TWI307739B - Centrifugal blower, heat dissipating apparatus having the centrifugal blower and electronic assembly incorporating the heat dissipating apparatus - Google Patents
Centrifugal blower, heat dissipating apparatus having the centrifugal blower and electronic assembly incorporating the heat dissipating apparatus Download PDFInfo
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- TWI307739B TWI307739B TW95139793A TW95139793A TWI307739B TW I307739 B TWI307739 B TW I307739B TW 95139793 A TW95139793 A TW 95139793A TW 95139793 A TW95139793 A TW 95139793A TW I307739 B TWI307739 B TW I307739B
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- 230000017525 heat dissipation Effects 0.000 claims description 28
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Description
1307739 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種離心風扇，尤係涉及一種對發 熱電子元件散熱之離心風扇，本發明還涉及一種具有 該離心風扇之散熱裝置及使用該散熱裝置之電子裝 置。 【先前技術】1307739 IX. Description of the Invention: [Technical Field] The present invention relates to a centrifugal fan, and more particularly to a centrifugal fan for dissipating heat from a heating electronic component, and to a heat dissipating device having the centrifugal fan and using the same The electronic device of the device. [Prior Art]
隨著中央處理器（CPU)等電子元件功率之不斷 提高，散熱問題越來越受到人們之重視，在筆記本電 腦中更是如此。爲了在有限之空間内高效地帶走系統 所産生之熱量，目前業界主要採用由散熱鰭片組、熱 管及離心風扇組合之方式進行散熱。該方式之熱傳導 路徑爲：CPU産生之熱量經熱管傳至散熱鰭片組，再 由離心風扇産生之氣流將傳至散熱鰭片組之熱量帶 走，所以離心風扇對系統之散熱性能有非常大之影 響。 爲了在有限之空間内更好地提高散熱裝置之散 熱性能，目前主要針對散熱裝置之離心風扇之葉片參 數、上下蓋尺寸、殼體曲線形狀、馬達設計參數等進 行優化設計，以期達到合理之組合，故離心風扇各變 數如何設計亦顯得尤爲重要。 在離心風扇設計中，風扇之風量係尤為重要之參 數，然而現實中風量風壓與噪音又是相互矛盾之參數 關係，故，對風扇進行優化設計之難度很高，能夠在 6 1307739 完全相同之條件下使風扇之風量實現提升，哪怕是幾 個百分點，便是對風扇之成功優化設計。目前對風扇 之眾多參數比如葉片參數、風扇外形結構參數、馬達 設計參數等進行之優化設計方式均需要較大幅度地 提升製造成本，導致優化設計之經濟效益低下。 【發明内容】As the power of electronic components such as central processing units (CPUs) continues to increase, the issue of heat dissipation has received increasing attention, especially in notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the industry currently uses heat sink fins, heat pipes and centrifugal fans to dissipate heat. The heat conduction path of the method is: the heat generated by the CPU is transmitted to the heat dissipation fin group through the heat pipe, and the air flow generated by the centrifugal fan takes away the heat transferred to the heat dissipation fin group, so the centrifugal fan has a very large heat dissipation performance to the system. The impact. In order to better improve the heat dissipation performance of the heat sink in a limited space, the blade parameters of the centrifugal fan, the size of the upper and lower covers, the shape of the casing curve, and the motor design parameters are optimized for the purpose of achieving a reasonable combination. Therefore, how to design the various variables of the centrifugal fan is also very important. In the design of centrifugal fan, the air volume of the fan is a particularly important parameter. However, the actual wind pressure and noise are contradictory parameters. Therefore, it is very difficult to optimize the design of the fan. It can be identical in 6 1307739. Under the condition, the air volume of the fan can be improved, even if it is a few percentage points, it is the successful optimization design of the fan. At present, the optimization design methods of many parameters of the fan, such as blade parameters, fan shape structure parameters, motor design parameters, etc., need to greatly increase the manufacturing cost, resulting in low economic efficiency of the optimized design. [Summary of the Invention]
