熱鰭片之結合處。 本發明之散熱裝置之散熱鰭片上設置有導流結構，以 改變進入流道之氣流方向，以根據散熱縛片各處之溫度而 低不同，重新分佈氣流，以使散熱鰭片與熱管結合之高溫 β區域具有大量之氣流，針對性加快高熱區之散熱。 【實施方式】 圖1和圖2所示為本發明第一實施之散熱裝置，該散熱 裝置包括一散熱器10和一風扇20。該風扇20通過一對固定 於散熱器10兩側之風扇固定架30安裝於散熱器10前侧。 該散熱器10包括一基座12, 一第二散熱鰭片組16, 一 導風架17, 一第一散熱鰭片組18及用以將基座12和第一散 熱鰭片組18導熱連接之三熱管14。 7 1326199 該基座12具有一矩形本體120，該本體120頂面上開設 .三相互平行之凹槽122，且三凹槽122中有兩相鄰之凹槽122 較另一凹槽122之兩端向内凹陷一些。該基座12之四角各連 接一凸耳124。該凸耳124靠近末端穿設緊固件50，用以將 散熱器10固定到中央處理器（圖未示）上。 每一熱管14均呈U形設置，並包括一吸熱部140及從吸 熱部140兩端向上延伸之二平行放熱部142，該吸熱部140收 容於基座12之凹槽124内以吸收來自基座12之熱量。如圖2 I所示，三熱管14中最左邊之熱管14下端部分朝一側小角度 彎折，中間之熱管14下端部分朝一側更小角度彎折，最右 •邊之熱管14則在同一平面上並無彎折。這兩下端部有彎折 •之熱管14之吸熱部140容置在兩端有凹陷之凹槽122内。 該第二散熱鰭片組16可由鋁等材料一體彎折成型，該 第二散熱鰭片組16包括複數散熱片160、將散熱片160連接 之上摺邊162和下摺邊164。所有上、下摺邊162、164分別 #形成上下平面，其中下摺邊164形成之下平面焊接在熱管16 吸熱部160之頂面上，這樣熱管16之部分熱量就可以傳導到 第二散熱鰭片組16上，由第二散熱鰭片組16散發到周圍之 環境中。 該導風架17夾置在第二散熱鰭片組16及第一散熱鰭片 組18之間，該導風架17可以用作導流罩，將由風扇20產生 之部分穿過第二散熱鰭片組16後之氣流導向位於中央處理 器周圍之電子元件（圖未示）上。該導風架17具有與第二 散熱鰭片組16之散熱片160垂直之一本體170，該本體170與 8 1326199 . 基座12相隔設置，本體170尾部邊緣彎折延伸出一向下彎折 .並朝向基座12呈弧形彎曲之導風部172;本體170兩側邊緣 各彎折延伸出一與本體170垂直之擋風板174。該本體170之 兩端開設有兩排相互平行之透孔176，每排有三個透孔 176，以供三熱管14之放熱部142從中穿過。 該第一散熱鰭片組18由複數相互扣合之散熱鰭片180 堆疊排列而成，每一散熱鰭片188都與基座12保持平行，且 每兩相鄰散熱鰭片180之間形成沿前後方向延伸之流道 • 188。該散熱鰭片180之中央位置設置有一導流結構，在本 實施例中該導流結構為一楔形通孔182及沿其邊緣垂直彎 -折延伸之導流側壁1820，該楔形通孔182之尖端正對風扇 • 20，即該尖端兩側之導流側壁1820相對風扇20之氣流方向 傾斜；該兩側導流側壁1820靠近流道氣流入口之兩端部間 之距離小於該導流側壁1820遠離流道入口之兩端部間之距 離，該導流側壁1820之高度等於其所在流道180對應之兩相 籲鄰散熱鰭片180之距離，且該導流側壁1820對風扇20產生之 氣流有導流作用。散熱鰭片180兩端上各設有三並列之穿孔 184，該穿孔184用以收容熱管14之放熱部142，該穿孔184 邊緣延伸設有環壁1840，以增大第一散熱鰭片180與放熱部 142接觸表面積，該等熱管14放熱部140容置在所有散熱鰭 片180之穿孔184和環壁1840組成之通道中，將基座12之熱 量傳導到散熱鰭片180兩端。該散熱鰭片組18兩相對側面上 各形成有一卡槽186，風扇固定架30卡制在卡槽186中，風 扇20通過螺釘（未標號）與風扇固定架30連接從而實現與 9 1326199 . 第一散熱鰭片組18結合。 : 在該散熱器10工作時，安裝於第一散熱鰭片組18前側 之風扇20運轉產生之氣流從中部進入流道188後將與位於 流道中部之導流側壁1820相遇，本來垂直風扇20扇葉面產 生之平行氣流撞擊在楔形通孔182之兩導流側壁1820上 後，氣流方向改變，被導向散熱鰭片180兩側與熱管14放熱 部142之結合處。這樣風扇20產生之氣流就可以更多地流經 第一散熱鰭片18與熱管14結合之溫度較高區域，從而使風 扇20產生之強制氣流得到有效之利用，極大地提高散熱器 10之整體散熱效率。 • 如圖4所示，在第二實施例中散熱鰭片190中部設置之 一導流結構為一向下衝壓形成之楔形凸部192，該凸部192包 括一垂直散熱鰭片190之導流側壁1920及與散熱鰭片190平 行之楔形頂壁1922;如圖5所示，在第三實施例中散熱鰭片 150中部之導流結構為二相互成八字之直線形條孔152，該 #二條孔152相鄰之内側分別向下彎折延伸一摺邊1520。上述 第二實施例之楔形凸部192尖端兩側之導流側壁1920或第 三實施例中之摺邊1520均和第一實施例一樣相對該風扇20 之氣流方向傾斜；每一該側壁1920或摺邊1520靠近流道氣 流入口之兩端部間之距離小於該側壁1920或摺邊1520遠離 流道入口之兩端部間之距離，它們之功效原理也均與第一 實施例之導流結構相同。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 1326199 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 .變化，皆應涵蓋於以下之申請專利範圍内。 ^【圖式簡單說明】 圖1係本發明第一實施例中散熱裝置之組裝圖。 圖2係圖1中之立體分解圖。 圖3係圖2中散熱片之放大圖。 圖4係本發明第二實施例中之散熱片之立體圖。 • 圖5係本發明第三實施例中之散熱片之立體圖。 【主要元件符號說明】 散熱器 10 基座 12 本體 120 凹槽 122 凸耳 124 熱管 14 吸熱部 140 放熱部 142 直線形條孔 152 摺邊 1520 第二散熱鰭片組 16 散熱片 160 上摺邊 162 下摺邊 164 導風架 17 本體 170 導風部 172 擋風板 174 透孔 176 第一散熱鰭片組 18 散熱鰭片 150 ' 180 ' 190 楔形通孔 182 導流側壁 1820 、 1920 穿孔 184 11 1861326199 環壁 1840 卡槽 流道 188 楔形凸部 楔形頂壁 1922 風扇 風扇固定架 30 緊固件 192 20 501326199 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipation device for a heat dissipation device. [Prior Art] With the rapid development of the electronics industry, such as the rapid increase in the speed of the electronic components in the computer, the heat generated by it has also increased dramatically. How to heat the components: the heat of the components to ensure their normal operation. -- The problem that the direct industry must solve. As we all know, the central processor installed on the motherboard is the core of the computer system. When the computer is running, the t-processor generates heat. Too much heat will cause the CPU to fail. In order to effectively dissipate the heat generated during the ICC 2ft shipping process, it is usually installed on the board - in contact with the central processor (4) to produce it. In order to improve