1308860 -九、發明說明： ‘【發明所屬之技術領域】 本發明係關於一種散熱裝置，尤指一種具有較高散熱 豉率之散熱器。 、 【先前技術】 隨著積體電路製造技術之發展，電子元件朝著更快之 運算速度邁it。由於電子元件之運算速度愈來愈快，其高 速運作過程中伴隨產生之熱量也愈來愈多。《電子元件産 ^之熱量不被及時導出，將會導致電子元件之溫度持續升 咼，從而影響其運行之穩定性，甚至會燒毀整個電子元件。 爲此’業界通常在産生熱量較多之電子元件（如中央處理器) 之頂面裝設-散熱n ’再透過系統風扇之協助排出熱量。 請一併參閱圖1及圖2,習知之散熱器1〇包括一方形 底座12及複數從該底座12頂部向上延伸之方形散孰 14。每相鄰兩散熱縛片14之間形成一通道，該通道位^該 散熱器10之一端具有一進風端13，該通道位於該散熱器 10之相對端具有一出風端15。當該散熱器裴設在 板之某電子兀件上時’該電子元件即爲發熱源， 該發熱源位於該底座12底部之中央位置。 献1〇 一定距離處設置」風扇(圖未示)協助散 …，該風扇産生之風流110從該進風％ 13進入該散 10;該風流110從該出風端15流出該散熱器1〇。，、… 1308860 r二rr::之每—散熱縛片14時均會受到較大阻 而二二二回流，或者在該進風端13產生渦旋，從 =風Γ降^順暢’增加該風流加進人該散熱器 10之風阻降低了散熱效率。 述缺=是’實有必要對習知之散熱器進行改良，以消除上 【發明内容】 熱器馨於上述内各’有必要提供一種可提高散熱效率之散 :種散熱器’包括複數散熱鰭片’每相鄰兩散熱鰭片 =曰形成-通道’該料位於該散_之—端具有一進風 =該通道位於該散熱器之相對_端具有—出風端，每― =縛片之上表面自中部向該進風端呈流線型逐漸降低， 表面自中部向該出風端先呈一較陡曲線 -至疋问度後再呈一平緩曲線降低。 相較習知技術，該散熱w之上表面自射部向該進 2 w㈣逐漸降低’則該風流與該散熱韓片位於該進 端之側端面不再垂直，故該風流所受到之阻力大大降 氏，基本上不會産生回流或渦旋，從而降低風阻，有效提 =散熱效率；並且’該等散熱縛片之上表面自該中部向該 、=風端先沿該較陡曲線降低後再沿該平緩曲線降低，則風 机在從該散熱鰭片中流出後分成兩部分擴散，由此可以降 低該風流流出該等散熱鰭片後在擴散之過程之相互擾動， 從而加快了擴散速度，有利於提高散熱效率。 1308860 【實施方式】 =併參_ 3及圖4，本發明^ 方式包括一底座22、葙赵你訪^ 1 u 24 ^ ^ 複數從該底座22向上延伸之散熱鰭 。母相郴兩散熱鰭片24之間形成一通 於該散熱器20之—端且右、隹门“ 道位 熱器20之相對—端^有2風端222’該通道位於該散 定距離處設置—風^、(有时出==。在該散熱器烈― 之風泣自兮、隹Γ7山’不）協助散熱時，該風扇產生 *以進風糕222進入該散熱器2〇;該 端^流出該散熱器20。每一散熱轉片24之中部較^風 =散熱縛片24之上表面自該中部向該進風 型逐漸降低直至與該❹22之上表面相交；㈣ = f片24之上表面自該中部向該出風端似先呈-較陡曲 線226降低再呈一平緩曲線228降低。 本發明散熱器20之較佳實施方式在使用時固定於一 電腦主機板之某一電子元件（圖未示）上，用於給該電子 疋件散熱。該電子元件（即發熱源）位於該底S 22底部之令 央位置。 該風扇産生之風流流經該等散熱器2()時，由於該散熱 縛片24之上表面自該中部向該進風端222呈流線型逐漸降 低’則該風流與該散熱鰭片24位於該進風端222之侧端面 不再垂直，故該風流所受到之阻力大大降低，基本上不會 産生回流或渦旋’從而降低風阻’有效提高散熱效率。 另外’由於該等散熱鰭片24之上表面自該中部向該出 風端224先沿該較陡曲線226降低後再沿該平緩曲線228 1308860 降低，則該風流中流經該等散熱鰭片24上部之第一風流 310自該較陡曲線226處流出後即開始擴散，而該風流中 流經該等散熱鰭片24下部之第二風流32G自該平緩曲線 U8靠近該出風端224處流出後才開始擴散，即該風流從 “散熱.、、、9片24中流出後分成兩部分擴散，這樣可以降低該 几々丨l /爪出該政熱鰭片24後在擴散之過程氣流之間之相互 擾動，從而加快了擴散速度，有利於提高散熱效率。 综上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，舉 凡熟心本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係現有散熱器之立體圖。 圖2係圖1之主視圖。 3 3係本發明放熱器之較佳實施方式之立體圖 圖4係圖3之主視圖。 【主要元件符號說明】 [習知] 散熱器 10 進風端 13 出風端 15 [本發明] 散熱器 20 散熱鰭片 24 底座 12 散熱鰭片 14 風流 110 底座 22 進風端 222 1308860 出風端 224 較陡曲線 226 平缓曲線 228 第一風流 310 第二風流 320 101308860 - Nine, the invention description: ‘[Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat sink having a high heat dissipation rate. [Prior Art] With the development of integrated circuit manufacturing technology, electronic components are moving toward faster computing speeds. As electronic components operate faster and faster, the amount of heat that comes with them during high-speed operation is increasing. "The heat generated by electronic components is not exported in time, which will cause the temperature of electronic components to continue to rise, which will affect the stability of its operation and even burn the entire electronic components. To this end, the industry usually installs heat-dissipating n' on the top surface of electronic components that generate more heat (such as a central processing unit) and then dissipates heat through the system fan. Referring to Figures 1 and 2 together, the conventional heat sink 1 includes a square base 12 and a plurality of square dimples 14 extending upward from the top of the base 12. A channel is formed between each adjacent two heat dissipating fins 14, and the end of the heat sink 10 has an air inlet end 13 having an air outlet end 15 at an opposite end of the heat sink 10. When the heat sink is disposed on an electronic component of the board, the electronic component is a heat source, and the heat source is located at a central position of the bottom of the base 12. A fan (not shown) is provided at a certain distance to assist the airflow, and the wind flow 110 generated by the fan enters the airflow 10 from the air inlet airflow 13; the windflow 110 flows out of the radiator 1 from the air outlet end 15 Hey. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The wind flow is added to the wind resistance of the radiator 10 to reduce the heat dissipation efficiency. Description: It is necessary to improve the conventional heat sink to eliminate the above [invention] The heat exchanger is in the above. It is necessary to provide a kind of dispersion that can improve the heat dissipation efficiency: the kind of radiator includes multiple heat sink fins. The sheet 'each adjacent two heat sink fins=曰 formation-channel' is located at the end of the heat sink with an air inlet=the channel is located at the opposite end of the heat sink and has an air outlet end, each ― ing piece The upper surface gradually