有雲於此’有必要提供·^種在不增加成本之基礎 上增大空氣流量之離心風扇，同時亦有必要提供一種 提升散熱性能之散熱裝置及使用該散熱裝置之電子 裝置。 一種離心風扇，包括一頂蓋、一底蓋及連接該頂 蓋與底蓋之間的一側壁，該側壁上設有一出風口，該 頂蓋上設有第一進風口，該底蓋上設有第二進風口， 該離心風扇之第一進風口之孔徑大於第二進風口之 孔徑，且該第二進風口於靠近出風口之一側相對第一 進風口内縮。 一種散熱裝置，包括一散熱鰭片組及用於産生冷 卻氣流並吹向該散熱鰭片組之一離心風扇，該離心風 扇包括一頂蓋、一底蓋及連接該頂蓋與底蓋之間之一 側壁，該側壁上設有一出風口，該頂蓋上設有第一進 風口，該底蓋上設有第二進風口，該離心風扇之第一 進風口之孔徑大於第二進風口之孔徑，且該第二進風 口於靠近出風口之一側相對第一進風口内縮。 一種電子裝置，包括一機殼及設於該機殼内之一 7 1307739 散熱裝置，該機殼包括一頂板及與蓋頂板相對之一底 板，該散熱裝置包括一離心風扇及設於該離心風扇之 出風口處之一散熱鰭片組，該離心風扇具有一頂蓋及 與該頂蓋相對之一底蓋，該離心風扇之頂蓋上設有第 一進風口，該底蓋上設有第二進風口，該離心風扇之 頂蓋距該機殼之頂板之距離大於該離心風扇之底蓋 距該機殼之底板之距離，該第二進風口於靠近出風口 之一側相對第一進風口内縮。There is a cloud here. It is necessary to provide a centrifugal fan that increases the air flow rate without increasing the cost. It is also necessary to provide a heat sink for improving the heat dissipation performance and an electronic device using the heat sink. A centrifugal fan includes a top cover, a bottom cover and a side wall connecting the top cover and the bottom cover, the side wall is provided with an air outlet, and the top cover is provided with a first air inlet, and the bottom cover is provided There is a second air inlet, the aperture of the first air inlet of the centrifugal fan is larger than the aperture of the second air inlet, and the second air inlet is retracted relative to the first air inlet on a side close to the air outlet. A heat dissipating device includes a heat dissipating fin set and a centrifugal fan for generating a cooling airflow and blowing toward the heat dissipating fin set, the centrifugal fan including a top cover, a bottom cover and connecting the top cover and the bottom cover a side wall, the side wall is provided with an air outlet, the top cover is provided with a first air inlet, the bottom cover is provided with a second air inlet, and the first air inlet of the centrifugal fan has a larger aperture than the second air inlet An aperture, and the second air inlet is retracted relative to the first air inlet on a side close to the air outlet. An electronic device includes a casing and a heat dissipating device disposed in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The heat dissipating device includes a centrifugal fan and is disposed on the centrifugal fan. a cooling fin group at the air outlet, the centrifugal fan has a top cover and a bottom cover opposite to the top cover, the top cover of the centrifugal fan is provided with a first air inlet, and the bottom cover is provided with a first a second air inlet, the distance between the top cover of the centrifugal fan and the top plate of the casing is greater than the distance between the bottom cover of the centrifugal fan and the bottom plate of the casing, and the second air inlet is relatively first to the side of the air outlet The tuyere is indented.