the heat dissipation effect, the heat demand is increasingly read. At present, many products use heat pipes, and a fan is installed on the side of the heat sink to speed up air flow. The heat dissipating device generally comprises a susceptor, a plurality of parallel fins, and a heat dissipating Korean film arranged at intervals, a u-shaped heat connecting the pedestal and the heat dissipating fins, and a fan on the side of the heat dissipating fin. The 1 shaped heat pipe includes a level portion spliced to the base and two vertical portions respectively passing through the ends of the heat dissipation fin. The heat officer installed, the forced airflow generated by the forced air flow can “take away the heat in the heat sink fins. The U-shaped heat pipes conduct the heat on the base to the heat sink fins 6 1326199 to the two ends, so that the heat dissipation The temperature at which the fin is in contact with the heat pipe and its vicinity is high. If the heat is dissipated in the heat collecting region, the heat dissipation efficiency of the heat sink can be increased accordingly. It is necessary to provide a heat dissipating device that effectively utilizes a fan airflow. A heat dissipating device includes a base, at least one heat pipe, and a plurality of heat radiating fins; the at least one heat pipe has a heat absorbing portion connected to the base and is disposed there a heat dissipation portion in the heat dissipation fin; the heat dissipation fins are arranged at intervals, and a flow path for airflow is formed between each adjacent two heat dissipation fins, and a flow guiding structure is disposed in the flow path to flow in from the flow path inlet The airflow is directed to the junction of the heat radiating portion of the heat pipe and the heat dissipating fin. The heat dissipating fin of the heat dissipating device of the present invention is provided with a diversion structure to change the direction of the airflow entering the flow channel to be bound according to the heat dissipation The temperature varies from place to place, and the airflow is redistributed so that the high-temperature β region where the heat-dissipating fins are combined with the heat pipe has a large amount of airflow, which accelerates the heat dissipation in the high-heat zone. [Embodiment] FIG. 1 and FIG. The heat dissipating device of the first embodiment of the present invention comprises a heat sink 10 and a fan 20. The fan 20 is mounted on the front side of the heat sink 10 by a pair of fan holders 30 fixed to both sides of the heat sink 10. 10 includes a pedestal 12, a second heat sink fin set 16, a wind guide 17, a first heat sink fin set 18, and three heat pipes for thermally connecting the susceptor 12 and the first heat sink fin set 18 14. 1 1326199 The base 12 has a rectangular body 120. The top surface of the body 120 defines three mutually parallel grooves 122, and the two grooves 122 have two adjacent grooves 122 than the other grooves 122. The two ends of the base 12 are recessed inwardly. Each of the four corners of the base 12 is connected with a lug 124. The lug 124 is disposed near the end of the fastener 50 for fixing the heat sink 10 to a central processing unit (not shown). Each heat pipe 14 is U-shaped and includes a heat absorbing portion 140 and sucks Two parallel heat radiating portions 142 extending upwardly from opposite ends of the portion 140 are received in the recesses 124 of the base 12 to absorb heat from the base 12. As shown in FIG. 2I, the leftmost of the three heat pipes 14 The lower end portion of the heat pipe 14 is bent at a small angle toward one side, the lower