decreases from the central portion to the air inlet end, and the surface exhibits a steep curve from the central portion to the outlet end - and then a gentle curve decreases after the enthalpy. Compared with the prior art, the surface of the heat dissipating surface is gradually lowered from the incident portion to the inward 2 w (four), and the wind flow is no longer perpendicular to the side end surface of the heat dissipating Korean sheet at the leading end, so the resistance to the wind flow is greatly increased. In the case of descending, there is basically no recirculation or vortex, thereby reducing the wind resistance, effectively raising the heat dissipation efficiency; and 'the upper surface of the heat-dissipating fins is lowered from the middle to the = wind end along the steep curve Further decreasing along the gentle curve, the fan is diffused into two parts after flowing out from the heat dissipation fin, thereby reducing the mutual disturbance of the wind flow flowing out of the heat dissipation fins during the diffusion process, thereby accelerating the diffusion speed. It is beneficial to improve heat dissipation efficiency. 1308860 [Embodiment] = _ _ 3 and FIG. 4, the method of the present invention includes a base 22, and the 葙 Zhao you visit ^ 1 u 24 ^ ^ a plurality of heat-dissipating fins extending upward from the base 22. The mother phase and the two heat dissipation fins 24 form a passage through the end of the heat sink 20 and the right and the door "the opposite end of the heat exchanger 20 has two wind ends 222". The channel is located at the scattered distance. Set - wind ^, (sometimes ==. In the radiator, the wind is crying, the mountain is not 兮, 隹Γ7 mountain 'no) to help dissipate heat, the fan produces * into the wind cake 222 into the radiator 2; The end of the heat sink 22 flows out. The upper surface of each of the heat-dissipating fins 24 is lower than the upper surface of the heat-dissipating fins 24 from the middle portion to the air-intake type until it intersects with the upper surface of the crucible 22; (4) = f-piece The upper surface of the second surface of the heat sink 24 is lowered from the middle portion to the air outlet end, and the lower curve 226 is lowered to form a gentle curve 228. The preferred embodiment of the heat sink 20 of the present invention is fixed to a computer motherboard during use. An electronic component (not shown) is used for dissipating heat to the electronic component. The electronic component (ie, the heat source) is located at a central position at the bottom of the bottom S 22. The wind generated by the fan flows through the heat sink 2 (), since the upper surface of the heat dissipation tab 24 is gradually reduced from the middle portion to the air inlet end 222 'The wind flow is no longer perpendicular to the side end of the heat sink fin 24 at the air inlet end 222, so the resistance to the wind flow is greatly reduced, and substantially no backflow or vortex is generated to reduce the wind resistance. In addition, since the upper surface of the fins 24 is lowered from the central portion toward the outlet end 224 along the steep curve 226 and then lowered along the gentle curve 228 1308860, the wind flows through the fins. The first wind flow 310 at the upper portion of the sheet 24 begins to diffuse after flowing out from the steep curve 226, and the second air flow 32G flowing through the lower portion of the heat dissipation fins 24 in the wind flow is close to the air outlet end 224 from the gentle curve U8. After the outflow, the diffusion begins, that is, the airflow flows out from the "heat dissipation.", and the 9 pieces 24 are diffused into two parts, which can reduce the airflow during the diffusion process after the several fins/claws are discharged from the political fin 24. The mutual disturbance between them accelerates the diffusion speed and is beneficial to improve the heat dissipation efficiency. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional heat sink. Figure 2 is a front view of Figure 1. 3 is a perspective view of a preferred embodiment of the heat radiator of the present invention. Fig. 4 is a front view of Fig. 3. [Main component symbol description] [General knowledge] Heat sink 10 air inlet end 13 air outlet end 15 [Invention] Heat sink 20 Heat sink fin 24 Base 12 Heat sink fin 14 Air flow 110 Base 22 Air inlet end 222 1308860 Air outlet end 224 steeper curve 226 gentle curve 228 first wind flow 310 second wind flow 320 10