與習知技術相比，上述離心風扇之第二進風口於 靠近出風口之一側相對第一進風口内縮，可使從第一 進風口進入離心風扇内之氣流有部分經由第二進風 口逃逸之逸風現象得到有效地抑制，在不增加離心風 扇之成本之基礎上，增加離心風扇之空氣流量，從而 提升散熱性能。 【實施方式】 目前大多數散熱裝置均採用配置離心風扇之主 動式散熱設計，且必須滿足能在有限且固定之空間内 進行安裝之需求。 圖6所示爲一種用於發熱電子元件（圖未示）散 熱之散熱裝置30，該散熱裝置30置於一機殼内，其 用於對設於該機殼内之一發熱電子元件散熱，其中， 該機殼包括一頂板40a及與該頂板40a相對之一底板 40b，該散熱裝置30設於該機殼之頂板40a與底板40b 之間，包括一散熱鰭片組31及一離心風扇32。該散 8Compared with the prior art, the second air inlet of the centrifugal fan is retracted relative to the first air inlet on one side of the air outlet, so that the airflow entering the centrifugal fan from the first air inlet is partially through the second air inlet. The escaping phenomenon of escape is effectively suppressed, and the air flow of the centrifugal fan is increased without increasing the cost of the centrifugal fan, thereby improving the heat dissipation performance. [Embodiment] At present, most of the heat sinks are designed with an active heat sink configured with a centrifugal fan, and must meet the requirements for installation in a limited and fixed space. FIG. 6 shows a heat dissipating device 30 for dissipating heat from a heat-generating electronic component (not shown). The heat dissipating device 30 is disposed in a casing for dissipating heat from a heat-generating electronic component disposed in the casing. The heat dissipation device 30 is disposed between the top plate 40a and the bottom plate 40b of the casing, and includes a heat dissipation fin group 31 and a centrifugal fan 32. The heat dissipation device 30 is disposed between the top plate 40a and the bottom plate 40b of the casing. . The scattered 8
1307739 熱鰭片組31設於該離心風扇32之出風口 321處，且 與發熱電子元件熱連接，該離心風扇32包括一底蓋 325、一側壁322、一頂蓋323及一設置於底蓋325與 頂蓋323之間之轉子324，該底蓋325上設有一下進 風口 326 ’該頂盖323上設有與該下進風口 326同心 且大小形狀均相同之一上進風口 328，由於散熱裝置 30 —般係固定在機殼之底板40b上，故通常會使該上 進風口 328距該機殼之頂板40a之距離大於該下進風 口 326距該機殼之底板40b之距離，當該離心風扇22 之轉子324開始運轉時，周圍之冷空氣分別由上、下 進風口 328、326進入離心風扇32内’經加壓後經由 出風口 321吹向散熱鰭片組31，以將散熱鰭片組31 由發熱電子元件吸收之熱量帶走，從而達到散熱之目 的。 申請人利用計算流體力學（Computational Fluid Dynamics，CFD)軟體對上述散熱裝置30進行不斷試 驗及流場模擬發現，由於上進風口 328距機殼之頂板 40a之距離大於下進風口 326距機殼之底板40b之距 離，導致從上進風口 328進入離心風扇32内之空氣 流量大於從下進風口 326進入之空氣流量，氣流在被 吹向散熱鰭片組31之同時，向下走之趨勢明顯，容 易導致溢風現象（如圖6中虚線圈中箭頭F所示）之 産生’使進入離心風扇32之部分空氣流量經由下進 風口 326逃逸，從而使離心風扇32之空氣流量下降， 9 1307739 降低了散熱裝置30之散熱性能，同時，該向下逃逸 之空氣還與從下進風口 326進入之空氣相互撞擊，導 致能量損失且産生較大之系統噪音。故，申請人積極 對此問題進行研究分析，以試圖將離心風扇32在機 殼内之優化設計及合理佈局來達到良好之散熱效 果，乃有本發明之誕生。1307739 The hot fin group 31 is disposed at the air outlet 321 of the centrifugal fan 32, and is thermally connected to the heat generating electronic component. The centrifugal fan 32 includes a bottom cover 325, a side wall 322, a top cover 323, and a bottom cover. a rotor 324 between the 325 and the top cover 323. The bottom cover 325 is provided with a lower air inlet 326. The top cover 323 is provided with an upper air inlet 328 concentric with the lower air inlet 326 and having the same size and shape. The heat sink 30 is generally fixed to the bottom plate 40b of the casing, so that the distance of the upper air inlet 328 from the top plate 40a of the casing is generally greater than the distance of the lower air inlet 326 from the bottom plate 40b of the casing. When the rotor 324 of the centrifugal fan 22 starts to operate, the surrounding cold air enters the centrifugal fan 32 from the upper and lower air inlets 328 and 326 respectively. After being pressurized, the cold air is blown to the heat dissipation fin group 31 via the air outlet 321 to dissipate heat. The fin group 31 is carried away by the heat absorbed by the heat-generating electronic component to achieve the purpose of heat dissipation. The applicant uses the Computational Fluid Dynamics (CFD) software to continuously test the above-mentioned heat sink 30 and simulate the flow field. It is found that the distance from the top air inlet 328 to the top plate 40a of the casing is larger than that of the lower air inlet 326 from the casing. The distance between the bottom plate 40b causes the air flow entering the centrifugal fan 32 from the upper air inlet 328 to be larger than the air flow entering from the lower air inlet 326. The air flow is blown toward the heat dissipation fin group 31, and the downward trend is obvious. It is easy to cause the occurrence of a wind phenomenon (as indicated by an arrow F in the dotted circle in FIG. 6) to cause a part of the air flow entering the centrifugal fan 32 to escape through the lower air inlet 326, thereby causing the air flow of the centrifugal fan 32 to decrease, and the reduction of 9 1307739 The heat dissipation performance of the heat sink 30, at the same time, the downward escaping air also collides with the air entering from the lower air inlet 326, resulting in energy loss and large system noise. Therefore, the applicant actively studied and analyzed this problem in an attempt to achieve a good heat dissipation effect by optimizing the design and rational layout of the centrifugal fan 32 in the casing, and the present invention was born.