end portion of the heat pipe 14 in the middle is bent at a smaller angle toward one side, and the heat pipe 14 at the rightmost side is not bent on the same plane. The lower ends are bent. The heat absorbing portion 140 of the heat pipe 14 is received in the recessed groove 122 at both ends. The second heat sink fin group 16 may be integrally bent and formed of aluminum or the like, and the second heat sink fin group 16 includes a plurality of heat sinks 160. The heat sink 160 is connected to the upper flange 162 and the lower flange 164. All the upper and lower flanges 162, 164 respectively form an upper and lower plane, wherein the lower flange 164 forms a lower plane welded to the top of the heat pipe 160 of the heat pipe 16. On the surface, part of the heat of the heat pipe 16 can be conducted to the second heat sink fin group 16, and the second heat sink fin group 16 is radiated to the surrounding environment. The air guiding frame 17 is interposed between the second heat dissipating fin group 16 and the first heat dissipating fin group 18, and the air guiding frame 17 can be used as a shroud to pass the portion generated by the fan 20 through the second heat dissipating fin. The airflow behind the set 16 is directed to electronic components (not shown) located around the central processor. The air guiding frame 17 has a main body 170 perpendicular to the heat sink 160 of the second heat dissipating fin group 16. The main body 170 is spaced apart from the base portion 12, and the tail edge of the main body 170 is bent to extend downward. And the air guiding portion 172 is curved toward the base 12; the two sides of the body 170 are bent to extend a wind deflector 174 perpendicular to the body 170. The two ends of the body 170 are provided with two rows of mutually parallel through holes 176, and each row has three through holes 176 for the heat radiating portion 142 of the three heat pipes 14 to pass therethrough. The first heat dissipation fin group 18 is formed by stacking a plurality of heat-dissipating fins 180 that are mutually fastened. Each of the heat dissipation fins 188 is parallel to the base 12 and forms an edge along each of the two adjacent heat dissipation fins 180. Runners extending in the front and rear direction • 188. A guiding structure is disposed at a central position of the heat dissipating fin 180. In the embodiment, the guiding structure is a wedge-shaped through hole 182 and a guiding and extending sidewall 1820 extending perpendicularly along the edge thereof. The wedge-shaped through hole 182 The tip is opposite to the fan 20, that is, the flow guiding sidewalls 1820 on both sides of the tip are inclined with respect to the airflow direction of the fan 20; the distance between the two sides of the flow guiding sidewall 1820 near the inlet of the flow channel is smaller than the guiding sidewall 1820 The distance between the two ends of the flow channel entrance is 18, the height of the flow guiding sidewall 1820 is equal to the distance between the two adjacent heat dissipation fins 180 corresponding to the flow channel 180, and the airflow generated by the guiding sidewall 1820 to the fan 20 Has a guiding effect. The heat dissipation fins 184 are disposed on the two ends of the heat dissipation fins 180. The through holes 184 are used to receive the heat radiating portion 142 of the heat pipe 14. The edge of the through hole 184 is extended with a ring wall 1840 to increase the first heat sink fin 180 and radiate heat. The heat exchange portion 140 is disposed in the passage formed by the through holes 184 of the heat dissipation fins 180 and the ring wall 1840 to