圖1至圖2所示爲本發明散熱裝置10之一較佳 實施例，該散熱裝置10可適用於一筆記本電腦之機 殼20 (如圖4所示）内進行散熱，可以理解地，該散 熱裝置10還可置於其他具有封閉殼體之電子裝置内 進行散熱，如桌上型電腦、投影儀等之殼體内。該散 熱裝置10包括一散熱鰭片組12及一離心風扇14,該 散熱鰭片組12與機殼20内之一發熱電子元件（圖未 示）熱連接，以吸收該發熱電子元件産生之熱量，該 離心風扇14提供吹向該散熱鰭片組12之具有較高壓 力之氣流，以將該散熱鰭片組12吸收之熱量散發到 周圍之空氣中。 該離心風扇14用於對該散熱鰭片組12散熱，其 包括一殼體141、一設於該殼體141上之頂蓋142及 一具有複數扇葉144之轉子143。該頂蓋142與該殼 體141合圍形成一容置空間，該轉子143設置於該容 置空間内。該頂蓋142上設有一圓孔以作爲該離心風 扇14之上進風口 146。該殼體141包括一底蓋147及 一渦形之側壁148，該側壁148與該底蓋147垂直， 1307739 其上設有一弧形之出風口 149。該散熱鰭片組12設置 於該離心風扇14之出風口 149處，該散熱鰭片組12 大致呈弧形，其包括複數散熱鰭片121，每相鄰之兩 散熱鰭片121之間形成一氣流通道125，該散熱鰭片 組12具有一上端面129及一下端面130,其中該上端 面129與離心風扇14之頂蓋142之上表面位於同一 平面内，該下端面130與離心風扇14之底蓋147之 下表面位於同一平面内。1 to 2 show a preferred embodiment of the heat sink 10 of the present invention. The heat sink 10 can be used for heat dissipation in a casing 20 (shown in FIG. 4) of a notebook computer. The heat sink 10 can also be placed in other electronic devices having a closed housing for heat dissipation, such as a desktop computer, a projector, or the like. The heat dissipating device 10 includes a heat dissipating fin set 12 and a centrifugal fan 14 . The heat dissipating fin set 12 is thermally connected to a heat generating electronic component (not shown) in the casing 20 to absorb heat generated by the heat generating electronic component. The centrifugal fan 14 provides a higher pressure airflow to the heat dissipation fin group 12 to dissipate the heat absorbed by the heat dissipation fin group 12 into the surrounding air. The centrifugal fan 14 is configured to dissipate heat from the heat dissipating fin set 12, and includes a casing 141, a top cover 142 disposed on the casing 141, and a rotor 143 having a plurality of blades 144. The top cover 142 and the housing 141 define an accommodating space, and the rotor 143 is disposed in the accommodating space. The top cover 142 is provided with a circular hole as the air inlet 146 above the centrifugal fan 14. The housing 141 includes a bottom cover 147 and a scroll side wall 148. The side wall 148 is perpendicular to the bottom cover 147. The 1307739 is provided with an arcuate air outlet 149. The heat dissipation fin set 12 is disposed at the air outlet 149 of the centrifugal fan 14. The heat dissipation fin set 12 is substantially arc-shaped, and includes a plurality of heat dissipation fins 121. A heat dissipation fin 121 is formed between each adjacent two heat dissipation fins 121. The air flow channel 125 has an upper end surface 129 and a lower end surface 130. The upper end surface 129 is in the same plane as the upper surface of the top cover 142 of the centrifugal fan 14. The lower end surface 130 and the centrifugal fan 14 The lower surface of the bottom cover 147 is located in the same plane.
該離心風扇14之底蓋147垂直於離心風扇14之 轉子143之轴線A，該底蓋147上亦設有一圓孔以作 爲該離心風扇14之下進風口 150,該下進風口 150之 孔徑小於該上進風口 146之孔徑，該下進風口 150中 間設有一圓形之支撐部151及將該支撐部151與該底 蓋147連接之連接肋153，該支撐部151與該下進風 口 150同心，該轉子143設置於該支撐部151上，且 該轉子143與該下進風口 150同心設置，即該下進風 口 150之中心Ο位於該轉子143之轴線A上。 本實施例中，該上進風口 146之中心Μ偏向該轉 子143轴線Α之左侧，即更靠近該離心風扇14之出 風口 149之一側。圖3所示爲上述離心風扇14之上、 下進風口 146、150沿轉子143之軸線A方向之投影 圖，從圖中可以看出，該上進風口 146更偏向出風口 149，而該下進風口 150於靠近出風口之一側則相對 於上進風口 146内縮，且該下進風口 150所形成之内 11 1307739 圓與該上進風口 146所形成之外圓於軸線a之右側相 切’使該下進風口 150於靠近出風ο ι49之一側相對 上進風口 146内縮之距離L爲該上違風口 146所形成 之外圓與該下進風口 150所形成之内圓之直徑之差。The bottom cover 147 of the centrifugal fan 14 is perpendicular to the axis A of the rotor 143 of the centrifugal fan 14, and the bottom cover 147 is also provided with a circular hole as the lower air inlet 150 of the centrifugal fan 14, and the aperture of the lower air inlet 150 The bottom air inlet 150 is provided with a circular support portion 151 and a connecting rib 153 connecting the support portion 151 and the bottom cover 147. The support portion 151 and the lower air inlet 150 are defined. Concentrically, the rotor 143 is disposed on the support portion 151, and the rotor 143 is disposed concentrically with the lower air inlet 150, that is, the center of the lower air inlet 150 is located on the axis A of the rotor 143. In this embodiment, the center of the upper air inlet 146 is biased to the left of the axis Α of the rotor 143, that is, closer to one side of the air outlet 149 of the centrifugal fan 14. 3 is a projection view of the upper and lower air inlets 146, 150 of the centrifugal fan 14 along the axis A of the rotor 143. As can be seen from the figure, the upper air inlet 146 is more biased toward the air outlet 149, and the lower portion The air inlet 150 is retracted relative to the upper air inlet 146 on one side of the air outlet, and the 11 1307739 circle formed by the lower air inlet 150 and the upper air inlet 146 are formed on the right side of the axis a. The distance L of the lower air inlet 150 from the side of the air outlet 146 opposite to the upper air inlet 146 is the inner circle formed by the outer circle formed by the upper air inlet 146 and the lower air inlet 150. The difference in diameter.
圖4所示爲散熱裝置10置於機鼓2〇内時且沿圖 2所示IV-IV線之剖視圖’該機殼2〇包括一頂板21 及一底板22，該散熱裝置10位於該頂板21與底板 22之間’該離心風扇之頂蓋142位於該機殼2〇之頂 板21與該離心風扇14之底蓋147之間，該離心風扇 14之底蓋147位於該機殼20之底板22與該離心風扇 14之頂蓋142之間。該離心風扇14之頂蓋142與機 殼20之頂板21之間形成〆上間隙（top gap ) 25，該 離心風扇14之底蓋147與機殼20之底板22之間形 成一下間隙（bottom gap) 26，該上、下間隙25、26 可分別作爲空氣進入離心風扇14之上、下進風口 146、150之空氣流道，該上間隙25之高度Η大於該 下間隙26之高度h ’故，流經該上間隙25並由上進 風口 146進入離心風扇14内之空氣流量，較流經該 下間隙26並由下進風口 150進入離心風扇14内之空 氣流量大，氣流有向下走之趨勢，但由於該下進風口 150罪近出風口 149之一側在轉子143轴線A之投參 方向上相對於上進風口 146内縮，故原本從下進風口 150溢出之氣流則會被離心風扇14之底蓋147所(!且 撞’在該底蓋147之導引下，沿離心風扇14之出風 12 1307739 口 149進入散熱鰭片組12之氣流通道125,如圖4中 虛線圈所示，從而使離心風扇14之逸風現象得到有 效地抑制，在不增加離心風扇14之成本之基礎上， 可增加離心風扇14之氣流流量，提升散熱裝置10之 散熱性能。4 is a cross-sectional view of the heat sink 10 placed in the drum 2 and along the line IV-IV of FIG. 2. The casing 2 includes a top plate 21 and a bottom plate 22, and the heat sink 10 is located on the top plate. The top cover 142 of the centrifugal fan is located between the top plate 21 of the casing 2 and the bottom cover 147 of the centrifugal fan 14. The bottom cover 147 of the centrifugal fan 14 is located at the bottom plate of the casing 20. 