conduct heat of the base 12 to both ends of the heat dissipation fins 180. A card slot 186 is formed on each of the opposite sides of the heat dissipation fin group 18, and the fan holder 30 is locked in the card slot 186, and the fan 20 is connected to the fan holder 30 by screws (not labeled) to achieve the same with 9 1326199. A heat sink fin set 18 is bonded. When the heat sink 10 is in operation, the airflow generated by the fan 20 installed on the front side of the first heat radiation fin group 18 will enter the flow channel 188 from the middle and will meet the flow guiding sidewall 1820 located in the middle of the flow channel. The vertical fan 20 is originally used. After the parallel airflow generated by the fan blade surface impinges on the two flow guiding sidewalls 1820 of the wedge-shaped through hole 182, the airflow direction is changed, and is guided to the junction of the heat radiating fin 180 on both sides of the heat radiating fin 180 and the heat pipe portion 14 of the heat pipe 14. Therefore, the airflow generated by the fan 20 can flow more through the higher temperature region where the first heat dissipation fins 18 and the heat pipe 14 are combined, so that the forced airflow generated by the fan 20 can be effectively utilized, thereby greatly improving the overall heat sink 10. Cooling efficiency. As shown in FIG. 4, in the second embodiment, a flow guiding structure disposed in the middle of the heat dissipating fin 190 is a downwardly stamped wedge-shaped convex portion 192, and the convex portion 192 includes a guiding sidewall of a vertical heat dissipating fin 190. 1920 and a wedge-shaped top wall 1922 parallel to the heat dissipation fins 190; as shown in FIG. 5, in the third embodiment, the flow guiding structure in the middle of the heat dissipation fins 150 is two straight-shaped strip holes 152 which are mutually octagonal, and the two The inner side adjacent to the hole 152 is bent downward to extend a flange 1520, respectively. The flow guiding side wall 1920 on both sides of the tip end of the wedge-shaped convex portion 192 of the second embodiment or the flange 1520 in the third embodiment are inclined with respect to the air flow direction of the fan 20 as in the first embodiment; each of the side walls 1920 or The distance between the two ends of the flange 1520 near the inlet of the flow channel is smaller than the distance between the ends of the sidewall 1920 or the flange 1520 away from the inlet of the runner, and the principle of their operation is also the same as that of the first embodiment. the same. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a heat dissipating device in a first embodiment of the present invention. Figure 2 is an exploded perspective view of Figure 1. Figure 3 is an enlarged view of the heat sink of Figure 2. Figure 4 is a perspective view of a heat sink in a second embodiment of the present invention. Figure 5 is a perspective view of a heat sink in a third embodiment of the present invention. [Main component symbol description] Heat sink 10 Base 12 Body 120 Groove 122 Lug 124 Heat pipe 14 Heat absorbing part 140 Heat releasing part 142 Straight hole 152 Folding 1520 Second heat sink fin group 16 Heat sink 160 Upper flange 162 Lower flange 164 Wind guide 17 Body 170 Air guide 172 Wind deflector 174 Through hole 176 First heat sink fin set 18 Heat sink fin 150 ' 180 ' 190 Wedge through hole 182 Guide side wall 1820, 1920 Perforation 184 11 1861326199 Ring wall 1840 Card slot flow path 188 Wedge-shaped convex wedge top wall 1922 Fan fan holder 30 Fastener 192 20 50
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