22 is between the top cover 142 of the centrifugal fan 14. A top gap 225 is formed between the top cover 142 of the centrifugal fan 14 and the top plate 21 of the casing 20, and a bottom gap is formed between the bottom cover 147 of the centrifugal fan 14 and the bottom plate 22 of the casing 20. 26, the upper and lower gaps 25, 26 can respectively enter the air flow passage of the upper and lower air inlets 146, 150 of the centrifugal fan 14, and the height Η of the upper gap 25 is greater than the height h of the lower gap 26 The flow of air flowing through the upper gap 25 and entering the centrifugal fan 14 from the upper air inlet 146 is larger than the air flow flowing through the lower gap 26 and entering the centrifugal fan 14 from the lower air inlet 150, and the air flow is downward. However, since one of the lower air inlets 149 is retracted in the direction of the axis A of the rotor 143 with respect to the upper air inlet 146, the airflow originally overflowing from the lower air inlet 150 is By the bottom cover 147 of the centrifugal fan 14 (! and hitting under the guidance of the bottom cover 147, along the outlet 12 of the centrifugal fan 14 12 1307739 149 into the air flow passage 125 of the heat dissipation fin group 12, as shown in FIG. The dotted circle is shown, so that the wind phenomenon of the centrifugal fan 14 is effectively System, without increasing the cost basis of the centrifugal fan 14, the air flow rate increase of the centrifugal fan 14, the heat sink 10 to enhance the heat dissipation performance.
當然，在使得離心風扇14之上進風口 146之孔 徑大於其下進風口 150之孔徑，且下進風口 150靠近 出風口 149之一侧在投影方向上相對上進風口 146内 縮之情形下，上述上進風口 146之中心Μ亦可與下進 風口 150之中心Ο同心設置，如圖5本發明之另一實 施例所示，該實施例由於上進風口 146之中心Μ與下 進風口 150之中心Ο同心設置，在下進風口 150之整 個圓周方向均可以起到很好之防止氣流溢出之效 果。本實施例中，該下進風口 150於靠近出風口之一 側相對上進風口 146内縮之距離L爲該上進風口 146 所形成之外圓與該下進風口 150所形成之内圓直徑之 差的一半。 在以上之兩個實施例中，整個下進風口 150均位 於上進風口 146於轉子143轴線Α之投影方向上之投 影範圍内，這樣有利於上、下進風口 146、150相互 對齊，減少從上、下進風口 146、150分別進入之氣 流之間的相互串擾。 表1爲依據本發明圖1至圖4所示實施例中散熱 裝置10在離心風扇14之轉速爲3600rpm、上間隙25 13 1307739 之高度Η爲3.6mm、下間隙26之高度h爲2.5mm之 '情況下進行試驗得出之實驗數據，由實驗可知，該散 熱裝置10與圖6所示之散熱裝置10相比，風量Q提 升了 0.51 立方英尺/每分鐘（Cubic Feet Per Minute， cfm) ° 表1 Q(cfm) AQ(cfm) 圖6所示散熱裝置 3,91 0.51 圖1至圖4所示散熱裝置 4.42Of course, in the case where the diameter of the air inlet 146 above the centrifugal fan 14 is larger than the aperture of the lower air inlet 150, and the side of the lower air inlet 150 near the air outlet 149 is retracted relative to the upper air inlet 146 in the projection direction, The center Μ of the upper air inlet 146 may also be disposed concentrically with the center 下 of the lower air inlet 150. As shown in another embodiment of the present invention, the embodiment has a center Μ and a lower air inlet 150 of the upper air inlet 146. The center is concentrically arranged to provide a good effect of preventing airflow over the entire circumference of the lower air inlet 150. In this embodiment, the distance L of the lower air inlet 150 from the side of the air outlet opposite to the upper air inlet 146 is the inner diameter of the outer circle formed by the upper air inlet 146 and the lower air inlet 150. Half of the difference. In the above two embodiments, the entire lower air inlet 150 is located in the projection range of the upper air inlet 146 in the projection direction of the axis Α of the rotor 143, so that the upper and lower air inlets 146 and 150 are aligned with each other, thereby reducing Mutual crosstalk between the airflows entering from the upper and lower air inlets 146, 150, respectively. 1 is a heat dissipation device 10 according to the present invention, wherein the speed of the centrifugal fan 14 is 3600 rpm, the height of the upper gap 25 13 1307739 is 3.6 mm, and the height h of the lower gap 26 is 2.5 mm. 'Experimental data obtained from the experiment, the experiment shows that the air volume Q is increased by 0.51 cubic feet per minute (Cubic Feet Per Minute, cfm) compared to the heat sink 10 shown in FIG. Table 1 Q (cfm) AQ (cfm) Figure 6 shows the heat sink 3, 91 0.51 Figure 1 to Figure 4 heat sink 4.42
綜上所述，本發明符合發明專利之要件，爰依法 提出專利申請。惟以上所述者僅為本發明之較佳實施 例，舉凡熟悉本案技藝之人士，在爰依本發明精神所 作之等效修飾或變化，皆應涵蓋於以下之申請專利範 圍内。 【圖式簡單說明】 圖1爲本發明散熱裝置一較佳實施例之立體分解 圖。 圖2爲圖1所示散熱裝置之立體組裝圖。 圖3爲圖1所示離心風扇之上、下進風口沿轉子之 轴線方向之投影關係圖。 圖4爲圖1所示散熱裝置置於機殼内時之剖視圖。 圖5爲本發明散熱裝置另一實施例中離心風扇之 上、下進風口之投影關係圖。 14 1307739 圖6爲基於改進之一散熱裝置置於機殼内時之剖 視圖。 【主要元件符號說明】In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of a preferred embodiment of a heat sink according to the present invention. 2 is a perspective assembled view of the heat sink shown in FIG. 1. Fig. 3 is a diagram showing the relationship between the upper and lower air inlets of the centrifugal fan shown in Fig. 1 along the axial direction of the rotor. 4 is a cross-sectional view of the heat sink of FIG. 1 placed in a casing. Fig. 5 is a diagram showing the projection relationship between the upper and lower air inlets of the centrifugal fan in another embodiment of the heat sink according to the present invention. 14 1307739 Figure 6 is a cross-sectional view of one of the improved heat sinks placed in the casing. [Main component symbol description]
散熱裝置 10、30 散熱鰭片組 12、31 散熱鰭片 121 氣流通道 125 上端面 129 下端面 130 離心風扇 14、32 殼體 141 頂蓋 142 、 323 轉子 143、324 扇葉 144 上進風口 146、328 底蓋 147 、 325 侧壁 148、322 出風口 149 、 321 下進風口 150、326 支撐部 151 連接肋 153 軸線 A 中心 Μ、0 距離 L 機殼 20 頂板 21 、 40a 底板 22、40b 上間隙 25 下間隙 26 上間隙之高度 Η 下間隙之高度 h 15Heat sink 10, 30 heat sink fin set 12, 31 heat sink fin 121 air flow channel 125 upper end surface 129 lower end surface 130 centrifugal fan 14, 32 housing 141 top cover 142, 323 rotor 143, 324 fan 144 upper air inlet 146, 328 bottom cover 147, 325 side wall 148, 322 air outlet 149, 321 lower air inlet 150, 326 support 151 connecting rib 153 axis A center 0, 0 distance L casing 20 top plate 21, 40a bottom plate 22, 40b upper gap 25 The height of the upper gap of the lower gap 26, the height of the lower gap h 15
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| TW95139793A TWI307739B (en) | 2006-10-27 | 2006-10-27 | Centrifugal blower, heat dissipating apparatus having the centrifugal blower and electronic assembly incorporating the heat dissipating apparatus |
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| CN104955309A (en) * | 2014-03-26 | 2015-09-30 | 鸿富锦精密工业(武汉)有限公司 | Electronic device and heat radiating fan thereof |
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